ATE328354T1 - Verkapseltes elektronisches bauelement und verfahren zu dessen herstellung - Google Patents

Verkapseltes elektronisches bauelement und verfahren zu dessen herstellung

Info

Publication number
ATE328354T1
ATE328354T1 AT03710751T AT03710751T ATE328354T1 AT E328354 T1 ATE328354 T1 AT E328354T1 AT 03710751 T AT03710751 T AT 03710751T AT 03710751 T AT03710751 T AT 03710751T AT E328354 T1 ATE328354 T1 AT E328354T1
Authority
AT
Austria
Prior art keywords
metal layer
layer
devices
terminal
insulating material
Prior art date
Application number
AT03710751T
Other languages
English (en)
Inventor
Ray Burke
Maurice O'brien
Brian Ahearne
John Kelly
Gordon L Bourns
Original Assignee
Bourns Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Bourns Inc filed Critical Bourns Inc
Application granted granted Critical
Publication of ATE328354T1 publication Critical patent/ATE328354T1/de

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01CRESISTORS
    • H01C1/00Details
    • H01C1/14Terminals or tapping points or electrodes specially adapted for resistors; Arrangements of terminals or tapping points or electrodes on resistors
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01CRESISTORS
    • H01C1/00Details
    • H01C1/02Housing; Enclosing; Embedding; Filling the housing or enclosure
    • H01C1/028Housing; Enclosing; Embedding; Filling the housing or enclosure the resistive element being embedded in insulation with outer enclosing sheath
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01CRESISTORS
    • H01C1/00Details
    • H01C1/14Terminals or tapping points or electrodes specially adapted for resistors; Arrangements of terminals or tapping points or electrodes on resistors
    • H01C1/1406Terminals or electrodes formed on resistive elements having positive temperature coefficient
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01CRESISTORS
    • H01C1/00Details
    • H01C1/14Terminals or tapping points or electrodes specially adapted for resistors; Arrangements of terminals or tapping points or electrodes on resistors
    • H01C1/142Terminals or tapping points or electrodes specially adapted for resistors; Arrangements of terminals or tapping points or electrodes on resistors the terminals or tapping points being coated on the resistive element
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01CRESISTORS
    • H01C17/00Apparatus or processes specially adapted for manufacturing resistors
    • H01C17/006Apparatus or processes specially adapted for manufacturing resistors adapted for manufacturing resistor chips
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01CRESISTORS
    • H01C17/00Apparatus or processes specially adapted for manufacturing resistors
    • H01C17/02Apparatus or processes specially adapted for manufacturing resistors adapted for manufacturing resistors with envelope or housing
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01CRESISTORS
    • H01C17/00Apparatus or processes specially adapted for manufacturing resistors
    • H01C17/28Apparatus or processes specially adapted for manufacturing resistors adapted for applying terminals
    • H01C17/281Apparatus or processes specially adapted for manufacturing resistors adapted for applying terminals by thick film techniques

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Thermistors And Varistors (AREA)
  • Control Of Vending Devices And Auxiliary Devices For Vending Devices (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Medical Preparation Storing Or Oral Administration Devices (AREA)
  • Manufacturing Of Micro-Capsules (AREA)
AT03710751T 2002-12-11 2003-01-24 Verkapseltes elektronisches bauelement und verfahren zu dessen herstellung ATE328354T1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US43255202P 2002-12-11 2002-12-11

Publications (1)

Publication Number Publication Date
ATE328354T1 true ATE328354T1 (de) 2006-06-15

Family

ID=32507963

Family Applications (1)

Application Number Title Priority Date Filing Date
AT03710751T ATE328354T1 (de) 2002-12-11 2003-01-24 Verkapseltes elektronisches bauelement und verfahren zu dessen herstellung

Country Status (6)

Country Link
US (1) US20060055500A1 (de)
EP (1) EP1573753B1 (de)
AT (1) ATE328354T1 (de)
AU (1) AU2003214908A1 (de)
DE (1) DE60305734T2 (de)
WO (1) WO2004053898A2 (de)

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US8358815B2 (en) * 2004-04-16 2013-01-22 Validity Sensors, Inc. Method and apparatus for two-dimensional finger motion tracking and control
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US8175345B2 (en) 2004-04-16 2012-05-08 Validity Sensors, Inc. Unitized ergonomic two-dimensional fingerprint motion tracking device and method
US8165355B2 (en) * 2006-09-11 2012-04-24 Validity Sensors, Inc. Method and apparatus for fingerprint motion tracking using an in-line array for use in navigation applications
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US8290150B2 (en) * 2007-05-11 2012-10-16 Validity Sensors, Inc. Method and system for electronically securing an electronic device using physically unclonable functions
KR101030858B1 (ko) * 2007-09-28 2011-04-22 삼성에스디아이 주식회사 이차전지
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US8204281B2 (en) * 2007-12-14 2012-06-19 Validity Sensors, Inc. System and method to remove artifacts from fingerprint sensor scans
US8276816B2 (en) * 2007-12-14 2012-10-02 Validity Sensors, Inc. Smart card system with ergonomic fingerprint sensor and method of using
US8116540B2 (en) * 2008-04-04 2012-02-14 Validity Sensors, Inc. Apparatus and method for reducing noise in fingerprint sensing circuits
TWI389278B (zh) * 2008-06-19 2013-03-11 Subtron Technology Co Ltd 封裝基板製程
TWI444903B (zh) * 2008-07-22 2014-07-11 Validity Sensors Inc 提供裝置組件安全之系統及其方法
US8391568B2 (en) * 2008-11-10 2013-03-05 Validity Sensors, Inc. System and method for improved scanning of fingerprint edges
US7829390B2 (en) * 2008-11-20 2010-11-09 Azurewave Technologies, Inc. Packaging structure of SIP and a manufacturing method thereof
US8278946B2 (en) 2009-01-15 2012-10-02 Validity Sensors, Inc. Apparatus and method for detecting finger activity on a fingerprint sensor
US20100180136A1 (en) * 2009-01-15 2010-07-15 Validity Sensors, Inc. Ultra Low Power Wake-On-Event Mode For Biometric Systems
US20100176892A1 (en) * 2009-01-15 2010-07-15 Validity Sensors, Inc. Ultra Low Power Oscillator
US8600122B2 (en) * 2009-01-15 2013-12-03 Validity Sensors, Inc. Apparatus and method for culling substantially redundant data in fingerprint sensing circuits
US8374407B2 (en) 2009-01-28 2013-02-12 Validity Sensors, Inc. Live finger detection
ITMO20090026A1 (it) * 2009-02-04 2010-08-05 Maria Prudenziati Elemento riscaldante innovativo, in particolare per stampi e camere calde di apparecchiature di stampaggio ad iniezione di materie plastiche in spessori sottili
US20100208953A1 (en) * 2009-02-17 2010-08-19 Validity Sensors, Inc. Illuminated Fingerprint Sensor and Method
US9274553B2 (en) 2009-10-30 2016-03-01 Synaptics Incorporated Fingerprint sensor and integratable electronic display
US9336428B2 (en) 2009-10-30 2016-05-10 Synaptics Incorporated Integrated fingerprint sensor and display
US8791792B2 (en) * 2010-01-15 2014-07-29 Idex Asa Electronic imager using an impedance sensor grid array mounted on or about a switch and method of making
US8421890B2 (en) 2010-01-15 2013-04-16 Picofield Technologies, Inc. Electronic imager using an impedance sensor grid array and method of making
US8866347B2 (en) 2010-01-15 2014-10-21 Idex Asa Biometric image sensing
US9666635B2 (en) 2010-02-19 2017-05-30 Synaptics Incorporated Fingerprint sensing circuit
US8716613B2 (en) 2010-03-02 2014-05-06 Synaptics Incoporated Apparatus and method for electrostatic discharge protection
US9001040B2 (en) 2010-06-02 2015-04-07 Synaptics Incorporated Integrated fingerprint sensor and navigation device
US8331096B2 (en) 2010-08-20 2012-12-11 Validity Sensors, Inc. Fingerprint acquisition expansion card apparatus
US8594393B2 (en) 2011-01-26 2013-11-26 Validity Sensors System for and method of image reconstruction with dual line scanner using line counts
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US9406580B2 (en) 2011-03-16 2016-08-02 Synaptics Incorporated Packaging for fingerprint sensors and methods of manufacture
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US10043052B2 (en) 2011-10-27 2018-08-07 Synaptics Incorporated Electronic device packages and methods
US9195877B2 (en) 2011-12-23 2015-11-24 Synaptics Incorporated Methods and devices for capacitive image sensing
US9785299B2 (en) 2012-01-03 2017-10-10 Synaptics Incorporated Structures and manufacturing methods for glass covered electronic devices
US8842406B2 (en) * 2012-01-06 2014-09-23 Polytronics Technology Corp. Over-current protection device
US9137438B2 (en) 2012-03-27 2015-09-15 Synaptics Incorporated Biometric object sensor and method
US9251329B2 (en) 2012-03-27 2016-02-02 Synaptics Incorporated Button depress wakeup and wakeup strategy
US9268991B2 (en) 2012-03-27 2016-02-23 Synaptics Incorporated Method of and system for enrolling and matching biometric data
US9600709B2 (en) 2012-03-28 2017-03-21 Synaptics Incorporated Methods and systems for enrolling biometric data
US9152838B2 (en) 2012-03-29 2015-10-06 Synaptics Incorporated Fingerprint sensor packagings and methods
EP2958053A1 (de) 2012-04-10 2015-12-23 Idex Asa Biometrische erfassung
US9665762B2 (en) 2013-01-11 2017-05-30 Synaptics Incorporated Tiered wakeup strategy
US9202682B2 (en) 2013-02-22 2015-12-01 Bourns, Inc. Devices and methods related to flat gas discharge tubes
CN103441053B (zh) * 2013-03-22 2016-03-23 深圳市槟城电子有限公司 集成气体放电管及其制备方法
US9907190B1 (en) * 2015-02-03 2018-02-27 Amazon Technologies, Inc. Composite structures and methods of making
CN107836032B (zh) * 2015-03-17 2020-11-27 伯恩斯公司 扁平气体放电管器件和方法
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Also Published As

Publication number Publication date
AU2003214908A1 (en) 2004-06-30
AU2003214908A8 (en) 2004-06-30
EP1573753A2 (de) 2005-09-14
WO2004053898A2 (en) 2004-06-24
WO2004053898A3 (en) 2004-10-21
DE60305734D1 (de) 2006-07-06
EP1573753B1 (de) 2006-05-31
US20060055500A1 (en) 2006-03-16
DE60305734T2 (de) 2007-05-31

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