ATE474843T1 - Verfahren zur abscheidung von kupfer auf einem träger - Google Patents
Verfahren zur abscheidung von kupfer auf einem trägerInfo
- Publication number
- ATE474843T1 ATE474843T1 AT03752819T AT03752819T ATE474843T1 AT E474843 T1 ATE474843 T1 AT E474843T1 AT 03752819 T AT03752819 T AT 03752819T AT 03752819 T AT03752819 T AT 03752819T AT E474843 T1 ATE474843 T1 AT E474843T1
- Authority
- AT
- Austria
- Prior art keywords
- copper
- substrate
- precursor composition
- cyclic compounds
- copper precursor
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/06—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the deposition of metallic material
- C23C16/18—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the deposition of metallic material from metallo-organic compounds
Landscapes
- Chemical & Material Sciences (AREA)
- General Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Chemical Vapour Deposition (AREA)
- Electrodes Of Semiconductors (AREA)
- Chemically Coating (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Electroplating Methods And Accessories (AREA)
- Organic Low-Molecular-Weight Compounds And Preparation Thereof (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR0206228A FR2839982B1 (fr) | 2002-05-22 | 2002-05-22 | Composition de precurseur pour le depot de cuivre sur un support |
PCT/FR2003/001483 WO2003097651A1 (fr) | 2002-05-22 | 2003-05-15 | Procede pour le depot de cuivre sur un support. |
Publications (1)
Publication Number | Publication Date |
---|---|
ATE474843T1 true ATE474843T1 (de) | 2010-08-15 |
Family
ID=29414985
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
AT03752819T ATE474843T1 (de) | 2002-05-22 | 2003-05-15 | Verfahren zur abscheidung von kupfer auf einem träger |
Country Status (8)
Country | Link |
---|---|
US (1) | US7208197B2 (de) |
EP (1) | EP1506206B1 (de) |
JP (1) | JP4425783B2 (de) |
AT (1) | ATE474843T1 (de) |
AU (1) | AU2003251045A1 (de) |
DE (1) | DE60333451D1 (de) |
FR (1) | FR2839982B1 (de) |
WO (1) | WO2003097651A1 (de) |
Family Cites Families (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB1251183A (de) * | 1967-11-09 | 1971-10-27 | ||
US3664933A (en) * | 1969-06-19 | 1972-05-23 | Udylite Corp | Process for acid copper plating of zinc |
US4751106A (en) * | 1986-09-25 | 1988-06-14 | Shipley Company Inc. | Metal plating process |
US5096737A (en) | 1990-10-24 | 1992-03-17 | International Business Machines Corporation | Ligand stabilized +1 metal beta-diketonate coordination complexes and their use in chemical vapor deposition of metal thin films |
US5098516A (en) | 1990-12-31 | 1992-03-24 | Air Products And Chemicals, Inc. | Processes for the chemical vapor deposition of copper and etching of copper |
US5144049A (en) | 1991-02-04 | 1992-09-01 | Air Products And Chemicals, Inc. | Volatile liquid precursors for the chemical vapor deposition of copper |
US5085731A (en) | 1991-02-04 | 1992-02-04 | Air Products And Chemicals, Inc. | Volatile liquid precursors for the chemical vapor deposition of copper |
EP0549148B1 (de) * | 1991-11-28 | 1998-03-04 | Kyocera Corporation | Kupferoxid-Supraleiter, Verfahren zu seiner Herstellung und dabei verwendete Kupferverbindung |
KR100225686B1 (ko) * | 1995-03-20 | 1999-10-15 | 모리시다 요이치치 | 막형성용 재료 및 배선형성방법 |
US5783716A (en) | 1996-06-28 | 1998-07-21 | Advanced Technology Materials, Inc. | Platinum source compositions for chemical vapor deposition of platinum |
EP0809282A1 (de) * | 1996-04-26 | 1997-11-26 | Max-Planck-Gesellschaft zur Förderung der Wissenschaften e.V. | Ein Verfahren zur Behandlung einer Substratoberfläche, ein Verfahren zum Herstellen zumindest eines teilweise metallisierten Substrats mit einer behandelten Oberfläche |
FR2760743B1 (fr) | 1997-03-13 | 1999-07-23 | Centre Nat Rech Scient | Nouveaux precurseurs de cuivre(i) pour depot chimique en phase gazeuse de cuivre metallique |
US6184403B1 (en) * | 1999-05-19 | 2001-02-06 | Research Foundation Of State University Of New York | MOCVD precursors based on organometalloid ligands |
US6291025B1 (en) * | 1999-06-04 | 2001-09-18 | Argonide Corporation | Electroless coatings formed from organic liquids |
US6824665B2 (en) * | 2000-10-25 | 2004-11-30 | Shipley Company, L.L.C. | Seed layer deposition |
-
2002
- 2002-05-22 FR FR0206228A patent/FR2839982B1/fr not_active Expired - Fee Related
-
2003
- 2003-05-15 EP EP03752819A patent/EP1506206B1/de not_active Expired - Lifetime
- 2003-05-15 WO PCT/FR2003/001483 patent/WO2003097651A1/fr active Application Filing
- 2003-05-15 DE DE60333451T patent/DE60333451D1/de not_active Expired - Lifetime
- 2003-05-15 JP JP2004505383A patent/JP4425783B2/ja not_active Expired - Fee Related
- 2003-05-15 AU AU2003251045A patent/AU2003251045A1/en not_active Abandoned
- 2003-05-15 US US10/514,457 patent/US7208197B2/en not_active Expired - Fee Related
- 2003-05-15 AT AT03752819T patent/ATE474843T1/de active
Also Published As
Publication number | Publication date |
---|---|
EP1506206B1 (de) | 2010-07-21 |
FR2839982B1 (fr) | 2005-04-15 |
WO2003097651A1 (fr) | 2003-11-27 |
JP2005526182A (ja) | 2005-09-02 |
FR2839982A1 (fr) | 2003-11-28 |
US20050214460A1 (en) | 2005-09-29 |
US7208197B2 (en) | 2007-04-24 |
JP4425783B2 (ja) | 2010-03-03 |
DE60333451D1 (de) | 2010-09-02 |
EP1506206A1 (de) | 2005-02-16 |
AU2003251045A1 (en) | 2003-12-02 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
UEP | Publication of translation of european patent specification |
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