ATE532231T1 - Hohlleiter in einer leiterplatte - Google Patents

Hohlleiter in einer leiterplatte

Info

Publication number
ATE532231T1
ATE532231T1 AT02752720T AT02752720T ATE532231T1 AT E532231 T1 ATE532231 T1 AT E532231T1 AT 02752720 T AT02752720 T AT 02752720T AT 02752720 T AT02752720 T AT 02752720T AT E532231 T1 ATE532231 T1 AT E532231T1
Authority
AT
Austria
Prior art keywords
circuit board
hollow conductor
trench
forming
printed circuit
Prior art date
Application number
AT02752720T
Other languages
English (en)
Inventor
Gary Brist
Charles Mejia
William Alger
Gary Long
Original Assignee
Intel Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Intel Corp filed Critical Intel Corp
Application granted granted Critical
Publication of ATE532231T1 publication Critical patent/ATE532231T1/de

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0237—High frequency adaptations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P11/00—Apparatus or processes specially adapted for manufacturing waveguides or resonators, lines, or other devices of the waveguide type
    • H01P11/001—Manufacturing waveguides or transmission lines of the waveguide type
    • H01P11/002—Manufacturing hollow waveguides
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0364—Conductor shape
    • H05K2201/037—Hollow conductors, i.e. conductors partially or completely surrounding a void, e.g. hollow waveguides
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0388—Other aspects of conductors
    • H05K2201/0394—Conductor crossing over a hole in the substrate or a gap between two separate substrate parts
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09036—Recesses or grooves in insulating substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/09981—Metallised walls
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0017—Etching of the substrate by chemical or physical means

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Structure Of Printed Boards (AREA)
  • Waveguides (AREA)
AT02752720T 2001-09-27 2002-08-07 Hohlleiter in einer leiterplatte ATE532231T1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US09/963,637 US6882762B2 (en) 2001-09-27 2001-09-27 Waveguide in a printed circuit board and method of forming the same
PCT/US2002/025012 WO2003028147A1 (en) 2001-09-27 2002-08-07 Waveguide in a printed circuit board

Publications (1)

Publication Number Publication Date
ATE532231T1 true ATE532231T1 (de) 2011-11-15

Family

ID=25507500

Family Applications (1)

Application Number Title Priority Date Filing Date
AT02752720T ATE532231T1 (de) 2001-09-27 2002-08-07 Hohlleiter in einer leiterplatte

Country Status (5)

Country Link
US (1) US6882762B2 (de)
EP (1) EP1433221B1 (de)
CN (1) CN1596485B (de)
AT (1) ATE532231T1 (de)
WO (1) WO2003028147A1 (de)

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KR100483622B1 (ko) * 2002-08-16 2005-04-19 삼성전기주식회사 광도파로 소자를 인쇄회로기판에 부착하는 방법
TWI282015B (en) * 2003-08-22 2007-06-01 Hon Hai Prec Ind Co Ltd Process about a reflective film of a light guide plate
US20050063637A1 (en) * 2003-09-22 2005-03-24 Mershon Jayne L. Connecting a component with an embedded optical fiber
US20050063638A1 (en) * 2003-09-24 2005-03-24 Alger William O. Optical fibers embedded in a printed circuit board
KR20050076742A (ko) * 2004-01-22 2005-07-27 마츠시타 덴끼 산교 가부시키가이샤 광전송로 기판의 제조방법, 광전송로 기판, 광전송로내장기판, 광전송로 내장기판의 제조방법 및 데이터처리장치
US20070145595A1 (en) * 2005-12-27 2007-06-28 Hall Stephen H High speed interconnect
US20070154156A1 (en) * 2005-12-30 2007-07-05 Gary Brist Imprinted waveguide printed circuit board structure
US20070274656A1 (en) * 2005-12-30 2007-11-29 Brist Gary A Printed circuit board waveguide
US20070154157A1 (en) * 2005-12-30 2007-07-05 Horine Bryce D Quasi-waveguide printed circuit board structure
US7480435B2 (en) 2005-12-30 2009-01-20 Intel Corporation Embedded waveguide printed circuit board structure
JP4711895B2 (ja) * 2006-02-03 2011-06-29 ホシデン株式会社 光電フレキシブル配線板の接続構造、並びにコネクタ及び光電フレキシブル配線板
US7800459B2 (en) * 2006-12-29 2010-09-21 Intel Corporation Ultra-high bandwidth interconnect for data transmission
US20090041409A1 (en) * 2007-08-06 2009-02-12 Xyratex Technology Limited electro-optical printed circuit board and a method of making an electro-optical printed circuit board
JP4928499B2 (ja) * 2008-05-14 2012-05-09 日東電工株式会社 回路付サスペンション基板
JP2010015641A (ja) * 2008-07-04 2010-01-21 Nitto Denko Corp 回路付サスペンション基板およびその製造方法
JP4989572B2 (ja) * 2008-07-07 2012-08-01 日東電工株式会社 回路付サスペンション基板およびその製造方法
JP5374106B2 (ja) * 2008-09-26 2013-12-25 ネオフォトニクス・セミコンダクタ合同会社 半導体光機能デバイス
JP5204738B2 (ja) * 2009-10-16 2013-06-05 日東電工株式会社 回路付サスペンション基板およびその製造方法
JP5227940B2 (ja) * 2009-11-26 2013-07-03 日東電工株式会社 回路付サスペンション基板
WO2012094722A1 (en) * 2011-01-12 2012-07-19 Research In Motion Limited Printed circuit board with an acoustic channel for a microphone
US9544678B2 (en) * 2011-01-12 2017-01-10 Blackberry Limited Printed circuit board with an acoustic channel for a microphone
US8748750B2 (en) 2011-07-08 2014-06-10 Honeywell International Inc. Printed board assembly interface structures
US9142497B2 (en) 2011-10-05 2015-09-22 Harris Corporation Method for making electrical structure with air dielectric and related electrical structures
US9144150B2 (en) 2012-04-20 2015-09-22 Xilinx, Inc. Conductor structure with integrated via element
DE102013226066A1 (de) * 2013-12-16 2015-06-18 Siemens Aktiengesellschaft Planartransformator und elektrisches Bauteil
CN107454989B (zh) * 2015-01-27 2020-10-27 奥特斯奥地利科技与***技术有限公司 电子组件和用于制造电子组件的方法
CN104795620B (zh) * 2015-04-10 2017-08-25 电子科技大学 一种太赫兹波导无源器件的制造方法
KR101927576B1 (ko) * 2016-01-18 2018-12-11 한국과학기술원 Em-터널이 내장된 구조를 갖는 인쇄회로기판 및 그 제작 방법
WO2017186913A1 (en) 2016-04-28 2017-11-02 At&S Austria Technologie & Systemtechnik Aktiengesellschaft Component carrier with integrated antenna arrangement, electronic apparatus, radio communication method
US9947981B1 (en) 2016-05-19 2018-04-17 National Technology & Engineering Solutions of Sandian, LLC Waveguide module comprising a first plate with a waveguide channel and a second plate with a raised portion in which a sealing layer is forced into the waveguide channel by the raised portion
DE102019200893B4 (de) * 2019-01-21 2023-06-15 Infineon Technologies Ag Verfahren zum Erzeugen eines Hohlleiters, Schaltungsvorrichtung und Radarsystem
EP3903376A1 (de) * 2019-12-20 2021-11-03 2pi-Labs GmbH Hohlleiteranordnung
TWI772096B (zh) * 2021-07-07 2022-07-21 先豐通訊股份有限公司 具有波導的電路板及其製造方法

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US3150336A (en) 1960-12-08 1964-09-22 Ibm Coupling between and through stacked circuit planes by means of aligned waeguide sections
US3157847A (en) 1961-07-11 1964-11-17 Robert M Williams Multilayered waveguide circuitry formed by stacking plates having surface grooves
US5381596A (en) 1993-02-23 1995-01-17 E-Systems, Inc. Apparatus and method of manufacturing a 3-dimensional waveguide
US5562838A (en) * 1993-03-29 1996-10-08 Martin Marietta Corporation Optical light pipe and microwave waveguide interconnects in multichip modules formed using adaptive lithography
US6043861A (en) * 1995-06-05 2000-03-28 Motorola, Inc. Optical waveguide using cholesteric liquid crystal polymer
US5617294A (en) * 1995-09-29 1997-04-01 Intel Corporation Apparatus for removing heat from an integrated circuit package that is attached to a printed circuit board
JP3218996B2 (ja) * 1996-11-28 2001-10-15 松下電器産業株式会社 ミリ波導波路
US5929728A (en) 1997-06-25 1999-07-27 Hewlett-Packard Company Imbedded waveguide structures for a microwave circuit package
US6000120A (en) * 1998-04-16 1999-12-14 Motorola, Inc. Method of making coaxial transmission lines on a printed circuit board
US6185354B1 (en) 1998-05-15 2001-02-06 Motorola, Inc. Printed circuit board having integral waveguide
DE19838519A1 (de) 1998-08-25 2000-03-02 Bosch Gmbh Robert Leiterplatte und Verfahren zur Herstellung
US6282358B1 (en) * 1998-12-21 2001-08-28 Lsi Logic Corporation On-chip single layer horizontal deflecting waveguide and damascene method of fabricating the same
US6539157B2 (en) * 2000-12-28 2003-03-25 Honeywell Advanced Circuits, Inc. Layered circuit boards and methods of production thereof
US6839478B2 (en) * 2001-05-01 2005-01-04 Terraop Ltd. Optical switching system based on hollow waveguides

Also Published As

Publication number Publication date
WO2003028147A1 (en) 2003-04-03
US6882762B2 (en) 2005-04-19
CN1596485A (zh) 2005-03-16
EP1433221A1 (de) 2004-06-30
CN1596485B (zh) 2010-12-01
US20030059151A1 (en) 2003-03-27
EP1433221B1 (de) 2011-11-02

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