ATE216554T1 - METHOD AND DEVICE FOR PRODUCING THIN-FILM STRUCTURES - Google Patents

METHOD AND DEVICE FOR PRODUCING THIN-FILM STRUCTURES

Info

Publication number
ATE216554T1
ATE216554T1 AT99924725T AT99924725T ATE216554T1 AT E216554 T1 ATE216554 T1 AT E216554T1 AT 99924725 T AT99924725 T AT 99924725T AT 99924725 T AT99924725 T AT 99924725T AT E216554 T1 ATE216554 T1 AT E216554T1
Authority
AT
Austria
Prior art keywords
film structures
producing thin
programmed
subjected
directed
Prior art date
Application number
AT99924725T
Other languages
German (de)
Inventor
Hans Koch
Wolfhard Semmler
Original Assignee
B R Deutschland Vertr D Bundes
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by B R Deutschland Vertr D Bundes filed Critical B R Deutschland Vertr D Bundes
Priority claimed from PCT/DE1999/000958 external-priority patent/WO1999053738A1/en
Application granted granted Critical
Publication of ATE216554T1 publication Critical patent/ATE216554T1/en

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1241—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by ink-jet printing or drawing by dispensing
    • H05K3/125—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by ink-jet printing or drawing by dispensing by ink-jet printing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J3/00—Typewriters or selective printing or marking mechanisms characterised by the purpose for which they are constructed
    • B41J3/407—Typewriters or selective printing or marking mechanisms characterised by the purpose for which they are constructed for marking on special material
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
    • H01L21/768—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics
    • H01L21/76838—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics characterised by the formation and the after-treatment of the conductors

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Particle Formation And Scattering Control In Inkjet Printers (AREA)
  • Liquid Deposition Of Substances Of Which Semiconductor Devices Are Composed (AREA)
  • Physical Deposition Of Substances That Are Components Of Semiconductor Devices (AREA)
  • Physical Vapour Deposition (AREA)

Abstract

The manufacture of thin film structure uses a multi layer form in which the layers have a pattern produced using an ink jet printing process that is programmed to produce a pixel pattern. This is then subjected a process in which a heated fluid is directed at the surface and is in a programmed jet form
AT99924725T 1998-04-09 1999-03-25 METHOD AND DEVICE FOR PRODUCING THIN-FILM STRUCTURES ATE216554T1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE19817530A DE19817530C2 (en) 1998-04-09 1998-04-09 Process for the production of thin-film structures
PCT/DE1999/000958 WO1999053738A1 (en) 1998-04-09 1999-03-25 Method and device for producing thin-layer structures

Publications (1)

Publication Number Publication Date
ATE216554T1 true ATE216554T1 (en) 2002-05-15

Family

ID=7865161

Family Applications (1)

Application Number Title Priority Date Filing Date
AT99924725T ATE216554T1 (en) 1998-04-09 1999-03-25 METHOD AND DEVICE FOR PRODUCING THIN-FILM STRUCTURES

Country Status (3)

Country Link
JP (1) JP2003523070A (en)
AT (1) ATE216554T1 (en)
DE (2) DE19817530C2 (en)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
ITUD20010220A1 (en) * 2001-12-27 2003-06-27 New System Srl SYSTEM FOR THE REALIZATION OF A LAYERING OF ELECTRONICALLY INTERACTIVE MATERIAL
JP4663373B2 (en) * 2005-03-31 2011-04-06 富士通コンポーネント株式会社 Method for forming conductive wire of panel type input device
DE102016202551A1 (en) * 2016-02-18 2017-09-07 Krones Ag Method, printhead and machine for printing on a container

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3047884A1 (en) * 1980-12-18 1982-07-15 Siemens AG, 1000 Berlin und 8000 München Printed circuit mfg. process - using ink jet printer for applying metal coating, lacquer or etching fluid to allow high prodn. rate
DE3805841A1 (en) * 1988-02-22 1989-08-31 Siemens Ag METHOD FOR EQUIPPING COMPONENT CARRIERS WITH COMPONENTS IN SURFACE MOUNTING TECHNOLOGY

Also Published As

Publication number Publication date
DE19817530A1 (en) 1999-10-14
DE19817530C2 (en) 2002-10-24
DE59901261D1 (en) 2002-05-23
JP2003523070A (en) 2003-07-29

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Legal Events

Date Code Title Description
REN Ceased due to non-payment of the annual fee