WO2021102921A1 - 显示面板母板及其切割及制备方法、显示面板及显示装置 - Google Patents
显示面板母板及其切割及制备方法、显示面板及显示装置 Download PDFInfo
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- WO2021102921A1 WO2021102921A1 PCT/CN2019/122012 CN2019122012W WO2021102921A1 WO 2021102921 A1 WO2021102921 A1 WO 2021102921A1 CN 2019122012 W CN2019122012 W CN 2019122012W WO 2021102921 A1 WO2021102921 A1 WO 2021102921A1
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- display panel
- cutting
- motherboard
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- 238000005520 cutting process Methods 0.000 title claims description 283
- 238000000034 method Methods 0.000 title claims description 53
- 238000004519 manufacturing process Methods 0.000 title claims description 12
- 239000000758 substrate Substances 0.000 claims abstract description 566
- 239000004973 liquid crystal related substance Substances 0.000 claims description 43
- 238000005530 etching Methods 0.000 claims description 15
- 238000007789 sealing Methods 0.000 claims description 13
- 238000010894 electron beam technology Methods 0.000 claims description 5
- 238000010884 ion-beam technique Methods 0.000 claims description 5
- 239000010410 layer Substances 0.000 description 170
- 239000010408 film Substances 0.000 description 116
- 230000000694 effects Effects 0.000 description 15
- 230000008569 process Effects 0.000 description 13
- 238000010586 diagram Methods 0.000 description 10
- 238000002360 preparation method Methods 0.000 description 10
- 230000005684 electric field Effects 0.000 description 8
- 230000002411 adverse Effects 0.000 description 7
- 230000036961 partial effect Effects 0.000 description 6
- 229910052751 metal Inorganic materials 0.000 description 5
- 239000002184 metal Substances 0.000 description 5
- 239000011241 protective layer Substances 0.000 description 5
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical group O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 3
- 230000008859 change Effects 0.000 description 3
- 238000005229 chemical vapour deposition Methods 0.000 description 3
- 239000011248 coating agent Substances 0.000 description 3
- 238000000576 coating method Methods 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 230000003287 optical effect Effects 0.000 description 3
- 238000005240 physical vapour deposition Methods 0.000 description 3
- 230000002829 reductive effect Effects 0.000 description 3
- 239000004020 conductor Substances 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- AMGQUBHHOARCQH-UHFFFAOYSA-N indium;oxotin Chemical compound [In].[Sn]=O AMGQUBHHOARCQH-UHFFFAOYSA-N 0.000 description 2
- 238000000206 photolithography Methods 0.000 description 2
- 239000010453 quartz Substances 0.000 description 2
- 239000010409 thin film Substances 0.000 description 2
- 229910000838 Al alloy Inorganic materials 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 229910000881 Cu alloy Inorganic materials 0.000 description 1
- 229910001182 Mo alloy Inorganic materials 0.000 description 1
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- 229910052581 Si3N4 Inorganic materials 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910021417 amorphous silicon Inorganic materials 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 230000004888 barrier function Effects 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000002346 layers by function Substances 0.000 description 1
- 230000000670 limiting effect Effects 0.000 description 1
- 230000000873 masking effect Effects 0.000 description 1
- 229910052750 molybdenum Inorganic materials 0.000 description 1
- 239000011733 molybdenum Substances 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 238000000059 patterning Methods 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 230000010287 polarization Effects 0.000 description 1
- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 229920005591 polysilicon Polymers 0.000 description 1
- -1 region Substances 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 1
- 229910052814 silicon oxide Inorganic materials 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Images
Classifications
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/133351—Manufacturing of individual cells out of a plurality of cells, e.g. by dicing
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
- G02F1/133509—Filters, e.g. light shielding masks
- G02F1/133514—Colour filters
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1343—Electrodes
- G02F1/134309—Electrodes characterised by their geometrical arrangement
- G02F1/134363—Electrodes characterised by their geometrical arrangement for applying an electric field parallel to the substrate, i.e. in-plane switching [IPS]
Definitions
- the embodiments of the present disclosure relate to a display panel mother board, a cutting and manufacturing method thereof, a display panel, and a display device.
- a light control panel can be provided between the display panel and the backlight module of the liquid crystal display device.
- the light control panel can adjust the polarization direction and intensity of the backlight provided by the backlight module, and provide the adjusted backlight to the display panel for performing display operations.
- At least one embodiment of the present disclosure provides a display panel motherboard, including: at least three motherboard substrates stacked on top of each other; at least one display panel unit; a cutting area at least partially surrounding the at least one display panel unit; In the cutting area, at least two of the at least three mother substrates are not provided with an organic film layer.
- At least one of the at least three motherboard substrates includes a binding area;
- the cutting area is not provided with an organic film layer and includes the bonding area on the mother board substrate, and the bonding area is not provided with the organic film layer.
- At least one of the at least three mother board substrates is not provided with an inorganic film layer.
- At least one embodiment of the present disclosure further provides a display panel, which is obtained by cutting the display panel mother board according to any embodiment of the present disclosure.
- the display panel includes at least three substrates; wherein, among the at least three substrates Each of the at least three motherboard substrates is obtained by cutting each of the at least three motherboard substrates; at least one of the at least three substrates includes a binding area, and one of the at least one display panel unit corresponds to the display panel.
- the outer edges of the at least three substrates are in a plane parallel to the main surface of the display panel.
- the projections do not overlap.
- the outer edges of the at least three substrates are in a stepped structure along a first direction, and the first direction is vertical On the main surface of the display panel.
- the outer edges of the at least three substrates are in a plane parallel to the main surface of the display panel. Except for the outermost orthographic projection, the distance between adjacent orthographic projections is 3mm to 4mm.
- the outer edges of the at least three substrates are in a plane parallel to the main surface of the display panel. Except for the outermost orthographic projection in the projection, the distance between adjacent orthographic projections is greater than or equal to 1/2 of the width of the cutter wheel used for cutting the display panel motherboard.
- the at least three substrates include a first substrate, a second substrate, and a third substrate, and the first substrate is located on the second substrate away from the third substrate.
- the orthographic projection of the outer edge of the first substrate on the second substrate is similar to that of the second substrate.
- the distance between the outer edges is 3mm ⁇ 4mm.
- the orthographic projection of the outer edge of the first substrate on the second substrate is similar to that of the second substrate.
- the distance between the outer edges of the display panel is greater than or equal to 1/2 of the width of the cutter wheel used for cutting the display panel motherboard.
- the display panel provided by at least one embodiment of the present disclosure further includes: a first liquid crystal layer located between the first substrate and the second substrate; a second liquid crystal layer located between the second substrate and the second substrate Between three substrates; wherein, the second substrate is a common substrate, and a display array element is provided on the side of the common substrate facing the first substrate; the first substrate is a color filter substrate, and the first substrate The side facing the common substrate is provided with a color filter layer; the third substrate is a light control array substrate, and the side of the third substrate facing the common substrate is provided with a light control array element.
- At least one of the at least three substrates is not provided with an inorganic film layer.
- each of the at least three substrates further includes a sealing area; in the substrate including the binding area, the binding area at least partially surrounds the The sealing area; on the side where the binding area is located, there is a gap between the outer edge of each of the at least three substrates and the binding area or the sealing area.
- At least one embodiment of the present disclosure further provides a method for cutting a display panel motherboard according to any one of the embodiments of the present disclosure, including: cutting the display panel motherboard along at least one cutting line located in the cutting area to form at least A display panel, wherein the display panel corresponds to the display panel unit.
- cutting the display panel mother board along the at least one cutting line located in the cutting area to form the at least one display panel includes: using an energy cutting beam The display panel mother board is cut along the first cutting line of the cutting area to separate at least one part to be processed from the display panel mother board; wherein each of the at least one part to be processed includes one The display panel unit.
- the energy cutting beam includes a laser, an electron beam, or an ion beam.
- cutting the display panel mother board along the at least one cutting line located in the cutting area to form the at least one display panel further includes: The portion to be processed is located on the side of the binding area, and at least one motherboard substrate of the portion to be processed is mechanically cut along a second cutting line to form the display panel.
- the second cutting line includes at least two sub-cutting lines; in a plane parallel to the main surface of the display panel mother board, the at least two sub-cutting lines The distance between two adjacent sub-cut lines in the line is 3mm-4mm.
- the mechanical cutting includes knife wheel cutting;
- the second cutting line includes at least two sub-cutting lines that are parallel to the main surface of the display panel mother board. In the plane, the distance between two adjacent sub-cutting lines of the at least two sub-cutting lines is greater than or equal to 1/2 of the width of the cutter wheel.
- the at least three mother board substrates include a first mother board substrate, a second mother board substrate, and a third mother board substrate.
- Cutting at least one motherboard substrate of the portion to be processed to form the display panel includes: mechanically cutting the first motherboard substrate of the portion to be processed along a first sub-cut line to form the first substrate of the display panel , And mechanically cutting the second motherboard substrate of the portion to be processed along the second sub-cutting line to form the second substrate of the display panel; wherein, the first sub-cutting line is located far away from the second sub-cutting line One side of the first cutting line.
- At least one embodiment of the present disclosure further provides a method for preparing a display panel motherboard, including: forming a display panel motherboard including at least one display panel unit, wherein the display panel motherboard includes: at least three display panel motherboards stacked on top of each other. A motherboard substrate; at least one display panel unit; a cutting area at least partially surrounding the at least one display panel unit; wherein, in the cutting area, at least two of the at least three motherboard substrates are not provided with an organic film Layer; said forming the display panel motherboard including the at least one display panel unit includes: separately forming each of the at least three motherboard substrates, and arranging the at least three motherboard substrates Forming the display panel mother board; wherein the step of separately forming each of the at least three mother board substrates includes: etching and removing the cut area of at least two of the at least three mother board substrates. Organic film layer.
- At least one of the at least three motherboard substrates includes a binding area; On a motherboard substrate that is not provided with an organic film layer and includes the bonding area, the organic film layer is not provided in the bonding area; the step of separately forming each of the at least three motherboard substrates further includes : Etching and removing the organic film layer in the bonding area of the motherboard substrate that is not provided with an organic film layer in the cutting area and includes the bonding area.
- At least one embodiment of the present disclosure further provides a display device, including the display panel described in any embodiment of the present disclosure.
- Fig. 1 is a schematic diagram of a partial cross-sectional structure of a display panel motherboard provided by some embodiments of the present disclosure
- FIG. 2 is a schematic diagram of a partial cross-sectional structure of another display panel motherboard provided by some embodiments of the present disclosure
- FIG. 3 is a schematic diagram of a partial cross-sectional structure of a display panel provided by some embodiments of the present disclosure
- 4A-4D are schematic diagrams of a method for cutting a display panel motherboard provided by some embodiments of the present disclosure.
- 5A-5I are schematic diagrams of a method for preparing a film layer on a motherboard substrate of a display panel motherboard provided by some embodiments of the present disclosure.
- the display panel is usually a display liquid crystal panel
- the light control panel is usually a light control liquid crystal panel.
- the deflection angle of liquid crystal molecules in the liquid crystal layer of the light control liquid crystal panel the brightness of the backlight provided to the display liquid crystal panel can be adjusted.
- the deflection angle of the liquid crystal molecules in the light-controlling liquid crystal panel the brightness of the backlight provided to the part of the display liquid crystal panel corresponding to the dark state area of the display screen can be reduced, so as to reduce the transmitted light intensity of the dark state area in the display screen. , Thereby avoiding or reducing the dark state light leakage phenomenon of the liquid crystal display device.
- the above-mentioned liquid crystal display device includes at least three substrates that are stacked.
- the display liquid crystal panel and the light-controlling liquid crystal panel may respectively include two oppositely arranged substrates, thereby forming a liquid crystal display device including a four-substrate structure; or, it is also possible to combine one substrate in the display liquid crystal panel and the light-controlling liquid crystal panel.
- One of the substrates is set as a common substrate, and the display liquid crystal panel and the light-controlling liquid crystal panel share the common substrate, thereby forming a liquid crystal display device including a three-substrate structure; or the above-mentioned liquid crystal display device may also include more than four substrates depending on functional requirements .
- the multiple organic film layers or inorganic film layers are cut at the same time, thus further increasing the difficulty of separating the part to be processed including three or more substrates from the preparation mother board. For example, if a laser is used to cut a three-layer substrate at the same time, since the refractive index of the organic film layer and the inorganic film layer are often different from the refractive index of the substrate, and there is often a big difference between the refractive index of the organic film layer and the refractive index of the substrate.
- the direction of the light path will change many times, making it difficult for the laser to focus to form the cutting wire (such as focus wire) required for cutting the film layer, so it is difficult to use energy such as laser to cut
- the beam cuts three or more substrates at the same time.
- the display panel mother board provided by the embodiments of the present disclosure, by reducing the number of organic film layers in the cutting area, it is possible to reduce the pairing of the organic film layers when cutting three or more mother board substrates at the same time, for example, , Energy beam cutting, resulting in adverse effects, which in turn helps to use energy beams to realize simultaneous cutting of three or more motherboard substrates in the display panel motherboard, improve the cutting accuracy of the display panel motherboard, and improve the display panel
- the cutting effect of the mother board improves the yield of the display panel prepared from the display panel mother board.
- the display panel motherboard provided by the embodiments of the present disclosure may include three or more than three motherboard substrates. Accordingly, the display panel obtained by cutting the display panel motherboard provided by the embodiments of the present disclosure may include three or three motherboards. Above the substrate.
- the embodiments of the present disclosure take a display panel motherboard including three motherboard substrates and a corresponding display panel including three substrates as an example, and perform the structure and function of the display panel motherboard and the display panel provided by the embodiments of the present disclosure. Description. It should be noted that the embodiments of the present disclosure include but are not limited to this.
- At least one embodiment of the present disclosure provides a display panel motherboard.
- the display panel motherboard includes at least three motherboard substrates, at least one display panel unit, and a cutting area. At least three mother substrates are stacked on top of each other, and the cutting area at least partially surrounds at least one display panel unit; in the cutting area, at least two of the at least three mother substrates are not provided with an organic film layer.
- At least one of the at least three motherboard substrates includes a bonding area; on a motherboard substrate that is not provided with an organic film layer in the cutting area and includes the bonding area, the bonding area No organic film layer is provided.
- At least one of the at least three mother substrates is not provided with an inorganic film layer.
- FIG. 1 is a schematic diagram of a partial cross-sectional structure of a motherboard of a display panel provided by some embodiments of the present disclosure.
- Three motherboard substrates are shown in FIG. 1, but they are only examples.
- the embodiments of the present disclosure may also include more than three motherboard substrates, the structure of which depends on specific functional requirements, but for the cutting area and the binding area
- the settings and functions of the components are basically the same as or similar to those of the three motherboard substrates in the embodiment shown in FIG. 1.
- the display panel motherboard 10 includes three motherboard substrates, at least one display panel unit 101 and a cutting area 102.
- the three motherboard substrates include a first motherboard substrate 11, a second motherboard substrate 12, and a third motherboard substrate 13.
- the first motherboard substrate 11, the second motherboard substrate 12, and the third motherboard substrate 13 are stacked on top of each other.
- the third motherboard substrate 13 is located on the side of the second motherboard substrate 12 away from the first motherboard substrate 11.
- the cutting area 102 at least partially surrounds at least one display panel unit 101.
- at least two of the first motherboard substrate 11, the second motherboard substrate 12, and the third motherboard substrate 13 are not provided with an organic film layer.
- None of the board substrate 11, the second motherboard substrate 12, and the third motherboard substrate 13 is provided with an organic film layer.
- an energy cutting beam (such as a laser, electron beam, or ion beam) is used to cut the first mother board substrate 11, the second mother board substrate 12, and the second mother board at the same time.
- an energy cutting beam such as a laser, electron beam, or ion beam
- three mother board substrates 13 are used to separate the display panel unit 101 from the display panel mother board, since the first mother board substrate 11, the second mother board substrate 12, and the third mother board substrate 13 are not provided with an organic film layer in the cutting area Taking the laser as an example, the optical path direction of the laser will not change basically. Therefore, in the process of using the laser to cut the display panel mother board 10, the light beam can be focused to form the cutting wire required for the cutting film layer, thereby realizing the alignment of the first mother board.
- the substrate 11, the second motherboard substrate 12, and the third motherboard substrate 13 are simultaneously cut. Therefore, it is possible to effectively avoid the adverse effects of the organic film layer on the cutting process of the display panel mother board 10, improve the cutting accuracy of the display panel mother board 10, improve the cutting effect of the display panel mother board 10, and further enhance the display panel mother board 10 The yield of the display panel prepared by the board 10.
- the first motherboard substrate 11, the second motherboard substrate 12, and the third motherboard substrate 13 are not provided with an organic film layer; In some other embodiments of the present disclosure, in the cutting area 102, one of the first motherboard substrate 11, the second motherboard substrate 12, and the third motherboard substrate 13 may also be provided with an organic film layer. In this case, since only one of the first motherboard substrate 11, the second motherboard substrate 12, and the third motherboard substrate 13 is provided with an organic film layer in the cutting area 102, the display panel is cut by laser, for example. When the motherboard 10 is used, the beam direction will not change significantly, so that the laser can focus on the cutting wire required to form the cutting film during the cutting of the display panel motherboard 10.
- the first motherboard substrate 11, the second motherboard substrate 12, and the third motherboard substrate 13 are simultaneously cut, which reduces the adverse effects of the organic film layer on the cutting process of the display panel motherboard 10.
- the organic film layer in the cutting area 102 of a motherboard substrate does not need to be etched and removed, in the process of preparing the motherboard substrate, the corresponding etching of the organic film layer can be omitted. Process, thereby simplifying the manufacturing process of the display panel motherboard 10 and reducing the manufacturing cost of the display panel motherboard 10.
- the first motherboard substrate 11, the second motherboard substrate 12, and the third motherboard substrate 13 are not provided with an inorganic film layer, that is, the implementation shown in FIG.
- the first mother board substrate 11, the second mother board substrate 12, and the third mother board substrate 13 are not provided with an organic film layer and an inorganic film layer in the cutting area 102. Therefore, when cutting the cutting area 102 of the display panel mother board 10, it is possible to further avoid the adverse effects of the inorganic film layer on the optical path direction of the laser, so that the laser can be focused and formed during the cutting of the display panel mother board 10.
- the cutting wire required for cutting the film layer can realize simultaneous cutting of the first mother board substrate 11, the second mother board substrate 12, and the third mother board substrate 13.
- the difference between the refractive index of the inorganic film layer and the first motherboard substrate 11, the second motherboard substrate 12, or the third motherboard substrate 13 is small, in some other embodiments of the present disclosure
- the first mother board 11, the second mother board 12, and the third mother board 13 may also be provided with an inorganic film layer in the cutting area 102.
- the process of etching and removing the inorganic film in the cutting area 102 on the mother board substrate can be omitted, thereby simplifying the preparation process of the display panel mother board 10 and reducing the display panel mother board.
- the second motherboard substrate 12 and the third motherboard substrate 13 further include a binding area 103.
- the binding area 103 of the second motherboard substrate 12 and the third motherboard substrate 13 is not provided with an organic film layer, that is, the binding area 103 and the cutting area 102 of the second motherboard substrate 12 and the third motherboard substrate 13 are both No organic film layer is provided. Since neither the second mother board substrate 12 nor the third mother board substrate 13 is provided with an organic film layer in the cutting area 102, it is necessary to use, for example, a masking process to remove the organic film in the cutting area 102 during the preparation of the display panel mother board 10. The film layer is removed by etching.
- the organic film layer in the bonding area 103 is simultaneously etched and removed, which can reduce the need for etching and removing the organic film layer on the second mother substrate 102 and the third mother substrate 103.
- the achieved process accuracy requirements are easy to operate, thereby simplifying the preparation process of the second mother board substrate 102 and the third mother board substrate 103, and reducing the preparation cost of the second mother board substrate 102 and the third mother board substrate 103.
- the binding area 103 of the second motherboard substrate 12 and the third motherboard substrate 13 is not provided with an inorganic film layer, that is, in the embodiment shown in FIG. 1, the second motherboard substrate Neither an organic film layer nor an inorganic film layer is provided in the bonding area 103 of the 12 and the third mother board substrate 13.
- the bonding area 103 does not need to be cut in the process of cutting the display panel motherboard 10, the second motherboard substrate 12 and the third motherboard substrate 13
- An organic film layer or an inorganic film layer may also be arranged in the binding area 103, which is not limited in the embodiment of the present disclosure.
- the second motherboard substrate 12 and the third motherboard substrate 13 are provided with a binding area 103; while in some other embodiments of the present disclosure, according to different In actual demand, the first motherboard substrate 11 may also be provided with a binding area 103, for example, the first motherboard substrate 11 and the third motherboard substrate 13 may be provided with a binding area 103, or it may be three mother boards.
- a binding area is provided on the board substrate, and the embodiment of the present disclosure does not limit the location of the binding area 103.
- the display panel unit 101 of the display panel motherboard 10 shown in FIG. 1 is configured to implement a display panel.
- the structure and function of the display panel unit 101 reference may be made to the corresponding description in the display panel provided in some embodiments of the present disclosure below.
- FIG. 1 shows a case where the display panel motherboard includes three motherboard substrates, but it is only an example.
- the embodiments of the present disclosure may also include more than three motherboard substrates, the structure of which depends on specific functional requirements.
- the display panel motherboard includes more than three motherboard substrates, the settings and functions of the cutting area and the binding area are basically the same as or similar to those of the three motherboard substrates in the embodiment shown in FIG. 1.
- the display panel motherboard may further include four or more motherboard substrates.
- FIG. 2 is a schematic diagram of a partial cross-sectional structure of another display panel motherboard provided by some embodiments of the present disclosure. It should be noted that, except for the fourth substrate 54, other structures of the display panel motherboard 50 shown in FIG. 2 are basically the same as or similar to those of the display panel motherboard 10 shown in FIG.
- the display panel motherboard 50 includes a first motherboard substrate 51, a second motherboard substrate 52, a third motherboard substrate 53 and a fourth motherboard substrate 54, the first motherboard substrate 51, the second motherboard substrate
- the mother board 52, the third mother board 53 and the fourth mother board 54 are stacked on each other, and the fourth mother board 54 is provided between the second mother board and the third mother board 53.
- the display panel mother board 50 includes at least one display panel unit 501 and a cutting area 502 at least partially surrounding the at least one display panel unit 501. In the cutting area 502, at least three of the first mother substrate 51, the second mother substrate 52, the third mother substrate 53, and the fourth mother substrate 54 are not provided with an organic film layer, as shown in FIG.
- the first motherboard substrate 51, the second motherboard substrate 52, the third motherboard substrate 53, and the fourth motherboard substrate 54 are not provided with an organic film layer. Therefore, it is possible to effectively avoid the adverse effects of the organic film layer on the cutting process of the display panel mother board 50, improve the cutting accuracy of the display panel mother board 50, improve the cutting effect of the display panel mother board 50, and further enhance the display panel mother board 50 The yield of the display panel prepared by the board 50.
- the embodiment of the present disclosure does not limit the specific position of the motherboard substrate.
- it may be the first motherboard substrate 51 and the second motherboard substrate.
- Any one of the motherboard substrate 52, the third motherboard substrate 53, and the fourth motherboard substrate 54 is provided with an organic film layer in the cutting area 502.
- the first mother board 51, the second mother board 52, the third mother board 53 and the fourth mother board 54 are not provided with an inorganic film layer, that is, In the embodiment shown in FIG. 2, the first mother board 51, the second mother board 52, the third mother board 53 and the fourth mother board 54 are not provided with an organic film layer and an inorganic film layer in the cutting area 502. ⁇ Film layer.
- the cutting wire required for cutting the film layer is thereby realized to cut the first mother board substrate 51, the second mother board substrate 52, the third mother board substrate 53 and the fourth mother board substrate 54 at the same time.
- the cutting area 502 there may be at least one of the first mother board 51, the second mother board 52, the third mother board 53 and the fourth mother board 54
- One motherboard substrate is provided with an inorganic film layer, for example, all motherboard substrates may be provided with an inorganic film layer, which is not limited in the embodiments of the present disclosure.
- the second motherboard substrate 52 and the third motherboard substrate 53 further include a binding area 503.
- the bonding area 503 of the second motherboard 52 and the third motherboard 53 is not provided with an organic film layer or an inorganic film layer, that is, the bonding area 503 and the bonding area 503 of the second motherboard 52 and the third motherboard 53
- the cutting area 502 is not provided with an organic film layer or an inorganic film layer.
- the fourth motherboard substrate 54 may also be provided with a binding area 503, and the embodiment of the present disclosure does not limit the location of the binding area 503.
- the N motherboard substrates are stacked on top of each other. Set up. In the cutting area, N-1 of the N motherboard substrates are not provided with an organic film layer, that is, at most only one cutting area of the mother substrate is provided with an organic film layer. It should be noted that, in the case where the organic film layer is provided in the cutting area of only one motherboard substrate, the embodiment of the present disclosure does not limit the specific position of the motherboard substrate where the organic film layer is provided in the cutting area.
- the arrangement of the organic film layer or the inorganic film layer in the cutting area and the binding area can refer to the embodiment of the display panel mother board 10 shown in FIG. 1 Or the corresponding description in the embodiment of the display panel motherboard 50 shown in FIG. 2 will not be repeated here.
- At least one embodiment of the present disclosure also provides a display panel, which is obtained by cutting the display panel mother board as described above.
- the display panel includes at least three substrates, and each of the at least three substrates is respectively obtained by cutting each of the at least three motherboard substrates of the display panel motherboard.
- At least one of the at least three substrates includes a binding area, and one of the at least one display panel unit of the display panel mother board corresponds to the display panel.
- FIG. 3 is a schematic diagram of a partial cross-sectional structure of a display panel provided by some embodiments of the present disclosure.
- the display panel 20 shown in FIG. 3 can be obtained by cutting the display panel motherboard 10 shown in FIG. 1.
- the display panel 20 may include a first substrate 21, a second substrate 22, and a third substrate 23, and each of the first substrate 21, the second substrate 22, and the third substrate 23 is cut through Each of a motherboard substrate 11, a second motherboard substrate 12, and a third motherboard substrate 13 is obtained.
- the first substrate 21 is obtained by cutting the first motherboard substrate 11 of the display panel motherboard 10 shown in FIG. 1
- the second substrate 22 is obtained by cutting the second motherboard substrate of the display panel motherboard 10 shown in FIG. 12 is obtained
- the third substrate 23 is obtained by cutting the third motherboard substrate 13 of the display panel motherboard 10 shown in FIG. 1.
- one of the at least one display panel unit 101 shown in FIG. 1 corresponds to the display panel 20, and at least one of the first substrate 21, the second substrate 22, and the third substrate 23 includes the binding area 103, for example, As shown in FIG. 3, the second substrate 22 and the third substrate 23 include a binding area 103.
- the orthographic projections of the outer edges of the at least three substrates in a plane parallel to the main surface of the display panel do not coincide.
- the main surface of the display panel refers to the display surface of the display panel, that is, the surface of the display panel close to the display side.
- the arrangement direction of the at least three substrates is perpendicular to the main surface of the display panel.
- the first direction R1 is perpendicular to the main surface of the display panel 20.
- the orthographic projections of the first substrate 21, the second substrate 22, and the third substrate 23 in a plane parallel to the main surface of the display panel 20 do not overlap. That is, on the side where the binding area 103 is located, the outer edges of the first substrate 21, the second substrate 22, and the third substrate 23 are not aligned, thereby helping to realize the binding process.
- the outer edges of the at least three substrates have a stepped structure along a first direction, and the first direction is perpendicular to the main surface of the display panel.
- the outer edges of the first substrate 21, the second substrate 22, and the third substrate 23 have a stepped structure along the first direction R1.
- the first direction R1 is perpendicular to the main surface of the display panel 20.
- the first direction R1 is a direction toward the display surface of the display panel 20, while in some other embodiments of the present disclosure, the first direction R1 may also be away from the display panel 20.
- the direction of the display surface is not limited in the embodiment of the present disclosure.
- the orthographic projection of the outer edge of the first substrate 21 on the second substrate 22 is located on the inner side of the outer edge of the second substrate 22.
- the orthographic projection of the outer edge on the third substrate 23 is located inside the outer edge of the third substrate 23 to form a stepped structure along the first direction R1.
- the embodiment of the present disclosure does not limit the extension direction of the stepped structure formed by the outer edges of the first substrate 21, the second substrate 22, and the third substrate 23.
- the orthographic projection of the outer edge of the third substrate 23 on the second substrate 22 may be located on the inner side of the outer edge of the second substrate 22, and the outer edge of the second substrate 22 may be located on the inner side of the outer edge of the second substrate 22.
- the orthographic projection on the first substrate 21 is located inside the outer edge of the first substrate 21, which is not limited in the embodiment of the present disclosure.
- the embodiment shown in FIG. 3 only takes the stepped structure formed by the outer edges of the first substrate 21, the second substrate 22 and the third substrate 23 as an example for description, while in some other embodiments of the present disclosure
- the outer edges of the first substrate 21, the second substrate 22, and the third substrate 23 may also constitute other structures.
- the orthographic projection of the outer edge of the first substrate 21 on the second substrate 22 is located inside the outer edge of the second substrate 22, and the outer edge of the third substrate 23 is on the second substrate.
- the orthographic projection on 22 is located on the inner side of the outer edge of the second substrate 22, which can also help to realize the binding process, which is not limited in the embodiment of the present disclosure.
- the orthographic projection of the outer edge of the first substrate 21 on the third substrate 23 and the orthographic projection of the outer edge of the second substrate 22 on the third substrate 23 may coincide or slightly deviate. .
- the display panel 20 includes a first substrate 21, a second substrate 22, and a third substrate 23.
- the display panel 20 may further include a fourth substrate or more substrates, etc., which is not limited in the embodiment of the present disclosure.
- the outer edge of the substrate on the side where the binding area is located may be stepped in a direction perpendicular to the main surface of the display panel.
- the stepped shape may refer to In FIG. 3, the first substrate 21, the second substrate 22 and the third substrate 23 constitute a stepped structure.
- the outer edge of the substrate on the side where the binding area is located may be that the outer edge of the middle substrate is longer than the outer edge of the outer substrate.
- the outer edges of the middle two substrates are longer than the outer edges of the outer two substrates; in the direction perpendicular to the main surface of the display panel, the outer edges of the middle two substrates may overlap or If there is a slight deviation, the outer edges of the two outer substrates can be overlapped or slightly deviated.
- the outer edges of the middle three substrates may be longer than the outer edges of the outer two substrates, etc., which is not limited in the embodiment of the present disclosure.
- the outer edge of the substrate can be set in a required form according to actual different requirements.
- the outer edges of the substrates can be arranged to overlap each other in a direction perpendicular to the main surface of the display panel; or if additional external components need to be connected, it can also be used to connect external components to the substrate Compared with the outer edges of other substrates, the outer edges of the substrates are slightly protruded, etc. The embodiments of the present disclosure do not limit this.
- adjacent orthographic projections In some embodiments, in the orthographic projection of the outer edges of at least three substrates in a plane parallel to the main surface of the display panel on the side where the binding area is located, except for the outermost orthographic projection, adjacent orthographic projections The distance between projections is 3mm to 4mm.
- the distance D1 between the orthographic projection of the outer edge of the first substrate 21 on the second substrate 22 and the outer edge of the second substrate 22 may be 3 mm. ⁇ 4mm.
- the distance D2 between the orthographic projection of the outer edge of the second substrate 22 on the third substrate 23 and the outer edge of the third substrate 23 may be 2 mm. ⁇ 3mm.
- the first motherboard substrate 11 and the second motherboard substrate 12 can be cut by a mechanical cutting method (such as knife wheel cutting) to make the first substrate 21 and the second substrate 22
- the third substrate 23 and the third substrate 23 have a stepped structure on the side where the binding area 103 is located.
- adjacent orthographic projections In some embodiments, in the orthographic projection of the outer edges of at least three substrates in a plane parallel to the main surface of the display panel on the side where the binding area is located, except for the outermost orthographic projection, adjacent orthographic projections The distance between the projections is greater than or equal to 1/2 of the width of the cutter wheel used to cut the display panel motherboard.
- the distance D1 between the orthographic projection of the outer edge of the first substrate 21 on the second substrate 22 and the outer edge of the second substrate 22 is greater than or equal to, That is, it is not less than 1/2 of the width of the cutter wheel used to cut the display panel motherboard 10. Therefore, the first mother board substrate 11 and the second mother board substrate 12 are respectively cut by a cutter wheel so that the first substrate 21, the second substrate 22, and the third substrate 23 are stepped on the side where the binding area 103 is located. In the structure, it can ensure that sufficient processing space is left, so that the cutter wheel can be cut smoothly to form the stepped structure of the display panel 20 shown in FIG. 3.
- the first substrate 21, the second substrate 22 and the third substrate 23 further include a sealing area 104.
- the bonding area 103 at least partially surrounds the sealing area 104.
- the binding area 103 On the side where the binding area 103 is located, there is a gap between the outer edge of the first substrate 21 and the sealing area 104, there is a gap between the outer edge of the second substrate 22 and the binding area 103, and the outer edge of the third substrate 23 There is a gap with the binding area 103.
- the first motherboard substrate 11, the second motherboard substrate 12, and the third motherboard substrate 13 of the display panel motherboard 10 shown in FIG. 1 are simultaneously cut using the energy cutting beam to make the first substrate of the display panel 20 21.
- the first substrate 21 and the second substrate 23 are separated from the display panel mother board 10, or when the first substrate 21 and the second substrate 22 are cut by mechanical cutting (such as knife wheel cutting), the first substrate 21 and the second substrate When the substrate 22 and the third substrate 23 have a stepped structure on the side where the binding area 103 is located, sufficient cutting margin can be left, thereby improving the cutting accuracy of the display panel 20 and improving the cutting effect of the display panel 20, and Due to the protection of the sealing area 104, when the display panel 20 is cut to form the display panel 20, the display area of the display panel 20 will not be adversely affected, and the yield rate of the display panel 20 can be improved.
- the distance between the outer edge of the first substrate 21 and the sealing area 104 may be 0.1 mm to 1 mm
- the distance between the outer edge of the second substrate 22 and the sealing area 104 may be 3.1 mm to 5 mm
- the third substrate 23 The distance between the outer edge of and the sealing area 104 may be 5.1 mm to 8 mm.
- the display panel 20 further includes a first liquid crystal layer 211 and a second liquid crystal layer 212.
- the first liquid crystal layer 211 is located between the first substrate 21 and the second substrate 22, and the second liquid crystal layer 212 is located between the second substrate 22 and the third substrate 23.
- the second substrate 22 is a common substrate, and the side of the common substrate (ie, the second substrate 22) facing the first substrate 21 is provided with a display array element 220.
- the first substrate 21 is a color filter substrate, and a color filter layer 230 is provided on the side of the first substrate 21 facing the common substrate.
- the third substrate 23 is a light control array substrate, and a light control array element 240 is provided on the side of the third substrate 23 facing the common substrate.
- the display panel 20 further includes a first polarizing structure 251 and a second polarizing structure 252.
- the first polarizing structure 251 is located between the second substrate 22 and the second liquid crystal layer 212
- the second polarizing structure 252 is located on the side of the third substrate 23 away from the second substrate 22.
- first polarizing structure 251 and the second polarizing structure 252 may also be arranged in other suitable positions, or display
- the panel 20 may also include other polarizing structures, which are not limited in the embodiment of the present disclosure.
- the first polarizing structure 251 and the second polarizing structure 252 may include a transmissive polarizer, a metal wire grid polarizer, etc., which are not limited in the embodiment of the present disclosure.
- the first polarizing structure 251 and the second polarizing structure 252 may further include a protective layer covering the surface of the polarizer to protect the polarizer.
- the protective layer can prevent the polarizer from being damaged, thereby prolonging the service life of the polarizer.
- the material of the protective layer can be silicon oxide or silicon nitride, and the thickness of the protective layer can be greater than or equal to 4500 angstroms to form a dense protective layer, thereby achieving a better water and oxygen barrier effect.
- the display panel 20 includes a liquid crystal display structure and a light-controlling display structure as an example for description, and in some other embodiments of the present disclosure, the display panel 20 may also be Including other structures or other types of display panels, the embodiments of the present disclosure do not limit the specific functions or types of the display panel 20.
- the first substrate 21, the second substrate 22, and the third substrate 23 may all be glass substrates, quartz substrates, etc. It can be a flexible substrate, such as a polyimide substrate, for making a flexible display panel.
- the display panel motherboard 10 shown in FIG. 1 and the display panel 20 shown in FIG. 3 may also include other structures or film layers, which are not limited in the embodiments of the present disclosure.
- the first substrate 21, the second substrate 22, and the film layer located between the first substrate 21 and the second substrate 22 may be configured as a display liquid crystal panel, which may include, for example, gate lines. , Data lines, pixel electrodes, common electrodes, liquid crystal layers and color filters, etc. for various display components.
- the display liquid crystal panel may be of various types, for example, vertical electric field type or horizontal electric field type.
- horizontal electric field type it may be in-plane switching type (IPS), fringe electric field switching type (FFS) or advanced ultra-dimensional switch ( ADS) type, etc., which are not limited in the embodiments of the present disclosure.
- the second substrate 22 and the third substrate 23 and the film layer located between the second substrate 22 and the third substrate 23 may be configured as a light-controlling liquid crystal panel, which may include, for example, gate lines, data lines, pixel electrodes, and common electrodes. , Liquid crystal layer and other components used to realize light control.
- the light-controlling liquid crystal panel can also be of various types, for example, vertical electric field type or horizontal electric field type.
- vertical electric field type it can be in-plane switching type (IPS), fringe electric field switching type (FFS) or advanced ultra-dimensional switch. (ADS) type, etc., which are not limited in the embodiments of the present disclosure.
- At least one embodiment of the present disclosure further provides a method for cutting a display panel mother board as described above.
- the cutting method includes: cutting the display panel mother board along at least one cutting line located in a cutting area to form at least one display panel, wherein , The display panel corresponds to the display panel unit.
- cutting the display panel mother board along at least one cutting line located in the cutting area to form at least one display panel may include the following steps.
- Step S10 Use the energy cutting beam to cut the display panel mother board along the first cutting line of the cutting area, so that at least one part to be processed is separated from the display panel mother board.
- Each of the at least one part to be processed includes a display panel unit.
- the energy cutting beam may be a laser, an electron beam, an ion beam, or the like.
- Step S20 on the side of the part to be processed where the binding area is located, mechanically cut at least one motherboard substrate of the part to be processed along the second cutting line to form a display panel.
- the second cutting line includes at least two sub-cutting lines. In a plane parallel to the main surface of the mother board of the display panel, the distance between two adjacent sub-cutting lines of the at least two sub-cutting lines is 3 mm-4 mm.
- the arrangement direction of at least three motherboard substrates is perpendicular to the main surface of the display panel motherboard.
- the main surface of the display panel motherboard may refer to the main surface of the display panel motherboard. Machined surface.
- mechanical cutting includes knife wheel cutting.
- the second cutting line includes at least two sub-cutting lines; in a plane parallel to the main surface of the display panel mother board, the distance between two adjacent sub-cutting lines of the at least two sub-cutting lines is greater than or equal to 1 of the width of the cutter wheel. /2.
- the at least three motherboard substrates may include a first motherboard substrate, a second motherboard substrate, and a third motherboard substrate.
- a method for cutting the display panel motherboard 10 shown in FIG. 1 to form the display panel 20 shown in FIG. 3 is taken as an example to describe the cutting method of the display panel motherboard provided by the embodiment of the present disclosure.
- FIGS. 4A-4D are schematic diagrams of a method for cutting a display panel motherboard provided by some embodiments of the present disclosure.
- the cutting method includes the following steps.
- Step S110 Use the energy cutting beam to cut the display panel mother board 10 along the first cutting line L10 of the cutting area 102, so that a portion 30 to be processed is separated from the display panel mother board 10.
- each of the parts 30 to be processed includes a display panel unit 101.
- the first motherboard substrate 11, the second motherboard substrate 12, and the third motherboard substrate 13 are simultaneously cut along the first cutting line L10 by the energy cutting beam, so that the portion 30 to be processed It can be separated from the display panel motherboard 10.
- the part 30 to be processed includes a display panel unit 101 for forming the display panel 20 shown in FIG. 3.
- the energy cutting beam can be a laser, an electron beam, an ion beam, or the like.
- the first cutting line L10 may be four.
- cutting can be performed corresponding to the four sides of the rectangular display panel, so that the part 30 to be processed can be separated from the display panel mother board 10.
- the number of first cutting lines L10 may be reduced, for example, to two, etc., as long as the number of first cutting lines L10 can meet the requirements for processing
- the portion 30 can be separated from the display panel mother board 10, and the embodiment of the present disclosure does not limit this.
- the second cutting line may include the first sub-cutting line L21 and the second sub-cutting line L22 shown in FIGS. 4B and 4C.
- mechanically cutting at least one motherboard substrate of the portion to be processed along the second cutting line to form a display panel may include the following steps.
- Step S120 mechanically cutting the first mother substrate 11 of the portion 30 to be processed along the first sub-cutting line L21 (that is, one of the second cutting lines) to form the first substrate 21 of the display panel 20.
- the distance D3 between the first sub-cutting line L21 and the first cutting line L10 is 6 mm to 8 mm.
- the mechanical cutting is knife wheel cutting, that is, the knife wheel 40 is used to cut the first mother substrate 11 along the first sub-cut line L21 to form the first substrate 21.
- Step S130 mechanically cutting the second mother substrate 12 of the portion to be processed 30 along the second sub-cutting line L22 (that is, one of the second cutting lines) to form the second substrate 22 of the display panel 20.
- the mechanical cutting is knife wheel cutting, that is, the knife wheel 40 is used to cut the second mother board substrate 12 along the second sub-cut line L22 to form the second substrate 22.
- the first sub-cutting line L21 is located on the side of the second sub-cutting line L22 away from the first cutting line L10.
- the distance D1 between the first sub-cut line L21 and the second sub-cut line L22 is 3 mm to 4 mm.
- the distance D2 between the second sub-cutting line L22 and the first cutting line L10 is 3 mm to 4 mm.
- the first sub-cutting line L21 and the second sub-cutting line The distance between L22 is greater than or equal to, that is, not less than 1/2 of the width of the cutter wheel 40. Therefore, it can be ensured that the cutter wheel 40 is used to cut the first motherboard substrate 11 and the second motherboard substrate 12 so that the first substrate 21, the second substrate 22 and the third substrate 23 of the display panel 20 are located in the binding area 103.
- the cutter wheel 40 has enough processing space, so that the cutter wheel 40 can be cut smoothly to form the stepped structure of the display panel 20 shown in FIG. 4D.
- the display panel to be prepared includes the outer edge of the first substrate on the inner side of the outer edge of the second substrate and the outer edge of the third substrate on the inner side of the second substrate.
- the first mother board substrate and the third mother board substrate can be respectively cut by a cutter wheel to form the desired structure.
- the four-layer motherboard substrate when preparing a display panel including four substrates, that is, when cutting a display panel motherboard including a four-layer motherboard substrate, the four-layer motherboard substrate may be cut by a laser to make the part to be processed After being separated from the display panel mother board, a cutter wheel is used to cut each layer of the mother board substrate to form the required structure.
- the first motherboard substrate 51, the second motherboard substrate 52, the third motherboard substrate 53, and the fourth motherboard substrate 54 are cut using, for example, a laser.
- the first mother board substrate 51, the second mother board substrate 52 and the fourth mother board substrate 54 are respectively cut by a cutter wheel to form a desired, for example, stepped structure.
- the specific cutting method can refer to the cutting method of the display panel motherboard 10 shown in FIGS. 4A to 4D, which will not be repeated here.
- a display panel motherboard that includes more than four layers of motherboard substrates
- the cutter wheel is used to cut each layer of the substrate to form the required structure.
- the specific cutting method can refer to the cutting method shown in FIG. 4A to FIG. 4D, which will not be repeated here.
- At least one embodiment of the present disclosure also provides a method for manufacturing a display panel motherboard, the manufacturing method including: forming a display panel motherboard including at least one display panel unit.
- the display panel mother board includes: at least three mother board substrates, at least one display panel unit, and a cutting area that are stacked on top of each other, and the cutting area at least partially surrounds the at least one display panel unit. In the cutting area, at least two of the at least three mother substrates are not provided with an organic film layer.
- Forming the display panel mother board including at least one display panel unit includes: separately forming each of the at least three mother board substrates, and arranging the at least three mother board substrates to form the display panel mother board.
- the step of separately forming each of the at least three mother substrates includes etching and removing the organic film layer in the cutting area of at least two of the at least three mother substrates.
- each of the at least one display panel unit in each of the at least one display panel unit, at least one of the at least three mother board substrates includes a bonding area.
- the organic film layer is not provided in the bonding area.
- the step of separately forming each of the at least three mother board substrates further includes: etching and removing the organic film layer in the bonding area of the mother board substrate that is not provided with an organic film layer in the cutting area and includes the bonding area.
- the step of separately forming each of the at least three mother board substrates further includes: etching and removing the organic film in the bonding area of the mother board substrate that is not provided with an organic film layer in the cutting area and includes the bonding area. ⁇ Film layer.
- the step of separately forming each of the at least three mother board substrates further includes: etching and removing the inorganic film in the bonding area of the mother board substrate that is not provided with an inorganic film layer and includes the bonding area in the cutting area. ⁇ Film layer.
- FIGS. 5A-5I are schematic diagrams of a method for preparing a film layer on a motherboard substrate of a display panel motherboard provided by some embodiments of the present disclosure.
- the organic film layer and the inorganic film layer in the bonding area 103 and the cutting area 102 of the second mother substrate 12 are etched and removed as an example for description.
- the preparation method may include the following steps.
- Step S210 Provide a second motherboard substrate 12.
- the second motherboard substrate 12 may be a glass substrate, a quartz substrate, a plastic substrate, or the like.
- Step S220 forming the gate 281, the power wiring 282 and the bonding wiring 283 on the second motherboard substrate 12.
- a conductive thin film (such as a metal thin film) may be formed on the second mother substrate 12 by deposition or the like, and then a gate 281, power supply wiring 282, and a gate electrode 281 may be formed by a patterning method (such as a photolithography method). Bind routing 283.
- the gate 281, the power trace 282, and the bonding trace 283 may be metal molybdenum or molybdenum alloy, metal aluminum or aluminum alloy, metal copper or copper alloy, or the like.
- Step S230 A gate insulating layer 291 is formed on the gate 281, the power wiring 282 and the bonding wiring 283, and the gate insulating layer 291 in the bonding area 103 and the cutting area 102 is etched to remove the bonding.
- the gate insulating layer 291 may be formed by a method such as physical vapor deposition, chemical vapor deposition, or coating, and the gate insulating layer 291 may be an inorganic insulating layer or an organic insulating layer.
- Step S240 forming an active layer 284 on the gate insulating layer 291.
- the active layer 284 may be amorphous silicon, polysilicon, oxide semiconductor, etc., and be patterned by, for example, a photolithography process.
- Step S250 forming the source electrode 285 and the drain electrode 286 of the transistor on the active layer 284.
- the source 285 and the drain 286 of the transistor are connected to the source region and the drain region of the active layer 284, respectively.
- Step S260 forming a first insulating layer 292 and a second insulating layer 293 on the source electrode 285 and the drain electrode 286 of the transistor, and etching and removing the first insulating layer 292 and the second insulating layer 292 and the second insulating layer in the bonding region 103 and the cutting region 102
- the layer 293 is etched to remove the organic film layer or the inorganic film layer in the binding area 103 and the cutting area 102.
- the first insulating layer 292 and the second insulating layer 293 may be formed by physical vapor deposition, chemical vapor deposition, or coating.
- the first insulating layer 292 and the second insulating layer 293 may be inorganic Insulating layer or organic insulating layer.
- Step S270 preparing a first conductive film layer 287 on the first insulating layer 292 and the second insulating layer 293.
- the material of the first conductive film layer 287 may be a conductive material such as indium tin oxide.
- Step S270 Prepare a third insulating layer 294 on the first conductive film layer 287, and remove the third insulating layer 294 in the bonding area 103 and the cutting area 102 by etching, that is, removing the bonding area 103 and the cutting area 102 by etching The organic film layer or the inorganic film layer.
- the third insulating layer 294 may be formed by a method such as physical vapor deposition, chemical vapor deposition, or coating, and the third insulating layer 294 may be an inorganic insulating layer or an organic insulating layer.
- Step S280 preparing a second conductive film layer 288 on the third insulating layer 294.
- the material of the second conductive film layer 288 may be a conductive material such as indium tin oxide.
- At least one embodiment of the present disclosure further provides a display device, which includes the display panel described in any embodiment of the present disclosure, for example, includes the display panel 20 in the foregoing embodiment.
- the display device provided by the embodiment of the present disclosure may be a liquid crystal display device, or may also be another type of device with a display function, which is not limited by the embodiment of the present disclosure.
- the display device provided by the embodiment of the present disclosure may be any product or component with display function, such as a display substrate, a display panel, an electronic paper, a mobile phone, a tablet computer, a television, a monitor, a notebook computer, a digital photo frame, a navigator, etc.
- a display substrate such as a liquid crystal display (LCD)
- a display panel such as a liquid crystal display (LCD)
- an electronic paper such as a liquid crystal display
- a mobile phone such as a tablet computer
- a television a monitor, a notebook computer, a digital photo frame, a navigator, etc.
- the disclosed embodiment does not limit this.
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Abstract
Description
Claims (20)
- 一种显示面板母板,包括:至少三个母板基板,彼此层叠设置;至少一个显示面板单元;切割区域,至少部分围绕所述至少一个显示面板单元;其中,在所述切割区域中,所述至少三个母板基板中的至少两个未设置有机膜层。
- 根据权利要求1所述的显示面板母板,其中,在所述至少一个显示面板单元的每个中,所述至少三个母板基板中的至少一个包括绑定区;在所述切割区域未设置有机膜层且包括所述绑定区的母板基板上,所述绑定区未设置所述有机膜层。
- 根据权利要求1或2所述的显示面板母板,其中,在所述切割区域中,所述至少三个母板基板中的至少一个未设置无机膜层。
- 一种显示面板,通过切割如权利要求1-3中任一项所述的显示面板母板而得到,所述显示面板包括至少三个基板;其中,所述至少三个基板中的每个分别通过切割所述至少三个母板基板中的每个而得到;所述至少三个基板中的至少一个包括绑定区,所述至少一个显示面板单元之一对应于所述显示面板。
- 根据权利要求4所述的显示面板,其中,在所述绑定区所在的一侧,所述至少三个基板的外边缘在平行于所述显示面板的主表面的平面内的正投影不重合。
- 根据权利要求5所述的显示面板,其中,在所述绑定区所在的一侧,所述至少三个基板的外边缘沿第一方向呈阶梯状结构,所述第一方向垂直于所述显示面板的主表面。
- 根据权利要求6所述的显示面板,其中,在所述绑定区所在的一侧,所述至少三个基板的外边缘在平行于所述显示面板的主表面的平面内的正投影中除位于最外侧的正投影以外,相邻的正投影之间的距离大于等于用于切割所述显示面板母板的刀轮的宽度的1/2。
- 根据权利要求6所述的显示面板,其中,所述至少三个基板包括第一基板、第二基板和第三基板,所述第一基板位于所述第二基板远离所述第三基板的一侧;在所述绑定区所在的一侧,所述第一基板的外边缘在所述第二基板上的正投影位于所述第二基板的外边缘的内侧,所述第二基板的外边缘在所述第三基板上的正投影位于所述第三基板的外边缘的内侧。
- 根据权利要求8所述的显示面板,还包括:第一液晶层,位于所述第一基板和所述第二基板之间;第二液晶层,位于所述第二基板和所述第三基板之间;其中,所述第二基板为公共基板,所述公共基板面向所述第一基板的一侧设置有显示阵列元件;所述第一基板为彩膜基板,所述第一基板面向所述公共基板的一侧设置有彩色滤光层;所述第三基板为控光阵列基板,所述第三基板面向所述公共基板的一侧设置有控光阵列元件。
- 根据权利要求4-9中任一项所述的显示面板,其中,在所述绑定区中,所述至少三个基板中的至少一个未设置无机膜层。
- 根据权利要求4-10中任一项所述的显示面板,其中,所述至少三个基板中的每个还包括密封区;在包括所述绑定区的基板中,所述绑定区至少部分围绕所述密封区;在所述绑定区所在的一侧,所述至少三个基板中的每个的外边缘与所述绑定区或所述密封区之间存在间隙。
- 一种如权利要求1-3中任一项所述的显示面板母板的切割方法,包括:沿位于所述切割区域的至少一条切割线切割所述显示面板母板以形成至少一个显示面板,其中,所述显示面板对应于所述显示面板单元。
- 根据权利要求12所述的切割方法,其中,沿位于所述切割区域的所述至少一条切割线切割所述显示面板母板以形成所述至少一个显示面板,包括:利用能量切割束沿所述切割区域的第一切割线切割所述显示面板母板,以使至少一个待加工部分从所述显示面板母板分离;其中,所述至少一个待加工部分中的每个包括一个所述显示面板单元。
- 根据权利要求13所述的切割方法,其中,所述能量切割束包括激光、电子束或离子束。
- 根据权利要求13所述的切割方法,其中,沿位于所述切割区域的所述至少一条切割线切割所述显示面板母板以形成所述至少一个显示面板,还包括:在所述待加工部分的位于所述绑定区所在的一侧,沿第二切割线机械切割所述待加工部分的至少一个母板基板以形成所述显示面板。
- 根据权利要求15所述的切割方法,其中,所述机械切割包括刀轮切割;所述第二切割线包括至少两条子切割线,在平行于所述显示面板母板的主表面的平面内,所述至少两条子切割线中相邻的两条子切割线之间的距离大于等于刀轮的宽度的1/2。
- 根据权利要求15所述的切割方法,其中,所述至少三个母板基板包括第一母板基板、第二母板基板和第三母板基板,沿所述第二切割线机械切割所述待加工部分的至少一个母板基板以形成所述显示面板,包括:沿第一子切割线机械切割所述待加工部分的第一母板基板以形成所述显示面板的第一基板,以及沿第二子切割线机械切割所述待加工部分的第二母板基板以形成所述显示面板的第二基板;其中,所述第一子切割线位于所述第二子切割线远离所述第一切割线的一侧。
- 一种显示面板母板的制备方法,包括:形成包括至少一个显示面板单元的显示面板母板,其中,所述显示面板母板包括:彼此层叠设置的至少三个母板基板;至少一个显示面板单元;切割区域,至少部分围绕所述至少一个显示面板单元;其中,在所述切割区域中,所述至少三个母板基板中的至少两个未设置有机膜层;所述形成包括所述至少一个显示面板单元的所述显示面板母板,包括:分别形成所述至少三个母板基板中的每个,以及对盒所述至少三个母板基板以形成所述显示面板母板;其中,分别形成所述至少三个母板基板中的每个的步骤中包括:刻蚀去除所述至少三个母板基板中的至少两个的切割区域内的有机膜层。
- 根据权利要求18所述的制备方法,其中,在所述至少一个显示面板单元的每个中,所述至少三个母板基板中的至少一个包括绑定区;在所述切割区域未设置有机膜层且包括所述绑定区的母板基板上,所述绑定区未设置所述有机膜层;分别形成所述至少三个母板基板中的每个的步骤中还包括:刻蚀去除所述切割区域未设置有机膜层且包括所述绑定区的母板基板的绑定区内的所述有机膜层。
- 一种显示装置,包括如权利要求4-11中任一项所述的显示面板。
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