ATE498872T1 - Verfahren zur herstellung eines transponders und transponder - Google Patents
Verfahren zur herstellung eines transponders und transponderInfo
- Publication number
- ATE498872T1 ATE498872T1 AT06831913T AT06831913T ATE498872T1 AT E498872 T1 ATE498872 T1 AT E498872T1 AT 06831913 T AT06831913 T AT 06831913T AT 06831913 T AT06831913 T AT 06831913T AT E498872 T1 ATE498872 T1 AT E498872T1
- Authority
- AT
- Austria
- Prior art keywords
- transponder
- area
- producing
- electric contact
- electric
- Prior art date
Links
Classifications
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
- G06K19/0775—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card arrangements for connecting the integrated circuit to the antenna
- G06K19/07754—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card arrangements for connecting the integrated circuit to the antenna the connection being galvanic
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07743—External electrical contacts
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07745—Mounting details of integrated circuit chips
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
- G06K19/0775—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card arrangements for connecting the integrated circuit to the antenna
- G06K19/07752—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card arrangements for connecting the integrated circuit to the antenna using an interposer
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/18—High density interconnect [HDI] connectors; Manufacturing methods related thereto
- H01L24/23—Structure, shape, material or disposition of the high density interconnect connectors after the connecting process
- H01L24/24—Structure, shape, material or disposition of the high density interconnect connectors after the connecting process of an individual high density interconnect connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L24/82—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected by forming build-up interconnects at chip-level, e.g. for high density interconnects [HDI]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/18—High density interconnect [HDI] connectors; Manufacturing methods related thereto
- H01L2224/23—Structure, shape, material or disposition of the high density interconnect connectors after the connecting process
- H01L2224/24—Structure, shape, material or disposition of the high density interconnect connectors after the connecting process of an individual high density interconnect connector
- H01L2224/241—Disposition
- H01L2224/24151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/24221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/24225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/24226—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation the HDI interconnect connecting to the same level of the item at which the semiconductor or solid-state body is mounted, e.g. the item being planar
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01033—Arsenic [As]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01078—Platinum [Pt]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01082—Lead [Pb]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/013—Alloys
- H01L2924/014—Solder alloys
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/14—Integrated circuits
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
- H01L2924/1901—Structure
- H01L2924/1904—Component type
- H01L2924/19041—Component type being a capacitor
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
- H01L2924/1901—Structure
- H01L2924/1904—Component type
- H01L2924/19043—Component type being a resistor
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/30—Technical effects
- H01L2924/301—Electrical effects
- H01L2924/30105—Capacitance
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49016—Antenna or wave energy "plumbing" making
- Y10T29/49018—Antenna or wave energy "plumbing" making with other electrical component
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Theoretical Computer Science (AREA)
- Power Engineering (AREA)
- Details Of Aerials (AREA)
- Radar Systems Or Details Thereof (AREA)
- Saccharide Compounds (AREA)
- Medicines Containing Material From Animals Or Micro-Organisms (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP05111388 | 2005-11-28 | ||
PCT/IB2006/054408 WO2007060631A1 (en) | 2005-11-28 | 2006-11-23 | A method of producing a transponder and a transponder |
Publications (1)
Publication Number | Publication Date |
---|---|
ATE498872T1 true ATE498872T1 (de) | 2011-03-15 |
Family
ID=37890396
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
AT06831913T ATE498872T1 (de) | 2005-11-28 | 2006-11-23 | Verfahren zur herstellung eines transponders und transponder |
Country Status (7)
Country | Link |
---|---|
US (2) | US8968510B2 (de) |
EP (1) | EP1966743B1 (de) |
JP (1) | JP2009517730A (de) |
CN (1) | CN101317186B (de) |
AT (1) | ATE498872T1 (de) |
DE (1) | DE602006020179D1 (de) |
WO (1) | WO2007060631A1 (de) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN113035721A (zh) | 2019-12-24 | 2021-06-25 | 维谢综合半导体有限责任公司 | 用于侧壁镀覆导电膜的封装工艺 |
CN113035722A (zh) | 2019-12-24 | 2021-06-25 | 维谢综合半导体有限责任公司 | 具有选择性模制的用于镀覆的封装工艺 |
EP4105830A4 (de) * | 2020-02-13 | 2023-07-19 | Asahi Kasei Kabushiki Kaisha | Transparente antenne und rf-etikett |
Family Cites Families (21)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5255839A (en) | 1992-01-02 | 1993-10-26 | Motorola, Inc. | Method for solder application and reflow |
US6864570B2 (en) | 1993-12-17 | 2005-03-08 | The Regents Of The University Of California | Method and apparatus for fabricating self-assembling microstructures |
IL108359A (en) | 1994-01-17 | 2001-04-30 | Shellcase Ltd | Method and device for creating integrated circular devices |
US5468999A (en) | 1994-05-26 | 1995-11-21 | Motorola, Inc. | Liquid encapsulated ball grid array semiconductor device with fine pitch wire bonding |
US5798146A (en) * | 1995-09-14 | 1998-08-25 | Tri-Star Technologies | Surface charging to improve wettability |
JP3003624B2 (ja) | 1997-05-27 | 2000-01-31 | ソニー株式会社 | 半導体装置 |
FR2769389B1 (fr) | 1997-10-07 | 2000-01-28 | Rue Cartes Et Systemes De | Carte a microcircuit combinant des plages de contact exterieur et une antenne, et procede de fabrication d'une telle carte |
US6091332A (en) | 1998-06-09 | 2000-07-18 | Motorola, Inc. | Radio frequency identification tag having printed circuit interconnections |
US6107920A (en) * | 1998-06-09 | 2000-08-22 | Motorola, Inc. | Radio frequency identification tag having an article integrated antenna |
WO2000007239A1 (de) | 1998-07-28 | 2000-02-10 | Infineon Technologies Ag | Integriertes bauelement, verbundkörper aus einem integrierten bauelement und einer leiterstruktur, chip-karte und verfahren zur herstellung des integrierten bauelementes |
US6404643B1 (en) | 1998-10-15 | 2002-06-11 | Amerasia International Technology, Inc. | Article having an embedded electronic device, and method of making same |
ES2246759T3 (es) * | 1999-02-09 | 2006-03-01 | Magnus Granhed | Antena encapsulada para transpondor pasivo. |
US6891110B1 (en) * | 1999-03-24 | 2005-05-10 | Motorola, Inc. | Circuit chip connector and method of connecting a circuit chip |
EP1299183A4 (de) | 2000-04-14 | 2005-11-16 | Karl Reimer | Vorrichtung und verfahren zur kontinuierlichen oberflächenmodifikation von substraten |
EP1325517A2 (de) | 2000-09-19 | 2003-07-09 | Nanopierce Technologies Inc. | Verfahren zum zusammenbauen von komponenten und antennen in hochfrequenz-identifikationsgeräten |
US6867983B2 (en) | 2002-08-07 | 2005-03-15 | Avery Dennison Corporation | Radio frequency identification device and method |
JP3808030B2 (ja) | 2002-11-28 | 2006-08-09 | 沖電気工業株式会社 | 半導体装置及びその製造方法 |
FI20022107A (fi) * | 2002-11-29 | 2004-05-30 | Rafsec Oy | Menetelmä sirujen kiinnittämiseksi transponderiin |
US6940408B2 (en) * | 2002-12-31 | 2005-09-06 | Avery Dennison Corporation | RFID device and method of forming |
EP1460690A1 (de) | 2003-02-25 | 2004-09-22 | Broadcom Corporation | Optimierung der Signalleitungen und des Platzbedarfs auf der Leiterplatte in einer Kugelmatrixverpackung |
DE10308855A1 (de) * | 2003-02-27 | 2004-09-16 | Infineon Technologies Ag | Elektronisches Bauteil und Halbleiterwafer, sowie Verfahren zur Herstellung derselben |
-
2006
- 2006-11-23 DE DE602006020179T patent/DE602006020179D1/de active Active
- 2006-11-23 WO PCT/IB2006/054408 patent/WO2007060631A1/en active Application Filing
- 2006-11-23 AT AT06831913T patent/ATE498872T1/de not_active IP Right Cessation
- 2006-11-23 CN CN2006800441188A patent/CN101317186B/zh active Active
- 2006-11-23 JP JP2008541892A patent/JP2009517730A/ja not_active Withdrawn
- 2006-11-23 EP EP06831913A patent/EP1966743B1/de active Active
- 2006-11-23 US US12/095,147 patent/US8968510B2/en active Active
-
2015
- 2015-01-28 US US14/607,517 patent/US9779349B2/en active Active
Also Published As
Publication number | Publication date |
---|---|
WO2007060631A1 (en) | 2007-05-31 |
EP1966743A1 (de) | 2008-09-10 |
DE602006020179D1 (de) | 2011-03-31 |
CN101317186A (zh) | 2008-12-03 |
US20150144704A1 (en) | 2015-05-28 |
JP2009517730A (ja) | 2009-04-30 |
US8968510B2 (en) | 2015-03-03 |
US20080309462A1 (en) | 2008-12-18 |
US9779349B2 (en) | 2017-10-03 |
CN101317186B (zh) | 2010-09-08 |
EP1966743B1 (de) | 2011-02-16 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
RER | Ceased as to paragraph 5 lit. 3 law introducing patent treaties |