ATE550401T1 - Materiau de connexion de circuit, structure de connexion d'element de circuit et procede de connexion de l'element de circuit - Google Patents
Materiau de connexion de circuit, structure de connexion d'element de circuit et procede de connexion de l'element de circuitInfo
- Publication number
- ATE550401T1 ATE550401T1 AT10156276T AT10156276T ATE550401T1 AT E550401 T1 ATE550401 T1 AT E550401T1 AT 10156276 T AT10156276 T AT 10156276T AT 10156276 T AT10156276 T AT 10156276T AT E550401 T1 ATE550401 T1 AT E550401T1
- Authority
- AT
- Austria
- Prior art keywords
- circuit
- connexion
- procede
- board
- cures
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
- C09J9/02—Electrically-conducting adhesives
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
- H05K3/323—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives by applying an anisotropic conductive adhesive layer over an array of pads
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G18/00—Polymeric products of isocyanates or isothiocyanates
- C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
- C08G18/28—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the compounds used containing active hydrogen
- C08G18/40—High-molecular-weight compounds
- C08G18/42—Polycondensates having carboxylic or carbonic ester groups in the main chain
- C08G18/4205—Polycondensates having carboxylic or carbonic ester groups in the main chain containing cyclic groups
- C08G18/4208—Polycondensates having carboxylic or carbonic ester groups in the main chain containing cyclic groups containing aromatic groups
- C08G18/4211—Polycondensates having carboxylic or carbonic ester groups in the main chain containing cyclic groups containing aromatic groups derived from aromatic dicarboxylic acids and dialcohols
- C08G18/4213—Polycondensates having carboxylic or carbonic ester groups in the main chain containing cyclic groups containing aromatic groups derived from aromatic dicarboxylic acids and dialcohols from terephthalic acid and dialcohols
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G18/00—Polymeric products of isocyanates or isothiocyanates
- C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
- C08G18/28—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the compounds used containing active hydrogen
- C08G18/67—Unsaturated compounds having active hydrogen
- C08G18/671—Unsaturated compounds having only one group containing active hydrogen
- C08G18/672—Esters of acrylic or alkyl acrylic acid having only one group containing active hydrogen
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J175/00—Adhesives based on polyureas or polyurethanes; Adhesives based on derivatives of such polymers
- C09J175/04—Polyurethanes
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J175/00—Adhesives based on polyureas or polyurethanes; Adhesives based on derivatives of such polymers
- C09J175/04—Polyurethanes
- C09J175/14—Polyurethanes having carbon-to-carbon unsaturated bonds
- C09J175/16—Polyurethanes having carbon-to-carbon unsaturated bonds having terminal carbon-to-carbon unsaturated bonds
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2666/00—Composition of polymers characterized by a further compound in the blend, being organic macromolecular compounds, natural resins, waxes or and bituminous materials, non-macromolecular organic substances, inorganic substances or characterized by their function in the composition
- C08L2666/02—Organic macromolecular compounds, natural resins, waxes or and bituminous materials
- C08L2666/14—Macromolecular compounds according to C08L59/00 - C08L87/00; Derivatives thereof
- C08L2666/20—Macromolecular compounds having nitrogen in the main chain according to C08L75/00 - C08L79/00; Derivatives thereof
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L75/00—Compositions of polyureas or polyurethanes; Compositions of derivatives of such polymers
- C08L75/04—Polyurethanes
- C08L75/06—Polyurethanes from polyesters
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
- H01R12/50—Fixed connections
- H01R12/51—Fixed connections for rigid printed circuits or like structures
- H01R12/52—Fixed connections for rigid printed circuits or like structures connecting to other rigid printed circuits or like structures
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/36—Assembling printed circuits with other printed circuits
- H05K3/361—Assembling flexible printed circuits with other printed circuits
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49126—Assembling bases
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Combinations Of Printed Boards (AREA)
- Conductive Materials (AREA)
- Coupling Device And Connection With Printed Circuit (AREA)
- Multi-Conductor Connections (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
PCT/JP2006/314475 WO2008010294A1 (fr) | 2006-07-21 | 2006-07-21 | Matériau de connexion, structure de connexion d'éléments de circuits et procédé de connexion de circuits. |
EP06768353A EP2046104B1 (de) | 2006-07-21 | 2006-07-21 | Schaltungsverbindungsmaterial, schaltungsglied-verbindungsstruktur und verfahren zum verbinden eines schaltungsglieds |
Publications (1)
Publication Number | Publication Date |
---|---|
ATE550401T1 true ATE550401T1 (de) | 2012-04-15 |
Family
ID=38956630
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
AT10156277T ATE540426T1 (de) | 2006-07-21 | 2006-07-21 | Material zur verbindung von leiterplatten, stromkreisverbindungsstruktur und verfahren zur verbindung des leiterplattenelements |
AT10156276T ATE550401T1 (de) | 2006-07-21 | 2006-07-21 | Materiau de connexion de circuit, structure de connexion d'element de circuit et procede de connexion de l'element de circuit |
Family Applications Before (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
AT10156277T ATE540426T1 (de) | 2006-07-21 | 2006-07-21 | Material zur verbindung von leiterplatten, stromkreisverbindungsstruktur und verfahren zur verbindung des leiterplattenelements |
Country Status (8)
Country | Link |
---|---|
US (3) | US8497431B2 (de) |
EP (5) | EP2223982B1 (de) |
JP (1) | JP4924609B2 (de) |
KR (3) | KR101121616B1 (de) |
CN (1) | CN101502188B (de) |
AT (2) | ATE540426T1 (de) |
PL (5) | PL2440023T3 (de) |
WO (1) | WO2008010294A1 (de) |
Families Citing this family (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6356485B1 (en) * | 1999-02-13 | 2002-03-12 | Integrated Device Technology, Inc. | Merging write cycles by comparing at least a portion of the respective write cycle addresses |
WO2008010294A1 (fr) | 2006-07-21 | 2008-01-24 | Hitachi Chemical Company, Ltd. | Matériau de connexion, structure de connexion d'éléments de circuits et procédé de connexion de circuits. |
JP4673933B2 (ja) * | 2009-08-26 | 2011-04-20 | 積水化学工業株式会社 | 異方性導電材料及び接続構造体 |
JP4673932B2 (ja) * | 2009-08-26 | 2011-04-20 | 積水化学工業株式会社 | 接続構造体の製造方法及び異方性導電材料 |
JP4673931B2 (ja) * | 2009-08-26 | 2011-04-20 | 積水化学工業株式会社 | 異方性導電材料及び接続構造体 |
WO2011024719A1 (ja) * | 2009-08-26 | 2011-03-03 | 積水化学工業株式会社 | 異方性導電材料、接続構造体及び接続構造体の製造方法 |
DE102009029476B4 (de) | 2009-09-15 | 2012-11-08 | Lisa Dräxlmaier GmbH | Elektronische Vorrichtung zum Schalten von Strömen und Herstellungsverfahren für dieselbe |
CN102449096A (zh) * | 2010-07-26 | 2012-05-09 | 日立化成工业株式会社 | 粘接剂组合物、连接结构体、连接结构体的制造方法、以及粘接剂组合物的应用 |
Family Cites Families (41)
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US3994764A (en) * | 1975-06-13 | 1976-11-30 | Pratt & Lambert, Inc. | Adhesive compositions |
US4223115A (en) * | 1978-04-24 | 1980-09-16 | Lord Corporation | Structural adhesive formulations |
DE3112123A1 (de) * | 1981-03-27 | 1982-10-07 | Basf Ag, 6700 Ludwigshafen | Lagerstabile dispersionen von aromatischen polyestern in polyhydroxylverbindungen, verfahren zu deren herstellung und deren verwendung zur herstellung von gegebenenfalls zelligen polyurethan- und/oder polyisocyanurat-kunststoffen |
JPS6147760A (ja) | 1984-08-16 | 1986-03-08 | Shin Etsu Polymer Co Ltd | 異方導電接着剤 |
JPH01135639A (ja) | 1987-11-24 | 1989-05-29 | Nippon Sheet Glass Co Ltd | ポリエステル積層物 |
US5037715A (en) | 1987-12-10 | 1991-08-06 | Mitsui Toatsu Chemicals, Inc. | Resins for toner of electrophotography and method for manufacturing the same |
JPH03110711A (ja) | 1989-09-22 | 1991-05-10 | Fuji Kobunshi Kogyo Kk | 異方導電性接着剤組成物 |
TW210422B (de) * | 1991-06-04 | 1993-08-01 | Akzo Nv | |
JPH0652715A (ja) * | 1992-07-30 | 1994-02-25 | Fuji Kobunshi Kogyo Kk | 異方導電性接着剤組成物 |
JPH0776185A (ja) | 1993-06-17 | 1995-03-20 | Sony Corp | ラミネートフィルム |
JP3876993B2 (ja) | 1997-02-27 | 2007-02-07 | セイコーエプソン株式会社 | 接着構造、液晶装置、及び電子機器 |
KR100333456B1 (ko) * | 1997-03-31 | 2002-04-18 | 이사오 우치가사키 | 회로 접속 재료, 및 회로 단자의 접속 구조 및 접속 방법 |
US7967943B2 (en) | 1997-03-31 | 2011-06-28 | Hitachi Chemical Company, Ltd. | Circuit-connecting material and circuit terminal connected structure and connecting method |
JPH11110747A (ja) | 1997-10-07 | 1999-04-23 | Toyobo Co Ltd | 磁気記録カード用基材 |
JP4423513B2 (ja) | 1997-10-20 | 2010-03-03 | 東洋紡績株式会社 | 接着用樹脂組成物及び接着用フィルム |
TW459032B (en) * | 1998-03-18 | 2001-10-11 | Sumitomo Bakelite Co | An anisotropic conductive adhesive and method for preparation thereof and an electronic apparatus using said adhesive |
JP2000239642A (ja) | 1999-02-23 | 2000-09-05 | Toyobo Co Ltd | 反応性ホットメルト接着剤組成物 |
JP2001055555A (ja) | 1999-08-19 | 2001-02-27 | Dainippon Ink & Chem Inc | ラミネート用接着剤組成物 |
JP4916677B2 (ja) * | 1999-08-25 | 2012-04-18 | 日立化成工業株式会社 | 配線接続材料及びそれを用いた配線板製造方法 |
US6762249B1 (en) | 1999-08-25 | 2004-07-13 | Hitachi Chemical Company, Ltd. | Wiring-connecting material and process for producing circuit board with the same |
CN100335583C (zh) | 1999-08-25 | 2007-09-05 | 日立化成工业株式会社 | 配线连接材料以及使用它的配线板制造方法 |
KR100671312B1 (ko) | 1999-08-25 | 2007-01-19 | 히다치 가세고교 가부시끼가이샤 | 배선단자 접속용 필름 |
CN1214455C (zh) | 2000-04-25 | 2005-08-10 | 日立化成工业株式会社 | 电路连接用粘接剂、使用其的电路连接方法及电路连接结构体 |
JP2002111213A (ja) | 2000-09-26 | 2002-04-12 | Nippon Mektron Ltd | 任意層間接続用バイア・ホールを有する多層プリント基板およびその製造方法 |
JP4734706B2 (ja) | 2000-11-01 | 2011-07-27 | Jsr株式会社 | 電気抵抗測定用コネクター並びに回路基板の電気抵抗測定装置および測定方法 |
KR20030037017A (ko) | 2001-11-01 | 2003-05-12 | 엘지전선 주식회사 | 이방성 도전 접착필름 |
JP4158080B2 (ja) | 2002-01-30 | 2008-10-01 | 東洋紡績株式会社 | 導電性ペースト |
US6815501B2 (en) | 2002-04-09 | 2004-11-09 | E. I. Du Pont De Nemours And Company | Dual cure coating compositions and process for the production of multilayer coatings |
JP4235895B2 (ja) | 2002-04-18 | 2009-03-11 | 東洋紡績株式会社 | 昇華型感熱転写記録材用ポリエステルフィルムおよびその製造方法 |
JP2003313533A (ja) | 2002-04-23 | 2003-11-06 | Sumitomo Bakelite Co Ltd | 異方導電性接着剤 |
US7371452B2 (en) | 2003-04-28 | 2008-05-13 | Eastman Kodak Company | Conductive patterned sheet utilizing multi-layered conductive conduit channels |
JP4470091B2 (ja) | 2003-08-11 | 2010-06-02 | 東洋紡績株式会社 | ポリウレタン樹脂組成物、積層体およびフレキシブルプリント配線板 |
KR100902204B1 (ko) * | 2003-10-10 | 2009-06-11 | 아사히 가세이 케미칼즈 가부시키가이샤 | 잠재성 경화제 및 조성물 |
JP2005194393A (ja) | 2004-01-07 | 2005-07-21 | Hitachi Chem Co Ltd | 回路接続用接着フィルム及び回路接続構造体 |
CN100523111C (zh) | 2004-04-09 | 2009-08-05 | 大日本油墨化学工业株式会社 | 湿气固化型聚氨酯热熔粘合剂 |
JP2006052258A (ja) * | 2004-08-10 | 2006-02-23 | Unitika Ltd | 活性エネルギー線硬化型樹脂組成物 |
WO2008010294A1 (fr) | 2006-07-21 | 2008-01-24 | Hitachi Chemical Company, Ltd. | Matériau de connexion, structure de connexion d'éléments de circuits et procédé de connexion de circuits. |
JP4844003B2 (ja) | 2005-05-10 | 2011-12-21 | 日立化成工業株式会社 | 回路接続材料、回路部材の接続構造及び回路部材の接続方法。 |
US7535462B2 (en) * | 2005-06-02 | 2009-05-19 | Eastman Kodak Company | Touchscreen with one carbon nanotube conductive layer |
JP2005290394A (ja) | 2005-07-04 | 2005-10-20 | Hitachi Chem Co Ltd | 回路接続用接着フィルム及びそれを用いた回路板の製造方法 |
JP2008290327A (ja) | 2007-05-24 | 2008-12-04 | Meiki Co Ltd | 射出成形装置および射出成形方法 |
-
2006
- 2006-07-21 WO PCT/JP2006/314475 patent/WO2008010294A1/ja active Application Filing
- 2006-07-21 KR KR1020097003597A patent/KR101121616B1/ko active IP Right Grant
- 2006-07-21 AT AT10156277T patent/ATE540426T1/de active
- 2006-07-21 EP EP10156277A patent/EP2223982B1/de active Active
- 2006-07-21 PL PL11189685T patent/PL2440023T3/pl unknown
- 2006-07-21 EP EP10156276A patent/EP2223981B1/de active Active
- 2006-07-21 AT AT10156276T patent/ATE550401T1/de active
- 2006-07-21 EP EP06768353A patent/EP2046104B1/de active Active
- 2006-07-21 CN CN2006800554078A patent/CN101502188B/zh active Active
- 2006-07-21 US US12/374,628 patent/US8497431B2/en not_active Expired - Fee Related
- 2006-07-21 EP EP11180866A patent/EP2429269B1/de not_active Not-in-force
- 2006-07-21 PL PL06768353T patent/PL2046104T3/pl unknown
- 2006-07-21 EP EP11189685A patent/EP2440023B1/de not_active Not-in-force
- 2006-07-21 PL PL11180866T patent/PL2429269T3/pl unknown
- 2006-07-21 KR KR1020107003373A patent/KR101065870B1/ko active IP Right Grant
- 2006-07-21 JP JP2008525772A patent/JP4924609B2/ja not_active Expired - Fee Related
- 2006-07-21 PL PL10156276T patent/PL2223981T3/pl unknown
- 2006-07-21 KR KR1020107003374A patent/KR101108777B1/ko active IP Right Grant
- 2006-07-21 PL PL10156277T patent/PL2223982T3/pl unknown
-
2010
- 2010-04-29 US US12/769,953 patent/US8558118B2/en not_active Expired - Fee Related
- 2010-04-29 US US12/769,925 patent/US8541688B2/en not_active Expired - Fee Related
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