AT331271B - Aus schichten aufgebautes strahlungs empfindliches material - Google Patents

Aus schichten aufgebautes strahlungs empfindliches material

Info

Publication number
AT331271B
AT331271B AT696072A AT696072A AT331271B AT 331271 B AT331271 B AT 331271B AT 696072 A AT696072 A AT 696072A AT 696072 A AT696072 A AT 696072A AT 331271 B AT331271 B AT 331271B
Authority
AT
Austria
Prior art keywords
radiation
layers
sensitive material
material built
built
Prior art date
Application number
AT696072A
Other languages
English (en)
Other versions
ATA696072A (de
Original Assignee
Fromson H A
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fromson H A filed Critical Fromson H A
Priority to AT750275A priority Critical patent/AT342942B/de
Publication of ATA696072A publication Critical patent/ATA696072A/de
Application granted granted Critical
Publication of AT331271B publication Critical patent/AT331271B/de

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/108—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by semi-additive methods; masks therefor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/04—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching
    • H05K3/046—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching by selective transfer or selective detachment of a conductive layer
    • H05K3/048—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching by selective transfer or selective detachment of a conductive layer using a lift-off resist pattern or a release layer pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
    • H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
    • H05K3/182—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating characterised by the patterning method
    • H05K3/185—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating characterised by the patterning method by making a catalytic pattern by photo-imaging
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0347—Overplating, e.g. for reinforcing conductors or bumps; Plating over filled vias
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0703—Plating
    • H05K2203/072—Electroless plating, e.g. finish plating or initial plating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0017—Etching of the substrate by chemical or physical means
    • H05K3/0023—Etching of the substrate by chemical or physical means by exposure and development of a photosensitive insulating layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/14—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using spraying techniques to apply the conductive material, e.g. vapour evaporation
    • H05K3/146—By vapour deposition
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/388—Improvement of the adhesion between the insulating substrate and the metal by the use of a metallic or inorganic thin film adhesion layer
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S430/00—Radiation imagery chemistry: process, composition, or product thereof
    • Y10S430/167—X-ray

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Printing Plates And Materials Therefor (AREA)
  • Photosensitive Polymer And Photoresist Processing (AREA)
AT696072A 1971-08-12 1972-08-11 Aus schichten aufgebautes strahlungs empfindliches material AT331271B (de)

Priority Applications (1)

Application Number Priority Date Filing Date Title
AT750275A AT342942B (de) 1971-09-24 1975-10-01 Mit einem metall beschichtetes material

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US17105271A 1971-08-12 1971-08-12

Publications (2)

Publication Number Publication Date
ATA696072A ATA696072A (de) 1975-11-15
AT331271B true AT331271B (de) 1976-08-10

Family

ID=22622300

Family Applications (1)

Application Number Title Priority Date Filing Date
AT696072A AT331271B (de) 1971-08-12 1972-08-11 Aus schichten aufgebautes strahlungs empfindliches material

Country Status (2)

Country Link
US (1) US3773514A (de)
AT (1) AT331271B (de)

Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4054094A (en) * 1972-08-25 1977-10-18 E. I. Du Pont De Nemours And Company Laser production of lithographic printing plates
FR2214934B1 (de) * 1973-01-18 1978-03-24 Thomson Csf
CA1049312A (en) * 1974-01-17 1979-02-27 John O.H. Peterson Presensitized printing plate with in-situ, laser imageable mask
FR2399184A1 (fr) * 1977-07-28 1979-02-23 Telecommunications Sa Procede de realisation de circuits imprimes a trous metallises a partir de supports isolants en stratifie : verre-resine synthetique
US4447519A (en) * 1981-12-16 1984-05-08 Nathan Pritikin Solid photoresist and method of making photoresist
US4526810A (en) * 1982-06-17 1985-07-02 At&T Technologies, Inc. Process for improved wall definition of an additive printed circuit
US4702994A (en) * 1984-10-01 1987-10-27 W. R. Grace & Co. Projection imaged relief printing plates
US4661372A (en) * 1985-12-23 1987-04-28 General Motors Corporation UV-induced copper-catalyzed electroless deposition onto styrene-derivative polymer surface
IL98660A (en) * 1991-06-28 1996-10-16 Orbotech Ltd Method of printing an image on a substrate particularly useful for producing printed circuit boards
US6030708A (en) * 1996-10-28 2000-02-29 Nissha Printing Co., Ltd. Transparent shielding material for electromagnetic interference
US6679982B1 (en) * 1997-08-07 2004-01-20 Ngk Spark Plug Co., Ltd. Oxygen sensor
US6120693A (en) * 1998-11-06 2000-09-19 Alliedsignal Inc. Method of manufacturing an interlayer via and a laminate precursor useful for same
IL133355A (en) * 1999-12-07 2003-10-31 Creo Il Ltd Method and plate for digitally-imaged offset printing
US9302452B2 (en) 2012-03-02 2016-04-05 Ppg Industries Ohio, Inc. Transparent laminates comprising inkjet printed conductive lines and methods of forming the same
US9389512B2 (en) * 2014-09-30 2016-07-12 Eastman Kodak Company Forming conductive metal patterns using water-soluble polymers
US9986669B2 (en) * 2015-11-25 2018-05-29 Ppg Industries Ohio, Inc. Transparency including conductive mesh including a closed shape having at least one curved side
US11745702B2 (en) 2018-12-11 2023-09-05 Ppg Industries Ohio, Inc. Coating including electrically conductive lines directly on electrically conductive layer

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NL280795A (de) * 1958-11-26
US3458311A (en) * 1966-06-27 1969-07-29 Du Pont Photopolymerizable elements with solvent removable protective layers

Also Published As

Publication number Publication date
ATA696072A (de) 1975-11-15
US3773514A (en) 1973-11-20

Similar Documents

Publication Publication Date Title
AT315210B (de) Aufzeichnungsmaterial
AT320685B (de) Lichtempfindliches Material
AT326525B (de) Sandale aus elastischem material
FI55696C (fi) Anordning foer bestrykning av banformigt material
AT321957B (de) Aufzeichnungsmaterial
AT331271B (de) Aus schichten aufgebautes strahlungs empfindliches material
AT325554B (de) Reissverschluss
AT326067B (de) Reissverschluss
AT325559B (de) Reissverschluss
AT332836B (de) Reissverschluss
AT327233B (de) Aufzeichnungsmaterial
AT332335B (de) Reissverschluss
AT337633B (de) Reissverschluss
FI55370C (fi) Anordning foer behandling av fibroest material innehaollande suspensioner
BE787636A (fr) Appareil de laminage de materiau en bandes
AT325638B (de) Aufzeichnungsmaterial
FI55882B (fi) Anordning foer spetsdragning av banformigt material
AT332833B (de) Reissverschluss
BE789588A (fr) Nouveau materiau composite
BE793545A (fr) Materiau semiconducteur magnetique
AT319842B (de) Behälter aus thermoplastischem Material
SE381004B (sv) Tryckkensligt kopieringsmaterial
AT332334B (de) Reissverschluss
CH526435A (de) Behälter aus flexiblem Material
IT963263B (it) Composti pesticidi

Legal Events

Date Code Title Description
ELJ Ceased due to non-payment of the annual fee