WO2022222429A1 - Pcb短波长脉冲激光钻孔方法及相关钻孔装置 - Google Patents
Pcb短波长脉冲激光钻孔方法及相关钻孔装置 Download PDFInfo
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- WO2022222429A1 WO2022222429A1 PCT/CN2021/129351 CN2021129351W WO2022222429A1 WO 2022222429 A1 WO2022222429 A1 WO 2022222429A1 CN 2021129351 W CN2021129351 W CN 2021129351W WO 2022222429 A1 WO2022222429 A1 WO 2022222429A1
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/38—Removing material by boring or cutting
- B23K26/382—Removing material by boring or cutting by boring
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/073—Shaping the laser spot
- B23K26/0734—Shaping the laser spot into an annular shape
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/70—Auxiliary operations or equipment
- B23K26/702—Auxiliary equipment
Definitions
- the present application relates to the technical field of PCB laser drilling, and in particular, to a PCB short-wavelength pulsed laser drilling method and a related drilling device.
- PCB Printed Circuit Board
- UV laser ultraviolet laser
- CO2 laser CO2 laser
- the diameter ratio (the ratio of hole depth to diameter) is limited, and at the same time, limited by the laser power, its drilling speed is slow and can only be used to process flexible printed boards or rigid printed boards with a small thickness; while CO2 lasers are mainly used for processing Rigid printed board, and since the copper foil on the surface of the printed board has a very low absorption rate, the surface of the printed board must be browned or blackened before processing, or a window treatment should be carried out at the position to be processed to remove it in advance The copper foil on the surface, and then use CO2 laser ablation to remove the inner layer insulating material.
- UV laser drilling machines and CO2 laser drilling machines respectively, and it is impossible to realize through-hole and blind-hole processing of multi-layer flexible boards and multi-layer rigid boards on one device.
- UV laser drilling machine needs to ablate all the materials in the hole to form through-holes, which has low processing efficiency and serious heat accumulation, and it is difficult to process multi-layer PCBs containing glass fibers.
- CO2 laser processing has problems such as large hole taper and residual glue at the bottom of blind hole processing, and the process is complicated and produces a large amount of chemical waste water.
- the present application provides a PCB short-wavelength pulsed laser drilling method, which can simultaneously realize through holes and blind holes of a multilayer flexible board and a multilayer rigid board on one device. It solves the problems of large hole taper, bottom glue residue, serious heat accumulation and low processing efficiency in the laser drilling process in the prior art.
- a first aspect of the present application provides a PCB short-wavelength pulsed laser drilling method, comprising:
- Step 1 extracting PCB data, the PCB data includes: PCB thickness, hole depth to be drilled, hole center position to be drilled, and hole diameter to be drilled;
- Step 2 Compare the depth of the hole to be drilled and the thickness of the PCB to determine the type of the hole to be drilled;
- Step 3 The comparison result in Step 2 is that the depth of the hole to be drilled is equal to the thickness of the PCB, then it is determined that the hole to be drilled is a through hole, and a ring beam is used to cover the center of the hole to be drilled on the PCB. Through holes are drilled, and the spot diameter of the annular beam irradiated on the PCB is equal to the aperture to be drilled;
- Step 4 The comparison result in step 2 is that the depth of the hole to be drilled is less than the thickness of the PCB, then it is determined that the hole to be drilled is a blind hole, and the Gaussian beam and the annular beam are used to drill the same hole on the PCB respectively. Blind holes are drilled in sections at the center position, and the diameter of the spot of the Gaussian beam irradiated on the PCB is smaller than the aperture to be drilled, and the diameter of the spot of the annular beam irradiated on the PCB is equal to the aperture to be drilled.
- step 4 the use of Gaussian beams and annular beams to drill blind holes in sections on the PCB for the same hole center position to be drilled includes:
- a Gaussian beam to perform preliminary drilling at the center of the hole to be drilled on the PCB, and the drilling depth of the preliminary drilling is less than or equal to the depth of the hole to be drilled to obtain a conical pre-drilled hole; use a ring beam to drill all the holes.
- the conical pre-drilling hole is used for secondary drilling, and the drilling depth of the secondary drilling hole is equal to the depth of the hole to be drilled, and the hole wall is trimmed.
- step 4 the use of Gaussian beams and annular beams to drill blind holes in sections on the PCB for the same hole center position to be drilled includes:
- a ring beam to perform preliminary drilling at the center of the hole to be drilled on the PCB, and the drilling depth of the initial drill is equal to the depth of the hole to be drilled to obtain an annular pre-drilled hole; use a Gaussian beam to drill the annular pre-drilled hole The hole is drilled for a second time, and the drilling depth of the second drilling is equal to the depth of the hole to be drilled, and the residue in the hole is eliminated.
- the diameter of the spot irradiated on the PCB by the Gaussian beam or the annular beam is smaller than the aperture to be drilled, and the drilling path of the Gaussian beam or the annular beam is a circular drilling or a spiral drilling.
- a second aspect of the application provides a PCB short-wavelength pulsed laser drilling device, adapted to the above-mentioned PCB short-wavelength pulsed laser drilling method, comprising:
- the laser beam emitted by the laser source is divided into a first sub-beam and a second sub-beam by the beam splitter, wherein the first sub-beam is processed by the Gaussian optical path module to emit a Gaussian beam, and the second sub-beam After being processed by the ring light path module, a ring beam is emitted;
- the beams emitted by the Gaussian optical path module and the annular optical path module are both irradiated on the mobile platform, and the mobile platform can move horizontally relative to the Gaussian optical path module and the annular optical path module, so that the Gaussian optical path module can move horizontally.
- the light beams generated by the module and the annular light path module can be successively irradiated on the same point on the moving platform.
- the Gaussian optical path module includes: a first mirror group, a first scanning galvanometer and a first focusing mirror;
- the first sub-beam emitted by the beam splitter is sequentially optically processed by the first reflection mirror group, the first scanning galvanometer and the first focusing mirror, and the first reflection mirror group
- the first partial beam reflects and adjusts the incident angle, so that the first partial beam is vertically irradiated on the moving platform
- the scanning galvanometer is used to control the deflection of the first partial beam
- the focusing mirror is used to adjust the The focal position of the first partial beam.
- the annular optical path module includes: a second mirror group, a second scanning galvanometer, a second focusing mirror, and an axicon;
- the axicon is installed between the beam splitter and the second reflection mirror group, and shapes the second partial beam emitted by the beam splitter to obtain a ring beam.
- the laser source comprises: a short wavelength pulsed laser and a beam expander;
- the short-wavelength pulsed laser generates a laser beam
- the beam expander is installed between the short-wavelength pulsed laser and the beam splitter, and the laser beam is subjected to beam area increase processing and collimation processing; the short-wavelength pulsed laser
- the beam quality M2 factor of the laser is less than 1.3, its wavelength is in the ultraviolet band between 248 and 355nm and the green band between 532 and 515nm, and its pulse repetition frequency is greater than or equal to 90kHz.
- the Gaussian optical path module and the annular optical path module are both mounted on the base through a lifting mechanism, and the lifting mechanism is composed of a Z-axis slide rail vertically fixed to the base and a slider driven by a motor ;
- Both the Gaussian optical path module and the annular optical path module are fixedly mounted on the slider and move vertically along the Z-axis slide rail with the slider;
- the PCB short-wavelength pulse laser drilling device further includes a control module, which is respectively connected in communication with the laser source, the Gaussian optical path module, the annular optical path module, the mobile platform and the lifting mechanism;
- the control module controls the laser source to start or close by sending instructions to the laser source, the Gaussian light path module, the ring light path module and the lifting mechanism, and the Gaussian light path module and the ring light path module emit light.
- the parameters of the laser; the control module controls the horizontal movement of the PCB carrying the mobile platform by sending instructions to the mobile platform.
- the Gaussian optical path module further comprises: a beam shaper
- the beam shaper is arranged between the beam splitter and the first reflecting mirror group, and the beam shaper is used for shaping the Gaussian beam into a flat-top beam.
- the PCB drilling requirements ie, drilling through holes or blind holes
- a switching drilling mode that matches the drilling requirements can be selected to realize the
- the need for through-hole processing and blind-hole processing of the circuit board when the through-hole needs to be drilled, the annular beam is used for nesting processing, which can concentrate the removal of the material around the hole, and the material inside the hole is separated from the hole wall after the through-hole is formed.
- automatic drop compared with the traditional Gaussian laser processing, does not need to ablate all the material inside the hole, which can reduce the amount of material removal and improve the processing efficiency.
- Gaussian beam and annular beam are used for combined processing, which can effectively reduce the thermal influence of traditional Gaussian laser processing, further trim the quality of the hole wall, remove residual glue at the bottom, improve drilling efficiency, and optimize drilling. hole effect.
- FIG. 1 is a schematic flowchart of a PCB short-wavelength pulsed laser drilling method shown in an embodiment of the present application
- Fig. 2 is another schematic flow chart of the PCB short-wavelength pulsed laser drilling method shown in the embodiment of the present application;
- FIG. 3 is a schematic structural diagram of a PCB short-wavelength pulsed laser drilling device shown in an embodiment of the present application.
- first, second, third, etc. may be used in this application to describe various information, such information should not be limited by these terms. These terms are only used to distinguish the same type of information from each other.
- first information may also be referred to as the second information, and similarly, the second information may also be referred to as the first information without departing from the scope of the present application.
- second information may also be referred to as the first information without departing from the scope of the present application.
- a feature defined as “first” or “second” may expressly or implicitly include one or more of that feature.
- “plurality” means two or more, unless otherwise expressly and specifically defined.
- flexible printed circuit board refers to a highly reliable and excellent flexible printed circuit board made of polyimide or polyester film
- rigid printed circuit board Board refers to printed circuit boards with phenolic paper laminates, epoxy paper laminates, polyester glass felt laminates or epoxy glass cloth laminates.
- the drilling of micro-through holes and micro-blind holes on PCBs mainly uses ultraviolet lasers or CO2 lasers (CO2 lasers refer to carbon dioxide lasers, the wavelength of the laser emitted is 10.6 microns, and the "body" is in the infrared region, which is invisible to the naked eye.
- CO2 lasers refer to carbon dioxide lasers
- the wavelength of the laser emitted is 10.6 microns
- the "body" is in the infrared region, which is invisible to the naked eye.
- the glass fiber in the PCB dielectric layer can only be removed by increasing the energy density to a high degree; and CO2 laser due to
- the copper foil on the surface of the printed board has a very low absorption rate.
- the surface of the printed board must be browned or blackened, or a window treatment should be performed at the position to be processed, and the copper foil on the surface should be removed in advance and reused.
- CO2 laser ablation removes the inner layer insulating material; the above two processing methods are relatively complicated, and chemical treatment is required when using CO2 laser, which is easy to cause chemical pollution, and problems such as large hole taper and bottom glue residue are very likely to occur during processing .
- an embodiment of the present application provides a method for drilling a PCB with a short-wavelength pulsed laser.
- the hole taper refers to the difference between the diameters of the upper and lower holes of the cone and the height of the cone
- PCB holes with small differences and small residual glue at the bottom are obtained.
- this laser drilling method does not require browning or blackening of the PCB surface before laser drilling, nor does it need to open windows at the position to be processed It reduces the chemical pretreatment steps of PCB laser drilling and improves the drilling efficiency.
- FIG. 1 is a schematic flowchart of a PCB short-wavelength pulsed laser drilling method shown in an embodiment of the present application.
- the technical solution provided by the present application is an embodiment of a method for short-wavelength pulsed laser drilling of a PCB, including:
- the PCB data includes: PCB thickness, hole depth to be drilled, hole center position to be drilled, and hole diameter to be drilled;
- the hole depth to be drilled refers to the hole depth required by PCB laser drilling
- the hole center position to be drilled refers to the hole center position of the hole required by PCB laser drilling (for example, the coordinate signal or size information on the PCB surface);
- the hole diameter to be drilled refers to the hole diameter required by PCB laser drilling
- the PCB thickness refers to the board thickness of the PCB.
- the comparison result is that the depth of the hole to be drilled is equal to the thickness of the PCB, it is determined that the hole to be drilled is a through hole.
- the comparison result is that the depth of the hole to be drilled is smaller than the thickness of the PCB, it is determined that the hole to be drilled is a blind hole.
- the to-be-drilled hole is a through hole, and a ring beam is used to drill the through hole at the center of the hole to be drilled on the PCB;
- step 102 If the comparison result in step 102 is that the depth of the hole to be drilled is equal to the thickness of the PCB, it is determined that the hole to be drilled is a through hole, and a ring beam is used to drill the through hole at the center of the hole to be drilled on the PCB. , and the diameter of the spot of the annular beam irradiated on the PCB is equal to the aperture to be drilled. Exemplarily, assuming that the aperture to be drilled is 50 ⁇ m, the irradiation diameter of the annular beam is directly set to 50 ⁇ m.
- nesting processing means that for a solid solid, to process through holes (holes that penetrate up and down), it is only necessary to remove the material on the circumference of the hole, and separate the material in the central part from the hole wall to form a through hole, and There is no need to remove all material from the center.
- the main function is to carry out hole processing.
- the aperture is equal to the diameter of the annular beam, only the through-hole processing can be realized by using the nested pulse laser processing.
- the material removal amount is smaller than that of the traditional pulse processing, which can effectively improve the processing efficiency.
- the annular beam emitted by the PCB short-wavelength pulsed laser drilling device is used for pulse processing, and the through hole is processed by the nesting method. Since the energy of the annular beam is concentrated in the circumference, the material at the circumference of the hole can be removed by concentrated ablation to form a hole after the through hole. The inner material separates from the hole wall and falls automatically.
- the depth of the hole to be drilled is less than the thickness of the PCB, determine that the hole to be drilled is a blind hole, and use Gaussian beam and annular beam respectively to perform segmented blind drilling on the same hole center position to be drilled on the PCB. hole.
- step 102 If the comparison result in step 102 is that the depth of the hole to be drilled is less than the thickness of the PCB, then it is determined that the hole to be drilled is a blind hole, and the Gaussian beam and the annular beam are used to drill the same hole center on the PCB. Blind holes are drilled in sections, and the spot diameter of the Gaussian beam irradiated on the PCB is smaller than the aperture to be drilled, and the spot diameter of the annular beam irradiated on the PCB is equal to the aperture to be drilled.
- the Gaussian beam is the laser light speed or electron beam whose amplitude distribution of the cross-section of the fundamental mode radiation field follows a Gaussian function. Further, the Gaussian beam can be shaped by a beam shaper into a top-hat beam, which is a laser beam or electron beam with an almost uniform flux (energy density) in a circular area. In practical applications, the flat-top beam can achieve uniform distribution of laser energy, which helps to improve processing accuracy.
- the short-wavelength pulsed laser refers to a type of laser, which is mainly in the ultraviolet band (248nm-355nm) and visible light band compared to the long-wavelength laser (near-infrared and mid-infrared bands). (515nm ⁇ 532nm) laser, that is, laser with short wavelength.
- the spiral drilling refers to a drilling method in which the light beam starts from the position of the hole center, and performs a spiral path scanning within the aperture range to be drilled to remove the material in the PCB hole to obtain the PCB hole;
- the Encircling drilling refers to the method in which the beam takes the hole center position as the center of the circle and scans the drilling circle by circle according to the concentric ring paths of different diameters to obtain the PCB hole.
- the PCB composition materials generally include copper foil, glass fiber and epoxy resin, the above materials are all good for short-wavelength lasers. Therefore, the short-wavelength pulsed laser can be used to directly process the PCB, which can achieve the purpose of ablation and removal of materials; while the CO2 laser with a longer wavelength has a very low absorptivity of the copper foil (often lower than 1%). Therefore, it is not possible to use CO2 laser for direct processing. It is necessary to blacken or brown the copper foil on the surface of the sheet to improve the surface absorption rate before processing the PCB with CO2 laser.
- the PCB drilling requirements ie, drilling through holes or blind holes
- a switching drilling mode that matches the drilling requirements can be selected to realize the
- the need for through-hole processing and blind-hole processing of the circuit board when the through-hole needs to be drilled, the annular beam is used for nesting processing, which can concentrate the removal of the material around the hole, and the material inside the hole is separated from the hole wall after the through-hole is formed.
- automatic drop compared with the traditional Gaussian laser processing, does not need to ablate all the material inside the hole, which can reduce the amount of material removal and improve the processing efficiency.
- Gaussian beam and annular beam are used for combined processing, which can effectively reduce the thermal influence of traditional Gaussian laser processing, further trim the quality of the hole wall, remove residual glue at the bottom, improve drilling efficiency, and optimize drilling. hole effect.
- step 104 of the above-mentioned embodiment 1 the scheme of "using Gaussian beam and annular beam to drill blind holes in segments on the same hole center position to be drilled on the PCB" is described.
- This scheme has the following two options: implementation, including:
- a Gaussian beam to perform preliminary drilling at the center of the hole to be drilled on the PCB, and the drilling depth of the preliminary drilling is less than or equal to the depth of the hole to be drilled to obtain a conical pre-drilled hole (the hole wall is rough. );
- the drilling depth of the secondary drilling hole is equal to the depth of the hole to be drilled, and the hole wall is trimmed.
- this application proposes to first use a Gaussian beam into the system for filling processing to remove the material inside the blind hole, and then use a ring beam to carry out the tapered hole. Trim, reduce taper of hole, remove glue residue at bottom of blind hole.
- the drilling depth of the secondary drilling hole is equal to the depth of the hole to be drilled, and the residue in the hole is eliminated.
- the present application proposes to use a ring beam for initial drilling to isolate the material inside the hole from the peripheral material around the hole, and then use a Gaussian beam for secondary drilling to remove the residual material in the hole without damaging the material around the hole and reducing thermal effects. Area.
- an embodiment of the PCB short-wavelength pulsed laser drilling device includes:
- the laser source including the short-wavelength pulse laser 10 and the beam expander 20
- the beam splitter 30 the Gaussian optical path module (including: the first scanning galvanometer B1, the first reflection mirror The mirror group (including the mirror A1 and the mirror A2) and the first focusing mirror C1)
- the annular optical path module including: the second mirror group (including the mirror A3 and the mirror A4), the second scanning mirror B2 and the first Two focusing mirrors C2);
- the laser beam emitted by the laser source is divided into a first sub-beam and a second sub-beam by the beam splitter, wherein the first sub-beam is processed by the Gaussian optical path module to emit a Gaussian beam, and the second sub-beam After being processed by the ring light path module, a ring beam is emitted;
- the beams emitted by the Gaussian optical path module and the annular optical path module are both irradiated on the moving platform 70, and the moving platform 70 can move horizontally relative to the Gaussian optical path module and the annular optical path module, so that the The beams generated by the Gaussian optical path module and the annular optical path module can be successively irradiated on the same point on the moving platform.
- the laser source includes: a short-wavelength pulsed laser 10 and a beam expander 20;
- the short-wavelength pulsed laser 10 generates a laser beam
- the beam expander 20 is installed between the short-wavelength pulsed laser 10 and the beam splitter 30, and the laser beam is subjected to beam area increase processing and collimation processing;
- the beam quality M2 factor of the short-wavelength pulsed laser is less than 1.3, and its wavelength is in the ultraviolet band between 248 and 355nm and in the green band between 532 and 515nm, and its pulse repetition frequency is greater than or equal to 90kHz.
- the beam expander 20 is used to receive the laser beam and perform beam area increase processing.
- the Gaussian optical path module includes: a first reflecting mirror group (including reflecting mirror A1 and reflecting mirror A2), a first scanning galvanometer B1 and a first focusing mirror C1;
- the reflector A1 in the first reflector group adjusts the beam propagation path, so that the beam and the center of the beam splitter 30 are kept on the same axis, and the beam enters from the center of the beam splitter 30; the first split beams emitted by the beam splitter 30 are sequentially After the optical processing of the reflecting mirror A2, the first scanning galvanometer B1 and the first focusing mirror C1 in the first reflecting mirror group, the first partial beam is vertically irradiated on the moving platform 70, The first scanning galvanometer B1 is used to control the deflection of the first partial beam, and the first focusing mirror C1 is used to adjust the focus position of the first partial beam.
- the annular optical path module includes: a second mirror group, a second scanning galvanometer B2, a second focusing mirror C2 and an axicon 40;
- the axicon 40 is installed between the beam splitter 30 and the reflecting mirror A3, and shapes the second split beam emitted by the beam splitter to obtain a ring beam.
- the diffractive axicon used in this application is an evolutionary version of the traditional axicon, and the divergence angle of the diffractive axicon can also be calculated from the traditional axicon that can output the same properties, that is, the characteristic parameters of the traditional axicon can be
- the diffractive axicon is introduced to produce the same effect, and the difference between the two is that the diffractive axicon has better accuracy, a larger parameter range, can eliminate the central dead zone, and the diffractive axicon is more refined and can form a structure More compact and finer optical modules.
- the control module extracts PCB data, the PCB data includes: PCB thickness, hole depth to be drilled, center position of the hole to be drilled, and hole diameter to be drilled.
- the control module compares the depth of the hole to be drilled and the thickness of the PCB, and determines the type of the hole to be drilled. If the comparison result is that the depth of the hole to be drilled is equal to the thickness of the PCB, it is determined that the hole to be drilled is through hole; if the comparison result is that the depth of the hole to be drilled is less than the thickness of the PCB, it is determined that the to-be-drilled hole is a blind hole.
- the short-wavelength pulsed laser 10 sends the laser beam through the beam expander 20 , the reflection mirror A1 and the beam splitter 30 to generate the first partial beam and the second partial beam.
- the first sub-beam enters the Gaussian optical path module for optical processing, specifically: the first sub-beam is irradiated into the first scanning galvanometer B1 through the reflecting mirror A2, and the first scanning galvanometer B1 controls the deflection of the first sub-beam, It is then irradiated into the first focusing mirror C1, and the focus position of the first partial beam is adjusted so that the first partial beam can be irradiated to the PCB placed on the mobile platform 70, and the Gaussian beam is controlled by the deflection of the first scanning galvanometer B1. Spiral or wrap-around drilling on PCBs.
- a beam shaper is also provided between the beam splitter 30 and the reflecting mirror A2, and the first split beam can be processed by the Gaussian beam through the beam shaper. into a flat-top beam.
- the second sub-beam enters the annular optical path module for optical processing, specifically: the second sub-beam is shaped into an annular beam by the axicon 40, and then irradiated to the second scanning galvanometer B2 through the reflecting mirror A3 and the reflecting mirror A4.
- the second scanning galvanometer B2 controls the deflection of the second sub-beam, and then irradiates it to the second focusing mirror C2 to adjust the focus position of the second sub-beam, so that the second sub-beam can be irradiated on the moving platform 70.
- PCB through the deflection of the second scanning galvanometer B2 to control the annular beam to perform spiral drilling or wrap-around drilling on the PCB.
- control module if the control module identifies that the depth of the hole to be drilled in the current PCB is equal to the thickness of the PCB, it is determined that the to-be-drilled hole is a through hole.
- the control module controls the second sub-beam to perform nesting drilling through holes on the PCB.
- control module if the control module identifies that the depth of the hole to be drilled in the current PCB is smaller than the thickness of the PCB, it is determined that the hole to be drilled is a blind hole.
- the control module controls the first sub-beam and the second sub-beam to drill blind holes in sections on the PCB respectively.
- the Gaussian optical path module and the annular optical path module also need to move in the vertical direction.
- the embodiments of the present application provide corresponding design solutions, specifically:
- the Gaussian optical path module and the annular optical path module are both mounted on the base 60 through a lifting mechanism, and the lifting mechanism is vertically fixed on the Z-axis of the base.
- the slide rail 50 is composed of a sliding block driven by a motor.
- the Gaussian optical path module and the annular optical path module in the figure are respectively connected with the Z-axis slide rail 50, one end of the Z-axis slide rail 50 is fixed to the base 60, and the other end is fixed to the Gaussian optical path module or the annular optical path module,
- the Gaussian optical path module or the annular optical path module can be moved in the vertical direction through the Z-axis slide rail 50 .
- a new lifting mechanism (composed of the Z-axis slide rail 50 vertically fixed to the base and a motor-driven slider) is added, so that the PCB short-wavelength pulse laser drilling device in the present application can cooperate with
- the above-mentioned moving platform 70 controls the Gaussian optical path module and the annular optical path module to move in the directions of the X-axis, Y-axis and Z-axis respectively relative to the PCB to be drilled, so as to realize precise position control.
- the PCB short-wavelength pulsed laser drilling device in the embodiment of the present application further includes a control module, the control module is respectively connected with the laser source, the Gaussian The optical path module, the annular optical path module, the mobile platform and the lifting mechanism are connected in communication.
- the control module controls the laser source to start or close by sending instructions to the laser source, the Gaussian light path module, the ring light path module and the lifting mechanism, and the laser light emitted by the Gaussian light path module and the ring light path module. parameters; the control module controls the horizontal movement of the PCB carrying the mobile platform by sending an instruction to the mobile platform.
- control module controls each module in the PCB short-wavelength pulsed laser drilling device to execute the specific process of the above-mentioned PCB short-wavelength pulsed laser drilling method, reference may be made to the third embodiment, which will not be repeated here.
- the control of the laser beam energy emitted by the laser is often uneven, resulting in damage to the PCB during the drilling process and increasing the error rate of production products.
- the beam quality M2 factor of the short-wavelength pulsed laser can be adjusted to be less than 1.3 through the control module, and the repetition frequency of the beam is generally set to be greater than or equal to 90kHz to ensure that there is enough laser energy during processing to remove the specified location material.
- the PCB drilling requirements ie, drilling through holes or blind holes
- a switching drilling mode that matches the drilling requirements can be selected.
- the annular beam is used for nesting processing, which can concentrate the removal of the material around the hole and form through-holes
- the material inside the rear hole is separated from the hole wall and automatically falls off.
- Gaussian laser processing there is no need to ablate all the material inside the hole, which can reduce the amount of material removal and improve the processing efficiency.
- Gaussian beam and annular beam are used for combined processing, which can effectively reduce the thermal influence of traditional Gaussian laser processing, further trim the quality of the hole wall, remove residual glue at the bottom, improve drilling efficiency, and optimize drilling. hole effect.
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Abstract
一种PCB短波长脉冲激光钻孔方法。该方法包括:提取PCB数据,PCB数据包括:PCB厚度、待钻孔的孔深、待钻孔的孔心位置和待钻孔的孔径;比较待钻孔的孔深与PCB厚度,判断待钻孔类型;比较结果为待钻孔的孔深等于PCB厚度,则确定待钻孔为通孔,采用环形光束在PCB上待钻孔的孔心位置进行套料钻通孔;比较结果为待钻孔的孔深小于PCB厚度,则确定待钻孔为盲孔,分别使用高斯光束与环形光束在PCB上对同一待钻孔的孔心位置进行分段钻盲孔。该钻孔方法能够在一台设备上同时实现多层柔性板和多层刚性板的通孔、盲孔加工,解决现有技术在激光钻孔过程中出现孔锥度大、底部残胶、热量累积严重、加工效率低等问题。还涉及一种PCB短波长脉冲激光钻孔装置。
Description
本申请涉及PCB激光钻孔技术领域,尤其涉及一种PCB短波长脉冲激光钻孔方法及相关钻孔装置。
电子产品在设计上不断提高整机性能,并且追求印制电路板(Printed Circuit Board,简称PCB)小型化;因此,需要对PCB的通孔或盲孔进行微型钻孔,并进行金属化,从而实现内部线路的导通和信号传输作用,提高性能的同时使得PCB小型化。
目前,在PCB上进行微通孔、微盲孔的钻孔主要采用紫外(UV)激光或CO2激光加工;其中,紫外激光主要用于加工盲孔和少量通孔,而且紫外激光加工孔的深径比(孔深度与直径的比例)有限,同时受激光功率限制,其钻孔速度慢,仅能用于加工柔性印制板或者厚度较小的刚性印制板;而CO2激光主要用于加工刚性印制板,且由于印制板表层的铜箔对其吸收率极低,在加工前必须将印制板表面进行棕化或黑化处理,或者在待加工位置进行开窗处理,预先去除表面的铜箔,再利用CO2激光烧蚀去除内层绝缘材料。
因此,针对柔性板和刚性板的加工,需要分别采用UV激光钻孔机和CO2激光钻孔机,无法在一台设备上实现多层柔性板和多层刚性板的通孔、盲孔加工。并且,UV激光钻孔机对于通孔加工,需要烧蚀孔内所有材料,形成通孔,加工效率低、热量累积严重,且对于含玻璃纤维的多层PCB难以加工。而CO2激光加工对于盲孔加工存在孔锥度大、底部残胶等问题,且工序繁杂,产生大量化学废水。
发明内容
为克服相关技术中存在的问题,本申请提供一种PCB短波长脉冲激光钻孔方法,该钻孔方法能够在一台设备上同时实现多层柔性板和多层刚性板的通孔、盲孔加工,解决现有技术在激光钻孔过程中出现孔锥度大、 底部残胶、热量累积严重、加工效率低等问题。
本申请第一方面提供一种PCB短波长脉冲激光钻孔方法,包括:
步骤一:提取PCB数据,所述PCB数据包括:PCB厚度、待钻孔的孔深、待钻孔的孔心位置和待钻孔的孔径;
步骤二:比较所述待钻孔的孔深与所述PCB厚度,判断待钻孔类型;
步骤三:步骤二中的比较结果为所述待钻孔的孔深等于所述PCB厚度,则确定所述待钻孔为通孔,采用环形光束在PCB上待钻孔的孔心位置进行套料钻通孔,且所述环形光束照射于PCB的光斑直径等于所述待钻孔的孔径;
步骤四:步骤二中的比较结果为所述待钻孔的孔深小于PCB厚度,则确定所述待钻孔为盲孔,分别使用高斯光束与环形光束在PCB上对同一待钻孔的孔心位置进行分段钻盲孔,且所述高斯光束照射于PCB的光斑直径小于所述待钻孔的孔径,所述环形光束照射于PCB的光斑直径等于待钻孔的孔径。
在一种实施方式中,步骤四中,所述分别使用高斯光束与环形光束在PCB上对同一待钻孔的孔心位置进行分段钻盲孔,包括:
使用高斯光束在PCB上所述待钻孔的孔心位置进行初钻,所述初钻的钻深小于或等于所述待钻孔的孔深,获得锥形预钻孔;使用环形光束对所述锥形预钻孔进行二次钻孔,所述二次钻孔的钻深与所述待钻孔的孔深相等,修齐孔壁。
在一种实施方式中,步骤四中,所述分别使用高斯光束与环形光束在PCB上对同一待钻孔的孔心位置进行分段钻盲孔,包括:
使用环形光束在PCB上所述待钻孔的孔心位置进行初钻,所述初钻的钻深与所述待钻孔的孔深相等,获得环形预钻孔;使用高斯光束对环形预钻孔进行二次钻孔,所述二次钻孔的钻深与所述待钻孔的孔深相等,剔除孔内残留。
在一种实施方式中,在使用高斯光束或环形光束进行钻孔时,
高斯光束或环形光束照射在PCB上的光斑直径小于所述待钻孔的孔径,则高斯光束或环形光束的钻孔路径选用环绕式钻孔或螺旋式钻孔。
本申请第二方面提供一种PCB短波长脉冲激光钻孔装置,适配于上 述的PCB短波长脉冲激光钻孔方法,包括:
基座和安装于基座上的移动平台、激光源、分光镜、高斯光路模块和环形光路模块;
所述激光源发出的激光束由所述分光镜分为第一分光束和第二分光束,其中所述第一分光束经所述高斯光路模块处理后射出高斯光束,所述第二分光束经所述环形光路模块处理后射出环形光束;
所述高斯光路模块和所述环形光路模块射出的光束均照射于所述移动平台上,所述移动平台能够相对于所述高斯光路模块和所述环形光路模块进行水平移动,使所述高斯光路模块和所述环形光路模块产生的光束能够先后照射于所述移动平台上的同一点。
在一种实施方式中,所述高斯光路模块包括:第一反射镜组、第一扫描振镜和第一聚焦镜;
由所述分光镜出射的所述第一分光束依次经过所述第一反射镜组、所述第一扫描振镜和所述第一聚焦镜的光学处理,所述第一反射镜组将所述第一分光束反射调整入射角度,使所述第一分光束垂直照射于所述移动平台,所述扫描振镜用于控制所述第一分光束的偏转,所述聚焦镜用于调整所述第一分光束的焦点位置。
在一种实施方式中,所述环形光路模块包括:第二反射镜组、第二扫描振镜、第二聚焦镜和轴锥镜;
所述轴锥镜安装于所述分光镜与所述第二反射镜组之间,对所述分光镜出射的所述第二分光束进行整形,得到环形光束。
在一种实施方式中,所述激光源包括:短波长脉冲激光器和扩束镜;
所述短波长脉冲激光器产生激光束,所述扩束镜安装于短波长脉冲激光器与所述分光镜之间,对所述激光束进行光束面积增大处理和准直处理;所述短波长脉冲激光器的光束质量M2因子小于1.3,其波长为248至355nm之间的紫外波段及波长为532至515nm之间的绿光波段,其脉冲重复频率大于或等于90kHz。
在一种实施方式中,所述高斯光路模块和所述环形光路模块均通过升降机构安装于基座,所述升降机构由竖直固定于基座的Z轴滑轨和电机驱动的滑块构成;
所述高斯光路模块和所述环形光路模块均固定安装于滑块并随滑块沿Z轴滑轨竖直运动;
所述PCB短波长脉冲激光钻孔装置还包括控制模块,所述控制模块分别与所述激光源、所述高斯光路模块、所述环形光路模块、所述移动平台和所述升降机构通信连接;
所述控制模块通过对所述激光源、所述高斯光路模块、所述环形光路模块和所述升降机构发送指令,操控激光源启动或关闭,及所述高斯光路模块和所述环形光路模块射出激光的参数;所述控制模块通过对所述移动平台发送指令,控制所述移动平台承载PCB水平移动。
在一种实施方式中,所述高斯光路模块还包括:光束整形器;
所述光束整形器设置在所述分光镜与所述第一反射镜组之间,所述光束整形器用于将高斯光束整形为平顶光束。
本申请提供的技术方案可以包括以下有益效果:
在本申请实施例中,通过PCB数据可识别PCB的钻孔需求(即,钻通孔或钻盲孔),选择与该钻孔需求相匹的切换钻孔模式,实现在一台设备上能同时对电路板进行通孔加工和盲孔加工的需求;当需要钻通孔时,采用环形光束进行套料式加工,能够集中去除孔圆周的材料,形成通孔后孔内部材料与孔壁分离而自动掉落,相比传统的高斯激光加工,无需将孔内部材料全部烧蚀,能够减少材料去除量,提高加工效率。当需要钻盲孔时,分别采用高斯光束与环形光束进行组合加工,能有效减少传统高斯激光加工时的热影响,进一步修整孔壁质量,去除底部残胶,提高了钻孔效率,优化了钻孔效果。
通过结合附图对本申请示例性实施方式进行更详细的描述,本申请的上述以及其它目的、特征和优势将变得更加明显,其中,在本申请示例性实施方式中,相同的参考标号通常代表相同部件。
图1是本申请实施例示出的PCB短波长脉冲激光钻孔方法的流程示意图;
图2是本申请实施例示出的PCB短波长脉冲激光钻孔方法的另一流 程示意图;
图3是本申请实施例示出的PCB短波长脉冲激光钻孔装置的结构示意图。
下面将参照附图更详细地描述本申请的优选实施方式。虽然附图中显示了本申请的优选实施方式,然而应该理解,可以以各种形式实现本申请而不应被这里阐述的实施方式所限制。相反,提供这些实施方式是为了使本申请更加透彻和完整,并且能够将本申请的范围完整地传达给本领域的技术人员。
在本申请使用的术语是仅仅出于描述特定实施例的目的,而非旨在限制本申请。在本申请和所附权利要求书中所使用的单数形式的“一种”、“所述”和“该”也旨在包括多数形式,除非上下文清楚地表示其他含义。还应当理解,本文中使用的术语“和/或”是指并包含一个或多个相关联的列出项目的任何或所有可能组合。
应当理解,尽管在本申请可能采用术语“第一”、“第二”、“第三”等来描述各种信息,但这些信息不应限于这些术语。这些术语仅用来将同一类型的信息彼此区分开。例如,在不脱离本申请范围的情况下,第一信息也可以被称为第二信息,类似地,第二信息也可以被称为第一信息。由此,限定有“第一”、“第二”的特征可以明示或者隐含地包括一个或者更多个该特征。在本申请的描述中,“多个”的含义是两个或两个以上,除非另有明确具体的限定。
在现有的PCB制作领域中,柔性印制板是指以聚酰亚胺或聚酯薄膜为基材制成的一种具有高度可靠性,绝佳的可挠性印刷电路板;刚性印制板是指有酚醛纸质层压板、环氧纸质层压板、聚酯玻璃毡层压板或环氧玻璃布层压板的印刷电路板。
目前,在PCB上进行微通孔、微盲孔的钻孔主要采用紫外激光或CO2激光(CO2激光是指二氧化碳激光器,发出的激光波长为10.6微米,“身”处红外区,肉眼不能觉察,其中工作方式有连续、脉冲两种)加工;其中,紫外激光可直接用于加工盲孔和通孔,但是用紫外激光加工的孔的深度与 直径比例比较有限,且受激光功率限制,使得钻孔速度慢,仅能用于加工柔性印制板或者厚度较小的刚性印制板,尤其对于PCB介质层中的玻璃纤维,只有将能量密度提高到很高程度才可以除去;而CO2激光由于印制板表层的铜箔对其吸收率极低,在加工前必须将印制板表面进行棕化或黑化处理,或者在待加工位置进行开窗处理,预先去除表面的铜箔,再利用CO2激光烧蚀去除内层绝缘材料;上述两种加工方法均比较繁杂,且利用CO2激光时需经过化学处理,易造成化学污染,在加工过程中极易出现孔锥度大、底部残胶等问题。
针对上述问题,本申请实施例提供一种PCB短波长脉冲激光钻孔方法,通过利用短波长脉冲激光对PCB进行钻孔,能够得到孔锥度(锥度是指圆锥的上下孔直径差与锥体高度之比)差异小和底部残胶较小的PCB孔;且该激光钻孔方法无需在激光钻孔前将印制板PCB表面进行棕化或黑化处理,也无需在待加工位置进行开窗处理,减少了PCB激光钻孔的化学前处理步骤,提高了钻孔效率。以下结合附图详细描述本申请实施例的技术方案。
实施例一
图1是本申请实施例示出的PCB短波长脉冲激光钻孔方法的流程示意图。参见图1,本申请提供的技术方案为一种PCB短波长脉冲激光钻孔方法的一个实施例,包括:
101、提取PCB数据,所述PCB数据包括:PCB厚度、待钻孔的孔深、待钻孔的孔心位置和待钻孔的孔径;
在本实施例中,需要在PCB上面加工通孔或盲孔,并且进行金属化,才能实现内部线路的导通和信号传输作用。
其中,待钻孔的孔深是指PCB激光钻孔要求的孔深度;
其中,待钻孔的孔心位置是指PCB激光钻孔要求的孔的孔心位置(如,PCB面上的坐标信号或尺寸信息);
其中,待钻孔的孔径是指PCB激光钻孔要求的孔直径;
其中,PCB厚是指PCB的板厚度。
102、比较所述待钻孔的孔深与所述PCB厚度,判断待钻孔类型;
若比较结果为所述待钻孔的孔深等于所述PCB厚度,则确定所述待 钻孔为通孔。
若比较结果为所述待钻孔的孔深小于所述PCB厚度,则确定所述待钻孔为盲孔。
103、若待钻孔的孔深等于所述PCB厚度,则确定所述待钻孔为通孔,采用环形光束在PCB上待钻孔的孔心位置进行套料钻通孔;
若步骤102比较结果为所述待钻孔的孔深等于所述PCB厚度,则确定所述待钻孔为通孔,采用环形光束在PCB上待钻孔的孔心位置进行套料钻通孔,且所述环形光束照射于PCB的光斑直径等于所述待钻孔的孔径。示例性的,假设待钻孔的孔径为50μm,则直接将环形光束的照射直径设置为50μm。
其中,套料式加工即对于一个实心的固体,要加工通孔(上下穿透的孔),则只需要去除孔圆周的材料,把中心部分的材料跟孔壁分离,就形成通孔,而不需要把中心的材料全去除。主要作用就是进行孔加工,对于孔径和环形光束直径相当的情况,只需要采套料式脉冲激光加工,就能实现通孔加工,材料去除量比传统脉冲式加工小,能有效提高加工效率。
由PCB短波长脉冲激光钻孔装置出射的环形光束进行脉冲加工,采用套料式加工通孔,由于环形光束的能量聚集在圆周,能够集中烧蚀去除孔圆周部分的材料,形成通孔后孔内部材料与孔壁分离而自动掉落。
104、若待钻孔的孔深小于所述PCB厚度,则确定所述待钻孔为盲孔,分别使用高斯光束与环形光束在PCB上对同一待钻孔的孔心位置进行分段钻盲孔。
若步骤102的比较结果为所述待钻孔的孔深小于所述PCB厚度,则确定所述待钻孔为盲孔,分别使用高斯光束与环形光束在PCB上对同一待钻孔的孔心位置进行分段钻盲孔,且所述高斯光束照射于PCB的光斑直径小于所述待钻孔的孔径,所述环形光束照射于PCB的光斑直径等于待钻孔的孔径。
其中,高斯光束为基模辐射场的横截面的振幅分布遵守高斯函数的激光光速或电子束。进一步的,高斯光束可通过光束整形器整形为平顶光束,平顶光束是一种在圆形区域内有几乎一致通量(能量密度)的激光光束或电子束。在实际应用中,平顶光束可以实现激光能量的均匀分布,有助于 提高加工的精度。
在本申请实施例中,所述短波长脉冲激光是指一类激光,该类激光相对于长波长激光(近红外和中红外波段)而言,主要为紫外波段(248nm~355nm)和可见光波段(515nm~532nm)激光,即波长短的激光。
在使用上述高斯光束或环形光束进行钻孔时,若高斯光束或环形光束照射在PCB上的光斑直径小于所述待钻孔的孔径,则选用环绕式钻孔或螺旋式钻孔。具体的,所述螺旋式钻孔是指光束以孔心位置为起点,在待钻孔的孔径范围内进行螺旋形的路径扫描去除PCB孔内的材料,得到PCB孔的钻孔方式;所述环绕式钻孔是指光束以孔心位置为圆心,按不同直径的同心环路径进行逐圈扫描钻孔,得到PCB孔的方式。
对于PCB激光加工,钻孔的激光波长越短,材料对激光的吸收率越高,由于PCB组成材料中一般包括有铜箔、玻璃纤维和环氧树脂等,上述材料均对短波长激光有良好的吸收率,因此可以使用短波长脉冲激光直接对PCB进行加工,能够达到烧蚀去除材料的目的;而相对波长较长的CO2激光,铜箔对其吸收率极低(往往低于1%),所以不能采用CO2激光直接加工,需要先对板材表面铜箔进行黑化或棕化处理,提高表面吸收率才能用CO2激光对PCB进行加工。
在本申请实施例中,通过PCB数据可识别PCB的钻孔需求(即,钻通孔或钻盲孔),选择与该钻孔需求相匹的切换钻孔模式,实现在一台设备上能同时对电路板进行通孔加工和盲孔加工的需求;当需要钻通孔时,采用环形光束进行套料式加工,能够集中去除孔圆周的材料,形成通孔后孔内部材料与孔壁分离而自动掉落,相比传统的高斯激光加工,无需将孔内部材料全部烧蚀,能够减少材料去除量,提高加工效率。当需要钻盲孔时,分别采用高斯光束与环形光束进行组合加工,能有效减少传统高斯激光加工时的热影响,进一步修整孔壁质量,去除底部残胶,提高了钻孔效率,优化了钻孔效果。
实施例二
在上述实施例一的步骤104中,描述了“分别使用高斯光束与环形光束在PCB上对同一待钻孔的孔心位置进行分段钻盲孔”的方案,该方案 具有可以有以下两种实施方式,包括:
(1)
201a、使用高斯光束在PCB上所述待钻孔的孔心位置进行初钻,所述初钻的钻深小于或等于所述待钻孔的孔深,获得锥形预钻孔(孔壁粗糙);
202a、使用环形光束对所述锥形预钻孔进行二次钻孔,所述二次钻孔的钻深与所述待钻孔的孔深相等,修齐孔壁。
值得注意的是,在填充式加工过程中,随着加工的深度越大,激光烧蚀形成的等离子体容易聚集在板材上方,从而阻挡激光对孔内材料的烧蚀,导致较大的孔锥度(即盲孔底部直径比入口直径小很多,整个孔截面呈现锥形),因此本申请提出先用高斯光束进***填充式加工,去除盲孔内部的材料,再用环形光束对锥形孔进行修整,减小孔的锥度,去除盲孔底部的残胶。
(2)
201b、使用环形光束在PCB上所述待钻孔的孔心位置进行初钻,所述初钻的钻深与所述待钻孔的孔深相等,获得环形预钻孔(孔壁平整中心有残留板屑);
202b、使用高斯光束对环形预钻孔进行二次钻孔,所述二次钻孔的钻深与所述待钻孔的孔深相等,剔除孔内残留。
在高斯激光多脉冲重复加工同一位置形成孔的过程中,极易因热量累积造成对孔圆周***的材料造成损伤,形成热影响区。本申请提出使用环形光束进行初钻,将孔内部材料与孔圆周***材料隔离,再使用高斯光束进行二次钻孔,去除孔内残留材料,同时不会损伤孔圆周***材料,减小热影响区。
实施例三
本申请实施例还提供了实现上述PCB短波长脉冲激光钻孔方法的PCB短波长脉冲激光钻孔装置,请参阅图3,PCB短波长脉冲激光钻孔装置的一个实施例,包括:
基座60和安装于基座上的移动平台70、激光源(包括短波长脉冲激光器10和扩束镜20)、分光镜30、高斯光路模块(包括:第一扫描振镜 B1、第一反射镜组(包括反射镜A1和反射镜A2)和第一聚焦镜C1)和环形光路模块(包括:第二反射镜组(包括反射镜A3和反射镜A4)、第二扫描振镜B2和第二聚焦镜C2);
所述激光源发出的激光束由所述分光镜分为第一分光束和第二分光束,其中所述第一分光束经所述高斯光路模块处理后射出高斯光束,所述第二分光束经所述环形光路模块处理后射出环形光束;
所述高斯光路模块和所述环形光路模块射出的光束均照射于所述移动平台70上,所述移动平台70能够相对于所述高斯光路模块和所述环形光路模块进行水平移动,使所述高斯光路模块和所述环形光路模块产生的光束能够先后照射于所述移动平台上的同一点。
所述激光源包括:短波长脉冲激光器10和扩束镜20;
所述短波长脉冲激光器10产生激光束,所述扩束镜20安装于短波长脉冲激光器10与所述分光镜30之间,对所述激光束进行光束面积增大处理和准直处理;所述短波长脉冲激光器的光束质量M2因子小于1.3,其波长为248至355nm之间的紫外波段及波长为532至515nm之间的绿光波段,其脉冲重复频率大于或等于90kHz。所述扩束镜20用于接收所述激光束,进行光束面积增大处理。
所述高斯光路模块包括:第一反射镜组(包括反射镜A1和反射镜A2)、第一扫描振镜B1和第一聚焦镜C1;
所述第一反射镜组中的反射镜A1调整光束传播路径,使光束与分光镜30中心保持在同一轴线,并使光束从分光镜30的中心进入;分光镜30出射的第一分光束依次经过所述第一反射镜组中的反射镜A2、所述第一扫描振镜B1和所述第一聚焦镜C1的光学处理,使所述第一分光束垂直照射于所述移动平台70,所述第一扫描振镜B1用于控制所述第一分光束的偏转,所述第一聚焦镜C1用于调整所述第一分光束的焦点位置。
所述环形光路模块包括:第二反射镜组、第二扫描振镜B2、第二聚焦镜C2和轴锥镜40;
所述轴锥镜40安装于所述分光镜30与反射镜A3之间,对所述分光镜出射的所述第二分光束进行整形,得到环形光束。
具体的,本申请使用的衍射轴锥镜是传统轴锥镜的进化版,衍射轴锥 镜的发散角也可由可输出同样性质的传统轴锥镜计算出来,即传统轴锥镜的特性参数可以推出产生相同效果的衍射轴锥镜,而两者区别则是衍射轴锥镜胜在精确性更好、参数范围更大、可以消除中心死区,并且衍射轴锥镜更加精细化,能够组成结构更加紧凑精细的光学模组。
下面对PCB短波长脉冲激光钻孔装置执行上述PCB短波长脉冲激光钻孔方法的具体流程进行描述:
控制模块(如,可编程逻辑控制器PLC或CPU)提取PCB数据,所述PCB数据包括:PCB厚度、待钻孔的孔深、待钻孔的孔心位置和待钻孔的孔径。
控制模块比较所述待钻孔的孔深与所述PCB厚度,判断待钻孔类型,若比较结果为所述待钻孔的孔深等于所述PCB厚度,则确定所述待钻孔为通孔;若比较结果为所述待钻孔的孔深小于所述PCB厚度,则确定所述待钻孔为盲孔。
短波长脉冲激光器10发送激光束经扩束镜20、反射镜A1和分光镜30,生成第一分光束和第二分光束。
其中第一分光束进入高斯光路模块进行光学处理,具体为:第一分光束经反射镜A2照射到第一扫描振镜B1中,第一扫描振镜B1控制所述第一分光束的偏转,再照射到第一聚焦镜C1中,调整所述第一分光束的焦点位置,使得第一分光束能照射到移动平台70上放置的PCB,通过第一扫描振镜B1的偏转控制高斯光束在PCB上进行螺旋式钻孔或环绕式钻孔。可选的,若需要将高斯光束进一步处理成平顶光束,则所述分光镜30与所述反射镜A2之间还设置有光束整形器,第一分光束经该光束整形器即可由高斯光束处理成平顶光束。
其中第二分光束进入环形光路模块进行光学处理,具体为:第二分光束经轴锥镜40整形成环形光束,再经反射镜A3以及反射镜A4照射到第二扫描振镜B2中,第二扫描振镜B2控制所述第二分光束的偏转,再照射到第二聚焦镜C2中,调整所述第二分光束的焦点位置,使得第二分光束能照射到移动平台70上放置的PCB,通过第二扫描振镜B2的偏转控制环形光束在PCB上进行螺旋式钻孔或环绕式钻孔。
示例性的,若控制模块识别到当前PCB的待钻孔的孔深等于所述PCB 厚度,则确定所述待钻孔为通孔。控制模块控制所述第二分光束对PCB进行套料钻通孔。
示例性的,若控制模块识别到当前PCB的待钻孔的孔深小于所述PCB厚度,则确定所述待钻孔为盲孔。控制模块控制所述分别控制所述第一分光束和第二分光束对PCB进行分段钻盲孔。
实施例四
在实际应用中,高斯光路模块和环形光路模块还有在竖直方向上移动的需求,本申请实施例提供了相应的设计方案,具体为:
基于上述实施例三的PCB短波长脉冲激光钻孔装置,所述高斯光路模块和所述环形光路模块均通过升降机构安装于基座60,所述升降机构由竖直固定于基座的Z轴滑轨50和电机驱动的滑块构成。
请参阅图3,图中的高斯光路模块和环形光路模块均分别连接有Z轴滑轨50,Z轴滑轨50的一端固定于基座60,另一端固定于高斯光路模块或环形光路模块,使得高斯光路模块或环形光路模块可以通过Z轴滑轨50实现在竖直方向的移动。
在本申请实施例中,新增了升降机构(由竖直固定于基座的Z轴滑轨50和电机驱动的滑块构成),使得本申请中的PCB短波长脉冲激光钻孔装置可以配合上述移动平台70,控制高斯光路模块和环形光路模块相对于待钻孔的PCB分别在X轴、Y轴和Z轴的方向移动,实现精确的位置控制。
实施例五
基于上述实施例三或四的PCB短波长脉冲激光钻孔装置,本申请实施例中的PCB短波长脉冲激光钻孔装置还包括控制模块,所述控制模块分别与所述激光源、所述高斯光路模块、所述环形光路模块、所述移动平台和所述升降机构通信连接。
控制模块通过对所述激光源、所述高斯光路模块、所述环形光路模块和所述升降机构发送指令,操控激光源启动或关闭,及所述高斯光路模块和所述环形光路模块射出激光的参数;所述控制模块通过对所述移动平台 发送指令,控制所述移动平台承载PCB水平移动。
具体的,控制模块控制PCB短波长脉冲激光钻孔装置中各个模块执行上述PCB短波长脉冲激光钻孔方法的具体流程,可以参考上述实施例三,此处不再赘述。
在实际应用中,在对PCB进行激光钻孔时,常常因为激光器发射出来的激光光束能量控制不均匀,导致在钻孔过程中损害了PCB,提高了生产产品的出错率,因此在进行激光钻孔过程中,可以通过控制模块将所述短波长脉冲激光器的光束质量M2因子调整至小于1.3,而光束的重复频率一般设置为大于或等于90kHz,以确保加工时有足够的激光能量来去除指定位置的材料。
本申请实施例中的PCB短波长脉冲激光钻孔装置,通过PCB数据可识别PCB的钻孔需求(即,钻通孔或钻盲孔),选择与该钻孔需求相匹的切换钻孔模式,实现在一台设备上能同时对电路板进行通孔加工和盲孔加工的需求;当需要钻通孔时,采用环形光束进行套料式加工,能够集中去除孔圆周的材料,形成通孔后孔内部材料与孔壁分离而自动掉落,相比传统的高斯激光加工,无需将孔内部材料全部烧蚀,能够减少材料去除量,提高加工效率。当需要钻盲孔时,分别采用高斯光束与环形光束进行组合加工,能有效减少传统高斯激光加工时的热影响,进一步修整孔壁质量,去除底部残胶,提高了钻孔效率,优化了钻孔效果。
上文中已经参考附图详细描述了本申请的方案。在上述实施例中,对各个实施例的描述都各有侧重,某个实施例中没有详细描述的部分,可以参见其他实施例的相关描述。本领域技术人员也应该知悉,说明书中所涉及的动作和模块并不一定是本申请所必须的。另外,可以理解,本申请实施例方法中的步骤可以根据实际需要进行顺序调整、合并和删减,本申请实施例装置中的模块可以根据实际需要进行合并、划分和删减。
附图中的流程图和框图显示了根据本申请的多个实施例的***和方法的可能实现的体系架构、功能和操作。也应当注意,在有些作为替换的实现中,方框中所标记的功能也可以以不同于附图中所标记的顺序发生。例如,两个连续的方框实际上可以基本并行地执行,它们有时也可以按相反的顺序执行,这依所涉及的功能而定。也要注意的是,框图和/或流程图 中的每个方框、以及框图和/或流程图中的方框的组合,可以用执行规定的功能或操作的专用的基于硬件的***来实现,或者可以用专用硬件与计算机指令的组合来实现。
以上已经描述了本申请的各实施例,上述说明是示例性的,并非穷尽性的,并且也不限于所披露的各实施例。在不偏离所说明的各实施例的范围和精神的情况下,对于本技术领域的普通技术人员来说许多修改和变更都是显而易见的。本文中所用术语的选择,旨在最好地解释各实施例的原理、实际应用或对市场中的技术的改进,或者使本技术领域的其它普通技术人员能理解本文披露的各实施例。
Claims (10)
- 一种PCB短波长脉冲激光钻孔方法,其特征在于,包括如下步骤:步骤一:提取PCB数据,所述PCB数据包括:PCB厚度、待钻孔的孔深、待钻孔的孔心位置和待钻孔的孔径;步骤二:比较所述待钻孔的孔深与所述PCB厚度,判断待钻孔类型;步骤三:步骤二中的比较结果为所述待钻孔的孔深等于所述PCB厚度,则确定所述待钻孔为通孔,采用环形光束在PCB上待钻孔的孔心位置进行套料钻通孔,且所述环形光束照射于PCB的光斑直径等于所述待钻孔的孔径;步骤四:步骤二中的比较结果为所述待钻孔的孔深小于所述PCB厚度,则确定所述待钻孔为盲孔,分别使用高斯光束与环形光束在PCB上对同一待钻孔的孔心位置进行分段钻盲孔,且所述高斯光束照射于PCB的光斑直径小于所述待钻孔的孔径,所述环形光束照射于PCB的光斑直径等于待钻孔的孔径。
- 根据权利要求1所述的PCB短波长脉冲激光钻孔方法,其特征在于:步骤四中,所述分别使用高斯光束与环形光束在PCB上对同一待钻孔的孔心位置进行分段钻盲孔,包括:使用高斯光束在PCB上所述待钻孔的孔心位置进行初钻,所述初钻的钻深小于或等于所述待钻孔的孔深,获得锥形预钻孔;使用环形光束对所述锥形预钻孔进行二次钻孔,所述二次钻孔的钻深与所述待钻孔的孔深相等,修齐孔壁。
- 根据权利要求1所述的PCB短波长脉冲激光钻孔方法,其特征在于:步骤四中,所述分别使用高斯光束与环形光束在PCB上对同一待钻孔的孔心位置进行分段钻盲孔,包括:使用环形光束在PCB上所述待钻孔的孔心位置进行初钻,所述初钻的钻深与所述待钻孔的孔深相等,获得环形预钻孔;使用高斯光束对环形预钻孔进行二次钻孔,所述二次钻孔的钻深与所述待钻孔的孔深相等,剔除孔内残留。
- 根据权利要求1所述的PCB短波长脉冲激光钻孔方法,其特征在于:在使用高斯光束或环形光束进行钻孔时,高斯光束或环形光束照射在PCB上的光斑直径小于所述待钻孔的孔径,则高斯光束或环形光束的钻孔路径选用环绕式钻孔或螺旋式钻孔。
- 一种PCB短波长脉冲激光钻孔装置,适配于权利要求1-4任意一项所述的PCB短波长脉冲激光钻孔方法,其特征在于:包括基座和安装于基座上的移动平台、激光源、分光镜、高斯光路模块和环形光路模块;所述激光源发出的激光束由所述分光镜分为第一分光束和第二分光束,其中所述第一分光束经所述高斯光路模块处理后射出高斯光束,所述第二分光束经所述环形光路模块处理后射出环形光束;所述高斯光路模块和所述环形光路模块射出的光束均照射于所述移动平台上,所述移动平台能够相对于所述高斯光路模块和所述环形光路模块进行水平移动,使所述高斯光路模块和所述环形光路模块产生的光束能够先后照射于所述移动平台上的同一点。
- 根据权利要求5所述的PCB短波长脉冲激光钻孔装置,其特征在于:所述高斯光路模块包括:第一反射镜组、第一扫描振镜和第一聚焦镜;由所述分光镜出射的所述第一分光束依次经过所述第一反射镜组、所述第一扫描振镜和所述第一聚焦镜的光学处理,所述第一反射镜组将所述第一分光束反射调整入射角度,使所述第一分光束垂直照射于所述移动平台,所述第一扫描振镜用于控制所述第一分光束的偏转,所述第一聚焦镜用于调整所述第一分光束的焦点位置。
- 根据权利要求6所述的PCB短波长脉冲激光钻孔装置,其特征在于:所述环形光路模块包括:第二反射镜组、第二扫描振镜、第二聚焦镜和轴锥镜;所述轴锥镜安装于所述分光镜与所述第二反射镜组之间,对所述分光镜出射的所述第二分光束进行整形,得到环形光束。
- 根据权利要求5所述的PCB短波长脉冲激光钻孔装置,其特征在 于:所述激光源包括:短波长脉冲激光器和扩束镜;所述短波长脉冲激光器产生激光束,所述扩束镜安装于短波长脉冲激光器与所述分光镜之间,对所述激光束进行光束面积增大处理和准直处理;所述短波长脉冲激光器的光束质量M2因子小于1.3,其波长为248至355nm之间的紫外波段及波长为532至515nm之间的绿光波段,其脉冲重复频率大于或等于90kHz。
- 根据权利要求5所述的PCB短波长脉冲激光钻孔装置,其特征在于:所述高斯光路模块和所述环形光路模块均通过升降机构安装于基座,所述升降机构由竖直固定于基座的Z轴滑轨和电机驱动的滑块构成;所述高斯光路模块和所述环形光路模块均固定安装于滑块并随滑块沿Z轴滑轨竖直运动;所述PCB短波长脉冲激光钻孔装置还包括控制模块,所述控制模块分别与所述激光源、所述高斯光路模块、所述环形光路模块、所述移动平台和所述升降机构通信连接;所述控制模块通过对所述激光源、所述高斯光路模块、所述环形光路模块和所述升降机构发送指令,操控激光源启动或关闭,及所述高斯光路模块和所述环形光路模块射出激光的参数;所述控制模块通过对所述移动平台发送指令,控制所述移动平台承载PCB水平移动。
- 根据权利要求6所述的PCB短波长脉冲激光钻孔装置,其特征在于:所述高斯光路模块还包括:光束整形器;所述光束整形器设置在所述分光镜与所述第一反射镜组之间,所述光束整形器用于将高斯光束整形为平顶光束。
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