WO2022191626A1 - 디스플레이 광원용 단열시트, 이를 포함하는 단열 광원모듈, 단열 백라이트 유닛 및 디스플레이 장치 - Google Patents
디스플레이 광원용 단열시트, 이를 포함하는 단열 광원모듈, 단열 백라이트 유닛 및 디스플레이 장치 Download PDFInfo
- Publication number
- WO2022191626A1 WO2022191626A1 PCT/KR2022/003342 KR2022003342W WO2022191626A1 WO 2022191626 A1 WO2022191626 A1 WO 2022191626A1 KR 2022003342 W KR2022003342 W KR 2022003342W WO 2022191626 A1 WO2022191626 A1 WO 2022191626A1
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- WO
- WIPO (PCT)
- Prior art keywords
- light source
- heat insulating
- heat
- sheet
- thickness
- Prior art date
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Images
Classifications
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- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
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- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
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- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
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- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
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- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
- G02F1/1336—Illuminating devices
- G02F1/133602—Direct backlight
- G02F1/133603—Direct backlight with LEDs
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- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
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- G02F1/133628—Illuminating devices with cooling means
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
- H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
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- H01L25/16—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits
- H01L25/167—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits comprising optoelectronic devices, e.g. LED, photodiodes
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/15—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components having potential barriers, specially adapted for light emission
- H01L27/153—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components having potential barriers, specially adapted for light emission in a repetitive configuration, e.g. LED bars
- H01L27/156—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components having potential barriers, specially adapted for light emission in a repetitive configuration, e.g. LED bars two-dimensional arrays
Definitions
- the present invention relates to a heat insulating sheet, and more particularly, to a heat insulating sheet for a display light source, a heat insulating light source module including the same, a backlight unit, and a display device.
- a typical example of such an electronic device is a display device.
- low-cost models are still being mass-produced for display devices, on the other hand, as larger and higher performance is promoted, more pixels are being designed in a limited area.
- the number of light sources to be used tends to increase.
- the present invention was devised in consideration of the above points, and by receiving heat from a plurality of LED elements, which are heating elements, lowering the heat generation level of the LED elements, and minimizing the transfer of the received heat in the vertical direction, so that the heat is transferred to the upper part of the sheet.
- An object of the present invention is to provide a thermal insulation sheet that can minimize or prevent conduction or radiation, for example, to provide a thermal insulation sheet suitable for application to a display light source.
- a plurality of LED elements constituting the light source of the display are provided on the opposite surface of the circuit board mounting surface mounted at a predetermined interval, so that the plurality of LED elements
- the temperature of the LED element is lowered by moving the heat transferred to the first surface from the first surface to the second surface in the thickness direction and in the surface direction perpendicular to the thickness direction, and heat is dominant in the surface direction than in the thickness direction and a thermal insulation member, which is a graphite sheet, having a function of minimizing heat transfer from the second surface toward a direction perpendicular to it by moving it to the side, wherein the insulation member overlaps according to the surface direction spreading of heat transmitted from a plurality of LED elements
- a display light source having a
- the graphite sheet may include a natural graphite sheet.
- the thickness of the insulating member may be 150 to 200 ⁇ m.
- it may further include an adhesive member disposed on the first surface of the heat insulating member and attached to the opposite surface of the circuit board mounting surface, and a protective member disposed on the second surface of the heat insulating member.
- each of the protection member and the adhesive member may be greater than the length and width of the insulating member so that the four side surfaces parallel to the thickness direction of the heat insulating member are sealed through the protection member and the adhesive member.
- a plurality of LED elements constituting the light source of the display are provided on the opposite surface of the circuit board mounting surface mounted at a predetermined interval, so that the heat generated by the plurality of LED elements is reduced
- a heat insulating sheet for a display light source to block transmission in a direction perpendicular to the opposite surface it is attached on the opposite surface of the circuit board mounting surface, and forms a hot spot with an area larger than the mounting area of each LED element and improves high temperature reliability
- a metal substrate for having and an adhesive member which is a double-sided metal tape including an adhesive layer on both sides of the metal substrate, and a first surface disposed on the adhesive member and perpendicular to the thickness direction and a second surface facing it, the adhesive The temperature of the LED element is lowered by moving the heat transferred to the first surface adjacent to the member from the first surface to the second surface in the thickness direction and in the surface direction perpendicular to the thickness direction, but in the surface direction rather than in the thickness direction.
- a heat insulating member which is a graphite sheet, having a function of moving heat predominantly to a direction perpendicular to it from the second surface and minimizing heat transfer, wherein the graphite sheet comprises a natural graphite sheet, the heat insulating member and The metal substrate minimizes overlap due to in-plane spreading of the heat received from a plurality of LED devices, and in order to transfer the received heat in the thickness direction as much as possible and accumulate it in the insulation sheet, considering the distance between the LED devices and the amount of heat generated by the LED devices. It provides a heat insulating sheet for a display light source, characterized in that it has a set thickness.
- the heat insulating member may have a thickness in the range of 70 to 500 ⁇ m.
- the thickness of the insulating member may be 150 to 200 ⁇ m.
- the metal substrate may be a metal foil having at least one of a copper foil and an aluminum foil.
- the thickness of the metal substrate may be 7 ⁇ 75 ⁇ m
- the thickness of the adhesive layer may be 7 ⁇ 55 ⁇ m.
- a protective member provided on the second surface of the heat insulating member may be further provided.
- each of the protection member and the adhesive member may be greater than the length and width of the insulating member so that the four side surfaces parallel to the thickness direction of the heat insulating member are sealed through the protection member and the adhesive member.
- the graphite sheet is used to minimize the overlapping of heat received from one LED element and each other LED element disposed adjacent thereto, respectively, being transferred in the plane direction. It may be provided that the ratio (a/b) of the thermal conductivity (a) in the plane direction to the thermal conductivity (b) in the thickness direction is 100 or less.
- the protective member is a protective film comprising at least one selected from the group consisting of polyimide, polyethylene terephthalate (PET) and polyethylene naphthalate (PEN), and an adhesive layer to be fixed to the heat insulating member is applied to one surface of the protective film may include more.
- the protective member may have a thickness of 50 ⁇ 200 ⁇ m.
- the adhesive member may further include a release film on the opposite surface of the one surface in contact with the heat insulating member.
- the present invention relates to a circuit board, a plurality of LED devices mounted at a predetermined distance from each other on one surface of the circuit board, and a display according to the present invention disposed so that an adhesive member is positioned on the opposite surface of the circuit board one surface It provides a heat-insulating light source module comprising a heat-insulating sheet for a light source.
- the plurality of LED devices may be a mini LED device or a micro LED device.
- one sheet or several sheets of the heat insulating sheet for the display light source may be arranged to cover the opposite surface corresponding to the positions of the plurality of LED elements.
- the present invention provides a heat insulating light source module according to the present invention and a heat insulating backlight unit including a plurality of optical sheets disposed on a light emitting surface of the light source module.
- it further comprises a lower case for accommodating a part or all of the side surface of the heat insulating light source module and one side of the heat insulating sheet in the heat insulating light source module, so that an air layer is formed between the heat insulating sheet and the lower case. may be spaced apart.
- the present invention provides a liquid crystal display device including the adiabatic backlight unit according to the present invention and a liquid crystal display panel disposed on a light emitting surface of the adiabatic backlight unit.
- the present invention provides a light emitting display device including the heat insulating light source module according to the present invention.
- the LED element included in the heat insulation light source module is an LED element that emits white, UV, or blue light, and further includes a color conversion unit disposed on a path of light emitted from the heat insulation light source module. can do.
- the plurality of LED elements included in the heat insulation light source module may include LED elements emitting red, green, and blue light.
- the heat insulating sheet according to the present invention receives heat generated from a plurality of LED elements employed as a display light source to reduce the heat generation level of the LED elements while minimizing the transfer of the received heat in the vertical direction, Alternatively, it is very suitable for blocking heat generated from a plurality of LED elements from being transferred to the housing, as it is advantageous to minimize or prevent the transfer of heat in a positive way.
- the heat insulating sheet according to an embodiment of the present invention can prevent dust that may be generated due to damage or destruction of the inner layer of the heat insulating sheet from scattering, thereby preventing malfunction or damage of the display device due to the dust. It can be widely applied to various kinds of display devices.
- 1 to 4b is a cross-sectional schematic view of a heat insulating sheet according to various embodiments of the present invention
- FIG. 5 is a perspective view of a heat insulating light source module employing a heat insulating sheet according to an embodiment of the present invention
- 6 and 7 are cross-sectional schematic diagrams showing the movement path of heat transferred from a plurality of LED elements, which are heating elements, in a cross section along the X-X' boundary line and the Y-Y' boundary line of FIG. 5;
- FIGS. 8A and 8B are exploded perspective views of a heat-insulating light source module according to various embodiments of the present invention, showing that the heat-insulating sheet is divided into a plurality of sheets;
- FIG. 9 is an exploded perspective view of a heat insulating backlight unit according to an embodiment of the present invention.
- FIG. 10 is an exploded perspective view of a liquid crystal display device according to an embodiment of the present invention.
- the heat insulating sheet according to the present invention is provided on the opposite surface of the circuit board mounting surface on which a plurality of LED elements constituting the light source of the display are mounted at a predetermined interval so that heat generated by the plurality of LED elements is perpendicular to the opposite surface. It is an insulating sheet for a display light source to block transmission in one direction.
- the heat insulating sheet 100 includes a heat insulating member 110 including a first surface perpendicular to the thickness direction and a second surface facing the same,
- the insulating member 110 may further include a protective member 130 provided on the second surface and the adhesive member 120 provided on the first surface of the heat insulating member 110 .
- the heat insulating member 110 moves the heat received toward the first surface adjacent to the LED element from the first surface to the second surface in the thickness direction and in the surface direction perpendicular to the thickness direction to lower the temperature of the LED element.
- the insulation member 110 is It is implemented as a graphite sheet.
- the heat insulating member 110 minimizes overlap due to in-plane spreading of heat received from a plurality of LED devices, and transmits the heat received from the plurality of LED devices in the thickness direction as much as possible and accumulates the heat in the heat insulating member. It has a thickness set in consideration of the calorific value of the , the thickness is set in the range of 70 to 500 ⁇ m.
- the heat reaching the first surface of the heat insulation member 110 from a plurality of LED elements that are hot spots through the adhesive member 120 is in a plane direction perpendicular to the thickness direction.
- the heat conduction characteristic of the heat insulating member 110 which is predominantly expressed as This tendency of heat conduction minimizes or prevents heat transfer from the second surface of the insulation sheet 100 toward the direction perpendicular thereto by minimizing heat movement in the thickness direction from the first surface of the insulation member 110 to the second surface. It exhibits the heat dissipation effect of reducing the temperature of the LED element for the LED element, which is a heating element, while exhibiting the thermal insulation effect.
- the heat insulating member 110 is implemented as a graphite sheet, and may be one graphite sheet or a laminated graphite sheet.
- the heat conduction property of the heat insulating member 110 may be the heat conduction property of the single graphite sheet.
- the heat insulating member 110 is in the form of stacking several graphite sheets or includes other layers such as an adhesive layer in addition to the graphite sheet, the combined heat insulating member as a whole satisfies the heat conduction characteristics of the heat insulating member 110 only. it's free if you do
- the heat insulating member 110 minimizes overlap due to in-plane spreading of heat transmitted from a plurality of LED elements, where the heat insulating member is a hot spot, and transmits the received heat in the thickness direction as much as possible and accumulates the heat in the heat insulating member.
- the insulation sheet It has a thickness set in consideration of the gap between elements and the amount of heat generated by the LED element, and through this, the insulation sheet can achieve a minimum thickness increase for the improvement of the insulation effect, and as the use of an excessively thick graphite sheet is prevented, the insulation sheet It is advantageous to create a spaced space in which an air layer is formed between the heat insulating sheet and the lower case in the provided backlight unit, and as the heat insulating effect due to the air layer increases, heat transfer from the backlight unit to the lower case side can be minimized.
- the thickness of the heat insulating member 110 may be set in the range of 70 to 500 ⁇ m. If the thickness is less than 70 ⁇ m, the time for expressing the heat insulation effect for a lot of heat generated from a plurality of LED devices is shortened, so that the sufficient insulation effect may be difficult to express. In addition, if the thickness exceeds 500 ⁇ m, the heat capacity increases, which is advantageous to improve the heat dissipation effect for the LED element and the heat insulation effect due to the heat insulating sheet, but in the case of an artificial graphite sheet, it is not easy to manufacture with such a thickness. In addition, in the case of a natural graphite sheet, the thermal conductivity in the thickness direction may decrease.
- the heat conduction in the plane direction becomes more dominant, and the heat derived from each adjacent LED element is transferred in the plane direction, and the overlap occurs faster.
- the heat movement in the thickness direction is slow, the movement of heat generated from the LED element is not smooth, and the heat dissipation performance of the LED element may be deteriorated.
- damage such as cracks may occur in the heat insulating member, and the generated damage may reduce heat dissipation and/or heat insulation effect.
- peeling and lifting may occur at the interface between the various members constituting the heat insulating sheet.
- the graphite sheet may specifically include a natural graphite sheet, an artificial graphite sheet, and/or a multi-layered graphene sheet.
- the graphite sheet needs to be thicker than a predetermined thickness.
- the in-plane thermal conductivity is too large compared to the thickness-direction thermal conductivity, and it is difficult to manufacture a thickness exceeding a certain thickness, for example, 50 ⁇ m, or 60 ⁇ m, 70 ⁇ m, or 80 ⁇ m. Even if it is not easy and can be manufactured, the unit price is very high, and there is a problem that it is difficult to use.
- the graphite sheet may include a natural graphite sheet.
- the natural graphite since it can be used without limitation in the case of conventionally commercialized or referred to as natural graphite, the present invention omits a detailed description thereof.
- the graphite sheet which is the heat insulating member 110, has a thickness in order to minimize overlapping of heat received from each of the LED elements and other LED elements disposed adjacent thereto in the plane direction, respectively.
- the ratio (a/b) of the thermal conductivity (a) in the plane direction to the directional thermal conductivity (b) is 100 or less, in another example 90 or less, 80 or less, 70 or less, 60 or less, 50 or less, or 40 or less.
- the ratio (a/b) of the thermal conductivity (a) in the plane direction to the thermal conductivity (b) in the thickness direction may be 20 or more, as another example, 30 or more.
- the heat insulating sheet 100 may further include an adhesive member 120 provided under the heat insulating member 110 and a protective member 130 provided above the heat insulating member 110 .
- the adhesive member 120 is for attaching the heat insulating sheet 100 to the opposite surface of the circuit board on which a plurality of LED elements are mounted, which is the adhesion surface, and may be used without limitation in the case of known adhesive members.
- the adhesive member 120 may be formed of an adhesive layer as shown in FIG. 1 as an example.
- the adhesive layer can be used without limitation, as long as it is an adhesive layer that can be used commonly in the art, and is preferably made of acrylic resin, urethane resin, epoxy resin, silicone rubber, acrylic rubber, carboxyl nitrile elastomer, phenoxy and polyimide resin. At least one selected from the group, more preferably, may be formed of an adhesive layer forming composition comprising an adhesive component having an acrylic resin.
- the adhesive layer-forming composition may further include a curing agent when the adhesive component is a curable resin, and may further include additives such as a curing accelerator according to the purpose.
- the curing agent can be used without limitation as long as it is a curing agent that can be used commonly in the art, and preferably an epoxy-based curing agent, a diisocyanate-based curing agent, a secondary amine-based curing agent, a tertiary amine-based curing agent, a melamine-based curing agent, and an isocyanic acid-based curing agent At least one selected from the group consisting of a curing agent and a phenol-based curing agent, more preferably an epoxy-based curing agent.
- the adhesive layer may further include a known heat dissipation filler.
- the adhesive layer may have a thickness of 7 ⁇ 55 ⁇ m, preferably 10 ⁇ 50 ⁇ m. If the thickness of the adhesive layer is less than 7 ⁇ m, interlayer adhesion may be reduced, and if the thickness exceeds 55 ⁇ m, it is not preferable in terms of thinning, and considering the limited thickness of the insulating sheet 100, the As the thickness becomes relatively thin, heat dissipation and/or thermal insulation properties may be deteriorated.
- the protection member 130 functions to physically and chemically protect the heat insulating sheet 100 .
- the protection member 130 may be employed without limitation in the case of the protection member 130 of a conventional sheet.
- the protective member 130 may include a protective layer 131 , and the protective layer 131 may be in the form of an inorganic porous film, a nanofiber web, or a laminated inorganic film on a nanofiber web.
- the insulating sheet 100 shown in FIG. 1 it is a case in which an inorganic porous film is provided as the protective layer 131.
- a plurality of nanofiber webs provided with a protective function and a protective function are provided. It has the advantage of being able to express the thermal insulation effect in the vertical direction through the pores of the
- the inorganic film may be a film including at least one selected from the group consisting of polyimide, polyethylene terephthalate (PET) and polyethylene naphthalate (PEN).
- the nanofiber web may be a nanofiber web formed of a known material such as urethane-based, fluorine-based, polyacrylonitrile.
- the diameter of the nanofibers in the nanofiber web may be 1 ⁇ m or less, but is not limited thereto.
- the inorganic porous film or nanofiber web may have a thickness of 10 to 30 ⁇ m, preferably 13 to 25 ⁇ m. If the thickness is less than 10 ⁇ m, protection performance such as abrasion resistance may be reduced, and if the thickness exceeds 30 ⁇ m, it is undesirable in terms of thinning, and flexibility may be reduced, which may lead to delamination.
- the protective member 130 may further include an adhesive layer 132 to be fixed on the heat insulating member 110 .
- the adhesive layer 132 provided in the protective member 130 is the same as the description of the adhesive layer provided in the above-described adhesive member 120 , so a detailed description will be omitted. Alternatively, it may be configured differently.
- each of the protective member 130 and the adhesive member 120 so that the four sides parallel to the thickness direction of the heat insulating member 110 are sealed through the protective member 130 and the adhesive member 120 It may be formed to be larger than the length and width of the heat insulating member 110 .
- the adhesive member 120 is made of only an adhesive layer, it may be difficult to seal the side surface of the heat insulating member 110 for a long time compared to the heat insulating sheet 102 shown in FIG. 3 .
- the heat insulating sheet 101 according to the second embodiment includes a heat insulating member 110 that is a double-sided metal tape and a graphite sheet as an adhesive member 120' attached to the opposite side of the circuit board mounting surface, and the heat insulating member ( A protection member 130 provided on the second surface of 110 may be further included.
- the graphite sheet heat insulating member 110 and the protective member 130 are the same as the description of the heat insulating member 110 and the protective member 130 in the heat insulating sheet 100 according to the first embodiment described above.
- the adhesive member 120 ′ forms a hot spot having a larger area than the mounting area of each LED device and includes a metal substrate 122 and adhesive layers 121 and 123 on both sides of the metal substrate 122 for high temperature reliability. Double-sided metal tape.
- the adhesive layers 121 and 123 provided on the adhesive member 120 ′ which is the double-sided metal tape, may be known adhesive layers, and since they are the same as the description of the adhesive layer in the adhesive member 120 described above, a detailed description thereof will be omitted. In this case, the material, adhesive strength, and/or thickness of the first adhesive layer 123 and the second adhesive layer 121 may be the same or different.
- the adhesive member 120' is a double-sided metal tape including a metal substrate 122.
- the metal substrate 122 is prevented from forming wrinkles due to heat transferred from a plurality of LED elements as a heating element, high-temperature reliability can be guaranteed.
- a polymer film is used as the substrate, wrinkles occur due to high heat transferred from a plurality of LED elements, and thereby, between the adhesion surface and the adhesive member 120', the adhesive member 120' and the heat insulating member 110 There is a risk of lifting or peeling at the interfacial interface, and thus high-temperature reliability may be lowered.
- it is easier to form the offset structure as shown in FIGS. 4A and 4B and it may be advantageous to maintain the offset structure for a long period of time.
- the thermal insulation performance of the thermal insulation sheet 101 can be further improved.
- the heat H of the LED element 224 as a hot spot due to the heat conduction characteristics of the metal substrate 232a is transferred to the heat insulating member 231 . ), it may be primarily moved in a plane direction perpendicular to the thickness direction of the metal substrate 232a in the adhesive member 232 .
- the area (S 2 ) of the hot spot formed on the metal substrate (232a) on the basis of the heat insulating member (231) is larger than the mounting area (S 1 ) of the LED element, and thus the heat reaching the first surface of the heat insulating member (231) is In a plane direction perpendicular to the thickness direction of the heat insulating member 231, it can be transferred faster and more, and the amount of heat transferred can be further reduced in the thickness direction from the first surface to the second surface relatively, through this Since heat transferred from the second surface of the heat insulating sheet 230 toward the direction perpendicular to the second surface can be further reduced, a more improved heat insulation effect can be expressed.
- the metal substrate 122 can be used without limitation as long as it is a metal substrate commonly used in the art, and preferably includes any one of copper foil, aluminum foil, silver foil, nickel foil and gold foil, or two or more of them. It may be an alloy, a metal film in which two or more of these are mixed, or two or more types are laminated to form each layer.
- the metal substrate 122 may be a metal foil including at least one of a copper foil and an aluminum foil.
- the metal substrate 122 may have a thickness of 7 to 75 ⁇ m, preferably 10 to 70 ⁇ m. If the thickness of the metal substrate 122 is less than 7 ⁇ m, the desired level of heat dissipation characteristics cannot be expressed and a tear phenomenon may occur. Accordingly, interlayer lifting and peeling may occur during bending, thereby reducing reliability.
- the metal substrate 122 may have a predetermined surface roughness by forming irregularities on the surface in order to improve adhesion characteristics with the first adhesive layer 123 and/or the second adhesive layer 121 , but is limited thereto. not.
- the graphite sheet which is the heat insulating member 110, includes a natural graphite sheet, minimizes overlap due to in-plane spreading of heat transmitted from a plurality of LED devices, and maximizes the heat received in the thickness direction.
- the thickness of the metal substrate and the thickness of the graphite sheet are set in consideration of the distance between the LED elements and the amount of heat generated by the LED element, and through this, the insulation sheet can achieve a minimum thickness increase for the improvement of the insulation effect, and the excessive thickness As the graphite sheet is prevented from being used, it is advantageous to create a spaced space in which an air layer is formed between the insulation sheet and the lower case in the backlight unit provided with the insulation sheet, and as the insulation effect due to the air layer increases, from the backlight unit toward the lower case Heat transfer can be minimized.
- the first LED element 221 , the second LED element 222 and the third LED element ( The heat generated from the 223) reaches the adhesive member 232 via the circuit board 210, and the heat transferred from the metal substrate 232a in the adhesive member 232 is primarily spread in the plane direction to the LED.
- a hot spot having a larger area than the mounting area of the device is formed, and a portion of the heat is spread in the planar direction, and the remaining heat is transferred in the vertical direction to reach the first surface of the heat insulating member 231 .
- the heat reaching the heat insulating member 231 is spread more rapidly in the planar direction than in the thickness direction due to the superior heat conduction characteristics in the planar direction than in the thickness direction of the heat insulating member 231 .
- the heat insulating member 231 which is a natural graphite sheet
- the ratio of thermal conductivity in the plane direction to the thermal conductivity in the thickness direction is small compared to the thermal conductivity in the thickness direction compared to the artificial graphite sheet.
- the remaining heat is spread in the plane direction, and this results in the plane-direction spreading (H xy1 ) of the heat originating from the first LED element 221 and the surface of the heat originating from the second LED element 222 .
- the overlap (A) between the direction spreading (H xy2 ) may be minimized.
- the heat moves in the thickness direction to an appropriate level (H z )
- the heat insulating member 231 may have an appropriate thickness to have a sufficient heat capacity in consideration of the distance between the LED elements and the amount of heat generated by the LED elements, and the metal substrate 232a also has an appropriate thickness. It can help to keep the heat insulating effect and exert the heat dissipation effect.
- the thermal conductivity is too small in the thickness direction compared to the plane direction, and as a result, the movement of heat in the thickness direction within the heat insulating member 231 is very small, so that most of the heat is in the plane direction. It is spread, and in this case, a very fast time between the in-plane spreading of heat derived from the first LED element 221 (H xy1 ) and the in-plane spreading of the heat originating in the second LED element 222 (H xy2 ). An overlap (A) may occur.
- the heat insulating member 231 When the overlap of the heat in the surface direction inside the heat insulating member 231 is large, the heat insulating member 231 is difficult to receive heat from the adhesive member 232 any more, whereas the amount of heat moving in the thickness direction is small, so that the LED elements 221, 222, 223 It can be difficult to achieve a desired level of heat dissipation because it is difficult to continuously transfer heat.
- the heat spreading in the plane direction is excellent, but since the heat must move in the thickness direction to an appropriate level, the plane direction thermal conductivity in comparison to the thermal conductivity in the thickness direction of the graphite sheet used for the heat insulating member 231 Adjusting the ratio to an appropriate level, for example, 100 or less, may also be another way to minimize overlap due to in-plane spreading of heat.
- the present invention improves the adhesion characteristics on the adhesion surface having a curvature or a step, prevents delamination between layers in the insulation sheet, and may occur according to the breakage of the insulation member 110 that may occur only once.
- the insulating sheets 102 and 102' may have a structure as shown in FIGS. 3, 4A and 4B.
- the heat insulating sheet 102 has a protective member 130 and an adhesive member 120 so that four sides parallel to the thickness direction of the heat insulating member 110' can be sealed through the protective member 130 and the adhesive member 120'.
- each length and width may be formed to be larger than each length and width of the heat insulating member 110' by a predetermined size (a).
- the length and width of each of the heat insulating member 110', the protective member 130, and the adhesive member 120' are not limited thereto, and may be appropriately changed in consideration of the area of the backlight unit and the desired heat insulating performance. have.
- the above-described heat insulating sheets 100, 101, 102, 102' may be implemented as a heat insulating light source module for a display.
- the heat insulation light source module 200 includes a circuit board 210, a plurality of LED elements 220 mounted on one surface of the circuit board 210 at a predetermined distance from each other, and It is implemented by including the above-described heat insulating sheet 230 for the display light source disposed so that the adhesive member is positioned on the opposite surface of the circuit board one surface.
- the plurality of LED elements 220 may be arranged in a tiled pattern as shown in FIG. 5 to implement a direct type light source.
- the plurality of LED devices 220 may be a mini LED device or a micro LED device.
- Each of the mini LED device and the micro LED device may have a length of more than 100 ⁇ m to 500 ⁇ m.
- the micro LED device may have a length of 100 ⁇ m or less on each side.
- the LED elements 211 , 212 , 213 , and 214 may be of a known LED material and structure.
- the LED devices 211 , 212 , 213 , and 214 may be made of, for example, InGaN or GaN, and may include an n-type semiconductor layer, a photoactive layer, and a p-type semiconductor layer, and may further include an electrode layer.
- the plurality of LED devices 220 may emit any one color of the visible light region, for example, blue light or UV light.
- the local dimming is a technology for controlling the brightness of an LED used as a backlight based on a configuration or characteristic of a screen, and is a technology capable of remarkably improving a contrast ratio and reducing power consumption.
- dark colors are expressed by adjusting the brightness of the mini LED or micro LED corresponding to the dark screen to be relatively dark, and the brightness of the mini LED or micro LED corresponding to the bright screen is relatively brightened to display vivid colors.
- more than 15,000 mini-LED devices may be provided on the circuit board, and in another example, more than 20,000.
- circuit board 210 may be a known circuit board used in a display light source module, and the present invention is not particularly limited thereto.
- the heat insulating sheet 230 for a light source according to the present invention is arranged such that the above-described plurality of LED elements 220 are positioned on the opposite surface of the surface mounted on the circuit board 210 .
- the heat insulating sheet 230 for the light source is arranged to cover the opposite surface corresponding to the position of the plurality of LED elements, or several sheets as shown in FIGS.
- the light source modules 200' and 200" can be implemented by being disposed to cover the surface.
- the present invention includes the adiabatic backlight unit 300 and the liquid crystal display device 1000 having the above-described adiabatic light source modules 200 , 200 ′, and 200 ′′.
- the heat insulating backlight unit 300 is implemented by including a heat insulating light source module 200 and a plurality of optical sheets 240 disposed on the emitting surface of the heat insulating light source module 200 .
- an intermediate molding material 250 for supporting and fixing the heat insulating light source module 200 and the optical sheet 240 and a lower case 260 for accommodating the heat insulating light source module may be further provided.
- the optical sheet 240 is for improving the intensity, direction, etc. of the light supplied to the liquid crystal display panel 400 through the light source modules 200, 200 ', and 200", and is limited in the case of a known optical sheet used in a display backlight unit.
- the optical sheet 240 may include a diffusion sheet 241 , a prism sheet 242 , and a reflective polarization sheet 243 , and each sheet is an optical sheet commonly used in the art.
- the optical sheet 240 may further include a sheet performing other functions in addition to the diffusion sheet 241, the prism sheet 242, and the reflective polarizing sheet 243, or any one or more of these sheets
- the optical sheet may be provided with a plurality of sheets of a specific type, and the stacking order of each sheet may be different depending on the purpose, so the present invention is not particularly limited thereto.
- an air layer may be spaced apart between the heat insulating sheet 220 positioned on the opposite side of the light emitting surface and the lower case 260 , and through this, the It is possible to minimize the transfer of a large amount of heat to the lower case side.
- liquid crystal display panel 400 may be disposed on the light emitting surface of the heat insulation backlight unit 300 to implement the liquid crystal display device 1000 .
- the liquid crystal display device may further include an upper case 500 supporting the front edge of the liquid crystal display panel 400 .
- the liquid crystal display panel 400 includes a color conversion film layer 410 that converts light emitted from the heat insulating backlight unit 300 to a desired color, a liquid crystal layer 430, and the liquid crystal layer 430 in upper and lower portions. It may include a lower substrate 420 and an upper substrate 440 supported by the.
- the color conversion film layer 410 may be used without limitation in the case of the color conversion film layer 410 employed in a known liquid crystal display device, and may be, for example, a fluorescence conversion film or a quantum dot conversion film.
- the liquid crystal layer 430 may be a liquid crystal layer employed in a liquid crystal display device, and the present invention is not particularly limited thereto.
- the color conversion film layer 410 has been described as one configuration of the liquid crystal display panel 400 , it is not limited thereto, and the color conversion film layer 410 is a liquid crystal display panel 400 independent of the liquid crystal display panel 400 . Note that it can be provided on the panel.
- the lower substrate 420 may include a plurality of pixel electrodes (not shown) and a plurality of thin film transistors (not shown) electrically connected to the pixel electrodes in a one-to-one correspondence. Each thin film transistor switches a driving signal provided to a corresponding pixel electrode.
- the upper substrate 440 may include a common electrode (not shown) that forms an electric field for controlling the arrangement of the liquid crystal together with the pixel electrodes.
- components employed in known liquid crystal display devices may be further included in addition to the above-described components, and detailed description thereof will be omitted in the present invention.
- the thermal insulation light source module of the present invention may be implemented as a light-emitting display device.
- the LED element included in the heat insulation light source module is an LED element that emits white, UV, or blue light, and further includes a color conversion unit disposed on a path of light emitted from the heat insulation light source module.
- a color conversion unit disposed on a path of light emitted from the heat insulation light source module.
- the plurality of LED elements included in the heat insulation light source module may include LED elements emitting red, green, and blue light.
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Abstract
Description
Claims (17)
- 디스플레이의 광원을 이루는 다수 개의 LED 소자가 소정의 간격을 두고 실장된 회로기판 실장면의 반대면 상에 구비되어 상기 다수 개의 LED 소자에서 발생되는 열이 상기 반대면에 수직한 방향으로 전달되는 것을 차단시키기 위한 디스플레이 광원용 단열시트로서,상기 회로기판 실장면의 반대면 상에 부착되며, 각각의 LED 소자 실장 면적보다 큰 면적의 핫스팟을 형성시키고 고온 신뢰성을 갖기 위한 금속기재와 상기 금속기재의 양면에 접착층을 포함하는 양면 금속테이프인 접착부재; 및상기 접착부재 상에 배치되며, 두께방향에 수직한 제1면과 이에 마주보는 제2면을 포함하고, 상기 접착부재에 인접하는 제1면 쪽으로 전달받은 열을 두께방향 및 상기 두께방향에 수직한 면방향으로 이동시켜서 상기 LED 소자의 온도를 낮추되, 상기 두께방향 보다 상기 면방향으로 열을 우세하게 이동시켜서 제2면으로부터 이에 수직한 방향 측을 향해서 열 전달을 최소화시키는 기능을 갖는 그라파이트 시트인 단열부재;를 포함하고,상기 그라파이트 시트는 천연 그라파이트 시트를 포함하며,상기 단열부재 및 상기 금속기재는 다수 개의 LED 소자로부터 전달받은 열의 면방향 스프레딩에 따른 중첩을 최소화 하고 전달받는 열을 최대한 두께방향으로 전달 및 단열시트 내 축적시키기 위하여 LED 소자 간 간격 및 LED 소자의 발열량을 고려하여 설정된 두께를 가지는 것을 특징으로 하는 디스플레이 광원용 단열시트.
- 제1항에 있어서,상기 단열부재는 두께가 70 내지 500㎛ 범위로 형성된 디스플레이 광원용 단열시트.
- 제2항에 있어서,상기 단열부재의 두께는 150 내지 200㎛ 인 것을 특징으로 하는 디스플레이 광원용 단열시트.
- 제1항에 있어서,상기 금속기재는 동박 및 알루미늄박 중 어느 하나 이상을 구비하는 금속박인 디스플레이 광원용 단열시트.
- 제1항에 있어서,상기 금속기재의 두께는 7 ~ 75㎛이며, 상기 접착층의 두께는 7 ~ 55㎛인 디스플레이 광원용 단열시트.
- 제6항에 있어서,상기 단열부재의 제2면 상에 구비되는 보호부재를 더 구비하는 디스플레이 광원용 단열시트.
- 제1항에 있어서,상기 단열부재의 제2면 상에 구비되는 보호부재를 더 구비하며,상기 단열부재의 두께방향에 평행한 네 측면이 보호부재와 접착부재를 통해 봉지되도록 상기 보호부재 및 접착부재 각각의 길이와 폭은 상기 단열부재의 길이와 폭보다 크게 형성된 디스플레이 광원용 단열시트.
- 제1항에 있어서,상기 그라파이트 시트는 어느 일 LED 소자와 이에 인접 배치되는 다른 LED 소자 각각으로부터 전달받은 열이 각각 면방향으로 전달되다가 서로 중첩되는 것을 최소화 하기 위하여 두께방향 열전도도(b)에 대한 면방향의 열전도도(a) 비율(a/b)이 100 이하인 것을 구비하는 디스플레이 광원용 단열시트.
- 제6항에 있어서,상기 보호부재는 폴리이미드, 폴리에틸렌테레프탈레이트(PET) 및 폴리에틸렌나프탈레이트(PEN)로 이루어진 군에서 선택된 1종 이상을 포함하는 보호필름이며,단열부재에 고정되기 위한 접착층을 상기 보호필름 일면에 더 포함하는 디스플레이 광원용 단열시트.
- 제6항에 있어서,상기 보호부재는 두께가 50 ~ 200㎛인 디스플레이 광원용 단열시트.
- 회로기판;상기 회로기판 일면 상에 상호 간에 소정의 간격을 두고 실장된 다수 개의 LED 소자; 및상기 회로기판 일면의 반대면 상에 접착부재가 위치하도록 배치된 제1항에 따른 디스플레이 광원용 단열시트;를 포함하는 단열 광원모듈.
- 제11항에 있어서,상기 다수 개의 LED 소자는 미니 LED 소자 또는 마이크로 LED 소자인 단열 광원모듈.
- 제11항에 있어서,상기 디스플레이 광원용 단열시트는 상기 다수 개의 LED 소자의 위치에 대응하는 상기 반대면을 덮도록 한 장 또는 여러 장이 배치되는 단열 광원모듈.
- 제11항에 따른 단열 광원모듈; 및상기 광원모듈에서 광 출사면 상에 배치되는 여러 장의 광학시트;를 포함하는 단열 백라이트 유닛.
- 제14항에 있어서,상기 단열 광원모듈의 측면 일부 또는 전부와, 단열 광원모듈 내 단열시트 측 일면을 수용하는 하부 케이스를 더 포함하며,상기 단열시트와 하부 케이스 사이에는 공기층이 형성되도록 이격되어 있는 단열 백라이트 유닛.
- 제15항에 따른 단열 백라이트 유닛; 및상기 단열 백라이트 유닛의 광 출사면 상에 배치되는 액정표시패널;을 구비하는 액정 디스플레이 장치.
- 제11항에 따른 단열 광원모듈을 포함하는 발광형 디스플레이 장치.
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US18/281,318 US20240154081A1 (en) | 2021-03-09 | 2022-03-10 | Insulation sheet for display light source, and insulation light source module, insulation backlight unit, and display device comprising same |
CN202280020078.2A CN116964519A (zh) | 2021-03-09 | 2022-03-10 | 显示器光源用隔热片、包括其的隔热光源模块、隔热背光单元及显示装置 |
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KR1020210030579A KR20220126393A (ko) | 2021-03-09 | 2021-03-09 | 디스플레이 광원용 단열시트, 이를 포함하는 단열 광원모듈, 단열 백라이트 유닛 및 디스플레이 장치 |
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Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20140019737A (ko) * | 2012-08-06 | 2014-02-17 | 주식회사 아모그린텍 | 방열 시트 및 그 제조방법 |
US20140370222A1 (en) * | 2013-06-18 | 2014-12-18 | A-Tech Solution Co., Ltd | Heat-dissipation sheet assembly manufactured by using electrochemical method |
KR200478488Y1 (ko) * | 2012-04-20 | 2015-10-12 | 그라프텍 인터내셔널 홀딩스 인코포레이티드 | 써멀 링크를 구비한 디스플레이 장치 |
KR20160018421A (ko) * | 2014-08-06 | 2016-02-17 | 주식회사 아모그린텍 | 이방성 열분산 시트 및 이를 구비하는 전자기기 |
KR20190020637A (ko) * | 2017-08-21 | 2019-03-04 | 김학모 | 시인성 및 작업성이 개선된 그라파이트 라미네이트 칩온필름형 반도체 패키지 |
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KR102059126B1 (ko) | 2018-06-15 | 2019-12-24 | (주)코아시아 | 미니 led를 이용한 백라이트 유닛 제조 방법 |
-
2021
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2022
- 2022-03-10 WO PCT/KR2022/003342 patent/WO2022191626A1/ko active Application Filing
- 2022-03-10 US US18/281,318 patent/US20240154081A1/en active Pending
- 2022-03-10 CN CN202280020078.2A patent/CN116964519A/zh active Pending
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR200478488Y1 (ko) * | 2012-04-20 | 2015-10-12 | 그라프텍 인터내셔널 홀딩스 인코포레이티드 | 써멀 링크를 구비한 디스플레이 장치 |
KR20140019737A (ko) * | 2012-08-06 | 2014-02-17 | 주식회사 아모그린텍 | 방열 시트 및 그 제조방법 |
US20140370222A1 (en) * | 2013-06-18 | 2014-12-18 | A-Tech Solution Co., Ltd | Heat-dissipation sheet assembly manufactured by using electrochemical method |
KR20160018421A (ko) * | 2014-08-06 | 2016-02-17 | 주식회사 아모그린텍 | 이방성 열분산 시트 및 이를 구비하는 전자기기 |
KR20190020637A (ko) * | 2017-08-21 | 2019-03-04 | 김학모 | 시인성 및 작업성이 개선된 그라파이트 라미네이트 칩온필름형 반도체 패키지 |
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KR20220126393A (ko) | 2022-09-16 |
US20240154081A1 (en) | 2024-05-09 |
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