ATE526683T1 - Chipmasstabskennzeichner und verfahren zur kennzeichnung - Google Patents
Chipmasstabskennzeichner und verfahren zur kennzeichnungInfo
- Publication number
- ATE526683T1 ATE526683T1 AT03250518T AT03250518T ATE526683T1 AT E526683 T1 ATE526683 T1 AT E526683T1 AT 03250518 T AT03250518 T AT 03250518T AT 03250518 T AT03250518 T AT 03250518T AT E526683 T1 ATE526683 T1 AT E526683T1
- Authority
- AT
- Austria
- Prior art keywords
- marking
- theta lens
- wafer
- chip
- chip scale
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/544—Marks applied to semiconductor devices or parts, e.g. registration marks, alignment structures, wafer maps
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67282—Marking devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2223/00—Details relating to semiconductor or other solid state devices covered by the group H01L23/00
- H01L2223/544—Marks applied to semiconductor devices or parts
- H01L2223/54473—Marks applied to semiconductor devices or parts for use after dicing
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Laser Beam Processing (AREA)
- Length Measuring Devices By Optical Means (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- Length Measuring Devices With Unspecified Measuring Means (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Adornments (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR10-2002-0020412A KR100461024B1 (ko) | 2002-04-15 | 2002-04-15 | 칩 스케일 마커 및 마킹 방법 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| ATE526683T1 true ATE526683T1 (de) | 2011-10-15 |
Family
ID=28673097
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| AT03250518T ATE526683T1 (de) | 2002-04-15 | 2003-01-28 | Chipmasstabskennzeichner und verfahren zur kennzeichnung |
Country Status (8)
| Country | Link |
|---|---|
| US (1) | US6710286B2 (de) |
| EP (1) | EP1355350B1 (de) |
| JP (1) | JP4113786B2 (de) |
| KR (1) | KR100461024B1 (de) |
| AT (1) | ATE526683T1 (de) |
| MY (1) | MY122961A (de) |
| SG (1) | SG106120A1 (de) |
| TW (1) | TWI228816B (de) |
Families Citing this family (19)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20030024913A1 (en) * | 2002-04-15 | 2003-02-06 | Downes Joseph P. | Laser scanning method and system for marking articles such as printed circuit boards, integrated circuits and the like |
| US20040144760A1 (en) | 2002-05-17 | 2004-07-29 | Cahill Steven P. | Method and system for marking a workpiece such as a semiconductor wafer and laser marker for use therein |
| KR100584840B1 (ko) * | 2002-12-24 | 2006-05-30 | 주식회사 이오테크닉스 | 칩 스케일 마커 및 마킹위치 보정방법 |
| JP4684687B2 (ja) * | 2005-03-11 | 2011-05-18 | 株式会社ディスコ | ウエーハのレーザー加工方法および加工装置 |
| CN100397564C (zh) * | 2005-08-26 | 2008-06-25 | 南茂科技股份有限公司 | 晶圆的激光标示方法 |
| JP5132911B2 (ja) | 2006-10-03 | 2013-01-30 | 浜松ホトニクス株式会社 | レーザ加工方法 |
| KR100828074B1 (ko) * | 2006-11-22 | 2008-05-08 | 주식회사 이오테크닉스 | 칩 스케일 마킹 장치 및 이를 이용하는 칩 스케일 마킹방법 |
| US7760331B2 (en) * | 2007-02-20 | 2010-07-20 | Electro Scientific Industries, Inc. | Decoupled, multiple stage positioning system |
| US7829384B2 (en) * | 2007-09-25 | 2010-11-09 | Stats Chippac, Ltd. | Semiconductor device and method of laser-marking wafers with tape applied to its active surface |
| US8916416B2 (en) * | 2007-09-25 | 2014-12-23 | Stats Chippac, Ltd. | Semiconductor device and method of laser-marking laminate layer formed over eWLB with tape applied to opposite surface |
| SG152090A1 (en) * | 2007-10-23 | 2009-05-29 | Hypertronics Pte Ltd | Scan head calibration system and method |
| US20130256286A1 (en) * | 2009-12-07 | 2013-10-03 | Ipg Microsystems Llc | Laser processing using an astigmatic elongated beam spot and using ultrashort pulses and/or longer wavelengths |
| CN102639280A (zh) * | 2009-12-07 | 2012-08-15 | Jp赛席尔联合股份有限公司 | 激光加工及切割***与方法 |
| US9245786B2 (en) * | 2011-06-02 | 2016-01-26 | Applied Materials, Inc. | Apparatus and methods for positioning a substrate using capacitive sensors |
| US10112258B2 (en) * | 2012-03-30 | 2018-10-30 | View, Inc. | Coaxial distance measurement via folding of triangulation sensor optics path |
| KR20170051001A (ko) * | 2015-11-02 | 2017-05-11 | 주식회사 이오테크닉스 | 레이저 마킹장치 및 이를 이용하는 레이저 마킹방법 |
| KR101812209B1 (ko) * | 2016-02-16 | 2017-12-26 | 주식회사 이오테크닉스 | 레이저 마킹 장치 및 레이저 마킹 방법 |
| CN113035734B (zh) * | 2021-02-25 | 2024-03-08 | 北京华卓精科科技股份有限公司 | 一种硅片偏移量确定方法及硅片交接精度检测方法 |
| CN113959303B (zh) * | 2021-10-15 | 2024-02-02 | 晋西工业集团有限责任公司 | 一种旋压筒形件两端螺纹连接台间距的测量方法 |
Family Cites Families (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS55157231A (en) * | 1979-05-25 | 1980-12-06 | Chiyou Lsi Gijutsu Kenkyu Kumiai | Method of forming pattern by electron beam |
| JPS6012550A (ja) * | 1983-07-04 | 1985-01-22 | Nippon Kogaku Kk <Nikon> | 露光転写装置用マスク供給装置 |
| JP2770960B2 (ja) * | 1988-10-06 | 1998-07-02 | キヤノン株式会社 | Ｓｏｒ−ｘ線露光装置 |
| JPH04186646A (ja) * | 1990-11-19 | 1992-07-03 | Oki Electric Ind Co Ltd | 半導体素子のマーキング方法及びその半導体素子の固定方法 |
| JP2682475B2 (ja) * | 1994-11-17 | 1997-11-26 | 日本電気株式会社 | ビームスキャン式レーザマーキング方法および装置 |
| JPH0950951A (ja) * | 1995-08-04 | 1997-02-18 | Nikon Corp | リソグラフィ方法およびリソグラフィ装置 |
| WO1999016113A1 (fr) | 1997-09-19 | 1999-04-01 | Nikon Corporation | Platine, dispositif d'alignement de balayage et procede d'exposition de balayage, et dispositif fabrique par ce moyen |
| JP2000114129A (ja) * | 1998-10-09 | 2000-04-21 | Toshiba Corp | 半導体装置及びその製造方法 |
| KR100274206B1 (ko) * | 1998-10-21 | 2000-12-15 | 한효용 | 칩사이즈패키지의 마킹방법 및 장치 |
| KR20010073299A (ko) * | 2000-01-13 | 2001-08-01 | 성규동 | 웨이퍼 마킹 장치 |
| KR100319898B1 (ko) * | 2000-03-20 | 2002-01-10 | 윤종용 | 웨이퍼의 치수인자 측정방법 및 그 장치 |
-
2002
- 2002-04-15 KR KR10-2002-0020412A patent/KR100461024B1/ko active IP Right Grant
- 2002-09-03 US US10/232,746 patent/US6710286B2/en not_active Expired - Lifetime
-
2003
- 2003-01-24 SG SG200300167A patent/SG106120A1/en unknown
- 2003-01-24 MY MYPI20030248A patent/MY122961A/en unknown
- 2003-01-24 JP JP2003015633A patent/JP4113786B2/ja not_active Expired - Fee Related
- 2003-01-24 TW TW092101557A patent/TWI228816B/zh not_active IP Right Cessation
- 2003-01-28 AT AT03250518T patent/ATE526683T1/de not_active IP Right Cessation
- 2003-01-28 EP EP03250518A patent/EP1355350B1/de not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| KR20030081946A (ko) | 2003-10-22 |
| US20030192866A1 (en) | 2003-10-16 |
| MY122961A (en) | 2006-05-31 |
| US6710286B2 (en) | 2004-03-23 |
| JP4113786B2 (ja) | 2008-07-09 |
| TW200305269A (en) | 2003-10-16 |
| JP2003318074A (ja) | 2003-11-07 |
| EP1355350B1 (de) | 2011-09-28 |
| KR100461024B1 (ko) | 2004-12-13 |
| TWI228816B (en) | 2005-03-01 |
| EP1355350A3 (de) | 2005-04-20 |
| SG106120A1 (en) | 2004-09-30 |
| EP1355350A2 (de) | 2003-10-22 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| RER | Ceased as to paragraph 5 lit. 3 law introducing patent treaties |