YU139887A - Electric assembly element - Google Patents

Electric assembly element

Info

Publication number
YU139887A
YU139887A YU01398/87A YU139887A YU139887A YU 139887 A YU139887 A YU 139887A YU 01398/87 A YU01398/87 A YU 01398/87A YU 139887 A YU139887 A YU 139887A YU 139887 A YU139887 A YU 139887A
Authority
YU
Yugoslavia
Prior art keywords
assembly element
electric assembly
support
component
coating
Prior art date
Application number
YU01398/87A
Other languages
English (en)
Inventor
J Lorenz
R Kicherer
E Keller
Original Assignee
Ego Elektro Blanc & Fischer
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ego Elektro Blanc & Fischer filed Critical Ego Elektro Blanc & Fischer
Publication of YU139887A publication Critical patent/YU139887A/xx

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B3/00—Ohmic-resistance heating
    • H05B3/20—Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater
    • H05B3/22—Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater non-flexible
    • H05B3/28—Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater non-flexible heating conductor embedded in insulating material
    • H05B3/30—Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater non-flexible heating conductor embedded in insulating material on or between metallic plates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/12—Mountings, e.g. non-detachable insulating substrates
    • H01L23/14—Mountings, e.g. non-detachable insulating substrates characterised by the material or its electrical properties
    • H01L23/142—Metallic substrates having insulating layers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/05—Insulated conductive substrates, e.g. insulated metal substrate
    • H05K1/053—Insulated conductive substrates, e.g. insulated metal substrate the metal substrate being covered by an inorganic insulating layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
    • H05K1/167—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed resistors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
    • H05K1/162—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed capacitors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/03—Metal processing
    • H05K2203/0315—Oxidising metal
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/14—Related to the order of processing steps
    • H05K2203/1453—Applying the circuit pattern before another process, e.g. before filling of vias with conductive paste, before making printed resistors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/325—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by abutting or pinching, i.e. without alloying process; mechanical auxiliary parts therefor
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02B—CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO BUILDINGS, e.g. HOUSING, HOUSE APPLIANCES OR RELATED END-USER APPLICATIONS
    • Y02B30/00—Energy efficient heating, ventilation or air conditioning [HVAC]

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical & Material Sciences (AREA)
  • Inorganic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Resistance Heating (AREA)
  • Surface Heating Bodies (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
  • Cable Accessories (AREA)
  • Emergency Protection Circuit Devices (AREA)
  • Control And Other Processes For Unpacking Of Materials (AREA)
  • Surgical Instruments (AREA)
  • Beans For Foods Or Fodder (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
  • Coils Or Transformers For Communication (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Laminated Bodies (AREA)
  • Insulated Metal Substrates For Printed Circuits (AREA)
  • Apparatuses And Processes For Manufacturing Resistors (AREA)
  • Non-Adjustable Resistors (AREA)
YU01398/87A 1986-07-24 1987-07-23 Electric assembly element YU139887A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE19863625087 DE3625087A1 (de) 1986-07-24 1986-07-24 Elektro-bauelement

Publications (1)

Publication Number Publication Date
YU139887A true YU139887A (en) 1990-04-30

Family

ID=6305909

Family Applications (1)

Application Number Title Priority Date Filing Date
YU01398/87A YU139887A (en) 1986-07-24 1987-07-23 Electric assembly element

Country Status (6)

Country Link
US (1) US4864106A (xx)
EP (1) EP0254070B1 (xx)
JP (1) JPS6344792A (xx)
AT (1) ATE84659T1 (xx)
DE (2) DE3625087A1 (xx)
YU (1) YU139887A (xx)

Families Citing this family (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
IT1218221B (it) * 1988-04-15 1990-04-12 Bayer Ag Sistemi di riscaldamento ad alta temperatura e metodo per produrli
US5068517A (en) * 1988-08-25 1991-11-26 Toshiba Lighting & Technology Corporation Printed strip heater
US5290606A (en) * 1989-01-30 1994-03-01 Svein Hestevik Method for manufacturing a substrate for a printed circuit board
NO169570C (no) * 1989-01-30 1992-07-08 Svein Hestevik Fremgangsmaate ved fremstilling av substrat til anbringelse av elektriske og/eller elektroniske komponenter.
FR2683026B1 (fr) * 1991-10-23 1994-02-04 Airelec Industries Appareil de chauffage electrique a element chauffant en toile emaillee et piste resistive compense en temperature .
DE4341036A1 (de) * 1993-12-02 1995-06-08 Ego Elektro Blanc & Fischer Beheizung
ES1027468Y (es) * 1994-03-28 1995-02-16 Morillo Casals Pilar Panel radiante a circuito impreso perfeccionado.
DE19737471C2 (de) * 1997-08-28 2002-03-07 Robert Peters Heizeinrichtung
GB2351894B (en) † 1999-05-04 2003-10-15 Otter Controls Ltd Improvements relating to heating elements
DE10018589A1 (de) * 2000-04-14 2001-10-25 Apag Elektronik Ag Duebendorf Heizanordnung
DE10341404B4 (de) * 2003-09-05 2006-06-01 Siemens Ag Schaltungsvorrichtung mit einem Schaltungsträger
DE102004060949A1 (de) * 2003-12-23 2006-02-09 BSH Bosch und Siemens Hausgeräte GmbH Dickschichtheizung für Fluide und Durchlauferhitzer
DE102011003464A1 (de) 2011-02-01 2012-04-26 E.G.O. Elektro-Gerätebau GmbH Heizeinrichtung für eine Pumpe und Pumpe
DE102011003467A1 (de) 2011-02-01 2012-08-02 E.G.O. Elektro-Gerätebau GmbH Heizeinrichtung für eine Pumpe und Pumpe
FR2989452B1 (fr) * 2012-04-11 2017-04-21 Eco-Matic Module electrique plat et dispositif de chauffage mural le comprenant
US20140097003A1 (en) * 2012-10-05 2014-04-10 Tyco Electronics Amp Gmbh Electrical components and methods and systems of manufacturing electrical components
DE202015007999U1 (de) 2015-11-17 2017-02-20 Parador Gmbh Plattenkörper
CN107525259A (zh) * 2017-09-07 2017-12-29 浙江安扬新能源科技有限公司 一种用于汽车水箱的厚膜加热装置
RU193720U1 (ru) * 2019-08-13 2019-11-11 Фёдор Станиславович Дягилев Нагревательное устройство

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE708273C (de) * 1937-05-28 1941-07-16 Siemens & Halske Akt Ges Hochbelastbarer Schichtwiderstand
DE1146991B (de) * 1959-04-13 1963-04-11 Therm O Lab Corp Elektrisches Heizelement
GB1020311A (en) * 1961-01-20 1966-02-16 Eisler Paul Electrical heating film
DE1440971A1 (de) * 1963-07-27 1969-01-16 Conex Elektro Und Haushaltgera Elektrisches Heizelement fuer Haushaltsgeraete und Raumheizgeraete
DE1515080B2 (de) * 1963-12-16 1971-12-30 Oberschwäbische Metallwarenfabrik GmbH, 7940 Riedlingen Plattenfoermiges elektrisches heizelement fuer heiz und kochgeraete sowie flaechenheizungen
DE1968229U (de) * 1967-04-28 1967-09-14 Robert Hugo Steger Flach- und langflaechen-elektro-heizung mit gedruckter bzw. aufgebrachter schaltung.
US3496336A (en) * 1967-10-25 1970-02-17 Texas Instruments Inc Electric heater
US3788997A (en) * 1971-12-17 1974-01-29 Trw Inc Resistance material and electrical resistor made therefrom
DE7206250U (de) * 1972-02-19 1972-06-08 Eschweiler B Bauelement fuer elektrische bodenheizung
US4053866A (en) * 1975-11-24 1977-10-11 Trw Inc. Electrical resistor with novel termination and method of making same
DE3035749A1 (de) * 1980-09-22 1982-05-06 Siemens AG, 1000 Berlin und 8000 München Waermeableitende leiterplatten
US4323875A (en) * 1981-01-21 1982-04-06 Trw, Inc. Method of making temperature sensitive device and device made thereby
DE8408990U1 (de) * 1984-03-23 1984-07-19 Deutsche Vitrohm Gmbh & Co Kg, 2080 Pinneberg Heizwiderstand fuer ein geraet zur verdampfung von substanzen
DE3426804C2 (de) * 1984-07-10 1987-01-22 W.C. Heraeus Gmbh, 6450 Hanau Substrat für gedruckte Schaltungen
DE3501372A1 (de) * 1985-01-17 1986-07-17 Brown, Boveri & Cie Ag, 6800 Mannheim Substrat fuer leiterplatten

Also Published As

Publication number Publication date
EP0254070A2 (de) 1988-01-27
DE3783526D1 (de) 1993-02-25
ATE84659T1 (de) 1993-01-15
DE3625087A1 (de) 1988-01-28
EP0254070B1 (de) 1993-01-13
JPS6344792A (ja) 1988-02-25
EP0254070A3 (en) 1989-04-12
US4864106A (en) 1989-09-05

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