ATE144677T1 - Erweiterungsfähige gekühlte gehäuse für computer- leiterplatten - Google Patents
Erweiterungsfähige gekühlte gehäuse für computer- leiterplattenInfo
- Publication number
- ATE144677T1 ATE144677T1 AT91918349T AT91918349T ATE144677T1 AT E144677 T1 ATE144677 T1 AT E144677T1 AT 91918349 T AT91918349 T AT 91918349T AT 91918349 T AT91918349 T AT 91918349T AT E144677 T1 ATE144677 T1 AT E144677T1
- Authority
- AT
- Austria
- Prior art keywords
- circuit boards
- expandable
- computer circuit
- sections
- enclosures
- Prior art date
Links
- 238000001816 cooling Methods 0.000 abstract 1
- 239000000428 dust Substances 0.000 abstract 1
- 239000007788 liquid Substances 0.000 abstract 1
Classifications
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/20—Cooling means
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F2200/00—Indexing scheme relating to G06F1/04 - G06F1/32
- G06F2200/20—Indexing scheme relating to G06F1/20
- G06F2200/201—Cooling arrangements using cooling fluid
Landscapes
- Engineering & Computer Science (AREA)
- Theoretical Computer Science (AREA)
- Human Computer Interaction (AREA)
- Physics & Mathematics (AREA)
- General Engineering & Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Devices That Are Associated With Refrigeration Equipment (AREA)
- Laminated Bodies (AREA)
- Manufacture Of Porous Articles, And Recovery And Treatment Of Waste Products (AREA)
- Packages (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US07/587,014 US5067040A (en) | 1990-09-24 | 1990-09-24 | Expandable refrigerated enclosure for computer boards |
Publications (1)
Publication Number | Publication Date |
---|---|
ATE144677T1 true ATE144677T1 (de) | 1996-11-15 |
Family
ID=24347980
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
AT91918349T ATE144677T1 (de) | 1990-09-24 | 1991-09-16 | Erweiterungsfähige gekühlte gehäuse für computer- leiterplatten |
Country Status (7)
Country | Link |
---|---|
US (1) | US5067040A (de) |
EP (1) | EP0550654B1 (de) |
AT (1) | ATE144677T1 (de) |
AU (1) | AU8739891A (de) |
DE (1) | DE69122878T2 (de) |
ES (1) | ES2095330T3 (de) |
WO (1) | WO1992005680A1 (de) |
Families Citing this family (41)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5319520A (en) * | 1991-11-26 | 1994-06-07 | Kabushiki Kaisha Toshiba | Electronic equipment assembly of tiered type |
US5335144A (en) * | 1992-11-02 | 1994-08-02 | Samar Enterprises Company, Ltd. | Modular stacked housing arrangement |
DE69726267T2 (de) * | 1996-05-29 | 2004-09-09 | Abb Ab | Elektrische Hochspannungs-Wechselstrommaschine |
JP3052843B2 (ja) * | 1996-07-03 | 2000-06-19 | 住友電装株式会社 | 電気接続箱 |
US5864467A (en) * | 1997-02-12 | 1999-01-26 | Paradyne Corporation | Cascadable modem apparatus |
US5909357A (en) * | 1997-04-24 | 1999-06-01 | Orr; Tom | Vertically stacked computer modules shaped to indicate compatibility with vertical cooling shaft extending throughout |
US6115242A (en) * | 1997-10-24 | 2000-09-05 | Advanced Micro Devices, Inc. | Chip chassis including a micro-backplane for receiving and connecting a plurality of computer chips |
US6134892A (en) * | 1998-04-23 | 2000-10-24 | Aps Technology, Inc. | Cooled electrical system for use downhole |
US5931000A (en) * | 1998-04-23 | 1999-08-03 | Turner; William Evans | Cooled electrical system for use downhole |
US6249671B1 (en) * | 1998-06-05 | 2001-06-19 | Lxe, Inc. | Aesthetic enclosure for a wireless network access point |
US9119705B2 (en) | 1998-06-08 | 2015-09-01 | Thermotek, Inc. | Method and system for thermal and compression therapy relative to the prevention of deep vein thrombosis |
AU1098700A (en) * | 1998-10-01 | 2000-04-17 | Sparrow Marcioni | Secure rack systems, methods, and apparatus |
US6574110B1 (en) * | 1999-12-13 | 2003-06-03 | 3Com Corporation | Stackable slide mount system for modem devices |
EP1256869A1 (de) * | 2001-05-10 | 2002-11-13 | Hewlett Packard Company, a Delaware Corporation | Montage von elektronischen Geräten |
KR100397498B1 (ko) * | 2001-06-11 | 2003-09-13 | 엘지전자 주식회사 | 공간절약형 데스크 홀더 |
GB2377085A (en) * | 2001-06-27 | 2002-12-31 | Dah Wei Chu | Electronic apparatus housing with heating/cooling system |
US6650539B1 (en) * | 2002-06-19 | 2003-11-18 | Handsome Electronics Ltd. | Modular backup power housing |
US6667883B1 (en) * | 2002-08-29 | 2003-12-23 | Proxim Corporation | Forced-air cooling of a transceiver unit |
US8100956B2 (en) | 2006-05-09 | 2012-01-24 | Thermotek, Inc. | Method of and system for thermally augmented wound care oxygenation |
EP1646351B1 (de) | 2003-07-18 | 2011-03-30 | Thermotek, Inc. | Thermisches system für eine decke |
US8574278B2 (en) | 2006-05-09 | 2013-11-05 | Thermotek, Inc. | Wound care method and system with one or both of vacuum-light therapy and thermally augmented oxygenation |
US8128672B2 (en) | 2006-05-09 | 2012-03-06 | Thermotek, Inc. | Wound care method and system with one or both of vacuum-light therapy and thermally augmented oxygenation |
US8778005B2 (en) | 2003-07-18 | 2014-07-15 | Thermotek, Inc. | Method and system for thermal and compression therapy relative to the prevention of deep vein thrombosis |
US7116553B2 (en) * | 2003-11-07 | 2006-10-03 | Scimeasure Analytical Systems, Inc. | Circuit board enclosure |
US10765785B2 (en) | 2004-07-19 | 2020-09-08 | Thermotek, Inc. | Wound care and infusion method and system utilizing a therapeutic agent |
US10016583B2 (en) | 2013-03-11 | 2018-07-10 | Thermotek, Inc. | Wound care and infusion method and system utilizing a thermally-treated therapeutic agent |
USD679023S1 (en) | 2004-07-19 | 2013-03-26 | Thermotek, Inc. | Foot wrap |
US20060034053A1 (en) * | 2004-08-12 | 2006-02-16 | Thermotek, Inc. | Thermal control system for rack mounting |
DE102005032607A1 (de) | 2005-05-31 | 2006-12-07 | Fpe Fischer Gmbh | Gehäuse für elektronische Geräte und Systeme |
US7909861B2 (en) | 2005-10-14 | 2011-03-22 | Thermotek, Inc. | Critical care thermal therapy method and system |
USD662214S1 (en) | 2007-04-10 | 2012-06-19 | Thermotek, Inc. | Circumferential leg wrap |
US8758419B1 (en) | 2008-01-31 | 2014-06-24 | Thermotek, Inc. | Contact cooler for skin cooling applications |
US20100319986A1 (en) * | 2009-06-17 | 2010-12-23 | Bleau Charles A | Modular vented circuit board enclosure |
RU2459231C2 (ru) * | 2010-09-30 | 2012-08-20 | Государственное образовательное учреждение высшего профессионального образования Томский государственный университет систем управления и радиоэлектроники (ТУСУР) | Устройство для стабилизации температуры микросборок |
US10512587B2 (en) | 2011-07-27 | 2019-12-24 | Thermotek, Inc. | Method and apparatus for scalp thermal treatment |
US10149927B2 (en) | 2012-04-24 | 2018-12-11 | Thermotek, Inc. | Method and system for therapeutic use of ultra-violet light |
US10300180B1 (en) | 2013-03-11 | 2019-05-28 | Thermotek, Inc. | Wound care and infusion method and system utilizing a therapeutic agent |
CN104516440A (zh) * | 2013-09-29 | 2015-04-15 | 鸿富锦精密电子(天津)有限公司 | 硬盘模组 |
WO2015051100A1 (en) * | 2013-10-03 | 2015-04-09 | Ciil Technologies, Llc | Media device enclosure system |
WO2015070144A1 (en) | 2013-11-11 | 2015-05-14 | Thermotek, Inc. | Method and system for wound care |
KR102123265B1 (ko) * | 2014-04-08 | 2020-06-16 | 주식회사 쏠리드 | 통신 모듈 어셈블리 |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3054024A (en) * | 1959-03-11 | 1962-09-11 | Polytron Ind Inc | Compatible module structure |
CH633929A5 (de) * | 1978-07-14 | 1982-12-31 | Hasler Ag | Zwangsbelueftetes elektronikgestell. |
US4558914A (en) * | 1982-09-23 | 1985-12-17 | Gould Inc. | Readily expandable input/output construction for programmable controller |
US4858070A (en) * | 1987-04-24 | 1989-08-15 | Racal Data Communications Inc. | Modular expandable housing arrangement for electronic apparatus |
JPH038907A (ja) * | 1989-06-07 | 1991-01-16 | Ohbayashi Corp | 免震装置 |
-
1990
- 1990-09-24 US US07/587,014 patent/US5067040A/en not_active Expired - Lifetime
-
1991
- 1991-09-16 EP EP91918349A patent/EP0550654B1/de not_active Expired - Lifetime
- 1991-09-16 AU AU87398/91A patent/AU8739891A/en not_active Abandoned
- 1991-09-16 ES ES91918349T patent/ES2095330T3/es not_active Expired - Lifetime
- 1991-09-16 DE DE69122878T patent/DE69122878T2/de not_active Expired - Fee Related
- 1991-09-16 WO PCT/US1991/006664 patent/WO1992005680A1/en active IP Right Grant
- 1991-09-16 AT AT91918349T patent/ATE144677T1/de active
Also Published As
Publication number | Publication date |
---|---|
WO1992005680A1 (en) | 1992-04-02 |
ES2095330T3 (es) | 1997-02-16 |
DE69122878D1 (de) | 1996-11-28 |
EP0550654B1 (de) | 1996-10-23 |
AU8739891A (en) | 1992-04-15 |
EP0550654A4 (en) | 1994-07-20 |
EP0550654A1 (de) | 1993-07-14 |
DE69122878T2 (de) | 1997-05-28 |
US5067040A (en) | 1991-11-19 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
ATE144677T1 (de) | Erweiterungsfähige gekühlte gehäuse für computer- leiterplatten | |
DE69131273D1 (de) | Elektronisches-Computer-Kühlsystem | |
US5040095A (en) | Thermally controlled equipment cabinet | |
DK174384D0 (da) | Fremgangsmaade og kredsloeb til identifikation af lagermoduler i elektroniske databehandlingsanlaeg | |
DE69321501D1 (de) | Kühlvorrichtung für Bauteile mit elektronischen Schaltungen | |
JPS6426310A (en) | Enclosed switchboard | |
DE3674905D1 (de) | Verkapselungsgehaeuse fuer eine elektronische schaltung. | |
IT8021314A0 (it) | Apparecchiatura per raffreddare moduli circuitali elettronici. | |
SE8704303D0 (sv) | Kylkropp for ett elektriskt kretskort | |
DE3688962D1 (de) | Kühlsystem für eine elektronische Schaltungsanordnung. | |
GB2319598A (en) | A cooling system for integrated circuit chips in electronic systems | |
KR930021041A (ko) | 장치의 섀시 | |
SE9404359D0 (sv) | Kylsystem | |
DE69207295D1 (de) | Flüssigkeitskühlkreislaufsystem | |
DE60134850D1 (de) | Vorrichtung zum erleichterten gebrauch von standard elektronischen bauteilen in rauhen umgebungen | |
PT81580B (pt) | Dispositivo para arrefecimento de placas de circuitos | |
DE69129888T2 (de) | Wärmesenke für elektronische Schaltung | |
KR860006135A (ko) | 직렬 데이타 입출력 회로를 갖춘 반도체 메모리장치 | |
IT8121675A0 (it) | Dispositivo di raffreddamento per componenti elettronici e/o per pannelli di circuiti sui quali i componenti sono montati. | |
BR8702521A (pt) | Refrigerador termoeletrico e recinto termo-isolante | |
IT8421074A1 (it) | Dispositivi elettronici controllati nella temperatura | |
SE8600656D0 (sv) | Anordning for astadkommande av informationsoverforande kommunikation mellan elektriska komponenter eller kretsar | |
ATE379848T1 (de) | Schalt- oder steuergerät | |
IT1170318B (it) | Igrometro elettronico con circuito di compensazione di temperatura | |
NO894328D0 (no) | Fremgangsmaate og anordning for kjoeling av elektroniske komponenter. |