ATE544323T1 - Montagesubstrat und herstellungsverfahren dafür - Google Patents

Montagesubstrat und herstellungsverfahren dafür

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Publication number
ATE544323T1
ATE544323T1 AT08013359T AT08013359T ATE544323T1 AT E544323 T1 ATE544323 T1 AT E544323T1 AT 08013359 T AT08013359 T AT 08013359T AT 08013359 T AT08013359 T AT 08013359T AT E544323 T1 ATE544323 T1 AT E544323T1
Authority
AT
Austria
Prior art keywords
electronic components
production method
insulating layer
mounting substrate
plate
Prior art date
Application number
AT08013359T
Other languages
English (en)
Inventor
Yoshikazu Kanemaru
Kenichi Kawabata
Original Assignee
Tdk Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tdk Corp filed Critical Tdk Corp
Application granted granted Critical
Publication of ATE544323T1 publication Critical patent/ATE544323T1/de

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
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    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
    • H05K3/0052—Depaneling, i.e. dividing a panel into circuit boards; Working of the edges of circuit boards
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    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
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    • H01L23/538—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates
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    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09136—Means for correcting warpage
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10636—Leadless chip, e.g. chip capacitor or resistor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10674—Flip chip
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/20—Details of printed circuits not provided for in H05K2201/01 - H05K2201/10
    • H05K2201/2009—Reinforced areas, e.g. for a specific part of a flexible printed circuit
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0147—Carriers and holders
    • H05K2203/0169—Using a temporary frame during processing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/14—Related to the order of processing steps
    • H05K2203/1461—Applying or finishing the circuit pattern after another process, e.g. after filling of vias with conductive paste, after making printed resistors
    • H05K2203/1469—Circuit made after mounting or encapsulation of the components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4602—Manufacturing multilayer circuits characterized by a special circuit board as base or central core whereon additional circuit layers are built or additional circuit boards are laminated
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Geometry (AREA)
  • Structure Of Printed Boards (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
AT08013359T 2007-07-25 2008-07-24 Montagesubstrat und herstellungsverfahren dafür ATE544323T1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2007193844A JP4487271B2 (ja) 2007-07-25 2007-07-25 集合基板及びその製造方法

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EP (1) EP2019572B1 (de)
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JP2014112632A (ja) * 2012-11-09 2014-06-19 Ibiden Co Ltd 複合配線板
JP2014096468A (ja) * 2012-11-09 2014-05-22 Ibiden Co Ltd 複合配線板及び複合配線板の製造方法
JP2015170631A (ja) * 2014-03-05 2015-09-28 イビデン株式会社 複合配線板
CN105378912B (zh) * 2014-06-09 2018-12-28 三菱电机株式会社 半导体封装件的制造方法以及半导体封装件
US9997428B2 (en) 2015-07-14 2018-06-12 Avago Technologies General Ip (Singapore) Pte. Ltd. Via structures for thermal dissipation
US10129972B2 (en) 2015-10-30 2018-11-13 Avago Technologies International Sales Pte. Limited Frame elements for package structures comprising printed circuit boards (PCBs)
TWI645973B (zh) * 2017-12-15 2019-01-01 律勝科技股份有限公司 聚醯亞胺薄化軟性基板及其製造方法
KR102639895B1 (ko) * 2019-01-21 2024-02-23 삼성전자주식회사 인쇄 회로 기판이 시뮬레이션을 위한 컴퓨터-구현 방법, 프로세서-구현 시스템, 그리고 명령들을 저장하는 비임시의 컴퓨터로 독출 가능한 저장 매체
US11277917B2 (en) 2019-03-12 2022-03-15 Advanced Semiconductor Engineering, Inc. Embedded component package structure, embedded type panel substrate and manufacturing method thereof
US10950551B2 (en) 2019-04-29 2021-03-16 Advanced Semiconductor Engineering, Inc. Embedded component package structure and manufacturing method thereof
US11296030B2 (en) 2019-04-29 2022-04-05 Advanced Semiconductor Engineering, Inc. Embedded component package structure and manufacturing method thereof
US11848280B2 (en) 2020-11-25 2023-12-19 ADVANCED SEMlCONDUCTOR ENGINEERING, INC. Method for manufacturing assembly structure by using frame structure on substrate
CN113953568B (zh) * 2021-10-22 2024-05-28 深圳市众博信发展有限公司 一种pcb板自动成型铣削***

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US20090025965A1 (en) 2009-01-29
CN101355850A (zh) 2009-01-28
CN101355850B (zh) 2010-10-20
JP4487271B2 (ja) 2010-06-23
EP2019572B1 (de) 2012-02-01
JP2009032826A (ja) 2009-02-12
EP2019572A3 (de) 2010-10-20
US8502081B2 (en) 2013-08-06
EP2019572A2 (de) 2009-01-28

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