ATE489733T1 - Zum emittieren mehrerer lichtwellenlängen ausgelegtes halbleiter-leuchtbauelement - Google Patents
Zum emittieren mehrerer lichtwellenlängen ausgelegtes halbleiter-leuchtbauelementInfo
- Publication number
- ATE489733T1 ATE489733T1 AT07859486T AT07859486T ATE489733T1 AT E489733 T1 ATE489733 T1 AT E489733T1 AT 07859486 T AT07859486 T AT 07859486T AT 07859486 T AT07859486 T AT 07859486T AT E489733 T1 ATE489733 T1 AT E489733T1
- Authority
- AT
- Austria
- Prior art keywords
- layer
- light emitting
- strain
- relieved
- light
- Prior art date
Links
- 239000004065 semiconductor Substances 0.000 title 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/005—Processes
- H01L33/0062—Processes for devices with an active region comprising only III-V compounds
- H01L33/0066—Processes for devices with an active region comprising only III-V compounds with a substrate not being a III-V compound
- H01L33/007—Processes for devices with an active region comprising only III-V compounds with a substrate not being a III-V compound comprising nitride compounds
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/02—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies
- H01L33/08—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies with a plurality of light emitting regions, e.g. laterally discontinuous light emitting layer or photoluminescent region integrated within the semiconductor body
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/02—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies
- H01L33/12—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies with a stress relaxation structure, e.g. buffer layer
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/02—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies
- H01L33/20—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies with a particular shape, e.g. curved or truncated substrate
- H01L33/22—Roughened surfaces, e.g. at the interface between epitaxial layers
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Led Devices (AREA)
- Led Device Packages (AREA)
- Luminescent Compositions (AREA)
- Non-Portable Lighting Devices Or Systems Thereof (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US11/615,601 US20080149946A1 (en) | 2006-12-22 | 2006-12-22 | Semiconductor Light Emitting Device Configured To Emit Multiple Wavelengths Of Light |
PCT/IB2007/055262 WO2008078297A2 (en) | 2006-12-22 | 2007-12-20 | Semiconductor light emitting device configured to emit multiple wavelengths of light |
Publications (1)
Publication Number | Publication Date |
---|---|
ATE489733T1 true ATE489733T1 (de) | 2010-12-15 |
Family
ID=39387249
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
AT07859486T ATE489733T1 (de) | 2006-12-22 | 2007-12-20 | Zum emittieren mehrerer lichtwellenlängen ausgelegtes halbleiter-leuchtbauelement |
Country Status (11)
Country | Link |
---|---|
US (3) | US20080149946A1 (de) |
EP (1) | EP2095435B1 (de) |
JP (1) | JP5189106B2 (de) |
KR (1) | KR101358701B1 (de) |
CN (1) | CN101675534B (de) |
AT (1) | ATE489733T1 (de) |
BR (1) | BRPI0721111A2 (de) |
DE (1) | DE602007010827D1 (de) |
RU (1) | RU2009128240A (de) |
TW (1) | TWI536599B (de) |
WO (1) | WO2008078297A2 (de) |
Families Citing this family (33)
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AU2007222162B2 (en) * | 2006-03-08 | 2013-03-07 | Qunano Ab | Method for metal-free synthesis of epitaxial semiconductor nanowires on Si |
EP2091862B1 (de) | 2006-12-22 | 2019-12-11 | QuNano AB | Erhöhte led und herstellungsverfahren dafür |
US7663148B2 (en) * | 2006-12-22 | 2010-02-16 | Philips Lumileds Lighting Company, Llc | III-nitride light emitting device with reduced strain light emitting layer |
US8183587B2 (en) * | 2006-12-22 | 2012-05-22 | Qunano Ab | LED with upstanding nanowire structure and method of producing such |
US8049203B2 (en) * | 2006-12-22 | 2011-11-01 | Qunano Ab | Nanoelectronic structure and method of producing such |
EP2126986B1 (de) | 2006-12-22 | 2019-09-18 | QuNano AB | Led mit aufrechter nanodrahtstruktur und herstellungsverfahren dafür |
KR101549270B1 (ko) | 2007-01-12 | 2015-09-01 | 큐나노 에이비 | 질화물 나노와이어 및 이의 제조 방법 |
DE102008035784A1 (de) * | 2008-07-31 | 2010-02-11 | Osram Opto Semiconductors Gmbh | Optoelektronischer Halbleiterchip und Verfahren zu dessen Herstellung |
US8716723B2 (en) * | 2008-08-18 | 2014-05-06 | Tsmc Solid State Lighting Ltd. | Reflective layer between light-emitting diodes |
US9293656B2 (en) * | 2012-11-02 | 2016-03-22 | Epistar Corporation | Light emitting device |
BRPI0823194A2 (pt) * | 2008-10-17 | 2015-06-23 | Univ Hokkaido Nat Univ Corp | Arranjo de elementos emissores de luz semicondutores e método em fabricação do mesmo |
US20110079766A1 (en) * | 2009-10-01 | 2011-04-07 | Isaac Harshman Wildeson | Process for fabricating iii-nitride based nanopyramid leds directly on a metalized silicon substrate |
US8692261B2 (en) * | 2010-05-19 | 2014-04-08 | Koninklijke Philips N.V. | Light emitting device grown on a relaxed layer |
KR20110131801A (ko) * | 2010-05-31 | 2011-12-07 | 삼성전자주식회사 | 발광 소자 및 다중 파장의 광을 만드는 방법 |
JP5390472B2 (ja) * | 2010-06-03 | 2014-01-15 | 株式会社東芝 | 半導体発光装置及びその製造方法 |
CN106159055B (zh) * | 2010-10-12 | 2019-04-23 | 皇家飞利浦电子股份有限公司 | 具有减小的外延应力的发光器件 |
CN102054916B (zh) * | 2010-10-29 | 2012-11-28 | 厦门市三安光电科技有限公司 | 反射器及其制作方法,以及包含该反射器的发光器件 |
WO2012059837A1 (en) * | 2010-11-04 | 2012-05-10 | Koninklijke Philips Electronics N.V. | Solid state light emitting devices based on crystallographically relaxed structures |
KR101591991B1 (ko) | 2010-12-02 | 2016-02-05 | 삼성전자주식회사 | 발광소자 패키지 및 그 제조 방법 |
EP2509120A1 (de) | 2011-04-05 | 2012-10-10 | Imec | Halbleiterbauelement und -verfahren |
JP6196987B2 (ja) | 2012-02-14 | 2017-09-13 | ヘキサジェム アーベー | 窒化ガリウムナノワイヤに基づくエレクトロニクス |
CN103367560B (zh) * | 2012-03-30 | 2016-08-10 | 清华大学 | 发光二极管的制备方法 |
CN103367585B (zh) * | 2012-03-30 | 2016-04-13 | 清华大学 | 发光二极管 |
CN103367584B (zh) | 2012-03-30 | 2017-04-05 | 清华大学 | 发光二极管及光学元件 |
CN103367383B (zh) | 2012-03-30 | 2016-04-13 | 清华大学 | 发光二极管 |
WO2014197799A1 (en) * | 2013-06-07 | 2014-12-11 | Glo-Usa, Inc. | Multicolor led and method of fabricating thereof |
WO2016022824A1 (en) | 2014-08-08 | 2016-02-11 | Glo Ab | Pixilated display device based upon nanowire leds and method for making the same |
KR102227771B1 (ko) | 2014-08-25 | 2021-03-16 | 삼성전자주식회사 | 나노구조 반도체 발광소자 |
WO2016049507A1 (en) | 2014-09-26 | 2016-03-31 | Glo Ab | Monolithic image chip for near-to-eye display |
JP2016081562A (ja) | 2014-10-09 | 2016-05-16 | ソニー株式会社 | 表示装置、表示装置の製造方法および電子機器 |
EP3453050B1 (de) * | 2016-05-04 | 2022-06-15 | Nanosys, Inc. | Lichtemittierende vorrichtung mit unterschiedlichen farbigen leds und verfahren zur herstellung einer matrix solcher lichtemittierenden vorrichtungen |
FR3105878B1 (fr) | 2019-12-26 | 2023-10-27 | Aledia | Dispositif à composants optoélectroniques tridimensionnels pour découpe au laser et procédé de découpe au laser d'un tel dispositif |
EP3869383B1 (de) | 2020-02-20 | 2023-07-19 | Continental Automotive Technologies GmbH | Verfahren zur identifizierung einer passiven rfid-karte |
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DE102004062799A1 (de) * | 2004-12-20 | 2006-06-29 | Ensinger Kunststofftechnologie GbR (vertretungsberechtigter Gesellschafter Wilfried Ensinger, 71154 Nufringen) | Kunststoffmaterial zur Herstellung von Halteringen |
KR100580751B1 (ko) * | 2004-12-23 | 2006-05-15 | 엘지이노텍 주식회사 | 질화물 반도체 발광소자 및 그 제조방법 |
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KR100631980B1 (ko) | 2005-04-06 | 2006-10-11 | 삼성전기주식회사 | 질화물 반도체 소자 |
US20070243703A1 (en) * | 2006-04-14 | 2007-10-18 | Aonex Technololgies, Inc. | Processes and structures for epitaxial growth on laminate substrates |
KR20110027752A (ko) * | 2008-07-04 | 2011-03-16 | 호도가야 가가쿠 고교 가부시키가이샤 | 탄소 섬유 및 복합 재료 |
-
2006
- 2006-12-22 US US11/615,601 patent/US20080149946A1/en not_active Abandoned
-
2007
- 2007-12-20 TW TW096149061A patent/TWI536599B/zh active
- 2007-12-20 AT AT07859486T patent/ATE489733T1/de not_active IP Right Cessation
- 2007-12-20 CN CN2007800477979A patent/CN101675534B/zh active Active
- 2007-12-20 RU RU2009128240/28A patent/RU2009128240A/ru not_active Application Discontinuation
- 2007-12-20 DE DE602007010827T patent/DE602007010827D1/de active Active
- 2007-12-20 KR KR1020097015482A patent/KR101358701B1/ko active IP Right Grant
- 2007-12-20 EP EP07859486A patent/EP2095435B1/de active Active
- 2007-12-20 BR BRPI0721111-2A patent/BRPI0721111A2/pt not_active IP Right Cessation
- 2007-12-20 WO PCT/IB2007/055262 patent/WO2008078297A2/en active Application Filing
- 2007-12-20 JP JP2009542379A patent/JP5189106B2/ja active Active
-
2010
- 2010-07-06 US US12/830,885 patent/US9911896B2/en active Active
-
2018
- 2018-02-15 US US15/897,564 patent/US10312404B2/en active Active
Also Published As
Publication number | Publication date |
---|---|
JP2010514190A (ja) | 2010-04-30 |
US10312404B2 (en) | 2019-06-04 |
BRPI0721111A2 (pt) | 2014-03-04 |
US20080149946A1 (en) | 2008-06-26 |
EP2095435A2 (de) | 2009-09-02 |
KR20090094162A (ko) | 2009-09-03 |
CN101675534B (zh) | 2012-09-05 |
CN101675534A (zh) | 2010-03-17 |
EP2095435B1 (de) | 2010-11-24 |
WO2008078297A3 (en) | 2008-10-23 |
US20180175236A1 (en) | 2018-06-21 |
TW200843148A (en) | 2008-11-01 |
RU2009128240A (ru) | 2011-01-27 |
JP5189106B2 (ja) | 2013-04-24 |
TWI536599B (zh) | 2016-06-01 |
WO2008078297A2 (en) | 2008-07-03 |
KR101358701B1 (ko) | 2014-02-07 |
US9911896B2 (en) | 2018-03-06 |
DE602007010827D1 (de) | 2011-01-05 |
US20100264454A1 (en) | 2010-10-21 |
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Legal Events
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RER | Ceased as to paragraph 5 lit. 3 law introducing patent treaties |