WO2022139203A1 - Substrat transparent utilisant une carte à led et son procédé de fabrication - Google Patents

Substrat transparent utilisant une carte à led et son procédé de fabrication Download PDF

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Publication number
WO2022139203A1
WO2022139203A1 PCT/KR2021/017393 KR2021017393W WO2022139203A1 WO 2022139203 A1 WO2022139203 A1 WO 2022139203A1 KR 2021017393 W KR2021017393 W KR 2021017393W WO 2022139203 A1 WO2022139203 A1 WO 2022139203A1
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WO
WIPO (PCT)
Prior art keywords
transparent substrate
transparent
light emitting
electrode pattern
led
Prior art date
Application number
PCT/KR2021/017393
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English (en)
Korean (ko)
Inventor
이동준
Original Assignee
주식회사 태그솔루션
이동준
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by 주식회사 태그솔루션, 이동준 filed Critical 주식회사 태그솔루션
Publication of WO2022139203A1 publication Critical patent/WO2022139203A1/fr

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Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/90—Methods of manufacture
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/60—Optical arrangements integrated in the light source, e.g. for improving the colour rendering index or the light extraction
    • F21K9/61—Optical arrangements integrated in the light source, e.g. for improving the colour rendering index or the light extraction using light guides
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V23/00—Arrangement of electric circuit elements in or on lighting devices
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V23/00—Arrangement of electric circuit elements in or on lighting devices
    • F21V23/003—Arrangement of electric circuit elements in or on lighting devices the elements being electronics drivers or controllers for operating the light source, e.g. for a LED array
    • F21V23/004—Arrangement of electric circuit elements in or on lighting devices the elements being electronics drivers or controllers for operating the light source, e.g. for a LED array arranged on a substrate, e.g. a printed circuit board
    • F21V23/005—Arrangement of electric circuit elements in or on lighting devices the elements being electronics drivers or controllers for operating the light source, e.g. for a LED array arranged on a substrate, e.g. a printed circuit board the substrate is supporting also the light source
    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
    • G09F13/00—Illuminated signs; Luminous advertising
    • G09F13/20—Illuminated signs; Luminous advertising with luminescent surfaces or parts
    • G09F13/22—Illuminated signs; Luminous advertising with luminescent surfaces or parts electroluminescent
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V2200/00—Use of light guides, e.g. fibre optic devices, in lighting devices or systems
    • F21V2200/20—Use of light guides, e.g. fibre optic devices, in lighting devices or systems of light guides of a generally planar shape
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]
    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
    • G09F13/00—Illuminated signs; Luminous advertising
    • G09F13/20—Illuminated signs; Luminous advertising with luminescent surfaces or parts
    • G09F13/22—Illuminated signs; Luminous advertising with luminescent surfaces or parts electroluminescent
    • G09F2013/222—Illuminated signs; Luminous advertising with luminescent surfaces or parts electroluminescent with LEDs

Definitions

  • the present invention relates to an LED light emitting board using a transparent substrate and a manufacturing method thereof, wherein a conductive metal film is adhered to one side of a transparent substrate, an electrode pattern is formed through etching, and a groove is formed in the transparent substrate and the groove is formed.
  • a transparent substrate configured to electrically connect the inserted LED element and the electrode pattern, thereby increasing the degree of integration of a plurality of LED elements installed on the light emitting board and increasing the resolution of the light emitting board using an electrode pattern made of a metal material having excellent conductivity It relates to an LED light emitting board using
  • Modern indoor/outdoor billboards can be largely divided into billboards with indirect lighting using fluorescent lamps or incandescent lamps, and billboards with direct lighting using neon signs and light emitting devices.
  • LED Light Emitting Diode
  • LEDs have the advantages of low calorific value and power consumption, excellent visibility and luminance, and can be manufactured in a small size.
  • Korean Patent Registration No. 10-1480961 (registered on January 05, 2015) proposed by the present inventor relates to a transparent plastic material LED light emitting board and a manufacturing method thereof, and a transparent plastic material
  • the electrode pattern is formed by printing a conductive ink on the substrate of the , and the electrode pattern and the LED light emitting device are electrically connected through the conductive epoxy.
  • the prior art has the advantage of improving aesthetics and productivity, for example, since it is a method of forming an electrode pattern by printing a conductive ink containing silver (Ag) in a screen printing method, the conductive characteristics of the electrode pattern material had its limitations.
  • the conductive ink containing silver (Ag) component is not generally 100% pure silver paste, but consists of 80 ⁇ 95% silver paste and 5 ⁇ 20% adhesive binder. has an electrical resistance of When the electrical resistance is so large, it is impossible to insert many LEDs into one light emitting board, and for this reason, if the LED light emitting board is to be used for display purposes such as a billboard, there is a limitation in that the resolution of the display cannot be increased.
  • Republic of Korea Patent Registration 10-1847100 (registered on April 03, 2018) proposed by the present inventor is a method for manufacturing a transparent light emitting device using UV imprinting technology and a transparent light emitting device manufactured accordingly.
  • a configuration in which an integrated circuit pattern is quickly imprinted through UV imprinting technology using a mold, and then a conductive material is filled in the circuit pattern to form an electrical circuit in the form of a metal mesh was proposed.
  • the prior art has the advantage of manufacturing a large-area high-resolution transparent light-emitting device, but it is necessary to form different circuit patterns to manufacture light-emitting boards of different shapes/sizes, and for this, a mold must be individually manufactured, so the manufacturing cost is high. It had a limitation in that the price of the material was high due to the high level of difficulty in producing the material.
  • Korean Patent Laid-Open Publication No. 10-2018-0012544 (published on February 06, 2018) relates to a high-resolution transparent light-emitting device and a method for manufacturing the same, wherein a transparent circuit is formed on a first transparent substrate with grooves formed therein. ; a second transparent substrate including a groove and having a transparent circuit formed thereon; an LED chip attached to a groove formed in the first transparent substrate and including a transparent electrode, wherein one electrode of the transparent electrodes is soldered to the first transparent substrate, and the other electrode is the A configuration in which soldering is performed in the groove of the second transparent substrate has been proposed.
  • the present invention has been devised in view of the above problems, by bonding a conductive metal film to one side of a transparent substrate, forming an electrode pattern through etching, forming a groove in the transparent substrate, and an LED device inserted into the groove LED light emission using a transparent substrate configured to electrically connect the electrode pattern to the electrode pattern of a metal material having excellent conductivity to increase the degree of integration of a plurality of LED elements installed on the light emitting board and to increase the resolution of the light emitting board It is an object of the present invention to provide a board and a method for manufacturing the same.
  • the transparent substrate is made of any one of a plastic material or a glass material.
  • the transparent substrate is made of a polycarbonate material or a polycarbonate-based laminated material.
  • the conductive metal film is any one of a Cu film, a Ni film, a Cu-Ni alloy film, and an Al film.
  • the adhesive surface of the conductive metal film is oxide-treated.
  • the transparent adhesive is a transparent UV (ultraviolet) adhesive.
  • the transparent ink layer is formed using a transparent UV ink.
  • the electrode pattern and the LED element are electrically connected using silver epoxy or low-temperature solder cream.
  • the transparent ink layer is formed to cover the remaining area except for a portion in which the LED element insertion groove is formed and an electrode pattern portion electrically directly connected to the LED element.
  • a transparent substrate having a plurality of LED device insertion grooves formed on one side thereof; an electrode pattern formed on the basis of a conductive metal film adhered to one side of the transparent substrate using a transparent adhesive; a transparent ink layer formed on one side of the transparent substrate and formed to cover at least a portion of an area where the electrode pattern is not formed; and an LED element inserted into each LED element insertion groove so that the LED light emitting surface faces the other side of the transparent substrate and faces the inside of the groove, and the LED element is electrically connected to the electrode pattern.
  • An LED light emitting board is disclosed.
  • the electrode pattern is formed by etching a conductive metal film adhered to one side of the transparent substrate using a transparent adhesive.
  • the transparent ink layer is formed to cover the remaining area except for a portion in which the LED element insertion groove is formed and an electrode pattern portion electrically directly connected to the LED element.
  • the present invention has the advantage of increasing the degree of integration of a plurality of LED elements installed on the light emitting board and increasing the resolution of the light emitting board by using an electrode pattern made of a metal material having excellent conductivity.
  • FIGS. 1A and 1B are schematic diagrams for explaining a method of manufacturing an LED light emitting board according to an embodiment of the present invention
  • FIG. 2 is a schematic plan view of an LED light emitting board according to an embodiment of the present invention.
  • FIG. 3 is a photo of a prototype of an LED light emitting board according to an embodiment of the present invention.
  • FIG. 4 is a photograph of a test article for explaining a state in which light transmittance is improved by forming a transparent ink layer according to an embodiment of the present invention.
  • first component may be referred to as a second component
  • second component may also be referred to as a first component
  • a component When a component is referred to as being “connected” or “connected” to another component, it may be directly connected or connected to the other component, but another component may exist in between.
  • FIGS. 1A and 1B are schematic diagrams for explaining a method of manufacturing an LED light emitting board according to an embodiment of the present invention.
  • a transparent substrate 10 is prepared.
  • the transparent substrate 10 may be made of any one of a plastic material or a glass material, and in view of workability, a plastic material is preferable.
  • the transparent substrate 10 is a substrate made of a plastic material, for example, various materials such as acrylic, PC (poly carbonate), PET (poly ethylene terephthalate), etc. can be selected, and the base substrate is It may be formed by cutting to a predetermined size.
  • the transparent substrate 10 is more preferably made of a polycarbonate material in consideration of processability, light transmission characteristics, thermal deformation characteristics, and the like.
  • the transparent substrate 10 may be made of a polycarbonate-based laminated material.
  • the laminating material is a polycarbonate substrate laminated with another plastic substrate, and as a preferred example, a polycarbonate substrate and an acrylic substrate may be laminated.
  • the thickness of the laminated material substrate may be configured such that the thickness of the polycarbonate substrate: the thickness of the acrylic substrate is in a ratio of about 8:2.
  • the transparent substrate 10 is preferably formed to have a thickness of about 1.2 to 1.5 mm in consideration of the usability as a light emitting board and the installation side of the LED element 50 .
  • the conductive metal film 30 is adhered to one side 10a of the transparent substrate 10 using a transparent adhesive 20 . (a of Fig. 1a)
  • the conductive metal film 30 may be any one of a Cu (copper) film, a Ni (nickel) film, a Cu-Ni alloy film, and an Al (aluminum) film, in particular, using a Cu film good night.
  • the adhesive surface of the conductive metal film 30 is oxide-treated.
  • Oxide treatment is to emboss the film surface through chemical treatment.
  • the surface of the conductive metal film 30 such as a Cu film is smooth, adhesion to the transparent substrate 10, in particular, the transparent substrate 10 made of a plastic material may not be easily achieved.
  • the adhesive surface of the conductive metal film 30 is oxide-treated to form an embossed surface, it is advantageous to form an adhesive force.
  • the conductive metal film 30 is too thin, the electrical resistance of the electrode pattern 32 is high, and if it is too thick, etching is difficult.
  • the transparent adhesive 20 uses a transparent UV (ultraviolet) adhesive.
  • a transparent UV adhesive is a transparent adhesive that is cured by UV irradiation after application.
  • the transparent adhesive 20 layer is not particularly limited, but may be formed to a thickness of about 3 to 4 ⁇ m.
  • the transparent adhesive 20 is a liquid adhesive and is uniformly applied to one side 10a of the transparent substrate 10 using a dispenser, and the upper and lower sides are laminated with the conductive metal film 30 on the upper side.
  • the conductive metal film 30 is attached by pressing with a rubber roller of When a transparent UV adhesive is used as the transparent adhesive 20, it is cured by UV irradiation.
  • the electrode pattern 32 is formed by masking and etching the adhered conductive metal film 30 for forming the electrode pattern 32 .
  • the masking method generally includes a dry film method and a photoresist (PR) method, and in this embodiment, it is preferable to use a PR (photoresist) method applicable to precise numerical conditions, but is not limited thereto.
  • PR photoresist
  • the etching process may be performed as follows. First, after masking the part that should not be etched with PR (photoresist), the etching agent is sprayed or put into the etching agent. An etching chemical etches a portion of the conductive metal film 30 corresponding to a region other than the masked region to leave an electrode pattern 32 constituting a circuit.
  • PR photoresist
  • a transparent ink layer 40 is formed on at least a portion of the portion 30c from which the conductive metal film 30 is removed by the etching process.
  • the transparent ink layer 40 is the remaining region 40a except for a portion in which a groove 12 for LED element insertion, which will be described later, is formed and an electrode pattern portion 32a electrically directly connected to the LED element 50 .
  • 40b) is preferably formed to cover.
  • the region 40a illustrated in FIG. 1B corresponds to a region covering the remaining electrode patterns 32 (patterns constituting the circuit line) except for the electrode pattern portion 32a that is directly electrically connected to the LED element 50, and the region 40b corresponds to a space region between the electrode patterns 32 .
  • the transparent ink layer 40 is formed using transparent UV ink (eg, transparent UV ink for silk screen).
  • transparent UV ink eg, transparent UV ink for silk screen.
  • the region 40a covering the remaining electrode pattern 32 except for the electrode pattern portion 32a that is directly electrically connected to the LED element 50 has a risk of deterioration due to oxidation when exposed to the atmosphere due to long-term use. , it is preferable to cover the transparent ink layer 40 up to this part.
  • the electrode pattern portion 32a that is directly electrically connected to the LED element 50 uses silver epoxy 62 or low-temperature solder cream 64 to form the electrode pattern 32 and the electrode of the LED element 50, as will be described later. to be electrically connected, there is no need to form the transparent ink layer 40 in this portion.
  • the inner surface of the LED element insertion groove 12 is also not a portion where the transparent adhesive 20 layer remains, it is not necessary to form the transparent ink layer 40 in this portion.
  • the transparent ink may be applied using a silk screen on which an ink application pattern is formed.
  • a transparent UV ink is used as the transparent ink, it is cured by UV irradiation after application.
  • the silk screen includes a portion in which the LED element insertion groove 12 is formed and an electrode pattern portion 32a that is electrically directly connected to the LED element 50 .
  • An ink application pattern is formed so that the transparent ink is not applied to the surface, and the transparent ink is applied to the remaining regions 40a and 40b.
  • a plurality of LED element insertion grooves 12 are formed in one side 10a of the transparent substrate 10 .
  • the groove 12 for inserting the LED element may be formed by a machining method using a mechanical device such as a CNC machine.
  • the groove 12 for inserting the LED element is formed based on the outer model of the LED element 50, and it is preferable to form a groove larger than the actual size by about +0.02 to 0.05 mm. (d of Fig. 1b)
  • the LED element 50 is inserted into each LED element insertion groove 12 so that the LED light emitting surface 50a faces the other side 10b of the transparent substrate 10 and faces the inside of the groove. do.
  • the LED element 50 may be adhesively fixed in the groove 12 for inserting the LED element through a transparent adhesive.
  • the other side 10b of the transparent substrate 10 may be understood as a front portion on which the light emitting display of the LED light emitting board is made.
  • the LED device 50 of this embodiment may be a known LED device in the form of a small chip, the LED light emitting surface 50a is formed on the upper portion, and has a form in which positive/negative electrodes are formed on the opposite side.
  • the LED light emitting surface 50a is the front surface of the transparent substrate 10 only through the process of inserting and bonding the LED element 50 into the LED element insertion groove 12 . It has a shape accommodated in the groove 12 for inserting the LED element while facing the part.
  • the electrode pattern 32 and the LED element 50 are electrically connected using silver epoxy 62 or low-temperature solder cream 64 .
  • the silver epoxy 62 may be applied using a dispenser to electrically connect the electrode pattern 32 and the LED element 50 .
  • a dispenser is a known equipment for dispensing a liquid substance in a fixed amount.
  • the low-temperature solder cream 64 may be applied by a silk printing method using a metal mask to electrically connect the electrode pattern 32 and the LED element 50 .
  • the silver epoxy 62 used for electrical connection can be cured at room temperature, but may be cured at a high temperature of 100° C. or higher to speed up the curing time.
  • the low-temperature solder cream 64 can be soldered under a high-temperature condition of 140° C. or higher.
  • the conductive metal film 30 such as the Cu film of this embodiment is thermally deformed under high temperature conditions, since it can be restored to its original state when returning to room temperature, there is no problem such as remaining warpage due to thermal deformation.
  • FIG. 2 is a schematic plan view of an LED light emitting board according to an embodiment of the present invention.
  • the LED light emitting board of this embodiment includes a transparent substrate 10 , an electrode pattern 32 , a transparent ink layer 40 , and at least one LED element 50 .
  • the transparent substrate 10 has a plurality of LED element insertion grooves 12 formed on one side 10a.
  • the electrode pattern 32 is formed based on the conductive metal film 30 adhered to one side 10a of the transparent substrate 10 using a transparent adhesive 20 .
  • the electrode pattern 32 may be formed by etching the conductive metal film 30 adhered to one side 10a of the transparent substrate 10 using a transparent adhesive 20 .
  • the transparent ink layer 40 is formed on one side 10a of the transparent substrate 10 and is formed to cover at least a portion 40b of the regions 12 and 40b where the electrode pattern 32 is not formed. do.
  • the LED element 50 is inserted into each LED element insertion groove 12 so that the LED light emitting surface 50a faces the other side 10b of the transparent substrate 10 and faces the inside of the groove, , electrically connected to the electrode pattern 32 .
  • the transparent ink layer 40 is not necessarily formed, but a transparent ink layer 40 is preferably formed to prevent oxidation of the electrode pattern 32, and the region 40b is formed on the transparent substrate 10 after etching. It needs to be formed in order to prevent haze caused by the transparent adhesive 20 layer remaining on the surface.
  • FIG. 3 is a photograph of a prototype of an LED light emitting board according to an embodiment of the present invention.
  • FIG. 4 is a photograph of a test article for explaining a state in which light transmittance is improved by forming a transparent ink layer according to an embodiment of the present invention.
  • Area A1 in FIG. 4 is a portion 30c from which the conductive metal film 30 has been removed by etching, and area A2 is a transparent ink layer ( 40) was formed.
  • the curved surface is missing by applying liquid transparent UV ink to the curved surface where light refraction occurs, the A2 area has good light transmittance and it can be seen that the letters placed under the board are clearly visible.

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  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Optics & Photonics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Illuminated Signs And Luminous Advertising (AREA)

Abstract

La présente invention concerne une cartouche destinée à un dispositif à ultrasons focalisés, et un dispositif à ultrasons focalisés comprenant celle-ci, la cartouche pouvant fournir le foyer d'ultrasons focalisés depuis la surface de la peau jusqu'à une profondeur souhaitée. La cartouche destinée à un dispositif à ultrasons focalisés peut comprendre : un corps principal de cartouche ayant un espace de réception capable de recevoir une substance à l'intérieur de celui-ci ; une unité de fourniture d'ultrasons disposée de manière à être mobile dans une direction dans l'espace de réception, et générant un ultrason focalisé ; une unité de transfert de puissance connectée à un côté de l'unité de fourniture d'ultrason de façon à transférer de la puissance à celle-ci ; et un actionneur relié à l'unité de transfert de puissance et tournant à un angle prédéterminé de façon à déplacer l'unité de transfert de puissance vers le haut ou vers le bas.
PCT/KR2021/017393 2020-12-24 2021-11-24 Substrat transparent utilisant une carte à led et son procédé de fabrication WO2022139203A1 (fr)

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KR1020200183731A KR102428820B1 (ko) 2020-12-24 2020-12-24 투명 기판을 이용한 ｌｅｄ 발광보드, 그 제조방법
KR10-2020-0183731 2020-12-24

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WO2022139203A1 true WO2022139203A1 (fr) 2022-06-30

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KR102626332B1 (ko) 2023-05-22 2024-01-19 글람 주식회사 접합유리형의 투명 전광 패널 및 그 제조 방법

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KR101628029B1 (ko) * 2015-04-28 2016-06-09 주식회사 이노뷰텍 발광 다이오드를 포함하는 소자 및 그 제조방법
KR20200114402A (ko) * 2019-03-28 2020-10-07 이호성 엘이디 패키지 및 그 제조방법
KR102192143B1 (ko) * 2019-06-28 2020-12-16 황준석 니켈실버 시트를 이용한 터치감응형 표시장치의 투명 연성회로기판 제조방법 및 이로부터 제조된 투명 연성회로기판

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KR20180012544A (ko) 2016-07-27 2018-02-06 박승환 고해상도 투명 발광장치 및 그 제조 방법
KR101847100B1 (ko) 2017-01-02 2018-04-09 박승환 Uv 임프린팅 기술을 이용한 투명 발광장치 제조 방법 및 그에 따라 제조되는 투명 발광장치

Patent Citations (5)

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Publication number Priority date Publication date Assignee Title
KR20110109650A (ko) * 2010-03-31 2011-10-06 (주)포인트엔지니어링 광 소자 디바이스 및 그 제조 방법
KR101480961B1 (ko) * 2013-04-10 2015-01-14 이동준 투명 플라스틱 소재 ｌｅｄ 발광보드 및 그의 제조방법
KR101628029B1 (ko) * 2015-04-28 2016-06-09 주식회사 이노뷰텍 발광 다이오드를 포함하는 소자 및 그 제조방법
KR20200114402A (ko) * 2019-03-28 2020-10-07 이호성 엘이디 패키지 및 그 제조방법
KR102192143B1 (ko) * 2019-06-28 2020-12-16 황준석 니켈실버 시트를 이용한 터치감응형 표시장치의 투명 연성회로기판 제조방법 및 이로부터 제조된 투명 연성회로기판

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