ATE474843T1 - Verfahren zur abscheidung von kupfer auf einem träger - Google Patents

Verfahren zur abscheidung von kupfer auf einem träger

Info

Publication number
ATE474843T1
ATE474843T1 AT03752819T AT03752819T ATE474843T1 AT E474843 T1 ATE474843 T1 AT E474843T1 AT 03752819 T AT03752819 T AT 03752819T AT 03752819 T AT03752819 T AT 03752819T AT E474843 T1 ATE474843 T1 AT E474843T1
Authority
AT
Austria
Prior art keywords
copper
substrate
precursor composition
cyclic compounds
copper precursor
Prior art date
Application number
AT03752819T
Other languages
English (en)
Inventor
Pascal Doppelt
Original Assignee
Centre Nat Rech Scient
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Centre Nat Rech Scient filed Critical Centre Nat Rech Scient
Application granted granted Critical
Publication of ATE474843T1 publication Critical patent/ATE474843T1/de

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/06Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the deposition of metallic material
    • C23C16/18Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the deposition of metallic material from metallo-organic compounds

Landscapes

  • Chemical & Material Sciences (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Chemical Vapour Deposition (AREA)
  • Electrodes Of Semiconductors (AREA)
  • Chemically Coating (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Organic Low-Molecular-Weight Compounds And Preparation Thereof (AREA)
AT03752819T 2002-05-22 2003-05-15 Verfahren zur abscheidung von kupfer auf einem träger ATE474843T1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
FR0206228A FR2839982B1 (fr) 2002-05-22 2002-05-22 Composition de precurseur pour le depot de cuivre sur un support
PCT/FR2003/001483 WO2003097651A1 (fr) 2002-05-22 2003-05-15 Procede pour le depot de cuivre sur un support.

Publications (1)

Publication Number Publication Date
ATE474843T1 true ATE474843T1 (de) 2010-08-15

Family

ID=29414985

Family Applications (1)

Application Number Title Priority Date Filing Date
AT03752819T ATE474843T1 (de) 2002-05-22 2003-05-15 Verfahren zur abscheidung von kupfer auf einem träger

Country Status (8)

Country Link
US (1) US7208197B2 (de)
EP (1) EP1506206B1 (de)
JP (1) JP4425783B2 (de)
AT (1) ATE474843T1 (de)
AU (1) AU2003251045A1 (de)
DE (1) DE60333451D1 (de)
FR (1) FR2839982B1 (de)
WO (1) WO2003097651A1 (de)

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1251183A (de) * 1967-11-09 1971-10-27
US3664933A (en) * 1969-06-19 1972-05-23 Udylite Corp Process for acid copper plating of zinc
US4751106A (en) * 1986-09-25 1988-06-14 Shipley Company Inc. Metal plating process
US5096737A (en) 1990-10-24 1992-03-17 International Business Machines Corporation Ligand stabilized +1 metal beta-diketonate coordination complexes and their use in chemical vapor deposition of metal thin films
US5098516A (en) 1990-12-31 1992-03-24 Air Products And Chemicals, Inc. Processes for the chemical vapor deposition of copper and etching of copper
US5144049A (en) 1991-02-04 1992-09-01 Air Products And Chemicals, Inc. Volatile liquid precursors for the chemical vapor deposition of copper
US5085731A (en) 1991-02-04 1992-02-04 Air Products And Chemicals, Inc. Volatile liquid precursors for the chemical vapor deposition of copper
EP0549148B1 (de) * 1991-11-28 1998-03-04 Kyocera Corporation Kupferoxid-Supraleiter, Verfahren zu seiner Herstellung und dabei verwendete Kupferverbindung
KR100225686B1 (ko) * 1995-03-20 1999-10-15 모리시다 요이치치 막형성용 재료 및 배선형성방법
US5783716A (en) 1996-06-28 1998-07-21 Advanced Technology Materials, Inc. Platinum source compositions for chemical vapor deposition of platinum
EP0809282A1 (de) * 1996-04-26 1997-11-26 Max-Planck-Gesellschaft zur Förderung der Wissenschaften e.V. Ein Verfahren zur Behandlung einer Substratoberfläche, ein Verfahren zum Herstellen zumindest eines teilweise metallisierten Substrats mit einer behandelten Oberfläche
FR2760743B1 (fr) 1997-03-13 1999-07-23 Centre Nat Rech Scient Nouveaux precurseurs de cuivre(i) pour depot chimique en phase gazeuse de cuivre metallique
US6184403B1 (en) * 1999-05-19 2001-02-06 Research Foundation Of State University Of New York MOCVD precursors based on organometalloid ligands
US6291025B1 (en) * 1999-06-04 2001-09-18 Argonide Corporation Electroless coatings formed from organic liquids
US6824665B2 (en) * 2000-10-25 2004-11-30 Shipley Company, L.L.C. Seed layer deposition

Also Published As

Publication number Publication date
EP1506206B1 (de) 2010-07-21
FR2839982B1 (fr) 2005-04-15
WO2003097651A1 (fr) 2003-11-27
JP2005526182A (ja) 2005-09-02
FR2839982A1 (fr) 2003-11-28
US20050214460A1 (en) 2005-09-29
US7208197B2 (en) 2007-04-24
JP4425783B2 (ja) 2010-03-03
DE60333451D1 (de) 2010-09-02
EP1506206A1 (de) 2005-02-16
AU2003251045A1 (en) 2003-12-02

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