ATE473889T1 - Elektronische steuereinheit mit einem zentralen elastischen element - Google Patents

Elektronische steuereinheit mit einem zentralen elastischen element

Info

Publication number
ATE473889T1
ATE473889T1 AT07425298T AT07425298T ATE473889T1 AT E473889 T1 ATE473889 T1 AT E473889T1 AT 07425298 T AT07425298 T AT 07425298T AT 07425298 T AT07425298 T AT 07425298T AT E473889 T1 ATE473889 T1 AT E473889T1
Authority
AT
Austria
Prior art keywords
circuit board
printed circuit
control unit
electronic control
elastic element
Prior art date
Application number
AT07425298T
Other languages
English (en)
Inventor
Endrio Fino
Fulvio Cicognati
Original Assignee
Magneti Marelli Spa
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Magneti Marelli Spa filed Critical Magneti Marelli Spa
Application granted granted Critical
Publication of ATE473889T1 publication Critical patent/ATE473889T1/de

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20845—Modifications to facilitate cooling, ventilating, or heating for automotive electronic casings
    • H05K7/20854—Heat transfer by conduction from internal heat source to heat radiating structure
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H05K7/20436—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing
    • H05K7/20445—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing the coupling element being an additional piece, e.g. thermal standoff

Landscapes

  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Casings For Electric Apparatus (AREA)
  • Mounting Of Printed Circuit Boards And The Like (AREA)
  • Electrophonic Musical Instruments (AREA)
  • Surgical Instruments (AREA)
  • Combinations Of Printed Boards (AREA)
AT07425298T 2007-05-21 2007-05-21 Elektronische steuereinheit mit einem zentralen elastischen element ATE473889T1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
EP07425298A EP2006161B1 (de) 2007-05-21 2007-05-21 Elektronische Steuereinheit mit einem zentralen elastischen Element

Publications (1)

Publication Number Publication Date
ATE473889T1 true ATE473889T1 (de) 2010-07-15

Family

ID=38612052

Family Applications (1)

Application Number Title Priority Date Filing Date
AT07425298T ATE473889T1 (de) 2007-05-21 2007-05-21 Elektronische steuereinheit mit einem zentralen elastischen element

Country Status (6)

Country Link
US (1) US20080291646A1 (de)
EP (1) EP2006161B1 (de)
CN (1) CN101312626A (de)
AT (1) ATE473889T1 (de)
BR (1) BRPI0802083A2 (de)
DE (1) DE602007007745D1 (de)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102008023714B4 (de) * 2008-05-15 2011-01-20 Semikron Elektronik Gmbh & Co. Kg Anordnung mit einem Hauptträger und einer Leiterplatte mit Bauelementen
US8338721B2 (en) * 2010-04-01 2012-12-25 Phoenix International Corporation Cover with improved vibrational characteristics for an electronic device
AT510389B1 (de) * 2010-09-13 2014-03-15 Melecs Ews Gmbh & Co Kg Kühlvorrichtung für ein elektrisches gerät und zugehöriges herstellungsverfahren
JP5281121B2 (ja) * 2011-06-14 2013-09-04 三菱電機株式会社 車載電子装置の基板収納筐体
GB2500119B (en) * 2013-03-22 2017-06-07 Premier Diagnostics Ltd Hand held device incorporating printed circuit board
KR101407194B1 (ko) 2013-05-10 2014-06-12 현대오트론 주식회사 차량의 전자제어장치
FR3040254B1 (fr) * 2015-08-20 2017-07-28 Renault Sas Systeme de mise en contrainte d'un carter d'electronique de puissance et carter correspondant
DE102015219071B3 (de) * 2015-10-02 2016-12-15 Continental Automotive Gmbh Leistungsmodul mit Kühlkörper
DE102017212968B4 (de) * 2016-08-05 2024-02-01 Robert Bosch Gmbh Gehäuseaufbau für eine elektronische steuereinheit und herstellungsverfahren
US10251297B2 (en) * 2016-12-21 2019-04-02 Robert Bosch Llc Printed circuit board housing including guiding ribs
AT519603B1 (de) * 2017-02-07 2020-01-15 Melecs Ews Gmbh Gehäuse für ein elektronisches Gerät mit einer Anpresseinrichtung
CN112243328A (zh) * 2020-11-10 2021-01-19 萧晓玥 一种用于无人载具控制器的传感器高频震动传导阻隔方法
DE102022110402A1 (de) * 2022-04-28 2023-11-02 Woco Industrietechnik Gmbh Deckel für ein Gehäuse eines Elektronikmoduls und Elektronikmodul

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4069498A (en) * 1976-11-03 1978-01-17 International Business Machines Corporation Studded heat exchanger for integrated circuit package
US4233645A (en) * 1978-10-02 1980-11-11 International Business Machines Corporation Semiconductor package with improved conduction cooling structure
US5812375A (en) * 1996-05-06 1998-09-22 Cummins Engine Company, Inc. Electronic assembly for selective heat sinking and two-sided component attachment
US6180436B1 (en) * 1998-05-04 2001-01-30 Delco Electronics Corporation Method for removing heat from a flip chip semiconductor device
US6281816B1 (en) * 1999-08-24 2001-08-28 International Business Machines Corporation Method and apparatus for reducing data expansion during data compression
AUPQ729400A0 (en) * 2000-05-04 2000-05-25 Robert Bosch Gmbh An electronic control module for a vehicle
GB2366668A (en) * 2000-09-08 2002-03-13 Motorola Inc Arrangement and method for rapid removal and disassembly of electronic modules
DE10141697A1 (de) * 2001-08-25 2003-03-06 Bosch Gmbh Robert Schalt- oder Steuergerät
JP2003229186A (ja) * 2002-01-31 2003-08-15 Denso Corp 電子装置
US7023699B2 (en) * 2002-06-10 2006-04-04 Visteon Global Technologies, Inc. Liquid cooled metal thermal stack for high-power dies
JP3748253B2 (ja) * 2002-11-14 2006-02-22 三菱電機株式会社 車載電子機器の筐体構造

Also Published As

Publication number Publication date
CN101312626A (zh) 2008-11-26
US20080291646A1 (en) 2008-11-27
EP2006161A1 (de) 2008-12-24
EP2006161B1 (de) 2010-07-14
BRPI0802083A2 (pt) 2009-02-10
DE602007007745D1 (de) 2010-08-26

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Legal Events

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