WO2022000636A1 - 压电超声换能器 - Google Patents
压电超声换能器 Download PDFInfo
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- WO2022000636A1 WO2022000636A1 PCT/CN2020/103901 CN2020103901W WO2022000636A1 WO 2022000636 A1 WO2022000636 A1 WO 2022000636A1 CN 2020103901 W CN2020103901 W CN 2020103901W WO 2022000636 A1 WO2022000636 A1 WO 2022000636A1
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- ultrasonic transducer
- diaphragm
- piezoelectric
- base
- piezoelectric ultrasonic
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- 239000000758 substrate Substances 0.000 claims abstract description 14
- 238000007789 sealing Methods 0.000 claims description 9
- 239000012528 membrane Substances 0.000 claims description 8
- 239000007787 solid Substances 0.000 claims description 6
- 230000008878 coupling Effects 0.000 abstract description 6
- 238000010168 coupling process Methods 0.000 abstract description 6
- 238000005859 coupling reaction Methods 0.000 abstract description 6
- 238000010586 diagram Methods 0.000 description 4
- 238000005516 engineering process Methods 0.000 description 4
- 238000003754 machining Methods 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 238000001514 detection method Methods 0.000 description 2
- 238000003384 imaging method Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000013016 damping Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000004377 microelectronic Methods 0.000 description 1
- 230000035945 sensitivity Effects 0.000 description 1
Classifications
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R17/00—Piezoelectric transducers; Electrostrictive transducers
- H04R17/02—Microphones
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R19/00—Electrostatic transducers
- H04R19/04—Microphones
Definitions
- the invention relates to the technical field of acoustics and electricity, in particular to a piezoelectric ultrasonic transducer.
- Ultrasonic sensors have a wide range of applications in social production and life, including ultrasonic processing, ultrasonic positioning, ultrasonic detection, and ultrasonic imaging.
- ultrasonic transducer As a device that converts electrical energy and mechanical energy into each other, ultrasonic transducer is an important component of ultrasonic sensor.
- Traditional ultrasonic transducers are usually fabricated based on machining, so they have the disadvantages of large volume, low machining accuracy, high machining cost, and difficulty in forming an array structure.
- MEMS Microelectromechanical Ultrasonic transducers of Micro-Electro-Mechanical Systems
- the diameter size can be reduced to micron level, and the resonant frequency can reach hundreds of megahertz.
- the ultrasonic transducer processed by the MEMS process can form a large-scale array unit, and the consistency of each unit is good, which is convenient to use the phase control technology to realize the functions of focusing, discrete and directional scanning of the ultrasonic beam, which greatly enhances the application of ultrasonic technology. flexibility.
- piezoelectric ultrasonic transducers are particularly widely used.
- the edge of the diaphragm is fixed by the base and then placed on the substrate.
- the restriction of the diaphragm edge of the piezoelectric ultrasonic transducer only a part of the diaphragm structure in the middle is transmitted/received, which weakens the effective electromechanical coupling coefficient and sound pressure output of the piezoelectric ultrasonic transducer to a certain extent, and reduces the The performance of the piezoelectric ultrasonic transducer mentioned above.
- the object of the present invention is to provide a piezoelectric ultrasonic transducer with high sensitivity.
- the present invention provides a piezoelectric ultrasonic transducer, comprising: a base; a vibrating membrane, which is disposed opposite to the base and spaced apart, the vibrating membrane includes a first surface close to the base and a surface far away from the the second surface of the base; at least one supporting member connecting the base and the first surface to support the vibrating film on the base; and a piezoelectric unit arranged on the second surface; wherein, the The diaphragm further includes a center portion and an edge portion extending from an edge of the center portion, the support member is connected to the center portion, and the piezoelectric unit is disposed on the edge portion.
- the support member is a hollow cylinder or a solid cylinder.
- the support is cylindrical.
- the diaphragm is supported on the base by a plurality of the support members, and the plurality of the support members are distributed in an array.
- the piezoelectric ultrasonic transducer further includes a sealing member, the sealing member covers the diaphragm and the piezoelectric unit and is fixedly connected to the base.
- the sealing member and the substrate are fixed by bonding.
- the piezoelectric unit is annular, and includes a first electrode layer, a piezoelectric layer and a second electrode layer that are stacked in sequence.
- the diaphragm is configured as a curved surface structure and protrudes or recesses from the central portion.
- the above-mentioned piezoelectric ultrasonic transducer supports the vibrating film on the base through a support member, and the vibrating film is suspended in the air, which increases the effective vibration area and motion capacitance of the vibrating film, thereby improving the performance of the vibrating film.
- FIG. 1 is a schematic three-dimensional structural diagram of a first embodiment of a piezoelectric ultrasonic transducer provided by the present invention.
- FIG. 2 is a schematic diagram of an exploded structure of the piezoelectric ultrasonic transducer shown in FIG. 1 .
- FIG. 3 is a cross-sectional view of the piezoelectric ultrasonic transducer shown in FIG. 1 along the line A-A, and the base is connected to the diaphragm through one of the support members.
- FIG. 4 is a cross-sectional view of the piezoelectric ultrasonic transducer shown in FIG. 1 along the line A-A, and the base is connected to the diaphragm through the two support members.
- FIG. 5 is a schematic three-dimensional structural diagram of the piezoelectric ultrasonic transducer shown in FIG. 1 after removing the sealing member.
- FIG. 6 is a schematic three-dimensional structural diagram of a second embodiment of the piezoelectric ultrasonic transducer provided by the present invention.
- FIG. 7 is a cross-sectional view of the piezoelectric ultrasonic transducer shown in FIG. 6 along the line B-B, and the base is connected to the diaphragm through one of the support members.
- FIG. 8 is a cross-sectional view of the piezoelectric ultrasonic transducer shown in FIG. 6 along the line B-B, and the base is connected to the diaphragm through a plurality of the support members.
- FIGS. 1-5 are the first embodiment of the present invention, please refer to FIGS. 1-5 at the same time, in this embodiment, the piezoelectric ultrasonic transducer 100 includes a base 10 and a sealing member sealingly connected with the base 10 and forming a closed space 20.
- the vibrating membrane 30 , the support member 40 and the piezoelectric unit 50 arranged in the sealed space.
- the vibrating membrane 30 and the base 10 are relatively spaced apart, and two ends of the support member 40 are respectively connected to the vibrating membrane 30 and the base 10 to support the vibrating membrane 30 on the base. 10 , and the piezoelectric unit 50 is disposed at the end of the diaphragm 30 away from the base 10 .
- the diaphragm 30 includes a center portion 33 and an edge portion 34 extending from an edge of the center portion 33 , a first surface 31 and a first surface 31 formed on two opposite surfaces of the center portion 33 and the edge portion 34 .
- the second surface 32 wherein the first surface 31 is close to the substrate 10 , and the second surface 32 is far from the substrate 10 .
- the first surface 31 is formed by the surface of the center portion 33 and the edge portion 34 close to the substrate 10
- the second surface 32 is formed by the center portion 33 and the edge portion 34 away from the surface
- the surface of the base 10 is formed, one end of the support member 40 is connected to the central portion 33 of the first surface 31 , and the other end is joined to the base 10 , so that the edge of the diaphragm 30 is
- the portion 34 is suspended in the air, which increases the effective vibration area and motion capacitance of the diaphragm 30 .
- the piezoelectric unit 50 is annular, and includes a first electrode layer 51 , a piezoelectric layer 52 and a second electrode layer 53 that are stacked in sequence.
- the first electrode layer 51 is attached to the edge portion 34 of the second surface 32 .
- the piezoelectric unit 50 and the support member 40 are arranged staggered from each other, and the orthographic projections of the support member 40 and the piezoelectric unit 50 on the substrate 10 do not overlap, so that the piezoelectric unit 50 and the piezoelectric unit 50 do not overlap with each other.
- the edge portions 34 together form a suspended structure, which improves the effective electromechanical coupling coefficient of the piezoelectric unit 50 , thereby increasing the sound pressure output of the piezoelectric ultrasonic transducer 100 .
- the diaphragm 30 is configured as a curved structure and protrudes or recesses from the central portion 33 , that is, the central portion 33 is bent and deformed toward the base 10 or protrudes in a direction away from the base 10 , so that the The surface of the diaphragm 30 close to the substrate 10 is convex or concave.
- the directivity can also be improved to a certain extent, thereby improving the performance of the piezoelectric ultrasonic transducer 100 .
- the base 10 is connected to the diaphragm 30 through at least one of the support members 40 , and the number and arrangement of the support members 40 can be set according to the situation.
- the base 10 is connected to the diaphragm 30 through a support member 40 .
- the support member 40 is a hollow cylinder, preferably a hollow cylinder.
- a through hole 41 is provided, and a single supporting member 40 is used to support the diaphragm 30 on the base 10 .
- the hollow structure of the supporting member 40 can increase the stability of the connection between the diaphragm 30 and the base 10 .
- the base 10 is also connected to the diaphragm 30 through a plurality of the support members 40 and 40' distributed in an array. As shown in FIG. 3 , the base 10 is not only connected to the diaphragm 30 through the support member 40 , but also connected to the diaphragm 30 through a support member 40 ′.
- the support member 40 and the support member 40' is coaxial and the outer diameter of the support member 40' is smaller than that of the support member 40.
- the support member 40 is sleeved on the outside of the support member 40', and the support member 40 and the support member 40' together
- the vibrating film 30 is supported on the base 10 , which further increases the stability of the connection between the vibrating film 30 and the base 10 .
- the sealing member 20 is generally in the shape of a cover, which includes a top wall 21 and a side wall 22 connected with the edge of the top wall 21 .
- the top wall 21 and the side wall 22 together surround the vibrating film 30 and the piezoelectric unit 50 , and one end of the side wall 22 away from the top wall 21 is fixedly connected to the base 10 , thereby The diaphragm 30 and the piezoelectric unit 50 are sealed to reduce the damping effect of the piezoelectric ultrasonic transducer 100 .
- the top wall 21 and the side wall 22 and the side wall 22 and the base 10 are fixed by bonding.
- the top wall 21 and the side wall 22 may be an integral structure.
- 5-8 are the second embodiment of the piezoelectric ultrasonic transducer 200 of the present invention.
- the difference between the second embodiment and the first embodiment lies in the structure of the support member 60 , so only the structure of the support member 60 is discussed. Description, other structures will not be repeated.
- the support member 60 is a solid cylinder, preferably a solid cylinder, and a single support member 60 is used to support the diaphragm 30 on the base 10 .
- the solid cylinder has fewer manufacturing processes, and setting the support member 60 as a solid cylinder can improve its processing efficiency.
- the diaphragm 30 is supported on the base 10 by a plurality of the support members 60 , and the plurality of support members 60 are distributed in a circular array between the base 10 and the center of the diaphragm 30 .
- the two ends of the plurality of the support members 60 are respectively connected with the diaphragm 30 and the base 10 , and the stability of the connection between the diaphragm 30 and the base 10 is increased by arranging the plurality of the support members 60 .
- the above-mentioned piezoelectric ultrasonic transducer supports the vibrating film on the base through a support member, and the vibrating film is suspended in the air, which increases the effective vibration area and motion capacitance of the vibrating film, thereby improving the performance of the vibrating film.
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- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Acoustics & Sound (AREA)
- Signal Processing (AREA)
- Transducers For Ultrasonic Waves (AREA)
Abstract
本发明提供了一种压电超声换能器,其包括:基底、与所述基底相对间隔设置的振膜。所述振膜包括靠近所述基底的第一表面和远离所述基底的第二表面。所述压电超声换能器还包括连接所述基底与所述第一表面的支撑件和所述第二表面的压电单元。所述振膜还包括中心部和自所述中心部的边缘延伸出的边缘部,所述支撑件与所述中心部连接,所述压电单元设于所述边缘部。与相关技术相比,上述压电超声换能器通过支撑件将振膜支撑于基底上,振膜呈悬空设置,增加了振膜的有效振动面积和运动容抗,从而可以提高有效机电耦合系数和上述压电超声换能器的声压输出。
Description
本发明涉及声电技术领域,尤其涉及一种压电超声换能器。
超声传感器在社会生产生活中具有广泛的应用,其包括超声加工、超声定位、超声探测和超声成像等各方面。作为电能和机械能相互转换的器件,超声换能器是超声传感器的重要组成部件。传统的超声换能器通常基于机械加工制成,因而具有体积较大,加工精度较低,加工成本较高,难以形成阵列结构等缺点。基于MEMS(Microelectromechanical
Systems,微机电***)技术的超声换能器因采用微电子工艺加工而成,直径尺寸可降低到微米级别,谐振频率可达到几百兆赫兹,较高的谐振频率大幅增加了成像和探测的精度。另外,由MEMS工艺加工成的超声换能器可组成大规模阵列单元,各单元一致性较好,便于运用相位控制技术实现超声波束的聚焦、离散和定向扫描等功能,大大增强了超声技术应用的灵活性。其中,压电超声换能器的应用尤为广泛。
相关技术的所述压电超声换能器,其中振膜的边缘由基座固定后再置于衬底上。但是,由于上述压电超声换能器的振膜边缘受到制约,只有中间一部分振膜结构进行发射/接收,一定程度上削弱了压电超声换能器的有效机电耦合系数和声压输出,降低了上述压电超声换能器的性能。
因此,必须提供一种新的压电超声换能器以解决上述技术问题。
本发明的目的在于提供一种灵敏度高的压电超声换能器。
为了达到上述目的,本发明提供了一种压电超声换能器,包括:基底;振膜,与所述基底相对间隔设置,所述振膜包括靠近所述基底的第一表面和远离所述基底的第二表面;至少一支撑件,连接所述基底与所述第一表面,以将所述振膜支撑于所述基底;以及压电单元,设于所述第二表面;其中,所述振膜还包括中心部和自所述中心部的边缘延伸出的边缘部,所述支撑件与所述中心部连接,所述压电单元设于所述边缘部。
优选地,所述支撑件为空心柱体或实心柱体。
优选地,所述支撑件呈圆柱体状。
优选地,所述振膜通过多个所述支撑件支撑于所述基底,多个所述支撑件呈阵列式分布。
优选地,所述的压电超声换能器还包括密封件,所述密封件罩住所述振膜和所述压电单元并与所述基底固定连接。
优选地,所述密封件与所述基底通过粘接固定。
优选地,所述压电单元呈圆环状,其包括依次堆叠设置的第一电极层、压电层和第二电极层。
优选地,所述振膜设置为曲面结构并自所述中心部凸起或凹陷。
与相关技术相比,本发明提供的上述压电超声换能器通过支撑件将振膜支撑于基底上,振膜呈悬空设置,增加了振膜的有效振动面积和运动容抗,从而可以提高有效机电耦合系数和上述压电超声换能器的声压输出。
为了更清楚地说明本发明实施例中的技术方案,下面将对实施例描述中所需要使用的附图作简单地介绍,显而易见地,下面描述中的附图仅仅是本发明的一些实施例,对于本领域普通技术人员来讲,在不付出创造性劳动的前提下,还可以根据这些附图获得其它的附图,其中。
图1为本发明提供的压电超声换能器第一实施例的立体结构示意图。
图2为图1所示的所述压电超声换能器的分解结构示意图。
图3为图1所示的所述压电超声换能器的沿A-A线的剖视图,所述基底通过一个所述支撑件与所述振膜连接。
图4为图1所示的所述压电超声换能器的沿A-A线的剖视图,所述基底通过两个所述支撑件与所述振膜连接。
图5为图1所示的所述压电超声换能器移除密封件后的立体结构示意图。
图6为本发明提供的压电超声换能器第二实施例的立体结构示意图。
图7为图6所示的所述压电超声换能器的沿B-B线的剖视图,所述基底通过一个所述支撑件与所述振膜连接。
图8为图6所示的所述压电超声换能器的沿B-B线的剖视图,所述基底通过多个所述支撑件与所述振膜连接。
下面将结合本发明实施例中的附图,对本发明实施例中的技术方案进行清楚、完整地描述,显然,所描述的实施例仅是本发明的一部分实施例,而不是全部的实施例。基于本发明中的实施例,本领域普通技术人员在没有做出创造性劳动前提下所获得的所有其它实施例,都属于本发明保护的范围。
图1-5为本发明的第一实施方式,请同时参阅图1-5,在本实施方式中,压电超声换能器100包括基底10、与基底10密封连接并形成封闭空间的密封件20、设于该密封空间内的振膜30、支撑件40以及压电单元50。其中,所述振膜30与所述基底10相对间隔设置,所述支撑件40的两端分别与所述振膜30和所述基底10连接,以将所述振膜30支撑于所述基底10上,而所述压电单元50则设置在所述振膜30远离所述基底10的一端。
具体地,所述振膜30包括中心部33以及自所述中心部33的边缘延伸出的边缘部34、形成于与中心部33和边缘部34的两个相反表面上的第一表面31和第二表面32,其中,所述第一表面31靠近所述基底10,所述第二表面32远离所述基底10。也就是说,所述第一表面31由所述中心部33和所述边缘部34靠近所述基底10的表面构成,所述第二表面32由所述中心部33和所述边缘部34远离所述基底10的表面构成,所述支撑件40的一端连接在所述第一表面31的所述中心部33处,另一端与所述基底10接合,使得所述振膜30的所述边缘部34呈悬空设置,增加了所述振膜30的有效振动面积和运动容抗。所述压电单元50呈圆环状,其包括依次堆叠设置的第一电极层51、压电层52和第二电极层53。所述第一电极层51贴合于所述第二表面32的边缘部34处。所述压电单元50与所述支撑件40相互错开设置,所述支撑件40与所述压电单元50在所述基底10上的正投影不重叠,使得所述压电单元50与所述边缘部34共同构成悬空结构,提高了所述压电单元50的有效机电耦合系数,从而增加了所述压电超声换能器100的声压输出。
其中,所述振膜30设置为曲面结构并自所述中心部33凸起或者凹陷,即所述中心部33朝所述基底10弯曲变形或朝远离所述基底10的方向凸起,使得所述振膜30靠近所述基底10的表面为凸面或凹面。相较于现有技术的振膜的边缘固定方式,本申请的所述振膜30的所述边缘部34呈悬空设置更易于将振膜30设置为凹面或者凸面结构,可以增大机电耦合因子,也能够一定程度上提高指向性,从而提高所述压电超声换能器100性能。
所述基底10通过至少一个所述支撑件40与所述振膜30连接,所述支撑件40的设置数量及排布可根据情况进行相应设置。如图2所示,所述基底10通过一个所述支撑件40与所述振膜30连接,具体地,所述支撑件40为空心柱体,优选为空心圆柱体,所述支撑件40内设有通孔41,使用单个支撑件40将所述振膜30支撑在所述基底10上,所述支撑件40的空心结构能增加所述振膜30与所述基底10连接的稳定性。
所述基底10也通过多个呈阵列分布所述支撑件40和40'与所述振膜30连接。如图3所示,所述基底10除了通过所述支撑件40与所述振膜30连接,还通过一个支撑件40'与所述振膜30连接,所述支撑件40和所述支撑件40'同轴且所述支撑件40'的外径小于所述支撑件40,所述支撑件40套在所述支撑件40'外侧,所述支撑件40和所述支撑件40'共同将所述振膜30支撑于所述基底10,进一步增加了所述振膜30与所述基底10连接的稳定性。
进一步地,所述密封件20大致呈罩体状,其包括顶壁21和与顶壁21边缘连接的侧壁22。所述顶壁21和所述侧壁22共同将所述振膜30和所述压电单元50包围起来,所述侧壁22远离所述顶壁21的一端与所述基底10固定连接,从而将所述振膜30及所述压电单元50封闭起来,以减小压电超声换能器压电超声换能器100的阻尼影响。可选地,所述顶壁21与所述侧壁22之间、所述侧壁22与所述基底10之间均通过粘接固定。在其他实施方式中,所述顶壁21和所述侧壁22可以为一体结构。
图5-8为本发明的压电超声换能器200的第二实施方式,第二实施方式与第一实施方式的区别在于支撑件60的结构,故仅对所述支撑件60的结构进行说明,其他结构不再赘述。
如图7所示,所述支撑件60为实心柱体,优选为实心圆柱体,使用单个所述支撑件60将所述振膜30支撑在所述基底10上。相对于空心柱体,实心柱体的制作工序较少,将所述支撑件60设置成实心柱体能提高其加工效率。如图8所示,使用多个所述支撑件60将所述振膜30支撑在所述基底10上,多个所述支撑件60呈圆周阵列分布在基底10与振膜30的中心部之间,多个的所述支撑件60的两端分别与振膜30和基底10连接,通过设置多个所述支撑件60来增加振膜30与基底10连接的稳定性。
与相关技术相比,本发明提供的上述压电超声换能器通过支撑件将振膜支撑于基底上,振膜呈悬空设置,增加了振膜的有效振动面积和运动容抗,从而可以提高有效机电耦合系数和上述压电超声换能器的声压输出。
以上所述的仅是本发明的实施方式,在此应当指出,对于本领域的普通技术人员来说,在不脱离本发明创造构思的前提下,还可以做出改进,但这些均属于本发明的保护范围。
Claims (8)
- 一种压电超声换能器,其特征在于,包括:基底;振膜,与所述基底相对间隔设置,所述振膜包括靠近所述基底的第一表面和远离所述基底的第二表面;至少一支撑件,连接所述基底与所述第一表面,以将所述振膜支撑于所述基底;以及压电单元,设于所述第二表面;其中,所述振膜还包括中心部和自所述中心部的边缘延伸出的边缘部,所述支撑件与所述中心部连接,所述压电单元设于所述边缘部。
- 根据权利要求1所述的压电超声换能器,其特征在于,所述支撑件为空心柱体或实心柱体。
- 根据权利要求2所述的压电超声换能器,其特征在于,所述支撑件呈圆柱体状。
- 根据权利要求1所述的压电超声换能器,其特征在于,所述振膜通过多个所述支撑件支撑于所述基底,多个所述支撑件呈阵列式分布。
- 根据权利要求1所述的压电超声换能器,其特征在于,所述压电超声换能器还包括密封件,所述密封件罩住所述振膜和所述压电单元并与所述基底固定连接。
- 根据权利要求5所述的压电超声换能器,其特征在于,所述密封件与所述基底通过粘接固定。
- 根据权利要求1所述的压电超声换能器,其特征在于,所述压电单元呈圆环状,其包括依次堆叠设置的第一电极层、压电层和第二电极层。
- 根据权利要求1所述的压电超声换能器,其特征在于,所述振膜设置为曲面结构并自所述中心部凸起或凹陷。
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