ATE511100T1 - Vorrichtung und verfahren zum testen und zur beurteilung von elektromigration - Google Patents
Vorrichtung und verfahren zum testen und zur beurteilung von elektromigrationInfo
- Publication number
- ATE511100T1 ATE511100T1 AT08737637T AT08737637T ATE511100T1 AT E511100 T1 ATE511100 T1 AT E511100T1 AT 08737637 T AT08737637 T AT 08737637T AT 08737637 T AT08737637 T AT 08737637T AT E511100 T1 ATE511100 T1 AT E511100T1
- Authority
- AT
- Austria
- Prior art keywords
- electromigration
- interconnect structure
- testing
- test
- interconnect
- Prior art date
Links
- 238000012360 testing method Methods 0.000 title abstract 7
- 238000000034 method Methods 0.000 title abstract 3
- 239000004020 conductor Substances 0.000 abstract 1
- 238000011156 evaluation Methods 0.000 abstract 1
- 238000004519 manufacturing process Methods 0.000 abstract 1
- 238000005457 optimization Methods 0.000 abstract 1
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2855—Environmental, reliability or burn-in testing
- G01R31/2856—Internal circuit aspects, e.g. built-in test features; Test chips; Measuring material aspects, e.g. electro migration [EM]
- G01R31/2858—Measuring of material aspects, e.g. electro-migration [EM], hot carrier injection
Landscapes
- Engineering & Computer Science (AREA)
- Environmental & Geological Engineering (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP07290395A EP1978371A1 (de) | 2007-04-02 | 2007-04-02 | Vorrichtungen und Verfahren zur Überprüfung und Bewertung von Elektromigration |
PCT/IB2008/051154 WO2008120151A1 (en) | 2007-04-02 | 2008-03-27 | Electromigration testing and evaluation apparatus and methods |
Publications (1)
Publication Number | Publication Date |
---|---|
ATE511100T1 true ATE511100T1 (de) | 2011-06-15 |
Family
ID=38521191
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
AT08737637T ATE511100T1 (de) | 2007-04-02 | 2008-03-27 | Vorrichtung und verfahren zum testen und zur beurteilung von elektromigration |
Country Status (5)
Country | Link |
---|---|
US (1) | US8237458B2 (de) |
EP (2) | EP1978371A1 (de) |
AT (1) | ATE511100T1 (de) |
TW (1) | TW200907367A (de) |
WO (1) | WO2008120151A1 (de) |
Families Citing this family (20)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102006049791A1 (de) * | 2006-10-21 | 2008-04-30 | X-Fab Semiconductor Foundries Ag | Teststruktur für hochbeschleunigte Elektromigrationstests für dicke Metallisierungssysteme von Festkörperschaltkreisen |
US20110285401A1 (en) * | 2010-05-21 | 2011-11-24 | Commissariat A L'energie Atomique Et Aux Energies Alternatives | Method for Determining the Lifetime of Interconnects |
US8917104B2 (en) | 2011-08-31 | 2014-12-23 | International Business Machines Corporation | Analyzing EM performance during IC manufacturing |
FR2980584B1 (fr) | 2011-09-23 | 2013-10-25 | Commissariat Energie Atomique | Procede d'estimation de la longueur de diffusion d'especes metalliques au sein d'une structure integree tridimensionnelle, et structure integree tridimensionnelle correspondante |
US8890556B2 (en) * | 2011-10-26 | 2014-11-18 | International Business Machines Corporation | Real-time on-chip EM performance monitoring |
US8656325B2 (en) | 2012-01-12 | 2014-02-18 | International Business Machines Corporation | Integrated circuit design method and system |
US10732216B2 (en) | 2012-10-30 | 2020-08-04 | Fifth Electronics Research Institute Of Ministry Of Industry And Information Technology | Method and device of remaining life prediction for electromigration failure |
CN102955121B (zh) * | 2012-10-30 | 2014-11-19 | 工业和信息化部电子第五研究所 | 一种电迁移失效的剩余寿命预测方法和装置 |
RU2573176C2 (ru) * | 2014-02-06 | 2016-01-20 | Открытое акционерное общество "Ангстрем-Т" | Способ оценки надежности металлической разводки интегральных схем |
US9506977B2 (en) | 2014-03-04 | 2016-11-29 | International Business Machines Corporation | Application of stress conditions for homogenization of stress samples in semiconductor product acceleration studies |
RU2567016C1 (ru) * | 2014-06-19 | 2015-10-27 | Открытое акционерное общество "Ангстрем-Т" | Способ оценки электромиграционных параметров металлических проводников |
US9952272B2 (en) | 2014-12-10 | 2018-04-24 | Arizona Board Of Regents On Behalf Of Arizona State University | Fixture for in situ electromigration testing during X-ray microtomography |
US9851397B2 (en) | 2015-03-02 | 2017-12-26 | Globalfoundries Inc. | Electromigration testing of interconnect analogues having bottom-connected sensory pins |
US10043720B2 (en) | 2015-12-02 | 2018-08-07 | Arizona Board Of Regents | Systems and methods for interconnect simulation and characterization |
US9472477B1 (en) | 2015-12-17 | 2016-10-18 | International Business Machines Corporation | Electromigration test structure for Cu barrier integrity and blech effect evaluations |
US10365322B2 (en) * | 2016-04-19 | 2019-07-30 | Analog Devices Global | Wear-out monitor device |
CN107607214B (zh) * | 2017-09-13 | 2019-12-24 | 上海华力微电子有限公司 | 一种温度的测量方法及电迁移的测试方法 |
CN109470377B (zh) * | 2018-11-12 | 2020-09-25 | 中国电子产品可靠性与环境试验研究所((工业和信息化部电子第五研究所)(中国赛宝实验室)) | 多层阻变存储器的温度分布测试方法 |
CN111007387A (zh) * | 2019-12-07 | 2020-04-14 | 苏州容启传感器科技有限公司 | 一种测试芯片及集成方法 |
CN116298603B (zh) * | 2023-02-02 | 2024-03-26 | 中国电子产品可靠性与环境试验研究所((工业和信息化部电子第五研究所)(中国赛宝实验室)) | 电迁移测试参数获取方法、***、计算机设备和存储介质 |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5497076A (en) * | 1993-10-25 | 1996-03-05 | Lsi Logic Corporation | Determination of failure criteria based upon grain boundary electromigration in metal alloy films |
TWI221908B (en) * | 2002-06-25 | 2004-10-11 | Infineon Technologies Ag | Electromigration test apparatus and an electromigration test method |
US6867056B1 (en) * | 2002-10-30 | 2005-03-15 | Advanced Micro Devices, Inc. | System and method for current-enhanced stress-migration testing of interconnect |
-
2007
- 2007-04-02 EP EP07290395A patent/EP1978371A1/de not_active Withdrawn
-
2008
- 2008-03-27 EP EP08737637A patent/EP2135102B1/de not_active Not-in-force
- 2008-03-27 WO PCT/IB2008/051154 patent/WO2008120151A1/en active Application Filing
- 2008-03-27 AT AT08737637T patent/ATE511100T1/de not_active IP Right Cessation
- 2008-03-27 US US12/594,212 patent/US8237458B2/en active Active
- 2008-03-31 TW TW097111692A patent/TW200907367A/zh unknown
Also Published As
Publication number | Publication date |
---|---|
EP2135102A1 (de) | 2009-12-23 |
TW200907367A (en) | 2009-02-16 |
EP2135102B1 (de) | 2011-05-25 |
WO2008120151A1 (en) | 2008-10-09 |
US8237458B2 (en) | 2012-08-07 |
US20100127719A1 (en) | 2010-05-27 |
EP1978371A1 (de) | 2008-10-08 |
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Legal Events
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RER | Ceased as to paragraph 5 lit. 3 law introducing patent treaties |