ATE501805T1 - Vorrichtung und verfahren zum wellenlöten - Google Patents
Vorrichtung und verfahren zum wellenlötenInfo
- Publication number
- ATE501805T1 ATE501805T1 AT07008559T AT07008559T ATE501805T1 AT E501805 T1 ATE501805 T1 AT E501805T1 AT 07008559 T AT07008559 T AT 07008559T AT 07008559 T AT07008559 T AT 07008559T AT E501805 T1 ATE501805 T1 AT E501805T1
- Authority
- AT
- Austria
- Prior art keywords
- solder
- enclosure
- protective
- wave soldering
- active gas
- Prior art date
Links
- 238000005476 soldering Methods 0.000 title abstract 2
- 238000000034 method Methods 0.000 title 1
- 229910000679 solder Inorganic materials 0.000 abstract 4
- 239000007789 gas Substances 0.000 abstract 2
- 230000001681 protective effect Effects 0.000 abstract 2
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 abstract 1
- 239000001301 oxygen Substances 0.000 abstract 1
- 229910052760 oxygen Inorganic materials 0.000 abstract 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/08—Soldering by means of dipping in molten solder
- B23K1/085—Wave soldering
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
- B23K3/06—Solder feeding devices; Solder melting pans
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
- B23K3/06—Solder feeding devices; Solder melting pans
- B23K3/0646—Solder baths
- B23K3/0653—Solder baths with wave generating means, e.g. nozzles, jets, fountains
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Molten Solder (AREA)
- Furnace Details (AREA)
- Coating With Molten Metal (AREA)
- Arc Welding In General (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE200610024192 DE102006024192A1 (de) | 2006-05-23 | 2006-05-23 | Vorrichtung und Verfahren zum Wellenlöten |
EP06015706 | 2006-07-27 |
Publications (1)
Publication Number | Publication Date |
---|---|
ATE501805T1 true ATE501805T1 (de) | 2011-04-15 |
Family
ID=39091131
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
AT07008559T ATE501805T1 (de) | 2006-05-23 | 2007-04-26 | Vorrichtung und verfahren zum wellenlöten |
Country Status (6)
Country | Link |
---|---|
US (1) | US8070049B2 (de) |
KR (1) | KR101342620B1 (de) |
AT (1) | ATE501805T1 (de) |
DE (1) | DE502007006711D1 (de) |
MY (1) | MY165410A (de) |
TW (1) | TWI370034B (de) |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8220699B2 (en) * | 2010-03-12 | 2012-07-17 | Air Products And Chemicals, Inc. | Apparatus and method for providing an inerting gas during soldering |
TWI401131B (zh) * | 2010-03-12 | 2013-07-11 | Air Prod & Chem | 於軟焊時提供惰性化氣體的設備及方法 |
US8579182B2 (en) | 2011-06-17 | 2013-11-12 | Air Products And Chemicals, Inc. | Method for providing an inerting gas during soldering |
DE102012022669B4 (de) * | 2012-11-21 | 2022-10-13 | Illinois Tool Works Inc. | Selektiv-Lötanlage |
CN104801809B (zh) * | 2014-01-29 | 2018-09-14 | 气体产品与化学公司 | 用于在焊接期间提供惰性气体的设备和方法 |
Family Cites Families (19)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5044542A (en) * | 1989-11-22 | 1991-09-03 | Electrovert Ltd. | Shield gas wave soldering |
US5121874A (en) * | 1989-11-22 | 1992-06-16 | Electrovert Ltd. | Shield gas wave soldering |
US5176307A (en) * | 1991-02-22 | 1993-01-05 | Praxair Technology, Inc. | Wave soldering in a protective atmosphere enclosure over a solder pot |
US5121875A (en) | 1991-02-22 | 1992-06-16 | Union Carbide Industrial Gases Technology Corporation | Wave soldering in a protective atmosphere enclosure over a solder pot |
GB9121003D0 (en) * | 1991-10-03 | 1991-11-13 | Boc Group Plc | Soldering |
US5203489A (en) * | 1991-12-06 | 1993-04-20 | Electrovert Ltd. | Gas shrouded wave soldering |
US5358167A (en) * | 1992-11-30 | 1994-10-25 | Nihon Den-Netsu Keiki Co., Ltd. | Soldering apparatus |
US5411200A (en) * | 1994-02-28 | 1995-05-02 | American Air Liquide, Inc. | Process and apparatus for the wave soldering of circuit boards |
US5409159A (en) | 1994-02-28 | 1995-04-25 | L'air Liquide, Societe Anonyme Pour L'etude Et L'exploitation Des Procedes Georges Claude | Apparatus and methods for inerting solder during wave soldering operations |
US5509598A (en) * | 1994-05-31 | 1996-04-23 | The Boc Group, Inc. | Wave soldering apparatus and process |
DE4421996A1 (de) | 1994-06-23 | 1996-01-04 | Linde Ag | Verfahren und Vorrichtung zum kombinierten Wellen- und Reflow-Löten von Leiterplatten und dergleichen |
JP3311547B2 (ja) * | 1995-08-02 | 2002-08-05 | 日本電熱計器株式会社 | はんだ付け装置 |
US5685475A (en) | 1995-09-08 | 1997-11-11 | Ford Motor Company | Apparatus for cooling printed circuit boards in wave soldering |
DE19541445B4 (de) | 1995-11-07 | 2005-02-10 | Linde Ag | Verfahren zum Wellenlöten von Werkstücken unter Schutzgas sowie hierfür vorgesehene Vorrichtung |
JP3638415B2 (ja) * | 1997-01-20 | 2005-04-13 | 日本電熱計器株式会社 | ガス雰囲気はんだ付け装置 |
DE19749185A1 (de) * | 1997-11-07 | 1999-05-12 | Messer Griesheim Gmbh | Mit einer Gasversorgung verbindbare Gasverteilung |
DE19749187A1 (de) * | 1997-11-07 | 1999-05-12 | Messer Griesheim Gmbh | Lötvorrichtung |
US6305596B1 (en) * | 1998-06-18 | 2001-10-23 | Asustek Computer Inc. | Apparatus and method for soldering through-hole components on circuit board |
US6913183B2 (en) * | 2002-09-30 | 2005-07-05 | Speedline Technologies, Inc. | Selective gas knife for wave soldering |
-
2007
- 2007-04-26 AT AT07008559T patent/ATE501805T1/de active
- 2007-04-26 DE DE502007006711T patent/DE502007006711D1/de active Active
- 2007-05-08 TW TW096116209A patent/TWI370034B/zh not_active IP Right Cessation
- 2007-05-17 MY MYPI20070774A patent/MY165410A/en unknown
- 2007-05-22 US US11/805,394 patent/US8070049B2/en not_active Expired - Fee Related
- 2007-05-22 KR KR1020070049645A patent/KR101342620B1/ko active IP Right Grant
Also Published As
Publication number | Publication date |
---|---|
MY165410A (en) | 2018-03-21 |
DE502007006711D1 (de) | 2011-04-28 |
KR20070113144A (ko) | 2007-11-28 |
TWI370034B (en) | 2012-08-11 |
KR101342620B1 (ko) | 2014-02-05 |
US20080277457A1 (en) | 2008-11-13 |
TW200804020A (en) | 2008-01-16 |
US8070049B2 (en) | 2011-12-06 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
ATE501805T1 (de) | Vorrichtung und verfahren zum wellenlöten | |
GB2451782A (en) | Method and apparatus for laser processing | |
ATE512743T1 (de) | Vorrichtung und verfahren zur bearbeitung von löchern | |
WO2014120913A3 (en) | Localized repair of supperalloy component | |
TW200726561A (en) | Apparatus of laser welding and method of the same | |
MX352525B (es) | Método para producir una junta de soldadura. | |
MX2014012944A (es) | Metodo y sistema de soldadura de arco giratorio adaptable. | |
WO2009114041A3 (en) | Apparatus and method for a liquid cooled shield for improved piercing performance | |
ATE512744T1 (de) | Verfahren und vorrichtung zur temperaturbehandlung, insbesondere lotverbindung | |
MY156095A (en) | Apparatus and method for providing an inerting gas during soldering | |
DE60233160D1 (de) | Verfahren und vorrichtung zum zusammenfügen von metallkomponenten, insbesondere komponenten aus leichtmetall | |
PL2219808T3 (pl) | Frez do elektrody z krawędziami frezującymi przerywanymi przez wgłębienia | |
ATE420746T1 (de) | Verfahren zum lichtbogen- oder laserschweissen von metall mit der hilfe von kryogendurchfluss | |
DE502007004829D1 (de) | Vorrichtung und Verfahren zum Schweißen eines Werkstückes | |
FR2885825B1 (fr) | Dispositif pour le centrage et le serrage de pieces tubulaires | |
TW200709887A (en) | Shielding gas, welding method by using the same and weldment thereof | |
SG145646A1 (en) | Weld repair as a combined heat treatment brazing process for metallic components | |
ATE482500T1 (de) | Verfahren zur verstärkung durch räumlich- zeitliche frequenzumsetzung und einrichtung zum ausführen des verfahrens | |
ATE551141T1 (de) | Verfahren zur bearbeitung eines metallischen bauteils | |
ATE454240T1 (de) | Vorrichtung zum verhindern von verunreinigungen auf einer bauteiloberfläche benachbart zu einer schweissnaht durch beim msg-schweissen erzeugte schweissspritzer mit einer relativ zum schweissbrenner bewegbaren abschirmung | |
ATE485121T1 (de) | Vorrichtung und verfahren zum plasmaschneiden von werkstücken mit einer zwischen der düse und dem werkstück geführten zusatz-schmelzbaren elektrode | |
RU2009115826A (ru) | Способ модификации металлических поверхностей и устройство | |
ATE335566T1 (de) | Verfahren zum laserstrahlschweissen | |
MX2016006187A (es) | Procedimiento en linea e instalacion de fabricacion en linea. | |
DE10393495D2 (de) | Verfahren, Vorrichtung und Anlage zum Schneiden von Textilien mittels Laser |