JP3183388B2
(ja)
*
|
1996-07-12 |
2001-07-09 |
株式会社東京精密 |
半導体ウェーハ研磨装置
|
US6183354B1
(en)
|
1996-11-08 |
2001-02-06 |
Applied Materials, Inc. |
Carrier head with a flexible membrane for a chemical mechanical polishing system
|
US6146259A
(en)
*
|
1996-11-08 |
2000-11-14 |
Applied Materials, Inc. |
Carrier head with local pressure control for a chemical mechanical polishing apparatus
|
JP3705670B2
(ja)
*
|
1997-02-19 |
2005-10-12 |
株式会社荏原製作所 |
ポリッシング装置及び方法
|
US6425812B1
(en)
|
1997-04-08 |
2002-07-30 |
Lam Research Corporation |
Polishing head for chemical mechanical polishing using linear planarization technology
|
US6244946B1
(en)
|
1997-04-08 |
2001-06-12 |
Lam Research Corporation |
Polishing head with removable subcarrier
|
EP0881039B1
(de)
*
|
1997-05-28 |
2003-04-16 |
Tokyo Seimitsu Co.,Ltd. |
Halbleiterscheibe Poliervorrichtung mit Halterring
|
US5964653A
(en)
|
1997-07-11 |
1999-10-12 |
Applied Materials, Inc. |
Carrier head with a flexible membrane for a chemical mechanical polishing system
|
EP0890416A3
(de)
|
1997-07-11 |
2002-09-11 |
Tokyo Seimitsu Co.,Ltd. |
Halbleiterscheiben Poliervorrichtung
|
US5916015A
(en)
*
|
1997-07-25 |
1999-06-29 |
Speedfam Corporation |
Wafer carrier for semiconductor wafer polishing machine
|
US6113479A
(en)
*
|
1997-07-25 |
2000-09-05 |
Obsidian, Inc. |
Wafer carrier for chemical mechanical planarization polishing
|
MY120754A
(en)
*
|
1997-08-11 |
2005-11-30 |
Tokyo Seimitsu Co Ltd |
Wafer polishing apparatus
|
TW434095B
(en)
*
|
1997-08-11 |
2001-05-16 |
Tokyo Seimitsu Co Ltd |
Wafer polishing apparatus
|
US5989103A
(en)
*
|
1997-09-19 |
1999-11-23 |
Applied Materials, Inc. |
Magnetic carrier head for chemical mechanical polishing
|
US6080040A
(en)
*
|
1997-11-05 |
2000-06-27 |
Aplex Group |
Wafer carrier head with inflatable bladder and attack angle control for polishing
|
JP3006568B2
(ja)
*
|
1997-12-04 |
2000-02-07 |
日本電気株式会社 |
ウエハ研磨装置および研磨方法
|
US6068548A
(en)
*
|
1997-12-17 |
2000-05-30 |
Intel Corporation |
Mechanically stabilized retaining ring for chemical mechanical polishing
|
US6531397B1
(en)
|
1998-01-09 |
2003-03-11 |
Lsi Logic Corporation |
Method and apparatus for using across wafer back pressure differentials to influence the performance of chemical mechanical polishing
|
JPH11285966A
(ja)
*
|
1998-04-02 |
1999-10-19 |
Speedfam-Ipec Co Ltd |
キャリア及びcmp装置
|
US6106379A
(en)
*
|
1998-05-12 |
2000-08-22 |
Speedfam-Ipec Corporation |
Semiconductor wafer carrier with automatic ring extension
|
US5985094A
(en)
*
|
1998-05-12 |
1999-11-16 |
Speedfam-Ipec Corporation |
Semiconductor wafer carrier
|
US6113480A
(en)
*
|
1998-06-02 |
2000-09-05 |
Taiwan Semiconductor Manufacturing Co., Ltd |
Apparatus for polishing semiconductor wafers and method of testing same
|
US6251215B1
(en)
|
1998-06-03 |
2001-06-26 |
Applied Materials, Inc. |
Carrier head with a multilayer retaining ring for chemical mechanical polishing
|
US6159079A
(en)
*
|
1998-09-08 |
2000-12-12 |
Applied Materials, Inc. |
Carrier head for chemical mechanical polishing a substrate
|
US6210255B1
(en)
|
1998-09-08 |
2001-04-03 |
Applied Materials, Inc. |
Carrier head for chemical mechanical polishing a substrate
|
SG96263A1
(en)
*
|
1998-09-25 |
2003-05-23 |
Tdk Corp |
Method for processing slider
|
US6347979B1
(en)
*
|
1998-09-29 |
2002-02-19 |
Vsli Technology, Inc. |
Slurry dispensing carrier ring
|
JP2000187832A
(ja)
*
|
1998-10-05 |
2000-07-04 |
Exclusive Design Co Inc |
磁気ディスク及び他の基板を自動研磨する方法及び装置
|
US6244942B1
(en)
|
1998-10-09 |
2001-06-12 |
Applied Materials, Inc. |
Carrier head with a flexible membrane and adjustable edge pressure
|
US6132298A
(en)
|
1998-11-25 |
2000-10-17 |
Applied Materials, Inc. |
Carrier head with edge control for chemical mechanical polishing
|
US6277014B1
(en)
|
1998-10-09 |
2001-08-21 |
Applied Materials, Inc. |
Carrier head with a flexible membrane for chemical mechanical polishing
|
US6220930B1
(en)
*
|
1998-11-03 |
2001-04-24 |
United Microelectronics Corp. |
Wafer polishing head
|
US6165058A
(en)
*
|
1998-12-09 |
2000-12-26 |
Applied Materials, Inc. |
Carrier head for chemical mechanical polishing
|
US6422927B1
(en)
|
1998-12-30 |
2002-07-23 |
Applied Materials, Inc. |
Carrier head with controllable pressure and loading area for chemical mechanical polishing
|
SG82058A1
(en)
*
|
1998-12-30 |
2001-07-24 |
Applied Materials Inc |
Carrier head with controllable pressure and loading area for chemical mechanical polishing
|
US6162116A
(en)
*
|
1999-01-23 |
2000-12-19 |
Applied Materials, Inc. |
Carrier head for chemical mechanical polishing
|
US6179709B1
(en)
*
|
1999-02-04 |
2001-01-30 |
Applied Materials, Inc. |
In-situ monitoring of linear substrate polishing operations
|
TW436378B
(en)
*
|
1999-02-05 |
2001-05-28 |
Mitsubishi Materials Corp |
Wafer polishing apparatus and method for making a wafer
|
US6645050B1
(en)
*
|
1999-02-25 |
2003-11-11 |
Applied Materials, Inc. |
Multimode substrate carrier
|
US6231428B1
(en)
*
|
1999-03-03 |
2001-05-15 |
Mitsubishi Materials Corporation |
Chemical mechanical polishing head assembly having floating wafer carrier and retaining ring
|
US6368189B1
(en)
|
1999-03-03 |
2002-04-09 |
Mitsubishi Materials Corporation |
Apparatus and method for chemical-mechanical polishing (CMP) head having direct pneumatic wafer polishing pressure
|
US6113468A
(en)
*
|
1999-04-06 |
2000-09-05 |
Speedfam-Ipec Corporation |
Wafer planarization carrier having floating pad load ring
|
US6431968B1
(en)
|
1999-04-22 |
2002-08-13 |
Applied Materials, Inc. |
Carrier head with a compressible film
|
WO2000078504A1
(en)
*
|
1999-06-19 |
2000-12-28 |
Speedfam-Ipec Corporation |
Method and apparatus for increasing the lifetime of a workpiece retaining structure and conditioning a polishing surface
|
US6224472B1
(en)
*
|
1999-06-24 |
2001-05-01 |
Samsung Austin Semiconductor, L.P. |
Retaining ring for chemical mechanical polishing
|
US6855043B1
(en)
|
1999-07-09 |
2005-02-15 |
Applied Materials, Inc. |
Carrier head with a modified flexible membrane
|
US6241593B1
(en)
*
|
1999-07-09 |
2001-06-05 |
Applied Materials, Inc. |
Carrier head with pressurizable bladder
|
US6494774B1
(en)
|
1999-07-09 |
2002-12-17 |
Applied Materials, Inc. |
Carrier head with pressure transfer mechanism
|
US6358121B1
(en)
|
1999-07-09 |
2002-03-19 |
Applied Materials, Inc. |
Carrier head with a flexible membrane and an edge load ring
|
WO2001007208A1
(en)
*
|
1999-07-28 |
2001-02-01 |
Mitsubishi Materials Corporation |
Cmp polishing head with three chambers and method for using the same
|
US6663466B2
(en)
|
1999-11-17 |
2003-12-16 |
Applied Materials, Inc. |
Carrier head with a substrate detector
|
US6375549B1
(en)
|
2000-03-17 |
2002-04-23 |
Motorola, Inc. |
Polishing head for wafer, and method for polishing
|
US6361419B1
(en)
|
2000-03-27 |
2002-03-26 |
Applied Materials, Inc. |
Carrier head with controllable edge pressure
|
US6450868B1
(en)
|
2000-03-27 |
2002-09-17 |
Applied Materials, Inc. |
Carrier head with multi-part flexible membrane
|
US6390905B1
(en)
*
|
2000-03-31 |
2002-05-21 |
Speedfam-Ipec Corporation |
Workpiece carrier with adjustable pressure zones and barriers
|
US7140956B1
(en)
|
2000-03-31 |
2006-11-28 |
Speedfam-Ipec Corporation |
Work piece carrier with adjustable pressure zones and barriers and a method of planarizing a work piece
|
US6666756B1
(en)
|
2000-03-31 |
2003-12-23 |
Lam Research Corporation |
Wafer carrier head assembly
|
US6354928B1
(en)
*
|
2000-04-21 |
2002-03-12 |
Agere Systems Guardian Corp. |
Polishing apparatus with carrier ring and carrier head employing like polarities
|
US6436828B1
(en)
|
2000-05-04 |
2002-08-20 |
Applied Materials, Inc. |
Chemical mechanical polishing using magnetic force
|
US6558232B1
(en)
*
|
2000-05-12 |
2003-05-06 |
Multi-Planar Technologies, Inc. |
System and method for CMP having multi-pressure zone loading for improved edge and annular zone material removal control
|
US6409579B1
(en)
*
|
2000-05-31 |
2002-06-25 |
Koninklijke Philips Electronics N.V. |
Method and apparatus for conditioning a polish pad at the point of polish and for dispensing slurry at the point of polish
|
US6540592B1
(en)
|
2000-06-29 |
2003-04-01 |
Speedfam-Ipec Corporation |
Carrier head with reduced moment wear ring
|
US6447380B1
(en)
|
2000-06-30 |
2002-09-10 |
Lam Research Corporation |
Polishing apparatus and substrate retainer ring providing continuous slurry distribution
|
US6722965B2
(en)
*
|
2000-07-11 |
2004-04-20 |
Applied Materials Inc. |
Carrier head with flexible membranes to provide controllable pressure and loading area
|
US7198561B2
(en)
*
|
2000-07-25 |
2007-04-03 |
Applied Materials, Inc. |
Flexible membrane for multi-chamber carrier head
|
US6857945B1
(en)
|
2000-07-25 |
2005-02-22 |
Applied Materials, Inc. |
Multi-chamber carrier head with a flexible membrane
|
US20040005842A1
(en)
*
|
2000-07-25 |
2004-01-08 |
Chen Hung Chih |
Carrier head with flexible membrane
|
US6419567B1
(en)
|
2000-08-14 |
2002-07-16 |
Semiconductor 300 Gmbh & Co. Kg |
Retaining ring for chemical-mechanical polishing (CMP) head, polishing apparatus, slurry cycle system, and method
|
US6652357B1
(en)
|
2000-09-22 |
2003-11-25 |
Lam Research Corporation |
Methods for controlling retaining ring and wafer head tilt for chemical mechanical polishing
|
US6443815B1
(en)
*
|
2000-09-22 |
2002-09-03 |
Lam Research Corporation |
Apparatus and methods for controlling pad conditioning head tilt for chemical mechanical polishing
|
JP4818505B2
(ja)
*
|
2000-10-19 |
2011-11-16 |
不二越機械工業株式会社 |
ウェーハ研磨ヘッド
|
US6447368B1
(en)
|
2000-11-20 |
2002-09-10 |
Speedfam-Ipec Corporation |
Carriers with concentric balloons supporting a diaphragm
|
US6468131B1
(en)
|
2000-11-28 |
2002-10-22 |
Speedfam-Ipec Corporation |
Method to mathematically characterize a multizone carrier
|
US6910949B1
(en)
|
2001-04-25 |
2005-06-28 |
Lam Research Corporation |
Spherical cap-shaped polishing head in a chemical mechanical polishing apparatus for semiconductor wafers
|
US6582277B2
(en)
|
2001-05-01 |
2003-06-24 |
Speedfam-Ipec Corporation |
Method for controlling a process in a multi-zonal apparatus
|
US6722942B1
(en)
|
2001-05-21 |
2004-04-20 |
Advanced Micro Devices, Inc. |
Chemical mechanical polishing with electrochemical control
|
US7217175B2
(en)
*
|
2001-05-29 |
2007-05-15 |
Ebara Corporation |
Polishing apparatus and polishing method
|
US6893327B2
(en)
*
|
2001-06-04 |
2005-05-17 |
Multi Planar Technologies, Inc. |
Chemical mechanical polishing apparatus and method having a retaining ring with a contoured surface
|
KR100421445B1
(ko)
*
|
2001-09-28 |
2004-03-09 |
삼성전자주식회사 |
연마 헤드 조립 방법 및 연마 헤드 조립 시의 공기 누설검사장치
|
US6890249B1
(en)
|
2001-12-27 |
2005-05-10 |
Applied Materials, Inc. |
Carrier head with edge load retaining ring
|
US6872130B1
(en)
|
2001-12-28 |
2005-03-29 |
Applied Materials Inc. |
Carrier head with non-contact retainer
|
US20030182015A1
(en)
*
|
2002-03-19 |
2003-09-25 |
Domaille Michael D. |
Polisher
|
US6689258B1
(en)
|
2002-04-30 |
2004-02-10 |
Advanced Micro Devices, Inc. |
Electrochemically generated reactants for chemical mechanical planarization
|
US6790123B2
(en)
|
2002-05-16 |
2004-09-14 |
Speedfam-Ipec Corporation |
Method for processing a work piece in a multi-zonal processing apparatus
|
AU2003300375A1
(en)
*
|
2002-10-11 |
2004-05-04 |
Semplastics, L.L.C. |
Retaining ring for use on a carrier of a polishing apparatus
|
US7001245B2
(en)
*
|
2003-03-07 |
2006-02-21 |
Applied Materials Inc. |
Substrate carrier with a textured membrane
|
US20060180486A1
(en)
*
|
2003-04-21 |
2006-08-17 |
Bennett David W |
Modular panel and storage system for flat items such as media discs and holders therefor
|
KR100600231B1
(ko)
*
|
2003-07-12 |
2006-07-13 |
동부일렉트로닉스 주식회사 |
씨엠피 폴리싱 헤드 및 그 동작방법
|
US7255771B2
(en)
|
2004-03-26 |
2007-08-14 |
Applied Materials, Inc. |
Multiple zone carrier head with flexible membrane
|
US6935938B1
(en)
|
2004-03-31 |
2005-08-30 |
Lam Research Corporation |
Multiple-conditioning member device for chemical mechanical planarization conditioning
|
KR101044739B1
(ko)
|
2004-11-01 |
2011-06-28 |
가부시키가이샤 에바라 세이사꾸쇼 |
폴리싱장치 및 폴리싱방법
|
US7101272B2
(en)
*
|
2005-01-15 |
2006-09-05 |
Applied Materials, Inc. |
Carrier head for thermal drift compensation
|
JP4814677B2
(ja)
*
|
2006-03-31 |
2011-11-16 |
株式会社荏原製作所 |
基板保持装置および研磨装置
|
US20090242125A1
(en)
*
|
2008-03-25 |
2009-10-01 |
Applied Materials, Inc. |
Carrier Head Membrane
|
US7749052B2
(en)
*
|
2008-09-08 |
2010-07-06 |
Applied Materials, Inc. |
Carrier head using flexure restraints for retaining ring alignment
|
US10160093B2
(en)
|
2008-12-12 |
2018-12-25 |
Applied Materials, Inc. |
Carrier head membrane roughness to control polishing rate
|