ATE513354T1 - Leiterplatte für eine dreiphasen- leistungseinrichtung mit eingebetteten richtungs- impedanzsteuerkanälen - Google Patents

Leiterplatte für eine dreiphasen- leistungseinrichtung mit eingebetteten richtungs- impedanzsteuerkanälen

Info

Publication number
ATE513354T1
ATE513354T1 AT04776671T AT04776671T ATE513354T1 AT E513354 T1 ATE513354 T1 AT E513354T1 AT 04776671 T AT04776671 T AT 04776671T AT 04776671 T AT04776671 T AT 04776671T AT E513354 T1 ATE513354 T1 AT E513354T1
Authority
AT
Austria
Prior art keywords
switching device
circuit board
source node
common source
power device
Prior art date
Application number
AT04776671T
Other languages
English (en)
Inventor
Larry Sparling
Scott Repplinger
Eugene Wineinger
Original Assignee
Motorola Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Motorola Inc filed Critical Motorola Inc
Application granted granted Critical
Publication of ATE513354T1 publication Critical patent/ATE513354T1/de

Links

Classifications

    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02M—APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF
    • H02M7/00—Conversion of ac power input into dc power output; Conversion of dc power input into ac power output
    • H02M7/003—Constructional details, e.g. physical layout, assembly, wiring or busbar connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0237—High frequency adaptations
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0263—High current adaptations, e.g. printed high current conductors or using auxiliary non-printed means; Fine and coarse circuit patterns on one circuit board
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/115—Via connections; Lands around holes or via connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/095—Conductive through-holes or vias
    • H05K2201/09627—Special connections between adjacent vias, not for grounding vias
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/0979—Redundant conductors or connections, i.e. more than one current path between two points
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10151—Sensor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10166—Transistor
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Inverter Devices (AREA)
  • Combinations Of Printed Boards (AREA)
  • Structure Of Printed Boards (AREA)
AT04776671T 2003-07-09 2004-06-17 Leiterplatte für eine dreiphasen- leistungseinrichtung mit eingebetteten richtungs- impedanzsteuerkanälen ATE513354T1 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US48587403P 2003-07-09 2003-07-09
US10/721,030 US7154196B2 (en) 2003-07-09 2003-11-24 Printed circuit board for a three-phase power device having embedded directional impedance control channels
PCT/US2004/019247 WO2005011342A2 (en) 2003-07-09 2004-06-17 Embedded directional impedance control channels for pc boards

Publications (1)

Publication Number Publication Date
ATE513354T1 true ATE513354T1 (de) 2011-07-15

Family

ID=34107724

Family Applications (1)

Application Number Title Priority Date Filing Date
AT04776671T ATE513354T1 (de) 2003-07-09 2004-06-17 Leiterplatte für eine dreiphasen- leistungseinrichtung mit eingebetteten richtungs- impedanzsteuerkanälen

Country Status (5)

Country Link
US (1) US7154196B2 (de)
EP (1) EP1645023B1 (de)
JP (1) JP4286861B2 (de)
AT (1) ATE513354T1 (de)
WO (1) WO2005011342A2 (de)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8089776B2 (en) * 2006-06-19 2012-01-03 Sony Ericsson Mobile Communications Ab Side switch for a contact exposed on an edge of a circuit board and method
JP4977165B2 (ja) * 2009-04-01 2012-07-18 トヨタ自動車株式会社 ３相ブラシレスモータのノイズ低減構造
DE102011008952A1 (de) 2011-01-19 2012-07-19 Texas Instruments Deutschland Gmbh Mehrchipmodul, Verfahren zum Betreiben desselben und DC/DC-Wandler
US9831482B2 (en) 2013-09-06 2017-11-28 Johnson Controls Technology Company Battery module lid system and method
JP6922175B2 (ja) * 2016-09-01 2021-08-18 富士電機株式会社 電力変換装置
WO2018131086A1 (ja) * 2017-01-11 2018-07-19 東芝三菱電機産業システム株式会社 電力変換装置
WO2019056072A1 (en) 2017-09-22 2019-03-28 Janislav Sega SYSTEM AND METHOD FOR CONTROLLING AN ENGINE

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63314177A (ja) * 1987-06-16 1988-12-22 Mitsubishi Electric Corp インバ−タ装置
US5519633A (en) 1993-03-08 1996-05-21 International Business Machines Corporation Method and apparatus for the cross-sectional design of multi-layer printed circuit boards
US5528073A (en) * 1994-07-05 1996-06-18 Allen-Bradley Company, Inc. Bus bar having reduced parasitic inductances and equal current path lengths
US5532512A (en) * 1994-10-03 1996-07-02 General Electric Company Direct stacked and flip chip power semiconductor device structures
DE69535775D1 (de) * 1994-10-07 2008-08-07 Hitachi Ltd Halbleiteranordnung mit einer Mehrzahl von Halbleiterelementen
US5641944A (en) 1995-09-29 1997-06-24 Allen-Bradley Company, Inc. Power substrate with improved thermal characteristics
US5682298A (en) 1996-06-13 1997-10-28 Hewlett-Packard Company Balancing power distribution in a power supply system with redundant power sources
US5912809A (en) 1997-01-21 1999-06-15 Dell Usa, L.P. Printed circuit board (PCB) including channeled capacitive plane structure
US6462976B1 (en) 1997-02-21 2002-10-08 University Of Arkansas Conversion of electrical energy from one form to another, and its management through multichip module structures
JPH11177189A (ja) 1997-12-12 1999-07-02 Fujitsu Ltd プリント基板上配線の終端構造
US6072699A (en) * 1998-07-21 2000-06-06 Intel Corporation Method and apparatus for matching trace lengths of signal lines making 90°/180° turns
US6356162B1 (en) 1999-04-02 2002-03-12 Nordx/Cdt, Inc. Impedance compensation for a cable and connector
JP2000102253A (ja) * 1998-09-25 2000-04-07 Hitachi Ltd 電力変換装置
US6194990B1 (en) 1999-03-16 2001-02-27 Motorola, Inc. Printed circuit board with a multilayer integral thin-film metal resistor and method therefor
JP3819195B2 (ja) * 1999-11-12 2006-09-06 三菱電機株式会社 パワーモジュール
US7012811B1 (en) * 2000-05-10 2006-03-14 Micron Technology, Inc. Method of tuning a multi-path circuit
JP2002320391A (ja) * 2001-04-19 2002-10-31 Fuji Electric Co Ltd 大容量電力変換装置の導体構造
US20040061241A1 (en) * 2002-09-30 2004-04-01 Osburn Edward P. Semiconductor device power interconnect striping

Also Published As

Publication number Publication date
JP4286861B2 (ja) 2009-07-01
EP1645023A4 (de) 2009-07-01
WO2005011342A3 (en) 2005-04-28
US7154196B2 (en) 2006-12-26
EP1645023A2 (de) 2006-04-12
WO2005011342A2 (en) 2005-02-03
JP2007527684A (ja) 2007-09-27
US20050035816A1 (en) 2005-02-17
EP1645023B1 (de) 2011-06-15

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Legal Events

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