WO2022012302A1 - 一种两相流主被动式多层级数据中心机柜散热装置及方法 - Google Patents

一种两相流主被动式多层级数据中心机柜散热装置及方法 Download PDF

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Publication number
WO2022012302A1
WO2022012302A1 PCT/CN2021/102365 CN2021102365W WO2022012302A1 WO 2022012302 A1 WO2022012302 A1 WO 2022012302A1 CN 2021102365 W CN2021102365 W CN 2021102365W WO 2022012302 A1 WO2022012302 A1 WO 2022012302A1
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WIPO (PCT)
Prior art keywords
cooling
thermosiphon
outlet
inlet
rack
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PCT/CN2021/102365
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English (en)
French (fr)
Inventor
刘旭
杜俊明
姜海涛
张程宾
殷东平
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东南大学
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Priority to US17/620,628 priority Critical patent/US11950393B2/en
Publication of WO2022012302A1 publication Critical patent/WO2022012302A1/zh

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20709—Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
    • H05K7/20718—Forced ventilation of a gaseous coolant
    • H05K7/20736—Forced ventilation of a gaseous coolant within cabinets for removing heat from server blades
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
    • H05K7/20327—Accessories for moving fluid, for connecting fluid conduits, for distributing fluid or for preventing leakage, e.g. pumps, tanks or manifolds
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20218—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures
    • H05K7/20245—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures by natural convection; Thermosiphons
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
    • H05K7/20318—Condensers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20709—Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
    • H05K7/20763—Liquid cooling without phase change
    • H05K7/20781—Liquid cooling without phase change within cabinets for removing heat from server blades
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20709—Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
    • H05K7/208—Liquid cooling with phase change
    • H05K7/20818—Liquid cooling with phase change within cabinets for removing heat from server blades
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20709—Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
    • H05K7/20836—Thermal management, e.g. server temperature control

Definitions

  • the invention relates to a heat dissipation device and method, in particular to a two-phase flow active-passive multi-level data center cabinet heat dissipation device and method, belonging to the technical field of heat dissipation in computer rooms.
  • PUE Power Usage Effectiveness, electrical energy
  • PUE value refers to the ratio of all the energy consumed by the data center to the energy consumed by the IT load, and has become a relatively common measure of the power utilization efficiency of data centers in the world. The system needs to reduce energy consumption as much as possible while meeting the cooling requirements.
  • data center cooling mainly includes three solutions: air cooling, single-phase liquid cooling, and a combination of the two methods, and some solutions include the use of heat pipes.
  • Air-cooled heat dissipation is mainly aimed at the heat dissipation of data center equipment rooms. Although the solution is relatively mature and consumes less energy, air-cooled heat dissipation is difficult to meet the heat dissipation requirements inside the cabinet; the combination of air-cooled and single-phase liquid cooling is also widely used.
  • the patent with the authorization announcement number of CN 111479441 B provides a data center cooling system with a pump-driven two-phase flow cycle, which involves the conversion of two-phase cooling and cooling modes, and also involves the heat exchange between air cooling and the external environment. Efficient heat dissipation performance; however, the patent involves gas-liquid separators and spray devices, which have complex structures and many heat dissipation methods, but also increase energy consumption. At the same time, the patent applies to two-phase heat dissipation, but does not The heat collection module described in the patent applies mode conversion, there is no improvement in heat dissipation means at the direct heat source, and the specific mode conversion effect may not be obvious.
  • the current data center cabinet urgently needs a cooling system with both high heat dissipation performance and energy saving, and two-phase heat dissipation is an excellent choice worth considering;
  • a cooling system that can change the cooling mode according to the cooling needs to minimize the energy consumption, of course, this system also needs a high degree of automatic control to reduce the difficulty of application.
  • the present invention proposes a two-phase flow active-passive data center cabinet cooling device and method, which adjusts the cooling mode according to different working states of the data center cabinet. So as to achieve automatic control of heat dissipation with low energy consumption.
  • the data center cabinet array includes a plurality of data center cabinets, each data center cabinet includes a plurality of blade server motherboards, and each blade server Rack-level loop thermosiphons of the motherboard are cascaded and connected to the thermosiphon cooling medium inlet pipe and the thermosiphon cooling medium outlet pipe; the thermosiphon cooling medium inlet pipe and the thermosiphon cooling medium outlet pipe stage of each cabinet Parallels and other components are connected by liquid piping; condensate inlet piping and condensate outlet piping for cabinet condensing units located on each rack-level loop thermosiphon cascade; accumulator and cooling fluid for cooling fluid inlet Outlet accumulators all have gas spaces and are connected to each other and to the top of the rack-level loop thermosiphons and rack-level loop thermosiphons through the inter-reservoir gas manifold, rack gas manifolds, and gas chambers with large gas spaces.
  • the liquid outlet of the accumulator at the cooling medium inlet is connected to the thermosiphon cooling medium inlet pipe of the data center cabinet, and the thermosiphon cooling medium outlet pipe is sequentially connected to the cooling medium circulation waste heat recovery device through the liquid pipe, and the storage medium at the cooling medium outlet is connected.
  • the liquid container is connected to the liquid inlet of the liquid pump of the cooling working medium circulation, and the liquid outlet of the liquid pump of the cooling working medium circulation is connected to the liquid inlet of the accumulator of the cooling working medium inlet through the liquid pipeline;
  • the condensed water outlet pipe of the cabinet condensing device is connected to the condensed water circulation waste heat recovery device through the liquid pipeline, and then connected to the liquid inlet of the liquid pump of the condensed water system through the liquid pipeline, and the liquid outlet of the liquid pump of the condensed water system is connected to the condensed water inlet of the cabinet condensing device pipeline;
  • the accumulator gas outlet of the cooling medium inlet is connected to the accumulator gas inlet of the cooling medium outlet, and the accumulator gas outlet of the cooling medium outlet is connected to the gas chamber and the top piping of the rack-level loop thermosiphon.
  • the data center cabinet includes a plurality of blade server motherboards, and the heat dissipation device of the blade server motherboard includes a rack-level loop thermosiphon and a blade server condensing device; the inlet and the outlet of each rack-level loop thermosiphon are respectively connected to the thermosiphon
  • the cooling medium inlet pipe and the thermosiphon cooling medium outlet pipe; the inlet and the outlet of each blade server condensing device are respectively connected to the condensate water inlet pipe and the condensate water outlet pipe.
  • a condensing device temperature sensor and a condensing water outlet temperature control valve are arranged at the connection pipe between the blade server condensing device and the condensing water outlet pipeline, and the condensing device temperature sensor is closer to the blade server condensing device than the condensing water outlet temperature controlling valve; the condensing water inlet The temperature control valve is located at the connecting pipe between the blade server condensing device and the condensed water inlet pipe; the condensing device temperature sensor, the condensing water inlet temperature controlling valve and the condensing water outlet temperature controlling valve are connected through the condensing device wire.
  • a temperature control valve for cooling the working medium inlet is provided at the connecting pipe between the rack-level loop thermosiphon and the cooling working medium inlet pipe of the thermosiphon;
  • the gas valve is located at the connecting pipe of the rack-level loop thermosiphon and the cabinet gas manifold;
  • the first CPU temperature sensor and the second CPU temperature sensor are respectively located on the blades on the blade server motherboard At the first CPU of the server and the second CPU of the blade server; the thermal control valve of the cooling medium inlet, the temperature control valve of the cooling medium outlet, the gas valve, the first CPU temperature sensor and the second CPU temperature sensor Siphon wire connection.
  • the first CPU of the blade server and the second CPU of the blade server are integrated with the thermal interface material, and the annular structure wrapping the thermosiphon evaporation section pipes in the thermal interface material wraps the thermosiphon evaporation section pipes; four thermosiphon evaporation sections
  • the pipeline is connected in parallel with the rack-level loop thermosiphon;
  • the thermal interface material has a fractal tree-like flow channel, and has two fluid inlets for the left inlet of the thermal interface material working medium and the right inlet of the thermal interface material working medium;
  • the thermal interface material The left outlet of the working medium and the right outlet of the thermal interface material are two fluid outlets; the left inlet of the thermal interface material and the right inlet of the thermal interface material are connected to the rack-level loop thermosiphon through the thermal interface material inlet pipe.
  • thermosiphon is on the right side of the pipe in the evaporation section of the thermosiphon 's pipeline.
  • the thermal interface material contains two upper and lower layers of fractal tree-shaped flow channels, and the two layers of fractal tree-shaped flow channels are connected by upper and lower connecting pipes of the fractal tree-shaped flow channel located at the tip of the fractal tree-shaped flow channel;
  • the annular structure surrounding the evaporation section pipeline of the thermosiphon is etched with a plurality of flow channels in the annular structure of thermal interface material, and the flow channels in the annular structure of thermal interface material are connected one by one.
  • the heat dissipation method of the two-phase flow active and passive multi-level data center cabinet heat dissipation device of the present invention the liquid accumulator for cooling the working medium inlet, the rack-level loop thermosiphon, the cooling working medium circulation waste heat recovery device, and the cooling working medium outlet.
  • the liquid container and the liquid pump for cooling the working medium circulation form a closed circulation structure.
  • the cooling working medium works in a low pressure state, and the working medium adopts distilled water.
  • This closed circulation structure is evacuated and then filled with a small amount of nitrogen, and finally the system works after the working medium is injected. Under 0.1 atmospheric pressure; the cabinet condensing device, the condensed water circulation waste heat recovery device, and the liquid pump of the condensed water system form a closed cycle structure.
  • This closed cycle structure uses water as the cooling medium and works under normal pressure; monitored by the temperature sensor of the condensing device Condensation water temperature; the CPU junction temperature is monitored by the first CPU temperature sensor and the second CPU temperature sensor.
  • both the condensed water inlet temperature control valve and the condensed water outlet temperature control valve are closed, and the liquid pump of the condensing water system is closed;
  • the temperature sensor of the condensing device sends a signal to open the condensed water inlet temperature control valve and the condensed water outlet temperature control valve, and turn on the liquid pump of the condensed water system to continuously inject condensed water into the cabinet condensing device.
  • the condensate temperature sensor When the condensate temperature monitored by the condensate temperature sensor is lower than the condensate low temperature threshold and the condensate inlet temperature control valve, the condensate outlet temperature control valve and the liquid pump of the condensate system are all in the open state, the condensate temperature sensor sends a signal , the liquid pump of the condensate system is closed, and then the condensate inlet temperature control valve and the condensate outlet temperature control valve are also closed successively.
  • the shelf-level loop thermosiphon performs passive two-phase flow cooling; when the CPU junction temperature monitored by the first CPU temperature sensor or the second CPU temperature sensor is higher than the CPU high temperature threshold, the sensor that exceeds the threshold temperature sends a signal to cool the inlet of the working medium.
  • the temperature control valve and the temperature control valve at the cooling medium outlet are opened, the gas valve remains closed, and the working medium in the accumulator at the cooling medium inlet located at a high place flows to the rack-level loop thermosiphon, and through the pipeline to the cooling medium.
  • the liquid reservoir at the lower cooling medium outlet, and the rack-level loop thermosiphon starts to perform active two-phase flow cooling; the CPU junction temperature monitored by the first CPU temperature sensor and the second CPU temperature sensor is lower than the CPU low load
  • the first CPU temperature sensor and the second CPU temperature sensor send signals, the temperature control valve of the cooling medium inlet is closed, and the gas The valve is opened, and the working medium of the top pipeline of the rack-level loop thermosiphon flows to the liquid reservoir at the cooling medium outlet at the lower part, and then the temperature control valve and the gas valve of the cooling medium outlet are closed, and the rack-level loop thermosiphon returns to the reservoir. to passive two-phase flow cooling.
  • thermosiphon The working fluid of the left pipe of the rack-level loop thermosiphon flows into the fractal tree-shaped flow channel in the thermal interface material through the thermal interface material working medium inlet pipe, and flows out to the rack-level ring through the thermal interface material working medium outlet pipe.
  • the right pipe of the thermosiphon; the microcell and the flow channel in the ring structure of the thermal interface material constitute the micro thermosiphon.
  • the present invention has the following advantages:
  • the present invention provides a complete set of embodiments for two-phase flow heat dissipation, which has better heat dissipation effect than traditional liquid cooling and air cooling heat dissipation;
  • the present invention designs a multi-level heat dissipation structure and an automatic control scheme, which solves the problem that the current data center heat dissipation system is low in integration and difficult to achieve automatic control;
  • the present invention designs two different modes of active and passive two-phase flow heat dissipation.
  • the heat dissipation system only needs to provide the electric power to drive the liquid pump and the sensor, which ensures the heat dissipation effect on the basis of ensuring
  • the PUE of the data center is as low as possible;
  • the present invention combines and improves the micro-channel cooling technology, so that the heat generated by the chip enters the heat dissipation system more efficiently.
  • FIG. 1 is a schematic diagram of the system structure of the present invention.
  • FIG. 2 is an internal schematic diagram of a cabinet cooling system.
  • Figure 3 is a block diagram of the top of a single blade server cooling system.
  • FIG. 4 is a structural diagram at the heat source of the cooling system of a single blade server.
  • Figure 5 is a schematic diagram of a thermal interface material.
  • Figure 6 shows the fractal tree-like flow channel of thermal interface material
  • Figure 7 shows the flow channel in the ring structure
  • Figure 8 is a detailed view of a fractal tree-like flow channel.
  • data center cabinet array 1 data center cabinet 2, cabinet condensing device 3, liquid pump 4 for cooling working fluid circulation, liquid pump 5 for condensate water system, liquid accumulator 6 for cooling working fluid inlet, cooling working fluid
  • the accumulator liquid inlet a of the cooling medium inlet, the accumulator liquid outlet b of the cooling medium inlet, the accumulator gas outlet c of the cooling medium inlet, the accumulator gas inlet d of the cooling medium outlet, the cooling medium The gas outlet e of the liquid accumulator of the refrigerant outlet, the liquid inlet f of the liquid pump of the cooling medium circulation, the liquid outlet g of the liquid pump of the cooling medium circulation, the liquid outlet m of the liquid pump of the condensate water system, the liquid inlet of the liquid pump of the condensate water system n, rack-level loop thermosiphon top pipe p.
  • the data center cabinet array 1 includes a plurality of data center cabinets 2, and each data center cabinet 2 includes a plurality of blade server motherboards 17, and each blade
  • the rack-level loop thermosiphons 11 of the server motherboard 17 are cascaded and connected to the thermosiphon cooling medium inlet pipe 12 and the thermosiphon cooling medium outlet pipe 13; the thermosiphon cooling medium inlet pipe 12 and the thermosiphon of each cabinet
  • the cooling medium outlet pipes 13 are cascaded and connected with other components through liquid pipes;
  • the condensed water inlet pipes 14 and the condensed water outlet pipes 15 of the cabinet condensing device 3 of the cabinet located on each rack-level loop thermosiphon 11 are cascaded ;
  • the liquid reservoir 6 of the cooling medium inlet and the liquid reservoir 7 of the cooling medium outlet have a gas space, and are connected to each other and to the gas manifold 9-1 between the liquid reservoirs and the cabinet gas manifold 9-2.
  • the accumulator liquid outlet b of the cooling medium inlet is connected to the thermosiphon cooling medium inlet pipe 12 of the data center cabinet 2, and the thermosiphon cooling medium outlet pipe 13 is sequentially connected to the cooling medium circulation waste heat recovery device 8-2 through the liquid pipe , the liquid accumulator 7 of the cooling working medium outlet is connected to the liquid pump liquid inlet f of the cooling working medium circulation, and the liquid pump liquid outlet g of the cooling working medium circulation is connected to the liquid inlet of the liquid accumulator of the cooling working medium inlet through the liquid pipeline a;
  • the condensed water outlet pipe 15 of the cabinet condensing device 3 is connected to the condensed water circulation waste heat recovery device 8-1 through the liquid pipe, and then connected to the liquid pump liquid inlet n of the condensed water system through the liquid pipe, and the liquid pump liquid outlet m of the condensed water system is connected to the The condensed water inlet pipe 14 of the cabinet condensing device 3;
  • the accumulator gas outlet c of the cooling medium inlet is connected to the accumulator gas inlet d of the cooling medium outlet, and the accumulator gas outlet e of the cooling medium outlet is connected to the gas chamber 10 and the top of the rack-level loop thermosiphon pipe p.
  • the present invention adopts a multi-level heat dissipation structure, including chip level, component level and system level.
  • Chip-level cooling solution The dual-channel CPU chip of the blade server is integrated with the thermal interface material (TIM).
  • the thermal interface material uses diamond with high thermal conductivity as the construction material, and a fluid channel is etched inside the diamond, and the main body of the channel adopts fractal
  • the tree-like structure enables the heat to be evenly distributed in the thermal interface material layer; in addition, the thermal interface material adds many micro-cells at the end of the fractal tree-like structure to form a micro-loop thermosiphon with the channel of the annular structure above.
  • the ring-shaped channel is etched in the annular structure on the upper part of the thermal interface material. This structure wraps the evaporation section of the rack-level loop thermosiphon.
  • the annular structure and the loop thermosiphon are bonded with thermal conductive silicone grease.
  • the heat is conducted to the fluid working medium more efficiently; the inlet of the channel in the thermal interface material is connected to the inlet channel of the evaporation section of the loop thermosiphon through the conduit, and the outlet is also connected to the outlet of the evaporation section of the thermosiphon.
  • the main body of component-level heat dissipation is a rack-level loop thermosiphon, and it also includes a condensing device, a temperature sensor, and a temperature control valve.
  • the evaporation section of the rack-level loop thermosiphon is bonded to the thermal interface material, and heat dissipation is achieved by directly cooling the thermal interface material; the condensation section of the loop thermosiphon is immersed in the condensing device, and the condensing device
  • the medium and low temperature water is used as the cooling medium, which reduces the temperature of the working medium at the entrance of the evaporation section of the thermosiphon, which in turn makes the thermosiphon with better continuous heat dissipation;
  • the temperature change automatically controls the working mode of the thermosiphon and the working mode of the condensing device.
  • System-level cooling scheme connects multiple rack-level loop thermosiphons in the cabinet in parallel, and the cooling systems between multiple cabinets in the computer room can also be connected in parallel to form the main body of the cooling system. Also included are liquid pumps, accumulators, waste heat recovery units, gas chambers and corresponding gas manifolds and gas valves.
  • the liquid pump drives the circulation of the working medium and the circulation of the condensing system; the liquid accumulator stores the liquid and retains the gas space, and the gas space is connected to the gas chamber, so that the phase change of the liquid working medium will not lead to drastic changes in the air pressure; the waste heat recovery device recovers the cooling working medium and The residual heat in the condensed water keeps the temperature of the working fluid and the condensed water at the inlet relatively low; the gas manifold connects the gas parts of the two accumulators and the top of the rack-level loop thermosiphon to balance the pressure of each part of the system. This allows the liquid to flow under the action of gravity when the air valve is opened.
  • the condensing devices of each rack-level loop thermosiphon are connected in parallel, and the waste heat is recovered by the waste heat recovery device and pumped to the inlet end by the liquid pump.
  • the system consists of two closed cycles, the cooling medium cycle and the condensed water cycle.
  • the main cooling working medium works in a low pressure state
  • the working medium is distilled water
  • the closed system is evacuated and then filled with a small amount of nitrogen, so that the system works at 0.1 atmosphere pressure finally.
  • the condensed water cycle uses water as the cooling medium and works under normal pressure.
  • the system can adopt two working modes of active and passive two-phase flow:
  • thermosiphon Passive two-phase flow: When the data center cabinets are operating at low load, all thermostatic valves and gas valves are closed, and the system relies on rack-level loop thermosiphons for passive two-phase flow cooling mode.
  • the liquid working medium undergoes a phase change in the evaporation section of the thermosiphon and the thermal interface material, so that a two-phase flow appears at the outlet of the evaporation section, and its density is lower than the single-phase flow at the inlet, so the pressure at the inlet end is higher than that at the outlet end, and the working medium is at this pressure. Under differential flow, the thermosiphon works in passive two-phase flow cooling mode.
  • the temperature sensor obtains the chip junction temperature of the blade server CPU.
  • the thermosiphon inlet and outlet temperature control valves are opened, and the high temperature control valve is opened.
  • the liquid working medium in the accumulator flows to the thermosiphon due to the action of gravity. After passing through the loop, the liquid working medium flows out from the outlet valve and flows into the liquid accumulator at the lower position through the waste heat recovery device. At this time, the system works in the active mobile phase change cooling mode. It should be noted that when the liquid accumulation in the lower reservoir reaches a certain level, turn on the liquid pump to pump the liquid to the higher reservoir.
  • the overall heat dissipation device adopts passive two-phase flow heat dissipation; when the system changes from a low load state to a high load state, the overall heat dissipation device changes to an active two-phase flow heat dissipation; When the system changes from a high load state to a low load state, the overall cooling device returns to passive two-phase flow cooling.
  • the liquid circulation of the condensed water system is independent of the above-mentioned working mode conversion process.
  • the temperature sensor obtains the temperature at the outlet of the condensing device. When the temperature exceeds the threshold, the temperature control valves at the inlet and outlet of the condenser are opened, and the liquid pump is turned on to inject into the corresponding condensing device. Condensate water; when the temperature at the outlet is lower than a certain threshold, the liquid pump is closed, and then the two temperature control valves are closed, and the condensing device exchanges heat with the thermosiphon top pipe under the closed condition again.
  • the two-phase flow heat dissipation method is applied, which has a higher heat transfer coefficient and heat dissipation effect;
  • the cooling system adjusts the working mode according to the different cooling requirements of the data center to maintain a large energy efficiency ratio
  • the gas chamber keeps the air pressure of the closed system stable, and the gas can assist the automatic control of the system
  • the liquid pump 5 of the condensate water system, the waste heat recovery device 8-1 and the cabinet condensing device 3 constitute the condensate water system
  • the rack-level loop thermosiphon 11 in the cabinet array 1 of the data center equipment room cools the
  • the cabinet gas manifold 9-2 and the gas chamber 10 constitute the cabinet cooling device.
  • the cabinet cooling device forms a closed loop and works under 0.1 atmosphere pressure, wherein the liquid working medium is distilled water (the boiling point of water at 0.1 atmosphere pressure is about 46°C, which meets the working conditions of two-phase flow).
  • the rack-level loop thermosiphon 11 is in passive cooling, the cooling device of the cabinet does not work, and there is no energy consumption, and only the condensed water system works.
  • the rack-level loop thermosiphon 11 is in active cooling, and the rack-level loop thermosiphon 11 becomes an active cooling fluid pipe, cooling the liquid storage at the inlet of the working medium.
  • the device 6 is located at a high place, and the liquid working medium is injected into the rack-level loop thermosiphon 11, and the outlet working medium enters the cooling working medium circulation waste heat recovery device 8-2 to recover the waste heat, and then enters the storage of the cooling working medium outlet.
  • the gas parts of the two accumulators are connected to each other through the inter-reservoir gas manifold 9-1, and are connected to the gas chamber 10 and the rack-level loop thermosiphon 11 through the cabinet gas manifold 9-2.
  • the pressure balance of the two liquid accumulators is ensured, so that the liquid exchange between the two can occur smoothly, and due to the large space of the gas chamber 10, the pressure will not change drastically.
  • 18 is a blade server condensing device, which cools the top of the rack-level loop thermosiphon 11 to keep the working fluid at the inlet of the evaporation section of the rack-level loop thermosiphon 11 at a lower temperature;
  • the thermostatic valve 19 at the mass inlet controls the inlet of the rack-level loop thermosiphon, the thermostatic valve 20 at the cooling medium outlet controls the outlet of the rack-level loop thermosiphon 11, and the gas valve 21 controls the machine. Connection of rack loop thermosiphon 11 to cabinet gas manifold 9-2 in FIG. 2 .
  • the temperature control valve 19 at the inlet of the cooling medium, the temperature control valve 20 and the gas valve 21 at the outlet of the cooling medium are all closed; when the rack-level loop heats When the siphon 11 enters the active cooling mode, the temperature control valve 19 of the cooling medium inlet and the temperature control valve 20 of the cooling medium outlet are opened.
  • the gas part of the liquid accumulator 7 at the mass outlet is communicated with the rack-level loop thermosiphon 11, the air pressure is balanced, and the working medium in the liquid accumulator 6 at the cooling working medium inlet automatically flows to the rack-level loop thermosiphon 11 due to gravity,
  • the rack-level loop thermosiphon 11 enters the active two-phase flow cooling mode; when the rack-level loop thermosiphon 11 enters the passive cooling mode again, the temperature control valve 19 of the cooling medium inlet is closed, and the gas valve 21 is opened.
  • the cabinet gas manifold 9-2 is connected to the top pipe of the rack-level loop thermosiphon 11 and the gas part of the liquid accumulator 7 that cools the outlet of the working medium.
  • the air pressure is balanced, and the working medium of the top pipe of the rack-level loop thermosiphon 11 is due to Gravity will flow to the accumulator 7 at the outlet of the cooling medium to complete the conversion of the cooling mode, and then the temperature control valve 20 and the gas valve 21 at the outlet of the cooling medium are closed, and the system enters the passive cooling mode.
  • the condensing device temperature sensor 22 monitors the condensing device outlet temperature, the condensed water inlet temperature control valve 23, and the condensed water outlet temperature control valve 24 respectively control the inlet and outlet of the condensing device branch circuit, when the condensing device temperature sensor 22 monitors that the temperature rises to a certain threshold At this time, the condensing device temperature sensor 22 sends a signal to the condensed water inlet temperature control valve 23 and the condensed water outlet temperature control valve 24 through the condensing device wire 25-1, and the condensed water inlet temperature control valve 23 and the condensed water outlet temperature control valve 24 are opened, In FIG.
  • the cooling working fluid circulating liquid pump 4 is turned on, and condensed water is injected into the blade server condensing device 18.
  • the cooling The working fluid circulating liquid pump 4 is turned off, the condensate inlet temperature control valve 23 and the condensate outlet temperature control valve 24 are subsequently closed, and the blade server condensing device 14 performs heat exchange with the rack-level loop thermosiphon 11 under the closed condition again. .
  • 26-1 and 26-2 are the first CPU of the blade server and the second CPU of the blade server, respectively, and are also the heat sources of the cooling system; the first CPU temperature sensor 27-1, the second CPU The temperature sensor 27-2 monitors the chip junction temperature of the first CPU 26-1 of the blade server and the second CPU 26-2 of the blade server, respectively, through the wire 26-2 and the temperature control valve 19 of the cooling medium inlet in FIG. 3 and the cooling device.
  • the temperature control valve 20 of the mass outlet is connected to the gas valve 21.
  • the first CPU temperature sensor 27-1 and the second CPU temperature sensor 27-2 send out the thermosiphon wire 25-2.
  • the signal is sent to the temperature control valve 19 at the inlet of the cooling medium, the temperature control valve 20 and the gas valve 21 at the outlet of the cooling medium, and controls the rack-level loop thermosiphon 11 to enter the active two-phase flow cooling mode.
  • the junction temperatures of the two CPU chips are both When the temperature is lower than a certain threshold, and the temperature control valve 19 of the cooling medium inlet and the temperature control valve 20 of the cooling medium outlet are opened, the first CPU temperature sensor 27-1 and the second CPU temperature sensor 27-2 pass through the thermosiphon wire 25 -2
  • 28 is the thermosiphon evaporation section pipe, in order to increase the heat exchange area, the evaporation section is divided into four pipes; 29 is the thermal interface material, which is connected with the first CPU26-1 of the blade server and the second CPU26 of the blade server.
  • thermosiphon 11 exchanges heat with it, and the annular structure of the thermal interface material 29 wraps the thermosiphon evaporation section pipe 28 , so that the heat is more uniformly conducted to the rack-level loop thermosiphon 11 .
  • the four annular structures of the annular structure 32 wrapping the evaporating section pipeline of the thermosiphon respectively wrap the pipeline 28 of the evaporating section of the loop thermosiphon shown in FIG.
  • Flow channels are also etched inside the annular structure 32 surrounding the evaporating section of the thermosiphon, so that the heat is uniformly conducted on the thermal interface material.
  • the internal flow channel of the thermal interface material adopts a fractal tree-shaped flow channel 35 with upper and lower layers.
  • the right inlet 33-2 of the thermal interface material working medium is connected to the fractal tree structure of the lower layer, while the left outlet 34-1 of the thermal interface material working medium and the right outlet 34-2 of the thermal interface material working medium are connected to the fractal tree structure of the upper layer. Except for the different entrance and exit directions, the flow channels have the same structure.
  • the two-layer flow channels are connected by the upper and lower connecting pipes 38 of the fractal tree-shaped flow channel in FIG. 8; the fractal tree-shaped flow channel 35 is divided into two independent fractal trees.
  • the right sides of the side and right fractal trees are respectively directly above the first CPU 26-1 of the blade server and the second CPU 26-2 of the blade server.
  • the two fractal trees are respectively extended to the thermal interface.
  • the central area of the material 29; the thermal interface material 29 also contains numerous micro-cell structures, namely the micro-cells 36, which are connected to the flow channel 37 in the ring structure of the thermal interface material in FIG. 7 while increasing the quality of the fractal tree working medium.
  • the thickness of the flow channel 37 in the ring structure of the thermal interface material is very small, the internal working medium is in a thin film state, and the evaporation efficiency is very high, which is beneficial to the heat exchange.

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Abstract

本发明提供了一种两相流主被动式多层级数据中心机柜散热装置及方法，***级结构包括机柜散热装置，冷凝水***，余热回收装置，储液器，液体泵，气体室以及流体工质和相应管道。以上结构构成一个闭合环路，环路充入氮气保持低压状态，由液体泵驱动管道流体流动；气体室维持两相流环路中气压相对稳定；储液器连通气体室，提供了使得相变更容易发生的足够气体空间；机柜散热装置可切换主被动模式，以求在良好散热能力下达到PUE最小化；冷凝水***独立于环路外，为机架级热虹吸管冷凝端提供冷源；余热回收装置回收余热，并使热虹吸管入口工质温度保持稳定。本发明高集成度，自动控制，多级结构散热，能效比优良。

Description

一种两相流主被动式多层级数据中心机柜散热装置及方法 技术领域
本发明涉及一种散热装置及方法，特别涉及一种两相流主被动式多层级数据中心机柜散热装置及方法，属于机房散热技术领域。
背景技术
随着云计算业务的高速发展，数据中心的规模逐渐增大，数据中心机柜中的刀片服务器发热量越来越大，加之电子设备尤其是CPU集成集体管数量激增，为了保证电子设备正常运行，这些热量需要高效的被输送出去，因此，数据中心机柜的散热***有着更新换代以匹配更高散热要求的必要；此外，数据中心机柜服务器的高散热需求也会增大PUE(Power Usage Effectiveness，电能利用效率)值，PUE值是指数据中心消耗的所有能源与IT负载消耗的能源之比，已经成为国际上比较通行的数据中心电力使用效率的衡量指标，出于节能考虑，数据中心机柜的散热***需要在满足散热需求的前提下尽可能减少能源消耗。
目前，数据中心散热主要有风冷、单相液冷以及两种方式结合三种方案，而部分方案中含有热管的使用。风冷散热主要针对的是数据中心机房的散热，虽然方案较成熟，耗能较小，但是风冷散热难以满足机柜内部的散热需求；风冷与单相液冷结合的散热方法使用也较为广泛，兼顾了机房散热与机柜散热，但是两种散热***须分别供能，能耗较高；单相液冷方案应用较少，且由于少了机房级风冷散热，散热效果不如风冷与单相液冷结合的方案。也有不少方案应用了现有的热管技术，运用到了气液两相流，但是热管仅作为一个散热组件出现，气液两相流并不是数据中心***的主要散热手段。
根据目前数据中心机柜散热方案，可以发现具体存在以下几个问题，首先，对于机柜散热，没有一个既高效又足够节能的散热方案，两相流散热可以解决这个问题但是目前没有一个成形的方案以支持数据中心的两相流散热；其次，目前的数据中心散热方案层次不够分明，没有一个集芯片级散热，组件级散热和***级散热于一体的高效易集成的散热方案，对于芯片级散热，现有方案涉及较少，且都不够具体可行，与组件级散热和***级散热不相兼容；其三，目前的散热方案有较多涉及到散热模式的转换，以实现根据散热需求而改变散热模式进而实现减小能耗的目标，但风冷和单相液冷的散热模式转换难以提供高散热性能与节约能耗兼具的方案。
授权公告号为CN 111479441 B的专利提供了一个泵驱两相流循环的数据中心散热***，其中涉及到了两相散热和散热模式的转换，还涉及到通过风冷与外界环境的换热，具有高效的散热性能；不过，该专利涉及到气液分离器和喷淋装置，结构复杂，散热方式众多但同时也意味着耗能的增加，同时，该专利应用到两相散热，但没有对该专利所述热收集模块应用模式转化，直接热源处没有散热手段的改进，具体的模式转换效果可能不明显。
结合以上情况，现在的数据中心机柜亟需一个兼具高散热性能与节约能耗的散热***，而其中两 相流散热是一个值得考虑的优良选择；同时考虑到数据中心载荷变化幅度大，需要一个可根据散热需求而改变散热模式的散热***，以实现能耗的最小化，当然，此***也需要高度的自动控制以降低应用的难度。
发明内容
技术问题：针对数据中心机柜散热难以集成，能效低，自动化程度低的问题，本发明提出了一种两相流主被动式数据中心机柜散热装置及方法，根据数据中心机柜不同工作状态调整散热模式，从而达到低耗能的自动控制散热。
技术方案：本发明的一种两相流主被动式多层级数据中心机柜散热装置中，数据中心机柜阵列包含多个数据中心机柜，每一个数据中心机柜中包含多个刀片服务器主板，每个刀片服务器主板的机架级环路热虹吸管级联并连接到热虹吸管冷却工质入口管道和热虹吸管冷却工质出口管道；每个机柜的热虹吸管冷却工质入口管道和热虹吸管冷却工质出口管道级联并和其他组件通过液体管道连接；位于每个机架级环路热虹吸管上的机柜冷凝装置的冷凝水入口管道和冷凝水出口管道级联；冷却工质入口的储液器和冷却工质出口的储液器均有气体空间，并通过储液器间气体歧管，机柜气体歧管相互连接并连接至具有很大气体空间的气体室和机架级环路热虹吸管的顶端；冷却工质入口的储液器位于比机架级环路热虹吸管高的位置，而冷却工质出口的储液器位于比机架级环路热虹吸管低的位置；
具体连接方式：
冷却工质入口的储液器液体出口连接至数据中心机柜的热虹吸管冷却工质入口管道，热虹吸管冷却工质出口管道通过液体管道依次连接冷却工质循环余热回收装置，冷却工质出口的储液器，并连接到冷却工质循环的液体泵液体入口，冷却工质循环的液体泵液体出口通过液体管道连接至冷却工质入口的储液器液体入口；
机柜冷凝装置的冷凝水出口管道通过液体管道连接冷凝水循环余热回收装置，再通过液体管道连接至冷凝水***的液体泵液体入口，冷凝水***的液体泵液体出口连接至机柜冷凝装置的冷凝水入口管道；
冷却工质入口的储液器气体出口连接至冷却工质出口的储液器气体入口，冷却工质出口的储液器气体出口连接至气体室和机架级环路热虹吸管顶部管道。
其中，
所述数据中心机柜包含多个刀片服务器主板，刀片服务器主板的散热装置包括机架级环路热虹吸管和刀片服务器冷凝装置；每个机架级环路热虹吸管的入口和出口分别连接至热虹吸管冷却工质入口管道和热虹吸管冷却工质出口管道；每个刀片服务器冷凝装置的入口和出口分别连接至冷凝水入口管道和冷凝水出口管道。
所述刀片服务器冷凝装置和冷凝水出口管道的连接管道处设有冷凝装置温度传感器和冷凝水出口温控阀，冷凝装置温度传感器相对冷凝水出口温控阀更靠近刀片服务器冷凝装置；冷凝水入口温控 阀位于刀片服务器冷凝装置和冷凝水入口管道的连接管道处；冷凝装置温度传感器、冷凝水入口温控阀和冷凝水出口温控阀之间通过冷凝装置导线连接。
所述机架级环路热虹吸管和热虹吸管冷却工质入口管道的连接管道处设有冷却工质入口的温控阀；冷却工质出口的温控阀位于机架级环路热虹吸管和热虹吸管冷却工质出口管道的连接管道处；气体阀位于机架级环路热虹吸管和机柜气体歧管的连接管道处；第一CPU温度传感器和第二CPU温度传感器分别位于刀片服务器主板上的刀片服务器的第一CPU，刀片服务器的第二CPU处；冷却工质入口的温控阀、冷却工质出口的温控阀、气体阀、第一CPU温度传感器以及第二CPU温度传感器之间通过热虹吸管导线连接。
所述刀片服务器的第一CPU、刀片服务器的第二CPU与热界面材料集成在一起，热界面材料中包裹热虹吸管蒸发段管道的圆环结构包裹着热虹吸管蒸发段管道；4个热虹吸管蒸发段管道并联，且与机架级环路热虹吸管连接；热界面材料带有分形树状流道，具有热界面材料工质左入口，热界面材料工质右入口两个流体入口；热界面材料工质左出口，热界面材料工质右出口两个流体出口；热界面材料工质左入口和热界面材料工质右入口通过热界面材料工质入口管道连接至机架级环路热虹吸管在热虹吸管蒸发段管道左侧的管道；热界面材料工质左出口和热界面材料工质右出口通过热界面材料工质出口管道连接至机架级环路热虹吸管在热虹吸管蒸发段管道右侧的管道。
所述热界面材料内包含上下两层分形树状流道，两层分形树状流道之间通过位于分形树状流道末梢的分形树状流道上下层连接管道相连；分形树状流道中包含多个微池，包裹热虹吸管蒸发段管道的圆环结构刻蚀有多个热界面材料圆环结构中的流道，微池和热界面材料圆环结构中的流道一一连接。
本发明的两相流主被动式多层级数据中心机柜散热装置的散热方法，冷却工质入口的储液器、机架级环路热虹吸管、冷却工质循环余热回收装置、冷却工质出口的储液器、冷却工质循环的液体泵构成封闭循环结构，冷却工质工作在低气压状态，工质采用蒸馏水，此封闭循环结构抽真空后充入少量氮气，最终使***在注入工质后工作在0.1个大气压下；机柜冷凝装置、冷凝水循环余热回收装置、冷凝水***的液体泵构成封闭循环结构，此封闭循环结构采用水作为冷却工质，工作在常压下；由冷凝装置温度传感器监测冷凝水温度；由第一CPU温度传感器和第二CPU温度传感器监测CPU结温。
其中，
当冷凝装置温度传感器监测的冷凝水温度低于冷凝水的高温阈值时，冷凝水入口温控阀和冷凝水出口温控阀均关闭，冷凝水***的液体泵关闭；当冷凝装置温度传感器监测的冷凝水温度高于冷凝水的高温阈值时，冷凝装置温度传感器发出信号开启冷凝水入口温控阀和冷凝水出口温控阀，并开启冷凝水***的液体泵，不断向机柜冷凝装置注入冷凝水；当冷凝装置温度传感器监测的冷凝水温度低于冷凝水低温阈值并且冷凝水入口温控阀、冷凝水出口温控阀和冷凝水***的液体泵均处于开启状态时，冷凝装置温度传感器发出信号，冷凝水***的液体泵关闭，随后冷凝水入口温控阀和冷凝水出口温控阀也先后关闭。
所述第一CPU温度传感器和第二CPU温度传感器监测的CPU结温均低于CPU高温阈值时，冷却工质入口的温控阀、冷却工质出口的温控阀和气体阀均关闭，机架级环路热虹吸管进行被动式两相流冷却；当第一CPU温度传感器或第二CPU温度传感器监测的CPU结温高于CPU高温阈值时，超过阈值温度的传感器发出信号，冷却工质入口的温控阀和冷却工质出口的温控阀开启，气体阀维持关闭状态，位于高处的冷却工质入口的储液器中的工质流向机架级环路热虹吸管，并通过管道流向位于低处的冷却工质出口的储液器，机架级环路热虹吸管开始进行主动式两相流冷却；第一CPU温度传感器和第二CPU温度传感器监测的CPU结温均低于CPU低负荷阈值温度，且冷却工质入口的温控阀、冷却工质出口的温控阀开启时，第一CPU温度传感器和第二CPU温度传感器发出信号，冷却工质入口的温控阀关闭，同时气体阀开启，机架级环路热虹吸管顶部管道的工质流向低处的冷却工质出口的储液器，随后冷却工质出口的温控阀与气体阀关闭，机架级环路热虹吸管回到被动式两相流冷却。
所述机架级环路热虹吸管左侧管道的工质通过热界面材料工质入口管道流入热界面材料中的分形树状流道，并通过热界面材料工质出口管道流出至机架级环路热虹吸管的右侧管道；微池和热界面材料圆环结构中的流道构成微型热虹吸管。
有益效果：本发明具有以下优点：
第一、本发明为两相流散热提供了一整套的实施方案，相比于传统液冷和风冷散热具有更好的散热效果；
第二、本发明设计了具有多层次的散热结构和自动控制方案，解决了目前数据中心散热***集成度低，难以实现自动控制的难题；
第三、本发明根据数据中心机柜的载荷不同，设计了主被动两相流散热两种不同模式，散热***仅需提供驱动液体泵和传感器的电能即可，在保证散热效果的基础上保证了数据中心的PUE尽可能低；
第四、本发明结合了微通道冷却技术并加以改进，使得芯片产生的热量更高效的进入散热***中。
附图说明
图1为本发明的***结构简图。
图2为机柜散热***的内部示意图。
图3为单个刀片服务器散热***顶部的结构图。
图4是单个刀片服务器散热***热源处的结构图。
图5是热界面材料的示意图。
图6显示的是热界面材料的分形树状流道，
图7显示的是圆环结构中的流道，
图8是分形树状流道的细节图。
图中有：数据中心机柜阵列1，数据中心机柜2，机柜冷凝装置3，冷却工质循环的液体泵4，冷凝水***的液体泵5，冷却工质入口的储液器6，冷却工质出口的储液器7，冷凝水循环余热回收装 置8-1，冷却工质循环余热回收装置8-2，储液器间气体歧管9-1，机柜气体歧管9-2，气体室10，机架级环路热虹吸管11，热虹吸管冷却工质入口管道12，热虹吸管冷却工质出口管道13，冷凝水入口管道14，冷凝水出口管道15；机柜外壳16，刀片服务器主板17，刀片服务器冷凝装置18；冷却工质入口的温控阀19，冷却工质出口的温控阀20，气体阀21，冷凝装置温度传感器22，冷凝水入口温控阀23，冷凝水出口温控阀24，冷凝装置导线25-1，热虹吸管导线25-2；刀片服务器的第一CPU26-1，刀片服务器的第二CPU26-2，第一CPU温度传感器27-1，第二CPU温度传感器27-2，热虹吸管蒸发段管道28，热界面材料29，热界面材料工质入口管道30，热界面材料工质出口管道31，包裹热虹吸管蒸发段管道的圆环结构32；热界面材料工质左入口33-1，热界面材料工质右入口33-2，热界面材料工质左出口34-1，热界面材料工质右出口34-2，分形树状流道35，微池36，热界面材料圆环结构中的流道37，分形树状流道上下层连接管道38。
冷却工质入口的储液器液体入口a，冷却工质入口的储液器液体出口b，冷却工质入口的储液器气体出口c，冷却工质出口的储液器气体入口d，冷却工质出口的储液器气体出口e，冷却工质循环的液体泵液体入口f，冷却工质循环的液体泵液体出口g，冷凝水***的液体泵液体出口m，冷凝水***的液体泵液体入口n，机架级环路热虹吸管顶部管道p。
具体实施方式
本发明的一种两相流主被动式多层级数据中心机柜散热装置中，数据中心机柜阵列1包含多个数据中心机柜2，每一个数据中心机柜2中包含多个刀片服务器主板17，每个刀片服务器主板17的机架级环路热虹吸管11级联并连接到热虹吸管冷却工质入口管道12和热虹吸管冷却工质出口管道13；每个机柜的热虹吸管冷却工质入口管道12和热虹吸管冷却工质出口管道13级联并和其他组件通过液体管道连接；位于每个机架级环路热虹吸管11上的机柜的机柜冷凝装置3的冷凝水入口管道14和冷凝水出口管道15级联；冷却工质入口的储液器6和冷却工质出口的储液器7均有气体空间，并通过储液器间气体歧管9-1，机柜气体歧管9-2相互连接并连接至具有很大气体空间的气体室10和机架级环路热虹吸管11的顶端；冷却工质入口的储液器6位于比机架级环路热虹吸管11高的位置，而冷却工质出口的储液器7比机架级环路热虹吸管11低的位置；
具体连接方式：
冷却工质入口的储液器液体出口b连接至数据中心机柜2的热虹吸管冷却工质入口管道12，热虹吸管冷却工质出口管道13通过液体管道依次连接冷却工质循环余热回收装置8-2，冷却工质出口的储液器7，并连接到冷却工质循环的液体泵液体入口f，冷却工质循环的液体泵液体出口g通过液体管道连接至冷却工质入口的储液器液体入口a；
机柜冷凝装置3的冷凝水出口管道15通过液体管道连接冷凝水循环余热回收装置8-1，再通过液体管道连接至冷凝水***的液体泵液体入口n，冷凝水***的液体泵液体出口m连接至机柜冷凝装置3的冷凝水入口管道14；
冷却工质入口的储液器气体出口c连接至冷却工质出口的储液器气体入口d，冷却工质出口的储 液器气体出口e连接至气体室10和机架级环路热虹吸管顶部管道p。
本发明采用多层级的散热结构，包括芯片级，组件级以及***级。
芯片级散热方案：刀片服务器的双路CPU芯片与热界面材料(TIM)集成，热界面材料选用高热导率的金刚石作为构造材料，并在金刚石内部刻蚀出流体沟道，沟道主体采用分形树状结构，使得热量可在热界面材料层均匀分布；此外，热界面材料在分形树状结构末端添加众多微池，与上方的圆环形结构的沟道组成微型环路热虹吸管，圆环形沟道刻蚀在热界面材料上部的圆环状结构中，此结构包裹着机架级环路热虹吸管的蒸发段，此圆环状结构与环路热虹吸管中间用导热硅脂粘合，使得热量更高效的传导至流体工质中；热界面材料中的沟道入口通过导管与环路热虹吸管蒸发段的入口流道相连，出口同样连接热虹吸管的蒸发段出口。
组件级散热方案：组件级散热主体是机架级环路热虹吸管，还包括冷凝装置，温度传感器以及温控阀。如芯片级散热方案所述，机架级环路热虹吸管的蒸发段与热界面材料粘合，通过直接冷却热界面材料来实现散热；环路热虹吸管的冷凝段浸没在冷凝装置中，冷凝装置中低温水作为冷却工质，使得热虹吸管蒸发段入口工质温度下降，进而使得热虹吸管拥有更好的持续散热效果；温度传感器获取工作状态下CPU芯片结温和冷凝水出口温度，温控阀根据温度的变化自动控制热虹吸管的工作模式和冷凝装置的工作模式。
***级散热方案：***级散热方案将机柜中多个机架级环路热虹吸管并联，机房中多个机柜间的散热***也可并联，构成散热***的主体。此外还包括的组件有液体泵，储液器，余热回收装置，气体室以及相应气体歧管和气阀。液体泵驱动工质循环以及冷凝***循环；储液器存储液体并保留气体空间，气体空间连接气体室，使得液体工质的相变不会导致气压的剧烈变化；余热回收装置回收冷却工质和冷凝水中的余热，使入口处的工质和冷凝水温度维持相对低温；气体歧管连接两储液器的气体部分，并连接机架级环路热虹吸管的顶部，使得***各个部分气压平衡，使得气阀打开时液体在重力作用下流动。同时，每个机架级环路热虹吸管的冷凝装置并联，并经过余热回收装置回收余热，由液体泵泵送至入口端。
所述***由两个封闭循环构成，冷却工质循环和冷凝水循环。主要的冷却工质工作在低气压状态，工质采用蒸馏水，封闭***抽真空后充入少量氮气，最终使***工作在0.1个大气压下。冷凝水循环采用水作为冷却工质，工作在常压下。
所述***随着所述数据中心热负荷的改变，可采用主被动式两相流两种工作模式：
被动两相流：当数据中心机柜处于低负荷运行时，所有温控阀和气阀关闭，***依靠机架级环路热虹吸管进行被动式两相流冷却模式。液体工质在热虹吸管蒸发段和热界面材料中发生相变，从而蒸发段出口出现两相流，其密度小于入口处的单相流，则入口端压力高于出口端，工质在此压差下流动，热虹吸管工作在被动式两相流冷却模式。
主动两相流：温度传感器获取刀片服务器CPU的芯片结温，当数据中心机柜处于高负荷运行，芯片结温超过了危险阈值时，热虹吸管入口和出口的温控阀开启，处在高处的储液器中的液体工质由 于重力作用流向热虹吸管，经过环路后，液体工质从出口阀门流出，经余热回收装置流进位于低处的储液器。此时***工作在主动式流动相变散热模式。需要注意的是，当低处储液器液体积累到一定程度，打开液体泵将液体泵送至高处的储液器。
当所述***工作在低负荷状态时，整体散热装置采取被动式两相流散热；当所述***由低负荷状态转向高负荷状态时，整体散热装置转变为主动式两相流散热；当所述***由高负荷状态转向低负荷状态时，整体散热装置回归为被动式两相流散热。
所述冷凝水***的液体循环独立于上述工作模式转换过程，温度传感器获取冷凝装置出口处温度，当温度超过阈值时，冷凝器入口和出口的温控阀打开，液体泵打开向相应冷凝装置注入冷凝水；当出口处温度低于一定阈值时，液体泵关闭，随后两个温控阀关闭，冷凝装置再次在封闭情况下与热虹吸管顶管进行热交换。
所述散热***及其控制方法具有以下特征：
1.具有多层次的散热结构，芯片级、组件级与***级层次分明，易于集成；
2.应用了两相流散热方式，具有更高的换热系数和散热效果；
3.散热***针对数据中心不同散热需求调整工作模式，保持较大的能效比；
4.利用温度传感器和温控阀实现***模式转换，实现了高度的自动控制；
5.气体室维持封闭***气压稳定，且气体可辅助***的自动控制；
6.使用微流道和微池并加以结合改进，使得芯片处的散热效果更显著。
下面结合附图对本发明做出进一步详细说明。
如图1所示，冷凝水***的液体泵5、余热回收装置8-1和机柜冷凝装置3组成冷凝水***，而数据中心机房的机柜阵列1中的机架级环路热虹吸管11，冷却工质循环的液体泵4，冷却工质入口的储液器6，冷却工质出口的储液器7，冷却工质循环余热回收装置8-2，储液器间气体歧管9-1、机柜气体歧管9-2和气体室10构成所述机柜散热装置。所述机柜散热装置构成闭合环路，工作在0.1个大气压下，其中液体工质为蒸馏水(0.1个大气压下水沸点约为46℃，符合两相流工作条件)。当数据中心热负荷较小时，所述机架级环路热虹吸管11处于被动式冷却，机柜散热装置不工作，没有能耗，仅有冷凝水***工作。而当数据中心热负荷较大时，所述机架级环路热虹吸管11处于主动式冷却，所述机架级环路热虹吸管11变为主动冷却的流体管道，冷却工质入口的储液器6位于高处，向所述机架级环路热虹吸管11中注入液体工质，而出口工质进入冷却工质循环余热回收装置8-2中回收余热，而后进入冷却工质出口的储液器7，当冷却工质入口的储液器6中液体工质过少时，启动冷凝水***的液体泵5，将冷却工质出口的储液器7中液体泵送至冷却工质入口的储液器6。值得注意的是，两储液器的气体部分通过储液器间气体歧管9-1相互连通，并通过机柜气体歧管9-2连接至气体室10和机架级环路热虹吸管11的冷凝段，既保证两储液器气压平衡，使得两者液体交换顺利发生，又由于气体室10的大空间，气压不会发生剧烈变化。
如图2、图3所示，18为刀片服务器冷凝装置，为机架级环路热虹吸管11的顶部冷却，使机架 级环路热虹吸管11蒸发段入口工质保持较低温度；冷却工质入口的温控阀19控制着机架级环路热虹吸管的入口，冷却工质出口的温控阀20控制着机架级环路热虹吸管11的出口，而气体阀21控制着所述机架级环路热虹吸管11与图2中机柜气体歧管9-2的连接。当所述机架级环路热虹吸管11处于被动散热模式时，冷却工质入口的温控阀19，冷却工质出口的温控阀20以及气体阀21均关闭；当机架级环路热虹吸管11进入主动冷却模式时，冷却工质入口的温控阀19和冷却工质出口的温控阀20打开，此时由于图1中冷却工质入口的储液器6的气体部分和冷却工质出口的储液器7的气体部分与机架级环路热虹吸管11连通，气压平衡，冷却工质入口的储液器6中工质由于重力自动流向机架级环路热虹吸管11中，机架级环路热虹吸管11进入主动两相流散热模式；当机架级环路热虹吸管11再次进入被动散热模式时，冷却工质入口的温控阀19关闭，气体阀21开启，此时机柜气体歧管9-2连通机架级环路热虹吸管11的顶部管道和冷却工质出口的储液器7的气体部分，气压平衡，机架级环路热虹吸管11顶部管道的工质由于重力会流向冷却工质出口的储液器7，完成散热模式转换，而后冷却工质出口的温控阀20和气体阀21关闭，***进入被动散热模式。冷凝装置温度传感器22监测冷凝装置出口温度，冷凝水入口温控阀23，冷凝水出口温控阀24分别控制冷凝装置分路的入口和出口，当冷凝装置温度传感器22监测到温度上升到一定阈值时，冷凝装置温度传感器22通过冷凝装置导线25-1发出信号至冷凝水入口温控阀23和冷凝水出口温控阀24，冷凝水入口温控阀23和冷凝水出口温控阀24开启，图1中冷却工质循环液体泵4开启，向刀片服务器冷凝装置18中注入冷凝水，当温度下降到一定阈值，且冷凝水入口温控阀23和冷凝水出口温控阀24开启时，冷却工质循环液体泵4关闭，冷凝水入口温控阀23和冷凝水出口温控阀24随后关闭，刀片服务器冷凝装置14再次在封闭情况下与机架级环路热虹吸管11顶管进行热交换。
如图4、图5所示，26-1、26-2分别为刀片服务器的第一CPU和刀片服务器的第二CPU，也是散热***的热源；第一CPU温度传感器27-1、第二CPU温度传感器27-2分别监测刀片服务器的第一CPU26-1、刀片服务器的第二CPU26-2的芯片结温，通过导线26-2与图3中冷却工质入口的温控阀19和冷却工质出口的温控阀20及气体阀21相连，当其中一个CPU芯片结温超过危险阈值时，第一CPU温度传感器27-1、第二CPU温度传感器27-2通过热虹吸管导线25-2发出信号到冷却工质入口的温控阀19、冷却工质出口的温控阀20和气体阀21，控制机架级环路热虹吸管11进入主动两相流散热模式，当两CPU芯片结温都低于一定阈值，且冷却工质入口的温控阀19、冷却工质出口的温控阀20打开时，第一CPU温度传感器27-1、第二CPU温度传感器27-2通过热虹吸管导线25-2发出信号到冷却工质入口的温控阀19、冷却工质出口的温控阀20和气体阀21，使机架级环路热虹吸管11再次进入被动两相流散热模式，具体控制方式如上文所述；28是热虹吸管蒸发段管道，为了增大换热面积，蒸发段分为四管道；29是热界面材料，其与刀片服务器的第一CPU26-1、刀片服务器的第二CPU26-2集成，直接与芯片交换热量，且其材料为金刚石，内部刻蚀有微流道，微流道通过热界面材料工质入口管道30和热界面材料工质出口管道31连接着机架级环路热虹吸管11，与其换热，此外热界面材料29的环状结构包裹着热虹吸管蒸发段管道28，使热量更均匀的传导至机架级环路热 虹吸管11。包裹热虹吸管蒸发段管道的圆环结构32的四个环状结构分别包裹着图4所示环路热虹吸管蒸发段的管道28，两者间用导热硅脂粘合，使热阻更小，包裹热虹吸管蒸发段管道的圆环结构32内部也刻蚀着流道，使热量在热界面材料上均匀传导。
如图6、图7和图8所示，热界面材料内部流道采用上下双层的分形树状流道35，图中所示为上层流道，热界面材料工质左入口33-1和热界面材料工质右入口33-2连接下层的分形树状结构，而热界面材料工质左出口34-1和热界面材料工质右出口34-2连接上层的分形树状结构，上下层流道除了出入口方向不同，结构均相同，两层流道通过图8中分形树状流道上下层连接管道38连接；分形树状流道35分为两个独立分形树，左分形树的左侧与右分形树的右侧分别直接处于刀片服务器的第一CPU26-1、刀片服务器的第二CPU26-2上方，为了将热量在热界面材料均匀的传导，将两分形树分别拓展到热界面材料29的中央区域；热界面材料29中还包含着众多微池结构，即微池36，增加分形树工质质量的同时，与图7热界面材料圆环结构中的流道37相连接。热界面材料圆环结构中的流道37厚度很小，内部工质处于薄膜状态，蒸发效率很高，有利于换热的进行。

Claims (10)

  1. 一种两相流主被动式多层级数据中心机柜散热装置，其特征在于，该散热装置中，数据中心机柜阵列(1)包含多个数据中心机柜(2)，每一个数据中心机柜(2)中包含多个刀片服务器主板(17)，每个刀片服务器主板(17)的机架级环路热虹吸管(11)级联并连接到热虹吸管冷却工质入口管道(12)和热虹吸管冷却工质出口管道(13)；每个机柜的热虹吸管冷却工质入口管道(12)和热虹吸管冷却工质出口管道(13)级联并和其他组件通过液体管道连接；位于每个机架级环路热虹吸管(11)上的机柜冷凝装置(3)的冷凝水入口管道(14)和冷凝水出口管道(15)级联；冷却工质入口的储液器(6)和冷却工质出口的储液器(7)均有气体空间，并通过储液器间气体歧管(9-1)，机柜气体歧管(9-2)相互连接并连接至具有很大气体空间的气体室(10)和机架级环路热虹吸管(11)的顶端；冷却工质入口的储液器(6)位于比机架级环路热虹吸管(11)高的位置，而冷却工质出口的储液器(7)位于比机架级环路热虹吸管(11)低的位置；
    具体连接方式：
    冷却工质入口的储液器液体出口(b)连接至数据中心机柜(2)的热虹吸管冷却工质入口管道(12)，热虹吸管冷却工质出口管道(13)通过液体管道依次连接冷却工质循环余热回收装置(8-2)，冷却工质出口的储液器(7)，并连接到冷却工质循环的液体泵液体入口(f)，冷却工质循环的液体泵液体出口(g)通过液体管道连接至冷却工质入口的储液器液体入口(a)；
    机柜冷凝装置(3)的冷凝水出口管道(15)通过液体管道连接冷凝水循环余热回收装置(8-1)，再通过液体管道连接至冷凝水***的液体泵液体入口(n)，冷凝水***的液体泵液体出口(m)连接至机柜冷凝装置(3)的冷凝水入口管道(14)；
    冷却工质入口的储液器气体出口(c)连接至冷却工质出口的储液器气体入口(d)，冷却工质出口的储液器气体出口(e)连接至气体室(10)和机架级环路热虹吸管顶部管道(p)。
  2. 根据权利要求1所述的两相流主被动式多层级数据中心机柜散热装置，其特征在于，所述数据中心机柜(2)包含多个刀片服务器主板(17)，刀片服务器主板(17)的散热装置包括机架级环路热虹吸管(11)和刀片服务器冷凝装置(18)；每个机架级环路热虹吸管(11)的入口和出口分别连接至热虹吸管冷却工质入口管道(12)和热虹吸管冷却工质出口管道(13)；每个刀片服务器冷凝装置(18)的入口和出口分别连接至冷凝水入口管道(14)和冷凝水出口管道(15)。
  3. 根据权利要求2所述的两相流主被动式多层级数据中心机柜散热装置，其特征在于，所述刀片服务器冷凝装置(18)和冷凝水出口管道(15)的连接管道处设有冷凝装置温度传感器(22)和冷凝水出口温控阀(24)，冷凝装置温度传感器(22)相对冷凝水出口温控阀(24)更靠近刀片服务器冷凝装置(18)；冷凝水入口温控阀(23)位于刀片服务器冷凝装置(18)和冷凝水入口管道(14)的连接管道处；冷凝装置温度传感器(22)、冷凝水入口温控阀(23)和冷凝水出口温控阀(24)之间通过冷凝装置导线(25-1)连接。
  4. 根据权利要求2所述的两相流主被动式多层级数据中心机柜散热装置，其特征在于，所述机架级环路热虹吸管(11)和热虹吸管冷却工质入口管道(12)的连接管道处设有冷却工质入口的温控阀(19)；冷却工质出口的温控阀(20)位于机架级环路热虹吸管(11)和热虹吸管冷却工质出口管道(13)的连接管道处；气体阀(21)位于机架级环路热虹吸管(11)和机柜气体歧管(9-2)的连接管道处；第一CPU温度传感器(27-1)和第二CPU温度传感器(27-2)分别位于刀片服务器主板上的刀片服务器的第一CPU(26-1)，刀片服务器的第二CPU(26-2)处；冷却工质入口的温控阀(19)、冷却工质出口的温控阀(20)、气体阀(21)、第一CPU温度传感器(27-1)以及第二CPU温度传感器(27-2)之间通过热虹吸管导线(25-2)连接。
  5. 根据权利要求4所述的两相流主被动式多层级数据中心机柜散热装置，其特征在于，所述刀片服务器的第一CPU(26-1)、刀片服务器的第二CPU(26-2)与热界面材料(29)集成在一起，热界面材料(29)中包裹热虹吸管蒸发段管道的圆环结构(32)包裹着热虹吸管蒸发段管道(28)；4个热虹吸管蒸发段管道(28)并联，且与机架级环路热虹吸管(11)连接；热界面材料(29)带有分形树状流道(35)，具有热界面材料工质左入口(33-1)，热界面材料工质右入口(33-2)两个流体入口；热界面材料工质左出口(34-1)，热界面材料工质右出口(34-2)两个流体出口；热界面材料工质左入口(33-1)和热界面材料工质右入口(33-2)通过热界面材料工质入口管道(30)连接至机架级环路热虹吸管(11)在热虹吸管蒸发段管道(28)左侧的管道；热界面材料工质左出口(34-1)和热界面材料工质右出口(34-2)通过热界面材料工质出口管道(31)连接至机架级环路热虹吸管(11)在热虹吸管蒸发段管道(28)右侧的管道。
  6. 根据权利要求5所述的两相流主被动式多层级数据中心机柜散热装置，其特征在于，所述热界面材料(29)内包含上下两层分形树状流道(35)，两层分形树状流道(35)之间通过位于分形树状流道(35)末梢的分形树状流道上下层连接管道(38)相连；分形树状流道(35)中包含多个微池(36)，包裹热虹吸管蒸发段管道的圆环结构(32)刻蚀有多个热界面材料圆环结构中的流道(37)，微池(36)和热界面材料圆环结构中的流道(37)一一连接。
  7. 一种如权利要求1所述的两相流主被动式多层级数据中心机柜散热装置的散热方法，其特征在于，冷却工质入口的储液器(6)、机架级环路热虹吸管(11)、冷却工质循环余热回收装置(8-2)、冷却工质出口的储液器(7)、冷却工质循环的液体泵(4)构成封闭循环结构，冷却工质工作在低气压状态，工质采用蒸馏水，此封闭循环结构抽真空后充入少量氮气，最终使***在注入工质后工作在0.1个大气压下；机柜冷凝装置(3)、冷凝水循环余热回收装置(8-1)、冷凝水***的液体泵(5)构成封闭循环结构，此封闭循环结构采用水作为冷却工质，工作在常压下；由冷凝装置温度传感器(22)监测冷凝水温度；由第一CPU温度传感器(27-1)和第二CPU温度传感器(27-2)监测CPU结温。
  8. 根据权利要求7所述的两相流主被动式多层级数据中心机柜散热装置的散热方法，其特征在于，当冷凝装置温度传感器(22)监测的冷凝水温度低于冷凝水的高温阈值时，冷凝水入口温控阀(23)和冷凝水出口温控阀(24)均关闭，冷凝水***的液体泵(5)关闭；当冷凝装置温度传感器(22) 监测的冷凝水温度高于冷凝水的高温阈值时，冷凝装置温度传感器(22)发出信号开启冷凝水入口温控阀(23)和冷凝水出口温控阀(24)，并开启冷凝水***的液体泵(5)，不断向机柜冷凝装置(3)注入冷凝水；当冷凝装置温度传感器(22)监测的冷凝水温度低于冷凝水低温阈值并且冷凝水入口温控阀(23)、冷凝水出口温控阀(24)和冷凝水***的液体泵(5)均处于开启状态时，冷凝装置温度传感器(22)发出信号，冷凝水***的液体泵(5)关闭，随后冷凝水入口温控阀(23)和冷凝水出口温控阀(24)也先后关闭。
  9. 根据权利要求7所述的两相流主被动式多层级数据中心机柜散热装置的散热方法，其特征在于，所述第一CPU温度传感器(27-1)和第二CPU温度传感器(27-2)监测的CPU结温均低于CPU高温阈值时，冷却工质入口的温控阀(19)、冷却工质出口的温控阀(20)和气体阀(21)均关闭，机架级环路热虹吸管(11)进行被动式两相流冷却；当第一CPU温度传感器(27-1)或第二CPU温度传感器(27-2)监测的CPU结温高于CPU高温阈值时，超过阈值温度的传感器发出信号，冷却工质入口的温控阀(19)和冷却工质出口的温控阀(20)开启，气体阀(21)维持关闭状态，位于高处的冷却工质入口的储液器(6)中的工质流向机架级环路热虹吸管(11)，并通过管道流向位于低处的冷却工质出口的储液器(7)，机架级环路热虹吸管(11)开始进行主动式两相流冷却；第一CPU温度传感器(27-1)和第二CPU温度传感器(27-2)监测的CPU结温均低于CPU低负荷阈值温度，且冷却工质入口的温控阀(19)、冷却工质出口的温控阀(20)开启时，第一CPU温度传感器(27-1)和第二CPU温度传感器(27-2)发出信号，冷却工质入口的温控阀(19)关闭，同时气体阀(21)开启，机架级环路热虹吸管(11)顶部管道的工质流向低处的冷却工质出口的储液器(7)，随后冷却工质出口的温控阀(20)与气体阀(21)关闭，机架级环路热虹吸管(11)回到被动式两相流冷却。
  10. 根据权利要求9所述的两相流主被动式多层级数据中心机柜散热装置的散热方法，其特征在于，所述机架级环路热虹吸管(11)左侧管道的工质通过热界面材料工质入口管道(30)流入热界面材料(29)中的分形树状流道(35)，并通过热界面材料工质出口管道(31)流出至机架级环路热虹吸管(11)的右侧管道；微池(36)和热界面材料圆环结构中的流道(37)构成微型热虹吸管。
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