ATE409702T1 - Flüchtige ketoiminat-metallkomplexe - Google Patents
Flüchtige ketoiminat-metallkomplexeInfo
- Publication number
- ATE409702T1 ATE409702T1 AT05028216T AT05028216T ATE409702T1 AT E409702 T1 ATE409702 T1 AT E409702T1 AT 05028216 T AT05028216 T AT 05028216T AT 05028216 T AT05028216 T AT 05028216T AT E409702 T1 ATE409702 T1 AT E409702T1
- Authority
- AT
- Austria
- Prior art keywords
- metal complexes
- ketoiminate
- volatile
- metal
- osmium
- Prior art date
Links
- 229910052751 metal Inorganic materials 0.000 title abstract 5
- 239000002184 metal Substances 0.000 title abstract 5
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 abstract 2
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 abstract 2
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 abstract 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 abstract 1
- KJTLSVCANCCWHF-UHFFFAOYSA-N Ruthenium Chemical compound [Ru] KJTLSVCANCCWHF-UHFFFAOYSA-N 0.000 abstract 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 abstract 1
- 238000000277 atomic layer chemical vapour deposition Methods 0.000 abstract 1
- 238000000231 atomic layer deposition Methods 0.000 abstract 1
- 229910017052 cobalt Inorganic materials 0.000 abstract 1
- 239000010941 cobalt Substances 0.000 abstract 1
- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 abstract 1
- 229910052802 copper Inorganic materials 0.000 abstract 1
- 239000010949 copper Substances 0.000 abstract 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 abstract 1
- 229910052737 gold Inorganic materials 0.000 abstract 1
- 239000010931 gold Substances 0.000 abstract 1
- 229910052738 indium Inorganic materials 0.000 abstract 1
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 abstract 1
- 238000000034 method Methods 0.000 abstract 1
- 229910052759 nickel Inorganic materials 0.000 abstract 1
- 229910052762 osmium Inorganic materials 0.000 abstract 1
- SYQBFIAQOQZEGI-UHFFFAOYSA-N osmium atom Chemical compound [Os] SYQBFIAQOQZEGI-UHFFFAOYSA-N 0.000 abstract 1
- 229910052763 palladium Inorganic materials 0.000 abstract 1
- 229910052697 platinum Inorganic materials 0.000 abstract 1
- 239000002243 precursor Substances 0.000 abstract 1
- 229910052703 rhodium Inorganic materials 0.000 abstract 1
- 239000010948 rhodium Substances 0.000 abstract 1
- MHOVAHRLVXNVSD-UHFFFAOYSA-N rhodium atom Chemical compound [Rh] MHOVAHRLVXNVSD-UHFFFAOYSA-N 0.000 abstract 1
- 229910052707 ruthenium Inorganic materials 0.000 abstract 1
- 229910052709 silver Inorganic materials 0.000 abstract 1
- 239000004332 silver Substances 0.000 abstract 1
- 239000000758 substrate Substances 0.000 abstract 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C07—ORGANIC CHEMISTRY
- C07F—ACYCLIC, CARBOCYCLIC OR HETEROCYCLIC COMPOUNDS CONTAINING ELEMENTS OTHER THAN CARBON, HYDROGEN, HALOGEN, OXYGEN, NITROGEN, SULFUR, SELENIUM OR TELLURIUM
- C07F1/00—Compounds containing elements of Groups 1 or 11 of the Periodic Table
- C07F1/08—Copper compounds
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/06—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the deposition of metallic material
- C23C16/18—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the deposition of metallic material from metallo-organic compounds
-
- C—CHEMISTRY; METALLURGY
- C07—ORGANIC CHEMISTRY
- C07F—ACYCLIC, CARBOCYCLIC OR HETEROCYCLIC COMPOUNDS CONTAINING ELEMENTS OTHER THAN CARBON, HYDROGEN, HALOGEN, OXYGEN, NITROGEN, SULFUR, SELENIUM OR TELLURIUM
- C07F1/00—Compounds containing elements of Groups 1 or 11 of the Periodic Table
-
- C—CHEMISTRY; METALLURGY
- C07—ORGANIC CHEMISTRY
- C07F—ACYCLIC, CARBOCYCLIC OR HETEROCYCLIC COMPOUNDS CONTAINING ELEMENTS OTHER THAN CARBON, HYDROGEN, HALOGEN, OXYGEN, NITROGEN, SULFUR, SELENIUM OR TELLURIUM
- C07F1/00—Compounds containing elements of Groups 1 or 11 of the Periodic Table
- C07F1/005—Compounds containing elements of Groups 1 or 11 of the Periodic Table without C-Metal linkages
-
- C—CHEMISTRY; METALLURGY
- C07—ORGANIC CHEMISTRY
- C07F—ACYCLIC, CARBOCYCLIC OR HETEROCYCLIC COMPOUNDS CONTAINING ELEMENTS OTHER THAN CARBON, HYDROGEN, HALOGEN, OXYGEN, NITROGEN, SULFUR, SELENIUM OR TELLURIUM
- C07F1/00—Compounds containing elements of Groups 1 or 11 of the Periodic Table
- C07F1/10—Silver compounds
-
- C—CHEMISTRY; METALLURGY
- C07—ORGANIC CHEMISTRY
- C07F—ACYCLIC, CARBOCYCLIC OR HETEROCYCLIC COMPOUNDS CONTAINING ELEMENTS OTHER THAN CARBON, HYDROGEN, HALOGEN, OXYGEN, NITROGEN, SULFUR, SELENIUM OR TELLURIUM
- C07F1/00—Compounds containing elements of Groups 1 or 11 of the Periodic Table
- C07F1/12—Gold compounds
-
- C—CHEMISTRY; METALLURGY
- C07—ORGANIC CHEMISTRY
- C07F—ACYCLIC, CARBOCYCLIC OR HETEROCYCLIC COMPOUNDS CONTAINING ELEMENTS OTHER THAN CARBON, HYDROGEN, HALOGEN, OXYGEN, NITROGEN, SULFUR, SELENIUM OR TELLURIUM
- C07F7/00—Compounds containing elements of Groups 4 or 14 of the Periodic Table
- C07F7/02—Silicon compounds
- C07F7/08—Compounds having one or more C—Si linkages
- C07F7/0803—Compounds with Si-C or Si-Si linkages
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
- Y10T428/31678—Of metal
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- General Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Chemical Vapour Deposition (AREA)
- Electrodes Of Semiconductors (AREA)
- Organic Low-Molecular-Weight Compounds And Preparation Thereof (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US64033804P | 2004-12-30 | 2004-12-30 | |
| US11/111,455 US7034169B1 (en) | 2004-12-30 | 2005-04-21 | Volatile metal β-ketoiminate complexes |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| ATE409702T1 true ATE409702T1 (de) | 2008-10-15 |
Family
ID=35994642
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| AT05028216T ATE409702T1 (de) | 2004-12-30 | 2005-12-22 | Flüchtige ketoiminat-metallkomplexe |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US7034169B1 (de) |
| EP (1) | EP1676849B1 (de) |
| JP (1) | JP4414397B2 (de) |
| KR (3) | KR100737260B1 (de) |
| AT (1) | ATE409702T1 (de) |
| DE (1) | DE602005010041D1 (de) |
| TW (1) | TWI332504B (de) |
Families Citing this family (19)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7323581B1 (en) | 1990-07-06 | 2008-01-29 | Advanced Technology Materials, Inc. | Source reagent compositions and method for forming metal films on a substrate by chemical vapor deposition |
| US6960675B2 (en) * | 2003-10-14 | 2005-11-01 | Advanced Technology Materials, Inc. | Tantalum amide complexes for depositing tantalum-containing films, and method of making same |
| US7205422B2 (en) * | 2004-12-30 | 2007-04-17 | Air Products And Chemicals, Inc. | Volatile metal β-ketoiminate and metal β-diiminate complexes |
| US7947814B2 (en) * | 2006-04-25 | 2011-05-24 | Air Products And Chemicals, Inc. | Metal complexes of polydentate beta-ketoiminates |
| US8283485B2 (en) * | 2007-06-21 | 2012-10-09 | Air Products And Chemicals, Inc. | Process for selectively depositing copper thin films on substrates with copper and ruthenium areas via vapor deposition |
| EP2014790A1 (de) | 2007-06-21 | 2009-01-14 | Air Products and Chemicals, Inc. | Verfahren zur Herstellung von deckenden Kupferdünnfilmen mittels Aufdampfung |
| US8263795B2 (en) * | 2007-11-05 | 2012-09-11 | Air Products And Chemicals, Inc. | Copper precursors for thin film deposition |
| EP2060577B1 (de) | 2007-11-05 | 2013-08-21 | Air Products and Chemicals, Inc. | Kupfervorstufen für Dünnschichtauftragung |
| US7691984B2 (en) | 2007-11-27 | 2010-04-06 | Air Products And Chemicals, Inc. | Metal complexes of tridentate β-ketoiminates |
| US7919409B2 (en) * | 2008-08-15 | 2011-04-05 | Air Products And Chemicals, Inc. | Materials for adhesion enhancement of copper film on diffusion barriers |
| WO2011006035A2 (en) * | 2009-07-10 | 2011-01-13 | L'air Liquide Societe Anonyme Pour L'etude Et L'exploitation Des Procedes Georges Claude | Bis-ketoiminate copper precursors for deposition of copper-containing films |
| JP5255029B2 (ja) * | 2009-09-08 | 2013-08-07 | エア プロダクツ アンド ケミカルズ インコーポレイテッド | 金属含有フィルムの現像用のアミノエーテル含有液体組成物 |
| US8507704B2 (en) | 2009-09-08 | 2013-08-13 | Air Products And Chemicals, Inc. | Liquid composition containing aminoether for deposition of metal-containing films |
| KR100990854B1 (ko) * | 2010-05-24 | 2010-10-29 | 주식회사 광성금속 | 도금 바렐에 사용하기 위한 댕글러 어셈블리 |
| US9079923B2 (en) | 2010-08-05 | 2015-07-14 | Air Products And Chemicals, Inc. | Multidentate ketoimine ligands for metal complexes |
| US8617305B2 (en) * | 2011-01-25 | 2013-12-31 | Air Products And Chemicals, Inc. | Metal complexes for metal-containing film deposition |
| KR102344660B1 (ko) | 2015-05-27 | 2021-12-29 | 에이에스엠 아이피 홀딩 비.브이. | 몰리브덴 또는 텅스텐 함유 박막의 ald용 전구체의 합성 및 사용 |
| US10358407B2 (en) | 2016-10-12 | 2019-07-23 | Asm Ip Holding B.V. | Synthesis and use of precursors for vapor deposition of tungsten containing thin films |
| WO2023068629A1 (ko) * | 2021-10-19 | 2023-04-27 | 한국화학연구원 | 3족 금속 전구체, 이의 제조방법 및 이를 이용하는 박막의 제조방법 |
Family Cites Families (16)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB1263720A (en) * | 1968-09-16 | 1972-02-16 | British Petroleum Co | Oxo process |
| US5098516A (en) | 1990-12-31 | 1992-03-24 | Air Products And Chemicals, Inc. | Processes for the chemical vapor deposition of copper and etching of copper |
| JP3079814B2 (ja) | 1992-11-11 | 2000-08-21 | 三菱マテリアル株式会社 | 銅膜形成用材料 |
| KR100225686B1 (ko) * | 1995-03-20 | 1999-10-15 | 모리시다 요이치치 | 막형성용 재료 및 배선형성방법 |
| KR20000013302A (ko) | 1998-08-06 | 2000-03-06 | 최형수 | 화학 증착법을 위한 유기 구리 전구체 |
| US6589329B1 (en) | 2000-03-09 | 2003-07-08 | Advanced Technology Materials, Inc. | Composition and process for production of copper circuitry in microelectronic device structures |
| WO2001068580A1 (fr) | 2000-03-14 | 2001-09-20 | Nissan Chemical Industries, Ltd. | COMPLEXE β-DICETONATOCUIVRE(I) CONTENANT UN COMPOSE ALLENE EN LIGAND ET PROCEDE DE PRODUCTION |
| US20020013487A1 (en) | 2000-04-03 | 2002-01-31 | Norman John Anthony Thomas | Volatile precursors for deposition of metals and metal-containing films |
| JP4660924B2 (ja) * | 2000-12-25 | 2011-03-30 | 東ソー株式会社 | 安定化された銅錯体及びその製造方法 |
| US6669990B2 (en) * | 2001-06-25 | 2003-12-30 | Samsung Electronics Co., Ltd. | Atomic layer deposition method using a novel group IV metal precursor |
| US6620956B2 (en) * | 2001-11-16 | 2003-09-16 | Applied Materials, Inc. | Nitrogen analogs of copper II β-diketonates as source reagents for semiconductor processing |
| WO2003044242A2 (en) | 2001-11-16 | 2003-05-30 | Applied Materials, Inc. | Atomic layer deposition of copper using a reducing gas and non-fluorinated copper precursors |
| US6552209B1 (en) | 2002-06-24 | 2003-04-22 | Air Products And Chemicals, Inc. | Preparation of metal imino/amino complexes for metal oxide and metal nitride thin films |
| US6869876B2 (en) | 2002-11-05 | 2005-03-22 | Air Products And Chemicals, Inc. | Process for atomic layer deposition of metal films |
| US20040247905A1 (en) | 2003-04-16 | 2004-12-09 | Bradley Alexander Zak | Volatile copper(I) complexes for deposition of copper films by atomic layer deposition |
| US6822107B1 (en) * | 2003-08-19 | 2004-11-23 | Advanced Technology Materials, Inc. | Chemical vapor deposition precursors for deposition of copper |
-
2005
- 2005-04-21 US US11/111,455 patent/US7034169B1/en active Active
- 2005-12-22 AT AT05028216T patent/ATE409702T1/de not_active IP Right Cessation
- 2005-12-22 DE DE200560010041 patent/DE602005010041D1/de active Active
- 2005-12-22 EP EP20050028216 patent/EP1676849B1/de not_active Not-in-force
- 2005-12-27 TW TW94146813A patent/TWI332504B/zh active
- 2005-12-30 KR KR1020050135036A patent/KR100737260B1/ko active IP Right Grant
-
2006
- 2006-01-04 JP JP2006000149A patent/JP4414397B2/ja not_active Expired - Fee Related
-
2007
- 2007-03-15 KR KR1020070025459A patent/KR100759779B1/ko active IP Right Grant
- 2007-05-03 KR KR1020070042940A patent/KR100767257B1/ko active IP Right Grant
Also Published As
| Publication number | Publication date |
|---|---|
| KR20070053191A (ko) | 2007-05-23 |
| DE602005010041D1 (de) | 2008-11-13 |
| US7034169B1 (en) | 2006-04-25 |
| KR100759779B1 (ko) | 2007-10-04 |
| TWI332504B (en) | 2010-11-01 |
| EP1676849A1 (de) | 2006-07-05 |
| TW200624434A (en) | 2006-07-16 |
| KR20060093013A (ko) | 2006-08-23 |
| KR100767257B1 (ko) | 2007-10-17 |
| EP1676849B1 (de) | 2008-10-01 |
| KR100737260B1 (ko) | 2007-07-10 |
| JP2006241137A (ja) | 2006-09-14 |
| KR20070036766A (ko) | 2007-04-03 |
| JP4414397B2 (ja) | 2010-02-10 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| RER | Ceased as to paragraph 5 lit. 3 law introducing patent treaties |