ATE360350T1 - CIRCUIT BOARD - Google Patents

CIRCUIT BOARD

Info

Publication number
ATE360350T1
ATE360350T1 AT04729604T AT04729604T ATE360350T1 AT E360350 T1 ATE360350 T1 AT E360350T1 AT 04729604 T AT04729604 T AT 04729604T AT 04729604 T AT04729604 T AT 04729604T AT E360350 T1 ATE360350 T1 AT E360350T1
Authority
AT
Austria
Prior art keywords
circuit arrangement
current circuit
printed
current
circuit board
Prior art date
Application number
AT04729604T
Other languages
German (de)
Inventor
Ernst-Christoph Grueter
Original Assignee
Korstens & Goossens Gmbh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=33546625&utm_source=***_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=ATE360350(T1) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by Korstens & Goossens Gmbh filed Critical Korstens & Goossens Gmbh
Application granted granted Critical
Publication of ATE360350T1 publication Critical patent/ATE360350T1/en

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0263—High current adaptations, e.g. printed high current conductors or using auxiliary non-printed means; Fine and coarse circuit patterns on one circuit board
    • H05K1/0265—High current adaptations, e.g. printed high current conductors or using auxiliary non-printed means; Fine and coarse circuit patterns on one circuit board characterized by the lay-out of or details of the printed conductors, e.g. reinforced conductors, redundant conductors, conductors having different cross-sections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
    • H05K1/183—Components mounted in and supported by recessed areas of the printed circuit board
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09145—Edge details
    • H05K2201/0919—Exposing inner circuit layers or metal planes at the side edge of the PCB or at the walls of large holes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/09881—Coating only between conductors, i.e. flush with the conductors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/09972—Partitioned, e.g. portions of a PCB dedicated to different functions; Boundary lines therefore; Portions of a PCB being processed separately or differently
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10416—Metallic blocks or heatsinks completely inserted in a PCB

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Structure Of Printed Boards (AREA)
  • Combinations Of Printed Boards (AREA)
  • Polysaccharides And Polysaccharide Derivatives (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Chemical And Physical Treatments For Wood And The Like (AREA)

Abstract

The invention relates to a printed circuit board comprising at least one non conductive support plate (1) equipped with components and printed conductors for electrically contacting said components, at least one low-current circuit arrangement (2) for coupling or transmitting low current outputs and at least one high-current circuit arrangement (3) for coupling and/or transmitting high current outputs. Printed circuit boards of this type are known, but have the disadvantage of being inflexible or expensive to produce. To solve this problem, the inventive high-current circuit arrangement is only situated in one section of the printed circuit board and in order to house the printed conductors (4) and/or the contact block (5) of the high-current circuit arrangement (3), the support plate (1) comprises at least one component receptacle (6) in the form of a pocket-type recess or continuous cavity, in which the printed conductors (4) and/or the contact block (5) of the high-current circuit arrangement (3) are mounted.
AT04729604T 2003-06-23 2004-04-27 CIRCUIT BOARD ATE360350T1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE10328285A DE10328285A1 (en) 2003-06-23 2003-06-23 circuit board

Publications (1)

Publication Number Publication Date
ATE360350T1 true ATE360350T1 (en) 2007-05-15

Family

ID=33546625

Family Applications (1)

Application Number Title Priority Date Filing Date
AT04729604T ATE360350T1 (en) 2003-06-23 2004-04-27 CIRCUIT BOARD

Country Status (4)

Country Link
EP (1) EP1639869B1 (en)
AT (1) ATE360350T1 (en)
DE (2) DE10328285A1 (en)
WO (1) WO2005002300A1 (en)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102011051411A1 (en) 2011-06-28 2013-01-03 Schweizer Electronic Ag A prepreg, a method for producing a prepreg, a method for producing a printed circuit board element and printed circuit board element
DE102011090002A1 (en) * 2011-12-28 2013-02-07 Continental Automotive Gmbh Printed circuit board of printed circuit board assembly used in automotive industry, has patterned metallization layer set facing away from cover layer, and metal core structure consisting of conductor track partially exposed by recess
DE102013007042A1 (en) * 2013-04-24 2014-10-30 Gottfried Wilhelm Leibniz Universität Hannover Printed circuit board and method for producing a printed circuit board
DE102014201484A1 (en) 2014-01-28 2015-07-30 Robert Bosch Gmbh Battery system with a plurality of battery cells and a battery management system
DE102016107085B4 (en) 2016-04-18 2024-03-14 Semikron Elektronik Gmbh & Co. Kg Circuit board with insulation layers arranged one above the other

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01168260A (en) * 1987-12-23 1989-07-03 Yusuke Shigyo Extraction and separation of active component of mycelia of microorganisms and health drink containing said component
US5358774A (en) * 1993-04-26 1994-10-25 Motorola, Inc. Electromagnetic shielding assembly and fabrication method
JP3509315B2 (en) * 1995-08-02 2004-03-22 三菱電機株式会社 Circuit board manufacturing method
FR2798036B1 (en) * 1999-08-26 2002-01-18 Sagem ELECTRONIC MODULE AND METHOD FOR MANUFACTURING SUCH A MODULE
JP2002159119A (en) * 2000-11-20 2002-05-31 Auto Network Gijutsu Kenkyusho:Kk Electrical junction box
JP4582491B2 (en) * 2001-03-19 2010-11-17 Ｔｄｋラムダ株式会社 Metal substrate
DE10134143A1 (en) * 2001-07-13 2003-01-30 Daimler Chrysler Ag Modern, high-power cells with low-current monitoring connections, comprises circuit boards attached by deformable fastenings
FR2837061A1 (en) * 2002-03-11 2003-09-12 Thales Sa CERAMIC MULTI-LAYERED SUBSTRATE FOR POWER COMPONENT, ELECTRONIC MODULE AND CIRCUIT COMPRISING THE SUBSTRATE AND METHOD FOR MANUFACTURING THE SUBSTRATE

Also Published As

Publication number Publication date
DE10328285A1 (en) 2005-02-10
WO2005002300A1 (en) 2005-01-06
EP1639869B1 (en) 2007-04-18
EP1639869A1 (en) 2006-03-29
DE502004003551D1 (en) 2007-05-31

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Legal Events

Date Code Title Description
REN Ceased due to non-payment of the annual fee