AT526564A5 - Verfahren und Vorrichtung zum Prägen von Substraten - Google Patents
Verfahren und Vorrichtung zum Prägen von Substraten Download PDFInfo
- Publication number
- AT526564A5 AT526564A5 ATA9445/2014A AT94452014A AT526564A5 AT 526564 A5 AT526564 A5 AT 526564A5 AT 94452014 A AT94452014 A AT 94452014A AT 526564 A5 AT526564 A5 AT 526564A5
- Authority
- AT
- Austria
- Prior art keywords
- embossing
- dosing
- compound
- stamp
- embossing substrates
- Prior art date
Links
- 238000004049 embossing Methods 0.000 title abstract 12
- 238000000034 method Methods 0.000 title abstract 2
- 239000000758 substrate Substances 0.000 title 1
- MEKOFIRRDATTAG-UHFFFAOYSA-N 2,2,5,8-tetramethyl-3,4-dihydrochromen-6-ol Chemical compound C1CC(C)(C)OC2=C1C(C)=C(O)C=C2C MEKOFIRRDATTAG-UHFFFAOYSA-N 0.000 abstract 3
- 239000002086 nanomaterial Substances 0.000 abstract 1
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/0002—Lithographic processes using patterning methods other than those involving the exposure to radiation, e.g. by stamping
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/16—Coating processes; Apparatus therefor
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C39/00—Shaping by casting, i.e. introducing the moulding material into a mould or between confining surfaces without significant moulding pressure; Apparatus therefor
- B29C39/22—Component parts, details or accessories; Auxiliary operations
- B29C39/24—Feeding the material into the mould
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
- B29C43/02—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles
- B29C43/021—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles characterised by the shape of the surface
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/0017—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor for the production of embossing, cutting or similar devices; for the production of casting means
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70216—Mask projection systems
- G03F7/70275—Multiple projection paths, e.g. array of projection systems, microlens projection systems or tandem projection systems
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C59/00—Surface shaping of articles, e.g. embossing; Apparatus therefor
- B29C59/02—Surface shaping of articles, e.g. embossing; Apparatus therefor by mechanical means, e.g. pressing
- B29C59/022—Surface shaping of articles, e.g. embossing; Apparatus therefor by mechanical means, e.g. pressing characterised by the disposition or the configuration, e.g. dimensions, of the embossments or the shaping tools therefor
- B29C2059/023—Microembossing
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Shaping Of Tube Ends By Bending Or Straightening (AREA)
- Micromachines (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
Abstract
Die Erfindung betrifft ein Verfahren zum Prägen mindestens einer Mikro oder Nanostruktur mit einem mindestens eine Prägestruktur (2) aufweisenden Prägestempel (1) mit folgenden Schritten, insbesondere folgendem Ablauf: Ausrichtung der Prägestruktur (2) des Prägestempels (1) gegenüber eine Dosiereinrichtung (4), Dosierung einer Prägemasse (6) in die Prägestruktur (2) mittels der Dosiereinrichtung (4), zumindest teilweise Aushärtung der Prägemasse (6) und Prägen der Prägemasse (6), dadurch gekennzeichnet, dass die Prägestrukturen (2) zumindest bei der Dosierung in eine Gravitationsrichtung (G) weisen. Weiterhin betrifft die Erfindung eine korrespondierende Vorrichtung.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE102013113241.3A DE102013113241B4 (de) | 2013-11-29 | 2013-11-29 | Verfahren zum Prägen von Strukturen |
PCT/EP2014/072638 WO2015078637A1 (de) | 2013-11-29 | 2014-10-22 | Verfahren und vorrichtung zum prägen von strukturen |
Publications (2)
Publication Number | Publication Date |
---|---|
AT526564B1 AT526564B1 (de) | 2024-05-15 |
AT526564A5 true AT526564A5 (de) | 2024-05-15 |
Family
ID=51845390
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
ATA139/2023A AT526465A1 (de) | 2013-11-29 | 2014-10-22 | Verfahren und Vorrichtung zum Prägen von Strukturen |
ATA9445/2014A AT526564B1 (de) | 2013-11-29 | 2014-10-22 | Verfahren und Vorrichtung zum Prägen von Substraten |
Family Applications Before (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
ATA139/2023A AT526465A1 (de) | 2013-11-29 | 2014-10-22 | Verfahren und Vorrichtung zum Prägen von Strukturen |
Country Status (9)
Country | Link |
---|---|
US (1) | US10088746B2 (de) |
JP (1) | JP6559130B2 (de) |
KR (2) | KR102250979B1 (de) |
CN (1) | CN105745575B (de) |
AT (2) | AT526465A1 (de) |
DE (1) | DE102013113241B4 (de) |
SG (1) | SG11201604314VA (de) |
TW (2) | TWI688467B (de) |
WO (1) | WO2015078637A1 (de) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR102311945B1 (ko) | 2014-06-26 | 2021-10-13 | 에베 그룹 에. 탈너 게엠베하 | 기질들을 서로 모이게 하여 연결 재료를 분포시키는 동안 기질들을 결합시키기 위한 방법 |
TWI707766B (zh) * | 2018-07-16 | 2020-10-21 | 奇景光電股份有限公司 | 壓印系統、供膠裝置及壓印方法 |
CN116954019A (zh) * | 2023-06-21 | 2023-10-27 | 湖北大学 | 一种基于液态镓的冷冻离心纳米压印方法 |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20050276919A1 (en) * | 2004-06-01 | 2005-12-15 | Molecular Imprints, Inc. | Method for dispensing a fluid on a substrate |
US20070228608A1 (en) * | 2006-04-03 | 2007-10-04 | Molecular Imprints, Inc. | Preserving Filled Features when Vacuum Wiping |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6916584B2 (en) | 2002-08-01 | 2005-07-12 | Molecular Imprints, Inc. | Alignment methods for imprint lithography |
WO2004086471A1 (en) | 2003-03-27 | 2004-10-07 | Korea Institute Of Machinery & Materials | Uv nanoimprint lithography process using elementwise embossed stamp and selectively additive pressurization |
US7811505B2 (en) | 2004-12-07 | 2010-10-12 | Molecular Imprints, Inc. | Method for fast filling of templates for imprint lithography using on template dispense |
JP5443103B2 (ja) * | 2009-09-10 | 2014-03-19 | 株式会社東芝 | パターン形成方法 |
WO2012160769A1 (ja) * | 2011-05-24 | 2012-11-29 | コニカミノルタアドバンストレイヤー株式会社 | 樹脂成形品の製造方法 |
WO2012169120A1 (ja) * | 2011-06-07 | 2012-12-13 | コニカミノルタアドバンストレイヤー株式会社 | 複合体の製造方法および複合体 |
-
2013
- 2013-11-29 DE DE102013113241.3A patent/DE102013113241B4/de not_active Revoked
-
2014
- 2014-10-22 KR KR1020167013828A patent/KR102250979B1/ko active IP Right Grant
- 2014-10-22 JP JP2016534902A patent/JP6559130B2/ja active Active
- 2014-10-22 CN CN201480065137.3A patent/CN105745575B/zh active Active
- 2014-10-22 AT ATA139/2023A patent/AT526465A1/de unknown
- 2014-10-22 KR KR1020217013477A patent/KR102361175B1/ko active IP Right Grant
- 2014-10-22 AT ATA9445/2014A patent/AT526564B1/de active
- 2014-10-22 SG SG11201604314VA patent/SG11201604314VA/en unknown
- 2014-10-22 US US15/038,761 patent/US10088746B2/en active Active
- 2014-10-22 WO PCT/EP2014/072638 patent/WO2015078637A1/de active Application Filing
- 2014-10-30 TW TW103137651A patent/TWI688467B/zh active
- 2014-10-30 TW TW108116265A patent/TWI705884B/zh active
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20050276919A1 (en) * | 2004-06-01 | 2005-12-15 | Molecular Imprints, Inc. | Method for dispensing a fluid on a substrate |
US20070228608A1 (en) * | 2006-04-03 | 2007-10-04 | Molecular Imprints, Inc. | Preserving Filled Features when Vacuum Wiping |
Also Published As
Publication number | Publication date |
---|---|
SG11201604314VA (en) | 2016-07-28 |
JP6559130B2 (ja) | 2019-08-14 |
TW201932279A (zh) | 2019-08-16 |
TWI705884B (zh) | 2020-10-01 |
CN105745575A (zh) | 2016-07-06 |
KR102361175B1 (ko) | 2022-02-10 |
AT526465A1 (de) | 2024-02-15 |
TW201532784A (zh) | 2015-09-01 |
KR20160091333A (ko) | 2016-08-02 |
DE102013113241B4 (de) | 2019-02-21 |
JP2017500738A (ja) | 2017-01-05 |
TWI688467B (zh) | 2020-03-21 |
DE102013113241A1 (de) | 2015-06-03 |
AT526564B1 (de) | 2024-05-15 |
US20170031242A1 (en) | 2017-02-02 |
KR102250979B1 (ko) | 2021-05-12 |
WO2015078637A1 (de) | 2015-06-04 |
KR20210054597A (ko) | 2021-05-13 |
US10088746B2 (en) | 2018-10-02 |
CN105745575B (zh) | 2019-12-17 |
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