ATE512462T1 - Mikroelektronische wärmeabfuhrgehäusung und deren herstellungsverfahren - Google Patents

Mikroelektronische wärmeabfuhrgehäusung und deren herstellungsverfahren

Info

Publication number
ATE512462T1
ATE512462T1 AT02392016T AT02392016T ATE512462T1 AT E512462 T1 ATE512462 T1 AT E512462T1 AT 02392016 T AT02392016 T AT 02392016T AT 02392016 T AT02392016 T AT 02392016T AT E512462 T1 ATE512462 T1 AT E512462T1
Authority
AT
Austria
Prior art keywords
chip
heat dissipation
enclosure
production process
cavities
Prior art date
Application number
AT02392016T
Other languages
English (en)
Inventor
Randall M German
Lye-King Tan
John Johnson
Original Assignee
Advanced Materials Tech
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Advanced Materials Tech filed Critical Advanced Materials Tech
Application granted granted Critical
Publication of ATE512462T1 publication Critical patent/ATE512462T1/de

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427—Cooling by change of state, e.g. use of heat pipes
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0275—Arrangements for coupling heat-pipes together or with other structures, e.g. with base blocks; Heat pipe cores
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
    • H01L21/4814—Conductive parts
    • H01L21/4871—Bases, plates or heatsinks
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D2015/0225—Microheat pipes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/4935—Heat exchanger or boiler making
    • Y10T29/49353—Heat pipe device making

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Sustainable Development (AREA)
  • Thermal Sciences (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Powder Metallurgy (AREA)
AT02392016T 2001-08-28 2002-08-28 Mikroelektronische wärmeabfuhrgehäusung und deren herstellungsverfahren ATE512462T1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US31530601P 2001-08-28 2001-08-28

Publications (1)

Publication Number Publication Date
ATE512462T1 true ATE512462T1 (de) 2011-06-15

Family

ID=23223806

Family Applications (1)

Application Number Title Priority Date Filing Date
AT02392016T ATE512462T1 (de) 2001-08-28 2002-08-28 Mikroelektronische wärmeabfuhrgehäusung und deren herstellungsverfahren

Country Status (6)

Country Link
US (3) US6935022B2 (de)
EP (1) EP1296373B1 (de)
JP (1) JP2003193114A (de)
AT (1) ATE512462T1 (de)
ES (1) ES2371726T3 (de)
SG (2) SG120884A1 (de)

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CN101754654A (zh) * 2008-12-08 2010-06-23 富准精密工业(深圳)有限公司 传热基板及具有该传热基板的散热装置
TW201113494A (en) * 2009-10-08 2011-04-16 Ying-Tung Chen Heat dissipation structure and manufacturing method thereof
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US8759843B2 (en) 2011-08-30 2014-06-24 Abl Ip Holding Llc Optical/electrical transducer using semiconductor nanowire wicking structure in a thermal conductivity and phase transition heat transfer mechanism
US8710526B2 (en) 2011-08-30 2014-04-29 Abl Ip Holding Llc Thermal conductivity and phase transition heat transfer mechanism including optical element to be cooled by heat transfer of the mechanism
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CN103415192B (zh) * 2013-08-20 2015-09-23 南京理工大学 蒸汽腔热管/微通道冷板复合结构均温装置
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US9517507B2 (en) 2014-07-17 2016-12-13 Pratt & Whitney Canada Corp. Method of shaping green part and manufacturing method using same
US11397057B2 (en) * 2014-09-26 2022-07-26 Asia Vital Components Co., Ltd. Vapor chamber structure
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US20160263656A1 (en) 2015-03-12 2016-09-15 Pratt & Whitney Canada Corp. Method of forming a component from a green part
CN105157460A (zh) * 2015-08-24 2015-12-16 东华大学 一种以氨水为介质，不锈钢为材质的脉动热管换热器
BE1024200B1 (fr) * 2016-05-13 2017-12-12 Centre De Recherches Metallurgiques Asbl - Centrum Voor Research In De Metallurgie Vzw Système de contrôle thermique dynamique par matériaux à changement de phase
CN112191842B (zh) * 2020-09-10 2023-09-29 安徽德诠新材料科技有限公司 一种可多管烧结的导热管烧结模
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Also Published As

Publication number Publication date
EP1296373A2 (de) 2003-03-26
EP1296373A3 (de) 2006-10-04
US6935022B2 (en) 2005-08-30
US20050284616A1 (en) 2005-12-29
SG152908A1 (en) 2009-06-29
SG120884A1 (en) 2006-04-26
US20030042006A1 (en) 2003-03-06
US20060000584A1 (en) 2006-01-05
ES2371726T3 (es) 2012-01-09
JP2003193114A (ja) 2003-07-09
EP1296373B1 (de) 2011-06-08

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