ATE531246T1 - Geschichteter wärmeartikel - Google Patents

Geschichteter wärmeartikel

Info

Publication number
ATE531246T1
ATE531246T1 AT06784340T AT06784340T ATE531246T1 AT E531246 T1 ATE531246 T1 AT E531246T1 AT 06784340 T AT06784340 T AT 06784340T AT 06784340 T AT06784340 T AT 06784340T AT E531246 T1 ATE531246 T1 AT E531246T1
Authority
AT
Austria
Prior art keywords
layered heat
heat article
article
layered
graphite
Prior art date
Application number
AT06784340T
Other languages
English (en)
Inventor
David S Flaherty
Gary D Shives
Original Assignee
Graftech Int Holdings Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Graftech Int Holdings Inc filed Critical Graftech Int Holdings Inc
Application granted granted Critical
Publication of ATE531246T1 publication Critical patent/ATE531246T1/de

Links

Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F21/00—Constructions of heat-exchange apparatus characterised by the selection of particular materials
    • F28F21/02—Constructions of heat-exchange apparatus characterised by the selection of particular materials of carbon, e.g. graphite
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H01L23/3735—Laminates or multilayers, e.g. direct bond copper ceramic substrates
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D21/00—Heat-exchange apparatus not covered by any of the groups F28D1/00 - F28D20/00
    • F28D2021/0019—Other heat exchangers for particular applications; Heat exchange systems not otherwise provided for
    • F28D2021/0028—Other heat exchangers for particular applications; Heat exchange systems not otherwise provided for for cooling heat generating elements, e.g. for cooling electronic components or electric devices
    • F28D2021/0029—Heat sinks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Materials Engineering (AREA)
  • Thermal Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Laminated Bodies (AREA)
  • Carbon And Carbon Compounds (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Thermotherapy And Cooling Therapy Devices (AREA)
AT06784340T 2005-04-11 2006-03-31 Geschichteter wärmeartikel ATE531246T1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US11/103,348 US20060225874A1 (en) 2005-04-11 2005-04-11 Sandwiched thermal article
PCT/US2006/012102 WO2006132695A2 (en) 2005-04-11 2006-03-31 Sandwiched thermal article

Publications (1)

Publication Number Publication Date
ATE531246T1 true ATE531246T1 (de) 2011-11-15

Family

ID=37082062

Family Applications (1)

Application Number Title Priority Date Filing Date
AT06784340T ATE531246T1 (de) 2005-04-11 2006-03-31 Geschichteter wärmeartikel

Country Status (5)

Country Link
US (1) US20060225874A1 (de)
EP (1) EP1875790B1 (de)
AT (1) ATE531246T1 (de)
ES (1) ES2375375T3 (de)
WO (1) WO2006132695A2 (de)

Families Citing this family (30)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2007122033A1 (en) 2006-04-21 2007-11-01 Oce-Technologies B.V. Heat exchange unit for a printing system
WO2007122198A1 (en) 2006-04-21 2007-11-01 Oce-Technologies B.V. Heat exchange laminate
WO2007142273A1 (ja) * 2006-06-08 2007-12-13 International Business Machines Corporation 高熱伝導で柔軟なシート
MX2009012704A (es) 2007-05-30 2009-12-08 Hoffmann La Roche Inhibidores de transcriptasa inversa de no nucleosidos.
US20100321897A1 (en) * 2009-06-17 2010-12-23 Laird Technologies, Inc. Compliant multilayered thermally-conductive interface assemblies
US8081468B2 (en) 2009-06-17 2011-12-20 Laird Technologies, Inc. Memory modules including compliant multilayered thermally-conductive interface assemblies
TW201136502A (en) * 2010-04-07 2011-10-16 Ascend Top Entpr Co Ltd Thin type heat dissipation device
US8372532B2 (en) * 2010-05-04 2013-02-12 GM Global Technology Operations LLC Secondary battery module and composite article thereof
US20120033384A1 (en) * 2010-08-06 2012-02-09 Pillai Unnikrishnan G Graphite wrapped heat spreading pillow
FI2633746T3 (fi) * 2010-10-26 2023-07-24 Henkel Ag & Co Kgaa Piirilevytasoiseen EMI-suojaukseen tarkoitettu komposiittikalvo
JP5978457B2 (ja) * 2012-03-19 2016-08-24 パナソニックＩｐマネジメント株式会社 熱伝導体
US20130327508A1 (en) * 2012-06-07 2013-12-12 Mark A. Zaffetti Cold plate assembly incorporating thermal heat spreader
WO2014154831A1 (en) * 2013-03-29 2014-10-02 Oce-Technologies B.V. Heat exchange laminate
CN105122147A (zh) * 2013-03-29 2015-12-02 奥西-技术有限公司 热交换层压板
US9312580B2 (en) 2013-07-30 2016-04-12 Johnson Controls Technology Company Battery module with phase change material
US8861191B1 (en) 2013-09-30 2014-10-14 Google Inc. Apparatus related to a structure of a base portion of a computing device
US9430006B1 (en) 2013-09-30 2016-08-30 Google Inc. Computing device with heat spreader
US20150096731A1 (en) * 2013-10-04 2015-04-09 Specialty Minerals (Michigan) Inc. Device and System for Dissipating Heat, and Method of Making Same
US9706684B2 (en) 2013-12-26 2017-07-11 Terrella Energy Systems Ltd. Exfoliated graphite materials and composite materials and devices for thermal management
US9700968B2 (en) 2013-12-26 2017-07-11 Terrella Energy Systems Ltd. Apparatus and methods for processing exfoliated graphite materials
US9442514B1 (en) 2014-07-23 2016-09-13 Google Inc. Graphite layer between carbon layers
US10281043B2 (en) * 2015-07-10 2019-05-07 Lockheed Martin Corporation Carbon nanotube based thermal gasket for space vehicles
JP2017028280A (ja) * 2015-07-20 2017-02-02 アールエヌユー カンパニー リミテッド 高性能電磁波シールド及び高放熱複合機能シート
ES2746161T3 (es) * 2015-09-07 2020-03-04 Hak Sik Joo Lámina compleja para la absorción/extinción y el blindaje contra las ondas electromagnéticas, y para la elevada disipación de calor de un dispositivo electrónico y procedimiento de fabricación de la misma
US9736923B1 (en) * 2017-01-17 2017-08-15 Northrop Grumman Systems Corporation Alloy bonded graphene sheets for enhanced thermal spreaders
EP3392906A1 (de) * 2017-04-19 2018-10-24 Siemens Aktiengesellschaft Verfahren zur herstellung einer kühlplatte für einen leistungshalbleiter
US11840013B2 (en) 2018-02-27 2023-12-12 Matthews International Corporation Graphite materials and devices with surface micro-texturing
JP2020053531A (ja) * 2018-09-26 2020-04-02 スリーエム イノベイティブ プロパティズ カンパニー 熱伝導性シート前駆体、並びに該前駆体から得られる熱伝導性シート及びその製造方法
US11483948B2 (en) 2019-08-28 2022-10-25 Laird Technologies, Inc. Thermal interface materials including memory foam cores
WO2021174006A1 (en) * 2020-02-28 2021-09-02 Neograf Solutions, Llc Thermal management system

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Publication number Priority date Publication date Assignee Title
GB991581A (en) * 1962-03-21 1965-05-12 High Temperature Materials Inc Expanded pyrolytic graphite and process for producing the same
US4591659A (en) * 1983-12-22 1986-05-27 Trw Inc. Multilayer printed circuit board structure
US4895713A (en) * 1987-08-31 1990-01-23 Union Carbide Corporation Intercalation of graphite
US4923000A (en) * 1989-03-03 1990-05-08 Microelectronics And Computer Technology Corporation Heat exchanger having piezoelectric fan means
JPH0721308Y2 (ja) * 1990-10-30 1995-05-17 信越化学工業株式会社 熱伝導性シート
US5375655A (en) * 1993-03-31 1994-12-27 Lee; Yong N. Heat sink apparatus
KR100261634B1 (ko) * 1995-01-11 2000-07-15 모리시타 요이찌 그래파이트클래드구조체
US5902762A (en) * 1997-04-04 1999-05-11 Ucar Carbon Technology Corporation Flexible graphite composite
US6026895A (en) * 1998-02-06 2000-02-22 Fujitsu Limited Flexible foil finned heatsink structure and method of making same
US6245400B1 (en) * 1998-10-07 2001-06-12 Ucar Graph-Tech Inc. Flexible graphite with non-carrier pressure sensitive adhesive backing and release liner
US6482520B1 (en) * 2000-02-25 2002-11-19 Jing Wen Tzeng Thermal management system
US6503626B1 (en) * 2000-02-25 2003-01-07 Graftech Inc. Graphite-based heat sink
US20020157818A1 (en) * 2001-04-04 2002-10-31 Julian Norley Anisotropic thermal solution
US6538892B2 (en) * 2001-05-02 2003-03-25 Graftech Inc. Radial finned heat sink
US6777086B2 (en) * 2001-08-31 2004-08-17 Julian Norley Laminates prepared from impregnated flexible graphite sheets
JP3938681B2 (ja) * 2001-11-21 2007-06-27 信越化学工業株式会社 放熱構造体
US6749010B2 (en) * 2002-06-28 2004-06-15 Advanced Energy Technology Inc. Composite heat sink with metal base and graphite fins
US6771502B2 (en) * 2002-06-28 2004-08-03 Advanced Energy Technology Inc. Heat sink made from longer and shorter graphite sheets
US20050155743A1 (en) * 2002-06-28 2005-07-21 Getz George Jr. Composite heat sink with metal base and graphite fins
US20040076810A1 (en) * 2002-10-17 2004-04-22 Ucar Carbon Company Inc. Composite high temperature insulator
DE202004007473U1 (de) 2004-05-10 2004-07-29 Richard Wöhr GmbH Lüfterloses Kühlsystem mit Wärmeleitrohr und mit doppelseitigem Mehrschichtenkühler
US7393587B2 (en) * 2004-09-17 2008-07-01 Graftech International Holdings Inc. Sandwiched finstock

Also Published As

Publication number Publication date
EP1875790A2 (de) 2008-01-09
US20060225874A1 (en) 2006-10-12
WO2006132695A3 (en) 2007-10-25
EP1875790A4 (de) 2009-10-21
ES2375375T3 (es) 2012-02-29
WO2006132695A2 (en) 2006-12-14
EP1875790B1 (de) 2011-10-26

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Legal Events

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