ATE495547T1 - BIPOLAR TRANSISTOR AND PRODUCTION METHOD THEREOF - Google Patents
BIPOLAR TRANSISTOR AND PRODUCTION METHOD THEREOFInfo
- Publication number
- ATE495547T1 ATE495547T1 AT06701807T AT06701807T ATE495547T1 AT E495547 T1 ATE495547 T1 AT E495547T1 AT 06701807 T AT06701807 T AT 06701807T AT 06701807 T AT06701807 T AT 06701807T AT E495547 T1 ATE495547 T1 AT E495547T1
- Authority
- AT
- Austria
- Prior art keywords
- region
- bipolar transistor
- collector
- base
- base region
- Prior art date
Links
- 238000004519 manufacturing process Methods 0.000 title abstract 2
- 238000002955 isolation Methods 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/66007—Multistep manufacturing processes
- H01L29/66075—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials
- H01L29/66227—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials the devices being controllable only by the electric current supplied or the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched, e.g. three-terminal devices
- H01L29/66234—Bipolar junction transistors [BJT]
- H01L29/66242—Heterojunction transistors [HBT]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/66007—Multistep manufacturing processes
- H01L29/66075—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials
- H01L29/66227—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials the devices being controllable only by the electric current supplied or the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched, e.g. three-terminal devices
- H01L29/66234—Bipolar junction transistors [BJT]
- H01L29/66272—Silicon vertical transistors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
- H01L29/70—Bipolar devices
- H01L29/72—Transistor-type devices, i.e. able to continuously respond to applied control signals
- H01L29/73—Bipolar junction transistors
- H01L29/732—Vertical transistors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
- H01L29/70—Bipolar devices
- H01L29/72—Transistor-type devices, i.e. able to continuously respond to applied control signals
- H01L29/73—Bipolar junction transistors
- H01L29/737—Hetero-junction transistors
- H01L29/7371—Vertical transistors
- H01L29/7378—Vertical transistors comprising lattice mismatched active layers, e.g. SiGe strained layer transistors
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Ceramic Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Manufacturing & Machinery (AREA)
- Bipolar Transistors (AREA)
- Metal-Oxide And Bipolar Metal-Oxide Semiconductor Integrated Circuits (AREA)
- Bipolar Integrated Circuits (AREA)
Abstract
Consistent with an example embodiment, there is a bipolar transistor with a reduced collector series resistance integrated in a trench of a standard CMOS shallow trench isolation region. The bipolar transistor includes a collector region manufactured in one fabrication step, therefore having a shorter conductive path with a reduced collector series resistance, improving the high frequency performance of the bipolar transistor. The bipolar transistor further includes a base region with a first part on a selected portion of the collector region (6, 34), which is on the bottom of the trench, and an emitter region on a selected portion of the first part of the base region. A base contact electrically contacts the base region on a second part of the base region, which is on an insulating region. The collector region is electrically contacted on top of a protrusion with a collector contact.
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP05100274 | 2005-01-18 | ||
EP05103967 | 2005-05-12 | ||
PCT/IB2006/050107 WO2006077502A1 (en) | 2005-01-18 | 2006-01-12 | Bipolar transistor and method of fabricating the same |
Publications (1)
Publication Number | Publication Date |
---|---|
ATE495547T1 true ATE495547T1 (en) | 2011-01-15 |
Family
ID=36283955
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
AT06701807T ATE495547T1 (en) | 2005-01-18 | 2006-01-12 | BIPOLAR TRANSISTOR AND PRODUCTION METHOD THEREOF |
Country Status (7)
Country | Link |
---|---|
US (1) | US7906403B2 (en) |
EP (1) | EP1842229B1 (en) |
JP (1) | JP2008527734A (en) |
AT (1) | ATE495547T1 (en) |
DE (1) | DE602006019549D1 (en) |
TW (1) | TW200639944A (en) |
WO (1) | WO2006077502A1 (en) |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2010020897A1 (en) * | 2008-08-19 | 2010-02-25 | Nxp B.V. | Gringo heterojunction bipolar transistor with a metal extrinsic base region |
EP2458624A1 (en) * | 2010-11-26 | 2012-05-30 | Nxp B.V. | Heterojunction Bipolar Transistor Manufacturing Method and Integrated Circuit Comprising a Heterojunction Bipolar Transistor |
US9553145B2 (en) * | 2014-09-03 | 2017-01-24 | Globalfoundries Inc. | Lateral bipolar junction transistors on a silicon-on-insulator substrate with a thin device layer thickness |
US9842834B2 (en) * | 2015-12-21 | 2017-12-12 | Marko Koricic | Horizontal current bipolar transistors with improved breakdown voltages |
US9799603B2 (en) * | 2016-01-27 | 2017-10-24 | Taiwan Semiconductor Manufacturing Co., Ltd. | Semiconductor device structure and method for forming the same |
US9935186B1 (en) * | 2016-09-21 | 2018-04-03 | International Business Machines Corporation | Method of manufacturing SOI lateral Si-emitter SiGe base HBT |
EP3664151A1 (en) * | 2018-12-06 | 2020-06-10 | Nexperia B.V. | Bipolar transistor with polysilicon emitter and method of manufacturing |
Family Cites Families (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4333227A (en) * | 1979-11-29 | 1982-06-08 | International Business Machines Corporation | Process for fabricating a self-aligned micrometer bipolar transistor device |
US4982257A (en) * | 1988-08-01 | 1991-01-01 | International Business Machines Corporation | Vertical bipolar transistor with collector and base extensions |
JP2971246B2 (en) | 1992-04-15 | 1999-11-02 | 株式会社東芝 | Method for manufacturing hetero bipolar transistor |
US5234846A (en) * | 1992-04-30 | 1993-08-10 | International Business Machines Corporation | Method of making bipolar transistor with reduced topography |
US6506657B1 (en) * | 2000-04-19 | 2003-01-14 | National Semiconductor Corporation | Process for forming damascene-type isolation structure for BJT device formed in trench |
US6548364B2 (en) * | 2001-03-29 | 2003-04-15 | Sharp Laboratories Of America, Inc. | Self-aligned SiGe HBT BiCMOS on SOI substrate and method of fabricating the same |
WO2002080281A1 (en) * | 2001-04-02 | 2002-10-10 | The Regent Of The University Of California | Horizontal current bipolar transistor |
AU2003232968A1 (en) | 2002-05-29 | 2003-12-12 | Koninklijke Philips Electronics N.V. | Method of fabrication sige heterojunction bipolar transistor |
FR2845522A1 (en) * | 2002-10-03 | 2004-04-09 | St Microelectronics Sa | INTEGRATED HIGHLY CONDUCTIVE LAYER CIRCUIT |
KR100604527B1 (en) * | 2003-12-31 | 2006-07-24 | 동부일렉트로닉스 주식회사 | Method for fabricating bipolar transistor |
US7342293B2 (en) * | 2005-12-05 | 2008-03-11 | International Business Machines Corporation | Bipolar junction transistors (BJTS) with second shallow trench isolation (STI) regions, and methods for forming same |
-
2006
- 2006-01-12 EP EP06701807A patent/EP1842229B1/en not_active Not-in-force
- 2006-01-12 DE DE602006019549T patent/DE602006019549D1/en active Active
- 2006-01-12 US US11/814,281 patent/US7906403B2/en active Active
- 2006-01-12 AT AT06701807T patent/ATE495547T1/en not_active IP Right Cessation
- 2006-01-12 JP JP2007550907A patent/JP2008527734A/en not_active Withdrawn
- 2006-01-12 WO PCT/IB2006/050107 patent/WO2006077502A1/en active Application Filing
- 2006-01-13 TW TW095101514A patent/TW200639944A/en unknown
Also Published As
Publication number | Publication date |
---|---|
US20100025808A1 (en) | 2010-02-04 |
EP1842229A1 (en) | 2007-10-10 |
TW200639944A (en) | 2006-11-16 |
JP2008527734A (en) | 2008-07-24 |
EP1842229B1 (en) | 2011-01-12 |
DE602006019549D1 (en) | 2011-02-24 |
WO2006077502A1 (en) | 2006-07-27 |
US7906403B2 (en) | 2011-03-15 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
RER | Ceased as to paragraph 5 lit. 3 law introducing patent treaties |