ATE438936T1 - Substratverbesserung für verbesserte signaleigenschaften in einer diskontinuierlichen übertragungsleitung - Google Patents

Substratverbesserung für verbesserte signaleigenschaften in einer diskontinuierlichen übertragungsleitung

Info

Publication number
ATE438936T1
ATE438936T1 AT03012278T AT03012278T ATE438936T1 AT E438936 T1 ATE438936 T1 AT E438936T1 AT 03012278 T AT03012278 T AT 03012278T AT 03012278 T AT03012278 T AT 03012278T AT E438936 T1 ATE438936 T1 AT E438936T1
Authority
AT
Austria
Prior art keywords
transmission line
permittivity
permeability
region
signal characteristics
Prior art date
Application number
AT03012278T
Other languages
English (en)
Inventor
Raymond Charles Rumpf
William Dean Killen
Randy T Pike
Original Assignee
Harris Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Harris Corp filed Critical Harris Corp
Application granted granted Critical
Publication of ATE438936T1 publication Critical patent/ATE438936T1/de

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P5/00—Coupling devices of the waveguide type
    • H01P5/02—Coupling devices of the waveguide type with invariable factor of coupling
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P1/00—Auxiliary devices
    • H01P1/02—Bends; Corners; Twists
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0237—High frequency adaptations
    • H05K1/024—Dielectric details, e.g. changing the dielectric material around a transmission line
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
    • H05K1/165—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed inductors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0183—Dielectric layers
    • H05K2201/0187—Dielectric layers with regions of different dielectrics in the same layer, e.g. in a printed capacitor for locally changing the dielectric properties
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09218—Conductive traces
    • H05K2201/09263—Meander
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09727—Varying width along a single conductor; Conductors or pads having different widths

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Structure Of Printed Boards (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Glass Compositions (AREA)
  • Extrusion Moulding Of Plastics Or The Like (AREA)
  • Multicomponent Fibers (AREA)
  • Waveguides (AREA)
AT03012278T 2002-06-27 2003-06-11 Substratverbesserung für verbesserte signaleigenschaften in einer diskontinuierlichen übertragungsleitung ATE438936T1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US10/185,162 US6825743B2 (en) 2002-06-27 2002-06-27 Substrate enhancement for improved signal characteristics on a discontinuous transmission line

Publications (1)

Publication Number Publication Date
ATE438936T1 true ATE438936T1 (de) 2009-08-15

Family

ID=29717989

Family Applications (1)

Application Number Title Priority Date Filing Date
AT03012278T ATE438936T1 (de) 2002-06-27 2003-06-11 Substratverbesserung für verbesserte signaleigenschaften in einer diskontinuierlichen übertragungsleitung

Country Status (7)

Country Link
US (1) US6825743B2 (de)
EP (1) EP1376736B1 (de)
JP (1) JP2004048736A (de)
AT (1) ATE438936T1 (de)
AU (1) AU2003204646A1 (de)
CA (1) CA2432263C (de)
DE (1) DE60328646D1 (de)

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7282647B2 (en) * 2002-12-23 2007-10-16 Intel Corporation Apparatus for improving coupling across plane discontinuities on circuit boards
JP4705377B2 (ja) * 2004-03-03 2011-06-22 ソニー株式会社 配線基板
US20050194961A1 (en) * 2004-03-04 2005-09-08 Summers Steven M. On board built in test
US7804172B2 (en) * 2006-01-10 2010-09-28 Halliburton Energy Services, Inc. Electrical connections made with dissimilar metals
JP2007335446A (ja) * 2006-06-12 2007-12-27 Sony Corp 配線基板
KR100857469B1 (ko) * 2006-12-06 2008-09-08 한국전자통신연구원 밀리미터파 대역 전송특성을 향상시키기 위한 변환기가구비된 초고주파 모듈
US7548143B2 (en) 2006-12-06 2009-06-16 Electronics And Telecommunications Research Institute Microwave module having converter for improving transmission characteristics
CA2673501C (en) * 2006-12-20 2015-08-11 Kolon Glotech, Inc. Heating fabric and method for fabricating the same
JP6019744B2 (ja) 2012-05-21 2016-11-02 株式会社リコー 磁性体組成物とそれを用いた磁性体成形体

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
BE475415A (de) 1945-06-19
US3571722A (en) 1967-09-08 1971-03-23 Texas Instruments Inc Strip line compensated balun and circuits formed therewith
US3654573A (en) * 1970-06-29 1972-04-04 Bell Telephone Labor Inc Microwave transmission line termination
US3678418A (en) 1971-07-28 1972-07-18 Rca Corp Printed circuit balun
DE3214471A1 (de) 1982-04-20 1983-10-27 Philips Kommunikations Industrie AG, 8500 Nürnberg Gekruemmte dielektrische leitung mit kleinem kruemmungsradius
US4525720A (en) 1982-10-15 1985-06-25 The United States Of America As Represented By The Secretary Of The Navy Integrated spiral antenna and printed circuit balun
US4495505A (en) 1983-05-10 1985-01-22 The United States Of America As Represented By The Secretary Of The Air Force Printed circuit balun with a dipole antenna
US4800344A (en) 1985-03-21 1989-01-24 And Yet, Inc. Balun
US4825220A (en) 1986-11-26 1989-04-25 General Electric Company Microstrip fed printed dipole with an integral balun
GB2210510A (en) 1987-09-25 1989-06-07 Philips Electronic Associated Microwave balun
US4924236A (en) 1987-11-03 1990-05-08 Raytheon Company Patch radiator element with microstrip balian circuit providing double-tuned impedance matching
JPH01245601A (ja) 1988-03-25 1989-09-29 Hitachi Chem Co Ltd 高周波回路用基板
US4916410A (en) 1989-05-01 1990-04-10 E-Systems, Inc. Hybrid-balun for splitting/combining RF power
US5039891A (en) 1989-12-20 1991-08-13 Hughes Aircraft Company Planar broadband FET balun
US5148130A (en) 1990-06-07 1992-09-15 Dietrich James L Wideband microstrip UHF balun
US5678219A (en) 1991-03-29 1997-10-14 E-Systems, Inc. Integrated electronic warfare antenna receiver
US5379006A (en) 1993-06-11 1995-01-03 The United States Of America As Represented By The Secretary Of The Army Wideband (DC to GHz) balun
US5455545A (en) 1993-12-07 1995-10-03 Philips Electronics North America Corporation Compact low-loss microwave balun
US5523728A (en) 1994-08-17 1996-06-04 The United States Of America As Represented By The Secretary Of The Army Microstrip DC-to-GHZ field stacking balun
JPH09260797A (ja) 1996-03-22 1997-10-03 Sony Corp 配線基板
US6184845B1 (en) 1996-11-27 2001-02-06 Symmetricom, Inc. Dielectric-loaded antenna
JPH118111A (ja) 1997-06-17 1999-01-12 Tdk Corp バルントランス用コア材料、バルントランス用コアおよびバルントランス
US6052039A (en) 1997-07-18 2000-04-18 National Science Council Lumped constant compensated high/low pass balanced-to-unbalanced transition
US6133806A (en) 1999-03-25 2000-10-17 Industrial Technology Research Institute Miniaturized balun transformer
US6307509B1 (en) 1999-05-17 2001-10-23 Trimble Navigation Limited Patch antenna with custom dielectric
WO2001001453A2 (en) 1999-06-29 2001-01-04 Sun Microsystems, Inc. Method and apparatus for adjusting electrical characteristics of signal traces in layered circuit boards
US6137376A (en) 1999-07-14 2000-10-24 International Business Machines Corporation Printed BALUN circuits
KR100533097B1 (ko) * 2000-04-27 2005-12-02 티디케이가부시기가이샤 복합자성재료와 이것을 이용한 자성성형재료, 압분 자성분말성형재료, 자성도료, 복합 유전체재료와 이것을이용한 성형재료, 압분성형 분말재료, 도료, 프리프레그및 기판, 전자부품
JP3680710B2 (ja) 2000-07-12 2005-08-10 日立電線株式会社 誘電体平面アンテナ

Also Published As

Publication number Publication date
CA2432263C (en) 2010-11-09
DE60328646D1 (de) 2009-09-17
US6825743B2 (en) 2004-11-30
CA2432263A1 (en) 2003-12-27
AU2003204646A1 (en) 2004-01-22
JP2004048736A (ja) 2004-02-12
US20040000978A1 (en) 2004-01-01
EP1376736B1 (de) 2009-08-05
EP1376736A1 (de) 2004-01-02

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Legal Events

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