ATE212717T1 - INSPECTION METHOD AND APPARATUS - Google Patents

INSPECTION METHOD AND APPARATUS

Info

Publication number
ATE212717T1
ATE212717T1 AT93309113T AT93309113T ATE212717T1 AT E212717 T1 ATE212717 T1 AT E212717T1 AT 93309113 T AT93309113 T AT 93309113T AT 93309113 T AT93309113 T AT 93309113T AT E212717 T1 ATE212717 T1 AT E212717T1
Authority
AT
Austria
Prior art keywords
polarization
inspection method
scattered
interference
inspected
Prior art date
Application number
AT93309113T
Other languages
German (de)
Inventor
Minoru Yoshii
Noriyuki Nose
Tetsuzo Mori
Kyoichi Miyazaki
Toshihiko Tsuji
Seiji Takeuchi
Original Assignee
Canon Kk
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP05099541A external-priority patent/JP3126546B2/en
Application filed by Canon Kk filed Critical Canon Kk
Application granted granted Critical
Publication of ATE212717T1 publication Critical patent/ATE212717T1/en

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
    • G03F7/70605—Workpiece metrology
    • G03F7/70616—Monitoring the printed patterns
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/94—Investigating contamination, e.g. dust
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
    • G03F7/70605—Workpiece metrology
    • G03F7/70616—Monitoring the printed patterns
    • G03F7/7065—Defects, e.g. optical inspection of patterned layer for defects
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/70908—Hygiene, e.g. preventing apparatus pollution, mitigating effect of pollution or removing pollutants from apparatus
    • G03F7/70916—Pollution mitigation, i.e. mitigating effect of contamination or debris, e.g. foil traps
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/17—Systems in which incident light is modified in accordance with the properties of the material investigated
    • G01N21/47—Scattering, i.e. diffuse reflection
    • G01N2021/4792—Polarisation of scatter light

Landscapes

  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Atmospheric Sciences (AREA)
  • Public Health (AREA)
  • Epidemiology (AREA)
  • Chemical & Material Sciences (AREA)
  • Immunology (AREA)
  • Pathology (AREA)
  • General Health & Medical Sciences (AREA)
  • Biochemistry (AREA)
  • Analytical Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Environmental & Geological Engineering (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Transplanting Machines (AREA)
  • Indicating And Signalling Devices For Elevators (AREA)

Abstract

An inspection method includes the steps of forming a first beam of first polarization and a second beam of second polarization different from the first polarization, illuminating a surface to be inspected, with the first beam, and detecting an interference beam resulting from interference between the second beam and a particular beam being scattered from the surface illuminated with the first beam and advancing in a direction sideways to the direction of illumination with the first beam, the scattered beam having its polarization being changed from the first polarization. <IMAGE>
AT93309113T 1992-11-16 1993-11-15 INSPECTION METHOD AND APPARATUS ATE212717T1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP30542292 1992-11-16
JP2267593 1993-02-10
JP05099541A JP3126546B2 (en) 1992-04-27 1993-04-26 Inspection apparatus, inspection method, and system using the same

Publications (1)

Publication Number Publication Date
ATE212717T1 true ATE212717T1 (en) 2002-02-15

Family

ID=27283936

Family Applications (1)

Application Number Title Priority Date Filing Date
AT93309113T ATE212717T1 (en) 1992-11-16 1993-11-15 INSPECTION METHOD AND APPARATUS

Country Status (3)

Country Link
EP (1) EP0598582B1 (en)
AT (1) ATE212717T1 (en)
DE (1) DE69331515D1 (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4434545B2 (en) 2001-03-01 2010-03-17 Ｄｏｗａホールディングス株式会社 Insulating substrate for semiconductor mounting and power module
NL2009462A (en) 2011-11-01 2013-05-07 Asml Holding Nv Lithographic apparatus and device manufacturing method.

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4710026A (en) * 1985-03-22 1987-12-01 Nippon Kogaku K. K. Position detection apparatus
JPS61260211A (en) * 1985-05-15 1986-11-18 Hitachi Ltd Automatic foreign matters detecting method and its device
JP2661913B2 (en) * 1986-05-02 1997-10-08 パ−テイクル、メジユアリング、システムズ インコ−ポレ−テツド Surface analysis method and surface analysis device
US4898471A (en) * 1987-06-18 1990-02-06 Tencor Instruments Particle detection on patterned wafers and the like
JPH02307046A (en) * 1989-05-22 1990-12-20 Hitachi Electron Eng Co Ltd Face plate defect detection system by heterodyne system and inspection device
JPH03249550A (en) * 1990-02-28 1991-11-07 Mitsubishi Electric Corp Pattern defect inspecting device
EP0567701B1 (en) * 1992-04-27 1998-01-14 Canon Kabushiki Kaisha Inspection method and apparatus

Also Published As

Publication number Publication date
EP0598582B1 (en) 2002-01-30
EP0598582A3 (en) 1994-09-14
EP0598582A2 (en) 1994-05-25
DE69331515D1 (en) 2002-03-14

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Legal Events

Date Code Title Description
RER Ceased as to paragraph 5 lit. 3 law introducing patent treaties