ATE534270T1 - Kühlung einer elektrischen geräteeinheit - Google Patents
Kühlung einer elektrischen geräteeinheitInfo
- Publication number
- ATE534270T1 ATE534270T1 AT03812201T AT03812201T ATE534270T1 AT E534270 T1 ATE534270 T1 AT E534270T1 AT 03812201 T AT03812201 T AT 03812201T AT 03812201 T AT03812201 T AT 03812201T AT E534270 T1 ATE534270 T1 AT E534270T1
- Authority
- AT
- Austria
- Prior art keywords
- cooling
- electric appliance
- appliance unit
- electric
- cooling channel
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2089—Modifications to facilitate cooling, ventilating, or heating for power electronics, e.g. for inverters for controlling motor
- H05K7/20909—Forced ventilation, e.g. on heat dissipaters coupled to components
- H05K7/20918—Forced ventilation, e.g. on heat dissipaters coupled to components the components being isolated from air flow, e.g. hollow heat sinks, wind tunnels or funnels
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
- H01L23/467—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Thermal Sciences (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Motorcycle And Bicycle Frame (AREA)
- Cookers (AREA)
- Cleaning And Drying Hair (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FI20022142A FI117815B (fi) | 2002-12-04 | 2002-12-04 | Sähkökojeyksikön jäähdytys |
PCT/FI2003/000931 WO2004052067A1 (en) | 2002-12-04 | 2003-12-04 | Cooling of electric appliance unit |
Publications (1)
Publication Number | Publication Date |
---|---|
ATE534270T1 true ATE534270T1 (de) | 2011-12-15 |
Family
ID=8565033
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
AT03812201T ATE534270T1 (de) | 2002-12-04 | 2003-12-04 | Kühlung einer elektrischen geräteeinheit |
Country Status (6)
Country | Link |
---|---|
EP (1) | EP1568260B1 (de) |
AT (1) | ATE534270T1 (de) |
AU (1) | AU2003302565B2 (de) |
ES (1) | ES2379431T3 (de) |
FI (1) | FI117815B (de) |
WO (1) | WO2004052067A1 (de) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8472194B2 (en) * | 2010-05-05 | 2013-06-25 | Custom Sensors & Technologies, Inc. | Solid state switching device with integral heatsink |
BE1029900B1 (de) * | 2021-11-05 | 2023-06-05 | Phoenix Contact Gmbh & Co | Gehäuse zur Aufnahme einer elektrischen Wärmequelle |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0034223A1 (de) * | 1980-02-18 | 1981-08-26 | BBC Aktiengesellschaft Brown, Boveri & Cie. | Luftkanal zur Kühlung von Halbleiterelementen |
JPH0432299A (ja) * | 1990-05-29 | 1992-02-04 | Fuji Electric Co Ltd | 電子機器の冷却装置 |
DE4401607C2 (de) * | 1994-01-20 | 1997-04-10 | Siemens Ag | Kühleinheit für Leistungshalbleiter |
JPH1020081A (ja) * | 1996-07-09 | 1998-01-23 | Toshiba Corp | 原子力発電所の海水冷却系設備 |
-
2002
- 2002-12-04 FI FI20022142A patent/FI117815B/fi not_active IP Right Cessation
-
2003
- 2003-12-04 WO PCT/FI2003/000931 patent/WO2004052067A1/en not_active Application Discontinuation
- 2003-12-04 EP EP03812201A patent/EP1568260B1/de not_active Expired - Lifetime
- 2003-12-04 AU AU2003302565A patent/AU2003302565B2/en not_active Ceased
- 2003-12-04 ES ES03812201T patent/ES2379431T3/es not_active Expired - Lifetime
- 2003-12-04 AT AT03812201T patent/ATE534270T1/de active
Also Published As
Publication number | Publication date |
---|---|
ES2379431T3 (es) | 2012-04-26 |
WO2004052067A1 (en) | 2004-06-17 |
EP1568260B1 (de) | 2011-11-16 |
FI20022142A0 (fi) | 2002-12-04 |
FI20022142A (fi) | 2004-06-05 |
AU2003302565B2 (en) | 2008-04-17 |
EP1568260A1 (de) | 2005-08-31 |
AU2003302565A1 (en) | 2004-06-23 |
FI117815B (fi) | 2007-02-28 |
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