ATA25096A - Kühlkörper für elektrische und elektronische bauelemente - Google Patents
Kühlkörper für elektrische und elektronische bauelementeInfo
- Publication number
- ATA25096A ATA25096A AT25096A AT25096A ATA25096A AT A25096 A ATA25096 A AT A25096A AT 25096 A AT25096 A AT 25096A AT 25096 A AT25096 A AT 25096A AT A25096 A ATA25096 A AT A25096A
- Authority
- AT
- Austria
- Prior art keywords
- electrical
- heat sink
- electronic components
- electronic
- sink
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
- H05K7/20436—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing
- H05K7/20445—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing the coupling element being an additional piece, e.g. thermal standoff
- H05K7/20454—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing the coupling element being an additional piece, e.g. thermal standoff with a conformable or flexible structure compensating for irregularities, e.g. cushion bags, thermal paste
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
- H01L23/3672—Foil-like cooling fins or heat sinks
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
- H01L23/3677—Wire-like or pin-like cooling fins or heat sinks
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
- H01L23/3736—Metallic materials
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
- H01L23/3737—Organic materials with or without a thermoconductive filler
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Power Engineering (AREA)
- Thermal Sciences (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Devices For Blowing Cold Air, Devices For Blowing Warm Air, And Means For Preventing Water Condensation In Air Conditioning Units (AREA)
- Details Of Measuring And Other Instruments (AREA)
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
AT25096A AT404532B (de) | 1996-02-13 | 1996-02-13 | Kühlkörper für elektrische und elektronische bauelemente |
FR9700889A FR2744873A1 (fr) | 1996-02-13 | 1997-01-28 | Corps de refroidissement pour composants electriques ou electroniques |
GB9701856A GB2310321A (en) | 1996-02-13 | 1997-01-30 | Deformable heat sink |
DE1997104549 DE19704549A1 (de) | 1996-02-13 | 1997-02-06 | Kühlkörper für elektrische und elektronische Bauelemente |
ITMI970270 IT1290293B1 (it) | 1996-02-13 | 1997-02-11 | Corpi raffreddanti per elementi da costurzione elettrici ed elettronici |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
AT25096A AT404532B (de) | 1996-02-13 | 1996-02-13 | Kühlkörper für elektrische und elektronische bauelemente |
Publications (2)
Publication Number | Publication Date |
---|---|
ATA25096A true ATA25096A (de) | 1998-04-15 |
AT404532B AT404532B (de) | 1998-12-28 |
Family
ID=3485550
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
AT25096A AT404532B (de) | 1996-02-13 | 1996-02-13 | Kühlkörper für elektrische und elektronische bauelemente |
Country Status (5)
Country | Link |
---|---|
AT (1) | AT404532B (de) |
DE (1) | DE19704549A1 (de) |
FR (1) | FR2744873A1 (de) |
GB (1) | GB2310321A (de) |
IT (1) | IT1290293B1 (de) |
Families Citing this family (27)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE19739591A1 (de) * | 1997-09-10 | 1999-03-11 | Wuerth Elektronik Gmbh & Co Kg | Recyclingfähige Leiterplatte, bestehend aus einem Folien- und Trägersystem |
US6131651A (en) * | 1998-09-16 | 2000-10-17 | Advanced Ceramics Corporation | Flexible heat transfer device and method |
DE69834934T2 (de) * | 1997-09-19 | 2007-02-01 | General Electric Co. | Flexibele wärmeübertragungsvorrichtung und verfahren |
EP0971407B1 (de) * | 1997-10-14 | 2004-07-21 | Matsushita Electric Industrial Co., Ltd. | Wärmeleitende einheit und wärmeverbindungsstruktur welche diese einheit verwendet |
DE19854642C2 (de) * | 1998-11-26 | 2003-02-20 | Vacuumschmelze Gmbh | Bauelement mit verbesserter Wärmesenke |
SE518446C2 (sv) * | 1999-06-14 | 2002-10-08 | Ericsson Telefon Ab L M | Anordning vid kylning av elektroniska komponenter |
DE10004474B4 (de) * | 2000-02-02 | 2006-04-13 | Rittal Gmbh & Co. Kg | Kühlvorrichtung |
US6690578B2 (en) * | 2000-02-02 | 2004-02-10 | Rittal Gmbh & Co. Kg | Cooling device |
FR2811476B1 (fr) * | 2000-07-07 | 2002-12-06 | Thomson Csf | Dispositif electronique avec encapsulant thermiquement conducteur |
DE10033848A1 (de) * | 2000-07-12 | 2002-01-24 | Plg Elektronik Ingenieur Und D | Elektrisches Gerät |
JP4268778B2 (ja) * | 2001-12-27 | 2009-05-27 | ポリマテック株式会社 | 発熱電子部品の冷却方法及びそれに用いる熱伝導性シート |
GB2388473B (en) * | 2002-05-08 | 2005-09-21 | Sun Microsystems Inc | Compliant heat sink interface |
DE10235047A1 (de) * | 2002-07-31 | 2004-02-12 | Endress + Hauser Gmbh + Co. Kg | Elektronikgehäuse mit integriertem Wärmeverteiler |
WO2004103047A1 (en) * | 2003-05-14 | 2004-11-25 | Chingyi Chen | High efficient heat dissipating module and method of manufacture |
DE102009056607B4 (de) | 2009-12-02 | 2014-11-13 | Amphenol-Tuchel Electronics Gmbh | Zellverbinderdeckel und Hochstromzellanordnung mit einem Zellverbinderdeckel |
WO2013092535A1 (en) | 2011-12-21 | 2013-06-27 | Tyst Design Ved Iver Munk | A heat bus |
DE102014200832A1 (de) * | 2014-01-17 | 2015-07-23 | Siemens Aktiengesellschaft | Flexibler Kühlkörper für unebene Kühlflächen |
JP2016219599A (ja) * | 2015-05-20 | 2016-12-22 | 株式会社リコー | 電子機器および熱拡散体 |
DE102016200156A1 (de) * | 2016-01-08 | 2017-07-13 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | Kühlelement für mindestens einen mit elektronischen und/oder elektrischen Bauelementen bestückten Träger |
AT521329B1 (de) * | 2018-06-12 | 2020-03-15 | Miba Ag | Akkumulator |
EP3923689B1 (de) * | 2020-06-12 | 2024-04-24 | Aptiv Technologies AG | Kühlvorrichtung und verfahren zu deren herstellung |
EP3955716B1 (de) | 2020-08-13 | 2024-07-31 | Aptiv Technologies AG | Kühlvorrichtung und verfahren zur herstellung davon |
DE102021209640A1 (de) * | 2021-09-01 | 2023-03-02 | Continental Automotive Technologies GmbH | Kühlvorrichtung, Kühlanordnung, Steuereinrichtung sowie Racksystem |
AT524582B1 (de) * | 2021-11-04 | 2022-07-15 | Miba Emobility Gmbh | Vorrichtung umfassend ein Elektronikbauteil |
DE102022102564A1 (de) | 2022-02-03 | 2023-08-03 | Cariad Se | Kühlanordnung und Kühlvorrichtung zum Kühlen zumindest eines Bauteils auf einer Leiterplatte |
DE102022207570A1 (de) | 2022-07-25 | 2024-01-25 | Robert Bosch Gesellschaft mit beschränkter Haftung | Kühlvorrichtung für eine zu kühlende Baugruppe in einem Fahrzeug |
CN116171030B (zh) * | 2023-04-21 | 2023-07-04 | 深圳市中电熊猫展盛科技有限公司 | 一种水冷式室内照明智能控制电源及水冷方法 |
Family Cites Families (18)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3654521A (en) * | 1971-01-13 | 1972-04-04 | Gen Electric | Electronic card module thermal clip |
US4092697A (en) * | 1976-12-06 | 1978-05-30 | International Business Machines Corporation | Heat transfer mechanism for integrated circuit package |
DE2903685A1 (de) * | 1979-01-31 | 1980-08-14 | Siemens Ag | Kuehlvorrichtung zur kuehlung von elektrischen bauelementen, insbesondere von integrierten bausteinen |
US4538675A (en) * | 1982-04-01 | 1985-09-03 | Planning Research Corporation | Retention and cooling of plug-in electronic modules in a high shock and vibration environment |
JPS60500391A (ja) * | 1982-12-16 | 1985-03-22 | ハスレル エ−ジ− | 熱伝導性のペ−スト又は液体が満たされた扁平なバッグ |
US4531146A (en) * | 1983-07-14 | 1985-07-23 | Cutchaw John M | Apparatus for cooling high-density integrated circuit packages |
JP2569003B2 (ja) * | 1986-03-20 | 1997-01-08 | 株式会社日立製作所 | 熱伝導装置 |
US4997032A (en) * | 1987-09-25 | 1991-03-05 | Minnesota Mining And Manufacturing Company | Thermal transfer bag |
GB2214719B (en) * | 1988-01-26 | 1991-07-24 | Gen Electric Co Plc | Housing for electronic device |
US4938279A (en) * | 1988-02-05 | 1990-07-03 | Hughes Aircraft Company | Flexible membrane heat sink |
ATE83116T1 (de) * | 1988-05-05 | 1992-12-15 | Siemens Nixdorf Inf Syst | Anordnung zur konvektiven kuehlung von elektronischen bauelementen, insbesondere von integrierten halbleiterschaltungen. |
US5345107A (en) * | 1989-09-25 | 1994-09-06 | Hitachi, Ltd. | Cooling apparatus for electronic device |
DE3935662C2 (de) * | 1989-10-26 | 1997-08-28 | Bosch Gmbh Robert | Auf einem Substrat angeordnete elektronische Schaltung |
US5000256A (en) * | 1990-07-20 | 1991-03-19 | Minnesota Mining And Manufacturing Company | Heat transfer bag with thermal via |
JPH04206555A (ja) * | 1990-11-30 | 1992-07-28 | Hitachi Ltd | 電子機器の冷却装置 |
JP3017837B2 (ja) * | 1991-05-31 | 2000-03-13 | 株式会社日立製作所 | 電子機器装置 |
JPH0590461A (ja) * | 1991-09-25 | 1993-04-09 | Hitachi Ltd | 電子装置 |
DE4336961C2 (de) * | 1993-10-29 | 2000-07-06 | Kerafol Keramische Folien Gmbh | Flexible Wärmeübertragungsvorrichtung |
-
1996
- 1996-02-13 AT AT25096A patent/AT404532B/de not_active IP Right Cessation
-
1997
- 1997-01-28 FR FR9700889A patent/FR2744873A1/fr not_active Withdrawn
- 1997-01-30 GB GB9701856A patent/GB2310321A/en not_active Withdrawn
- 1997-02-06 DE DE1997104549 patent/DE19704549A1/de not_active Ceased
- 1997-02-11 IT ITMI970270 patent/IT1290293B1/it active IP Right Grant
Also Published As
Publication number | Publication date |
---|---|
GB9701856D0 (en) | 1997-03-19 |
FR2744873A1 (fr) | 1997-08-14 |
AT404532B (de) | 1998-12-28 |
ITMI970270A1 (it) | 1998-08-11 |
IT1290293B1 (it) | 1998-10-22 |
DE19704549A1 (de) | 1997-08-14 |
GB2310321A (en) | 1997-08-20 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
ELJ | Ceased due to non-payment of the annual fee | ||
REN | Ceased due to non-payment of the annual fee |