ATE547929T1 - Submezzaninstruktur für leiterplattenanordnungen - Google Patents
Submezzaninstruktur für leiterplattenanordnungenInfo
- Publication number
- ATE547929T1 ATE547929T1 AT07814163T AT07814163T ATE547929T1 AT E547929 T1 ATE547929 T1 AT E547929T1 AT 07814163 T AT07814163 T AT 07814163T AT 07814163 T AT07814163 T AT 07814163T AT E547929 T1 ATE547929 T1 AT E547929T1
- Authority
- AT
- Austria
- Prior art keywords
- card
- mezzan
- instruction
- sub
- circuit board
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/14—Structural association of two or more printed circuits
- H05K1/141—One or more single auxiliary printed circuits mounted on a main printed circuit, e.g. modules, adapters
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/20—Cooling means
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/04—Assemblies of printed circuits
- H05K2201/042—Stacked spaced PCBs; Planar parts of folded flexible circuits having mounted components in between or spaced from each other
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/07—Electric details
- H05K2201/073—High voltage adaptations
- H05K2201/0746—Protection against transients, e.g. layout adapted for plugging of connector
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10189—Non-printed connector
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10227—Other objects, e.g. metallic pieces
- H05K2201/10409—Screws
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10431—Details of mounted components
- H05K2201/10598—Means for fastening a component, a casing or a heat sink whereby a pressure is exerted on the component towards the PCB
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/20—Details of printed circuits not provided for in H05K2201/01 - H05K2201/10
- H05K2201/2036—Permanent spacer or stand-off in a printed circuit or printed circuit assembly
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/15—Position of the PCB during processing
- H05K2203/1572—Processing both sides of a PCB by the same process; Providing a similar arrangement of components on both sides; Making interlayer connections from two sides
Landscapes
- Engineering & Computer Science (AREA)
- Theoretical Computer Science (AREA)
- Human Computer Interaction (AREA)
- Physics & Mathematics (AREA)
- General Engineering & Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Details Of Connecting Devices For Male And Female Coupling (AREA)
- Coupling Device And Connection With Printed Circuit (AREA)
- Combinations Of Printed Boards (AREA)
- Mobile Radio Communication Systems (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US82257106P | 2006-08-16 | 2006-08-16 | |
PCT/US2007/076084 WO2008022249A2 (en) | 2006-08-16 | 2007-08-16 | Sub-mezzanine structure for printed circuit card assemblies |
Publications (1)
Publication Number | Publication Date |
---|---|
ATE547929T1 true ATE547929T1 (de) | 2012-03-15 |
Family
ID=39083131
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
AT07814163T ATE547929T1 (de) | 2006-08-16 | 2007-08-16 | Submezzaninstruktur für leiterplattenanordnungen |
Country Status (4)
Country | Link |
---|---|
US (1) | US7539026B2 (de) |
EP (1) | EP2057873B1 (de) |
AT (1) | ATE547929T1 (de) |
WO (1) | WO2008022249A2 (de) |
Families Citing this family (32)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7764509B2 (en) * | 2006-12-20 | 2010-07-27 | Spirit Aerosystems, Inc. | Method and apparatus for interfacing components |
US7746654B2 (en) * | 2007-06-07 | 2010-06-29 | Hewlett-Packard Development Company, L.P. | Adaptable plug-in mezzanine card for blade servers |
US8300417B2 (en) * | 2007-12-11 | 2012-10-30 | Bae Systems Information And Electronic Systems Integration Inc. | Apparatus for adapting mezzanine cards |
DE102008033173A1 (de) * | 2008-07-15 | 2010-02-04 | Fujitsu Siemens Computers Gmbh | Befestigungsanordnung für ein Sicherheitsmodul und Verwendung einer Schraube zur Befestigung eines Sicherheitsmoduls |
JP4934710B2 (ja) * | 2009-10-20 | 2012-05-16 | 能美防災株式会社 | 火災報知設備用中継器 |
US8169781B2 (en) * | 2010-04-06 | 2012-05-01 | Fsp Technology Inc. | Power supply and heat dissipation module thereof |
US20110311013A1 (en) * | 2010-06-21 | 2011-12-22 | Lockheed Martin Corporation | System and apparatus for plant monitoring and control |
US10133636B2 (en) | 2013-03-12 | 2018-11-20 | Formulus Black Corporation | Data storage and retrieval mediation system and methods for using same |
US9304703B1 (en) | 2015-04-15 | 2016-04-05 | Symbolic Io Corporation | Method and apparatus for dense hyper IO digital retention |
US9817728B2 (en) | 2013-02-01 | 2017-11-14 | Symbolic Io Corporation | Fast system state cloning |
CN103365377B (zh) * | 2013-06-28 | 2017-05-10 | 曙光信息产业股份有限公司 | 一种机柜立柱、背板、槽位识别***及方法 |
GB2528464A (en) | 2014-07-22 | 2016-01-27 | Ibm | Data processing system with balcony boards |
USD777123S1 (en) * | 2014-07-24 | 2017-01-24 | Allen-Vanguard Corporation | Mezzanine board |
US10061514B2 (en) | 2015-04-15 | 2018-08-28 | Formulus Black Corporation | Method and apparatus for dense hyper IO digital retention |
US10367284B2 (en) | 2015-07-27 | 2019-07-30 | Hewlett Packard Enterprise Development Lp | Socket to support boards in a spaced relation |
WO2017023257A1 (en) | 2015-07-31 | 2017-02-09 | Hewlett Packard Enterprise Development Lp | Multi-chip module |
WO2017023254A1 (en) * | 2015-07-31 | 2017-02-09 | Hewlett Packard Enterprise Development Lp | Heat exchangers |
US20170147044A1 (en) * | 2015-11-23 | 2017-05-25 | General Electric Company | Mezzanine filler module apparatuses and methods for computing devices |
US9603251B1 (en) | 2016-03-09 | 2017-03-21 | Symbolic Io Corporation | Apparatus and method of midplane panel connections |
US10051729B2 (en) | 2016-09-21 | 2018-08-14 | Seagate Technology Llc | Configuration element for printed circuit board assemblies |
US10197755B1 (en) * | 2016-11-22 | 2019-02-05 | Triad National Security, Llc | Fiber optic transceiver FPGA mezzanine card (FMC) |
US10528092B2 (en) | 2017-04-05 | 2020-01-07 | International Business Machines Corporation | Midplane anti-codocking interlock system |
US10572186B2 (en) | 2017-12-18 | 2020-02-25 | Formulus Black Corporation | Random access memory (RAM)-based computer systems, devices, and methods |
US11029985B2 (en) | 2018-01-19 | 2021-06-08 | Ge Aviation Systems Llc | Processor virtualization in unmanned vehicles |
US11032919B2 (en) * | 2018-01-19 | 2021-06-08 | Ge Aviation Systems Llc | Control boxes and system-on-module circuit boards for unmanned vehicles |
US10827629B2 (en) * | 2018-01-19 | 2020-11-03 | Ge Aviation Systems Llc | Control boxes and system-on-module circuit boards for unmanned vehicles |
US10942509B2 (en) | 2018-01-19 | 2021-03-09 | Ge Aviation Systems Llc | Heterogeneous processing in unmanned vehicles |
WO2019156634A1 (en) * | 2018-02-09 | 2019-08-15 | National University Of Singapore | Apparatus and method for configuring small satellites |
WO2020142431A1 (en) | 2019-01-02 | 2020-07-09 | Formulus Black Corporation | Systems and methods for memory failure prevention, management, and mitigation |
US11419239B2 (en) * | 2020-06-24 | 2022-08-16 | Micron Technology, Inc. | Thermal management of circuit boards |
US11978971B2 (en) * | 2021-07-15 | 2024-05-07 | Dell Products, L.P. | Toolless information handling system Compression attached memory module installation apparatus, systems, and methods |
US11937393B2 (en) * | 2021-11-16 | 2024-03-19 | Arinc Incorporated | Circuit board assembly and system for communication to an access point of an avionics network |
Family Cites Families (19)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2120197A5 (de) * | 1970-08-04 | 1972-08-18 | Lannionnais Electronique | |
US4998180A (en) * | 1989-05-23 | 1991-03-05 | Clearpoint Research Corporation | Bus device with closely spaced double sided daughter board |
US5257379A (en) * | 1991-09-04 | 1993-10-26 | International Business Machines Corporation | Establishing synchronization of hardware and software I/O configuration definitions |
US5793998A (en) * | 1996-04-17 | 1998-08-11 | Digital Equipment Corporation | Method and apparatus for interconnection of multiple modules |
US5903439A (en) * | 1998-05-18 | 1999-05-11 | Unisys Corporation | Mezzanine connector assembly |
US6389499B1 (en) | 1999-06-09 | 2002-05-14 | Western Digital Ventures, Inc. | Integrated computer module |
US6542952B1 (en) * | 2000-02-08 | 2003-04-01 | Motorola, Inc. | PCI computer system having a transition module and method of operation |
US6587351B2 (en) * | 2001-04-05 | 2003-07-01 | Cooper Technologies | Surface mount standoff for printed circuit board assembly |
US6762939B2 (en) * | 2002-02-20 | 2004-07-13 | Intel Corporation | Thermal solution for a mezzanine card |
US7082487B2 (en) * | 2002-02-20 | 2006-07-25 | Spectrum Signal Processing, Inc. | Multiple configurable I/O common mezzanine cards |
SG101536A1 (en) * | 2002-03-30 | 2004-01-30 | Inst Of Microelectronics | A high frequency board-to-board connector |
US7212961B2 (en) * | 2002-08-30 | 2007-05-01 | Lsi Logic Corporation | Interface for rapid prototyping system |
US6983385B2 (en) * | 2002-09-30 | 2006-01-03 | Motorola, Inc. | Configurable baseboard to power a mezzanine card and method |
US7042734B2 (en) * | 2003-01-23 | 2006-05-09 | Hewlett-Packard Development Company, L.P. | Multi-slot CompactPCI blade assembly |
US20040190274A1 (en) * | 2003-03-27 | 2004-09-30 | Yoshio Saito | Compact low cost plastic MCM to PCB |
US6924437B1 (en) * | 2003-04-10 | 2005-08-02 | Cisco Technology, Inc. | Techniques for coupling an object to a circuit board using a surface mount coupling device |
US7038914B2 (en) * | 2003-06-20 | 2006-05-02 | Apple Computer, Inc. | Processor module mounting assembly and a method of use |
US6951466B2 (en) * | 2003-09-02 | 2005-10-04 | Hewlett-Packard Development Company, L.P. | Attachment plate for directly mating circuit boards |
US6805560B1 (en) * | 2003-09-02 | 2004-10-19 | Intel Corporation | Apparatus interconnecting circuit board and mezzanine card or cards |
-
2007
- 2007-08-13 US US11/837,666 patent/US7539026B2/en active Active
- 2007-08-16 EP EP07814163A patent/EP2057873B1/de active Active
- 2007-08-16 AT AT07814163T patent/ATE547929T1/de active
- 2007-08-16 WO PCT/US2007/076084 patent/WO2008022249A2/en active Application Filing
Also Published As
Publication number | Publication date |
---|---|
EP2057873A4 (de) | 2010-05-05 |
WO2008022249A2 (en) | 2008-02-21 |
WO2008022249A3 (en) | 2008-10-16 |
US7539026B2 (en) | 2009-05-26 |
US20080043448A1 (en) | 2008-02-21 |
EP2057873A2 (de) | 2009-05-13 |
EP2057873B1 (de) | 2012-02-29 |
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