WO2019237414A1 - Lossless real-time measurement method for junction temperature of led light source - Google Patents
Lossless real-time measurement method for junction temperature of led light source Download PDFInfo
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- WO2019237414A1 WO2019237414A1 PCT/CN2018/092225 CN2018092225W WO2019237414A1 WO 2019237414 A1 WO2019237414 A1 WO 2019237414A1 CN 2018092225 W CN2018092225 W CN 2018092225W WO 2019237414 A1 WO2019237414 A1 WO 2019237414A1
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
- G01K7/00—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements
- G01K7/02—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements using thermoelectric elements, e.g. thermocouples
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01M—TESTING STATIC OR DYNAMIC BALANCE OF MACHINES OR STRUCTURES; TESTING OF STRUCTURES OR APPARATUS, NOT OTHERWISE PROVIDED FOR
- G01M11/00—Testing of optical apparatus; Testing structures by optical methods not otherwise provided for
- G01M11/02—Testing optical properties
Definitions
- the present invention relates to the technical field of measuring junction temperature of LED light sources, and in particular, to a non-destructive real-time measurement method of junction temperature of LED light sources.
- LED light sources have gradually replaced traditional light sources (such as fluorescent lamps, etc.), and have been widely used in various fields.
- traditional light sources such as fluorescent lamps, etc.
- multi-chip LED light sources were created.
- each chip will have a certain temperature difference during working lighting.
- the chip with the highest temperature will be burned out with the long-term working lighting, and the chip with the highest temperature among the remaining chips will be burned out in turn, which will cause the entire LED light source to be scrapped. Therefore, it is of great significance to measure the junction temperature of LED light sources.
- the existing LED light source is packaged in a case, and the junction temperature of the LED chip cannot be directly measured without damaging the outer case. Only the surrounding junction temperature can be obtained, which affects the measurement. The accuracy of the results. Therefore, it is necessary to propose further solutions to the above problems.
- the present invention aims to provide a non-destructive real-time measurement method of the junction temperature of an LED light source to overcome the shortcomings in the prior art.
- a non-destructive real-time measurement method for the junction temperature of an LED light source includes the following steps:
- S1 energize the LED light source to be detected, and project the optical image formed by the light beam emitted after the LED light source is energized to the screen through the optical element;
- the light beams at various positions in the optical imaging are collected separately.
- the light emitted by the ED chip is subjected to a spectral analysis to obtain information about the optical frequency peak and width of each LED chip at the corresponding position;
- the optical element is a lens group.
- the optical imaging formed by the optical element is projected on the projection screen.
- a flat rectangular coordinate system is set on the projection screen, and the optical imaging is located in the flat rectangular coordinate system.
- the collection ends of the optical fibers are brought closer to the respective positions in the optical imaging surface to collect the beams.
- the optical fiber is a glass optical fiber, a quartz optical fiber, or a plastic optical fiber.
- the junction temperature of the LED chip is individually measured by the thermocouple thermal balance method or the current pulse method, and the spectrum at different junction temperatures is measured to establish the LED spectrum- Standard curve of temperature.
- the junction temperature of the actually measured LED chip is obtained by comparing the above-mentioned measured spectral information with the spectrum-temperature comparison curve measured above.
- the measurement method further includes
- junction temperature value when the junction temperature value is within the rated temperature difference range, it indicates that the LED light source is a qualified product, otherwise it indicates that the LED light source is a defective product.
- the spectral analysis element used for the spectral analysis includes a grating and a CCD or a CMOS and a computer.
- the present invention has the following beneficial effects:
- the method for non-destructive real-time measurement of the junction temperature of the LED light source according to the present invention can measure the junction temperature of each LED chip in real-time without damage, and the Evaluate the quality and service life of the light source. At the same time, it is not necessary to touch the LED light source during the measurement process, which ensures the accuracy and real-time performance of the measurement results.
- FIG. 1 is a schematic flowchart of a method for a non-destructive real-time measurement method of a junction temperature of an LED light source according to an embodiment of the present invention.
- the invention is suitable for real-time non-destructive measurement of the junction temperature of an LED light source composed of multiple chips.
- the measurement principle of the present invention is: For an LED chip, the temperature at the time of power-on and light emission has a one-to-one correspondence with the spectrum at the temperature, so the corresponding junction temperature can be obtained indirectly by acquiring the spectrum of the LED chip in real time. Temperature value.
- the method for non-destructive real-time measurement of the junction temperature of an LED light source includes the following steps:
- S1 The LED light source to be detected is energized, and an optical image formed by the light beam emitted after the LED light source is energized is passed through an optical element and projected onto a screen.
- the optical element used is a lens group.
- the lens group includes at least two lenses.
- the optical imaging formed by the light beam passing through the optical element is projected on a projection screen, which is located on the optical path of the optical element.
- the optical imaging can be directly taken as an object to avoid contact with the LED chip, which facilitates the measurement of the LED chip junction temperature.
- a flat rectangular coordinate system is set on the projection screen, and the optical imaging is located in the planar rectangular coordinate system.
- the light emitted by the ED chip is subjected to spectral analysis to obtain the optical frequency peak and width information of each LED chip including the corresponding position.
- the white light includes not only the light emitted by the LED chip, but also doped with excitation fluorescence. Therefore, in order to ensure the accuracy of the result, it is necessary to remove the collected light beam before performing spectral analysis. Excitation light.
- the collection ends of the optical fibers are approached to the respective positions in the optical imaging plane to perform the light beam collection. Therefore, the light beams at various positions enter the optical fiber through the acquisition end, are transmitted along the optical fiber, and then enter the spectrometer for spectral analysis.
- the optical fiber is a glass optical fiber or a quartz optical fiber or a plastic optical fiber.
- an aperture may be provided between the optical fiber and the projection sheet.
- the spectral analysis components used for spectral analysis include gratings and CCDs or CMOS and computers.
- the junction temperature of the LED chip is individually measured by a thermocouple thermal balance method or a current pulse method, and spectra at different junction temperatures are measured to thereby establish a standard curve of LED spectrum-temperature. Therefore, the actual measured junction temperature of the LED chip is obtained by comparing the measured spectral information with the measured spectral-temperature comparison curve.
- the measurement method further includes:
- junction temperature value when the junction temperature value is within the rated temperature difference range, it indicates that the LED light source is a qualified product, otherwise it indicates that the LED light source is a defective product. Therefore, when the difference is within the rated temperature difference range, it indicates that the heat distribution of each LED chip in the LED light source is well balanced, and a single LED chip will not cause a short circuit or short circuit due to overheating. Otherwise, it indicates the heat distribution of each LED chip in the LED light source The balance is poor, the temperature of individual LED chips is too high, and burn-out problems are prone to occur after long hours of work.
- the method for non-destructive real-time measurement of the junction temperature of the LED light source of the present invention can measure the junction temperature of each LED chip in real time without damage, and evaluate the quality and service life of the LED light source according to the measurement results. At the same time, it is not necessary to touch the LED light source during the measurement process, which ensures the accuracy and real-time of the measurement results.
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- Testing Of Optical Devices Or Fibers (AREA)
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- Investigating, Analyzing Materials By Fluorescence Or Luminescence (AREA)
Abstract
The present invention provides a lossless real-time measurement method for the junction temperature of an LED light source. The method comprises the following steps: S1, energizing an LED light source to be detected, and projecting, onto a screen, an optical image formed by a light beam emitted by the energized LED light source after passing through an optical element; S2, establishing a position correlation between each LED chip in the LED light source and the optical image; S3, according to the established correlation, respectively collecting a light beam at each position in the optical image, carrying out spectral analysis on light emitted by the LED chip in the light beam, and obtaining an optical frequency peak value and width information of each LED chip including a corresponding position; and S4, establishing a standard curve of a spectrum-temperature relationship, and combining the standard curve and an obtained spectrum to determine the junction temperature of each LED chip in the LED light source. By means of the present invention, the junction temperature of each LED chip can be measured in a real-time and lossless manner, and according to a measurement result, the quality and the service life of an LED light source are evaluated.
Description
说明书 发明名称: LED光源结温的无损实时测量方法 技术领域 Specification Invention Name: Nondestructive real-time measurement method for junction temperature of LED light source Technical field
[0001] 本发明涉及一种 LED光源结温测量技术领域, 尤其涉及一种 LED光源结温的无 损实时测量方法。 [0001] The present invention relates to the technical field of measuring junction temperature of LED light sources, and in particular, to a non-destructive real-time measurement method of junction temperature of LED light sources.
背景技术 Background technique
[0002] 目前, 随着 LED的发展, LED光源已经逐步取代了传统光源 (如日光灯等) , 并在各个领域得到了广泛的应用。 为了提供充足的照明, 多芯片的 LED光源应用 而生。 然而, 由于不同芯片之间性能和质量的差异, 各个芯片在工作照明时会 有一定的温度差。 当该温度差较大时, 随着长时间的工作照明, 温度最高的芯 片会被烧坏, 剩余芯片中温度最高的芯片会被依次烧坏, 继而导致整个 LED光源 的报废。 因此, 对于 LED光源的结温进行测量具有重要的意义。 然而, 现有的 L ED光源是封装于壳体中的, 在不破坏外部壳体的条件下无法直接测量 LED芯片 的结温温度, 而只能获得其周围的结温温度, 进而影响了测量结果的准确性。 因此, 针对上述问题, 有必要提出进一步地解决方案。 [0002] Currently, with the development of LEDs, LED light sources have gradually replaced traditional light sources (such as fluorescent lamps, etc.), and have been widely used in various fields. In order to provide sufficient lighting, multi-chip LED light sources were created. However, due to the difference in performance and quality between different chips, each chip will have a certain temperature difference during working lighting. When the temperature difference is large, the chip with the highest temperature will be burned out with the long-term working lighting, and the chip with the highest temperature among the remaining chips will be burned out in turn, which will cause the entire LED light source to be scrapped. Therefore, it is of great significance to measure the junction temperature of LED light sources. However, the existing LED light source is packaged in a case, and the junction temperature of the LED chip cannot be directly measured without damaging the outer case. Only the surrounding junction temperature can be obtained, which affects the measurement. The accuracy of the results. Therefore, it is necessary to propose further solutions to the above problems.
发明概述 Summary of invention
技术问题 technical problem
问题的解决方案 Problem solution
技术解决方案 Technical solutions
[0003] 本发明旨在提供一种 LED光源结温的无损实时测量方法, 以克服现有技术中存 在的不足。 [0003] The present invention aims to provide a non-destructive real-time measurement method of the junction temperature of an LED light source to overcome the shortcomings in the prior art.
[0004] 为解决上述技术问题, 本发明的技术方案是: [0004] In order to solve the above technical problems, the technical solution of the present invention is:
[0005] 一种 LED光源结温的无损实时测量方法, 其包括如下步骤: [0005] A non-destructive real-time measurement method for the junction temperature of an LED light source includes the following steps:
[0006] S1、 对待检测的 LED光源进行通电, 将 LED光源通电后发出的光束经光学元件 后形成的光学成像投影到屏上; [0006] S1, energize the LED light source to be detected, and project the optical image formed by the light beam emitted after the LED light source is energized to the screen through the optical element;
[0007] S2、 建立 LED光源中各 LED芯片与光学成像之间的位置对应关系; [0007] S2. Establish a position correspondence between each LED chip and optical imaging in the LED light source;
[0008] S3、 根据建立的对应关系, 分别采集光学成像中各个位置的光束, 对光束中 L
ED芯片发出的光进行光谱分析, 获得包括对应位置的各 LED芯片的光频峰值、 宽度信息; [0008] S3. According to the established corresponding relationship, the light beams at various positions in the optical imaging are collected separately. The light emitted by the ED chip is subjected to a spectral analysis to obtain information about the optical frequency peak and width of each LED chip at the corresponding position;
[0009] S4、 建立光谱-温度关系的标准曲线, 结合标准曲线和获得的光谱, 确定 LED 光源中各 LED芯片的结温温度。 [0009] S4. Establish a standard curve of the spectrum-temperature relationship, and determine the junction temperature of each LED chip in the LED light source by combining the standard curve and the obtained spectrum.
[0010] 作为本发明的 LED光源结温的无损实时测量方法的改进, 所述光学元件为透镜 组。 [0010] As an improvement of the non-destructive real-time measurement method of the junction temperature of the LED light source of the present invention, the optical element is a lens group.
[0011] 作为本发明的 LED光源结温的无损实时测量方法的改进, 经光学元件形成的光 学成像投射于投影屏上。 [0011] As an improvement of the non-destructive real-time measurement method of the junction temperature of the LED light source of the present invention, the optical imaging formed by the optical element is projected on the projection screen.
[0012] 作为本发明的 LED光源结温的无损实时测量方法的改进, 所述投影屏上设置有 平面直角坐标系, 所述光学成像位于所述平面直角坐标系中。 [0012] As an improvement of the non-destructive real-time measurement method of the junction temperature of the LED light source of the present invention, a flat rectangular coordinate system is set on the projection screen, and the optical imaging is located in the flat rectangular coordinate system.
[0013] 作为本发明的 LED光源结温的无损实时测量方法的改进, 采集光学成像中各个 位置的光束时, 将光纤的采集端分别靠近光学成像面中的各个位置进行光束采 集。 [0013] As an improvement of the non-destructive real-time measurement method of the junction temperature of the LED light source of the present invention, when collecting light beams at various positions in the optical imaging, the collection ends of the optical fibers are brought closer to the respective positions in the optical imaging surface to collect the beams.
[0014] 作为本发明的 LED光源结温的无损实时测量方法的改进, 所述光纤为玻璃光纤 或者石英光纤或者塑料光纤。 [0014] As an improvement of the non-destructive real-time measurement method of the junction temperature of the LED light source of the present invention, the optical fiber is a glass optical fiber, a quartz optical fiber, or a plastic optical fiber.
[0015] 作为本发明的 LED光源结温的无损实时测量方法的改进, 通过热电偶热平衡法 或者电流脉冲法单独测量 LED芯片结温, 并且测量不同结温下的光谱, 以此建立 LED光谱 -温度的标准曲线。 [0015] As an improvement of the non-destructive real-time measurement method of the junction temperature of the LED light source of the present invention, the junction temperature of the LED chip is individually measured by the thermocouple thermal balance method or the current pulse method, and the spectrum at different junction temperatures is measured to establish the LED spectrum- Standard curve of temperature.
[0016] 作为本发明的 LED光源结温的无损实时测量方法的改进, 实际测量的 LED芯片 结温是通过以上测量光谱信息比较以上测得的光谱-温度比较曲线获得。 [0016] As an improvement of the non-destructive real-time measurement method of the junction temperature of the LED light source of the present invention, the junction temperature of the actually measured LED chip is obtained by comparing the above-mentioned measured spectral information with the spectrum-temperature comparison curve measured above.
[0017] 作为本发明的 LED光源结温的无损实时测量方法的改进, 所述测量方法还包括 [0017] As an improvement of the non-destructive real-time measurement method of the junction temperature of the LED light source of the present invention, the measurement method further includes
[0018] 对比所有 LED芯片结温的数值, 当结温值位于额定的温差范围内时, 表明 LED 光源为合格品, 否则表明 LED光源为不合格品。 [0018] Comparing the junction temperature values of all LED chips, when the junction temperature value is within the rated temperature difference range, it indicates that the LED light source is a qualified product, otherwise it indicates that the LED light source is a defective product.
[0019] 作为本发明的 LED光源结温的无损实时测量方法的改进, 进行光谱分析所采用 的光谱分析元件包括光栅和 CCD或者 CMOS和计算机。 [0019] As an improvement of the non-destructive real-time measurement method of the junction temperature of the LED light source of the present invention, the spectral analysis element used for the spectral analysis includes a grating and a CCD or a CMOS and a computer.
发明的有益效果 The beneficial effects of the invention
有益效果
[0020] 与现有技术相比, 本发明的有益效果是: 本发明的 LED光源结温的无损实时测 量方法能够实时无损地对每个 LED芯片的结温进行测量, 并根据测量结果对 LED 光源的质量、 使用寿命作出评价。 同时, 测量过程中, 不必接触 LED光源, 保证 了测量结果的准确性和实时性。 Beneficial effect [0020] Compared with the prior art, the present invention has the following beneficial effects: The method for non-destructive real-time measurement of the junction temperature of the LED light source according to the present invention can measure the junction temperature of each LED chip in real-time without damage, and the Evaluate the quality and service life of the light source. At the same time, it is not necessary to touch the LED light source during the measurement process, which ensures the accuracy and real-time performance of the measurement results.
对附图的简要说明 Brief description of the drawings
附图说明 BRIEF DESCRIPTION OF THE DRAWINGS
[0021] 为了更清楚地说明本发明实施例或现有技术中的技术方案, 下面将对实施例或 现有技术描述中所需要使用的附图作简单地介绍, 显而易见地, 下面描述中的 附图仅仅是本发明中记载的一些实施例, 对于本领域普通技术人员来讲, 在不 付出创造性劳动的前提下, 还可以根据这些附图获得其他的附图。 [0021] In order to explain the technical solutions in the embodiments of the present invention or the prior art more clearly, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the following description The drawings are just some of the embodiments described in the present invention. For those of ordinary skill in the art, other drawings can be obtained based on these drawings without paying creative labor.
[0022] 图 1为本发明的 LED光源结温的无损实时测量方法一具体实施方式的方法流程 示意图。 [0022] FIG. 1 is a schematic flowchart of a method for a non-destructive real-time measurement method of a junction temperature of an LED light source according to an embodiment of the present invention.
实施该发明的最佳实施例 The best embodiment for carrying out the invention
本发明的最佳实施方式 Best Mode of the Invention
[0023] 下面将结合本发明实施例中的附图, 对本发明实施例中的技术方案进行清楚、 完整地描述, 显然, 所描述的实施例仅仅是本发明一部分实施例, 而不是全部 的实施例。 基于本发明中的实施例, 本领域普通技术人员在没有做出创造性劳 动前提下所获得的所有其他实施例, 都属于本发明保护的范围。 [0023] The technical solutions in the embodiments of the present invention will be clearly and completely described with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, but not all of the implementations. example. Based on the embodiments of the present invention, all other embodiments obtained by a person of ordinary skill in the art without creative efforts shall fall within the protection scope of the present invention.
[0024] 本发明适用于对由多芯片组成的 LED光源的结温进行实时无损测量。 本发明的 测量原理为: 对于 LED芯片而言, 其通电发光时的温度与该温度下的光谱具有一 一对应的关系, 因此通过实时地获取 LED芯片的光谱可间接地得到其对应的结温 温度值。 [0024] The invention is suitable for real-time non-destructive measurement of the junction temperature of an LED light source composed of multiple chips. The measurement principle of the present invention is: For an LED chip, the temperature at the time of power-on and light emission has a one-to-one correspondence with the spectrum at the temperature, so the corresponding junction temperature can be obtained indirectly by acquiring the spectrum of the LED chip in real time. Temperature value.
[0025] 如图 1所示, 本发明的 LED光源结温的无损实时测量方法包括如下步骤: [0025] As shown in FIG. 1, the method for non-destructive real-time measurement of the junction temperature of an LED light source according to the present invention includes the following steps:
[0026] S1、 对待检测的 LED光源进行通电, 将 LED光源通电后发出的光束经光学元件 后形成的光学成像投影到屏上。 [0026] S1. The LED light source to be detected is energized, and an optical image formed by the light beam emitted after the LED light source is energized is passed through an optical element and projected onto a screen.
[0027] 其中, 为了获得 LED光源的光学成像, 采用的光学元件为透镜组。 优选地, 所 述透镜组中至少包括两个透镜。 同时, 经过光学元件的光束形成的光学成像投 射于一投影屏, 该投影屏位于所述光学元件的光路上。
[0028] S2、 建立 LED光源中各 LED芯片与光学成像之间的位置对应关系。 [0027] Among them, in order to obtain optical imaging of the LED light source, the optical element used is a lens group. Preferably, the lens group includes at least two lenses. At the same time, the optical imaging formed by the light beam passing through the optical element is projected on a projection screen, which is located on the optical path of the optical element. [0028] S2. Establish a position correspondence between each LED chip and optical imaging in the LED light source.
[0029] 从而, 由于 LED芯片与光学成像之间的对应关系, 可直接以光学成像为对象, 避免接触 LED芯片, 方便了 LED芯片结温的测量。 为了方便地建立各 LED芯片与 光学成像之间的位置对应关系, 所述投影屏上设置有平面直角坐标系, 所述光 学成像位于所述平面直角坐标系中。 [0029] Therefore, due to the corresponding relationship between the LED chip and the optical imaging, the optical imaging can be directly taken as an object to avoid contact with the LED chip, which facilitates the measurement of the LED chip junction temperature. In order to conveniently establish a position correspondence between each LED chip and optical imaging, a flat rectangular coordinate system is set on the projection screen, and the optical imaging is located in the planar rectangular coordinate system.
[0030] S3、 根据建立的对应关系, 分别采集光学成像中各个位置的光束, 对光束中 L [0030] S3. According to the established correspondence relationship, collect light beams at various positions in the optical imaging, respectively.
ED芯片发出的光进行光谱分析, 获得包括对应位置的各 LED芯片的光频峰值、 宽度信息。 The light emitted by the ED chip is subjected to spectral analysis to obtain the optical frequency peak and width information of each LED chip including the corresponding position.
[0031] 由于 LED光源发出的光为白光, 该白光中不仅包括 LED芯片发出的光, 还掺杂 有激发荧光, 因此为了保证结果的准确性, 在进行光谱分析之前, 需要去除采 集的光束中的激发光。 [0031] Since the light emitted by the LED light source is white light, the white light includes not only the light emitted by the LED chip, but also doped with excitation fluorescence. Therefore, in order to ensure the accuracy of the result, it is necessary to remove the collected light beam before performing spectral analysis. Excitation light.
[0032] 进一步地, 采集光学成像中各个位置的光束时, 将光纤的采集端分别靠近光学 成像面中的各个位置进行光束采集。 从而, 各个位置的光束通过采集端进入到 光纤中, 并沿光纤进行传导, 进而进入到光谱仪中进行光谱分析。 优选地, 所 述光纤为玻璃光纤或者石英光纤或者塑料光纤。 此外, 为了滤除光学成像之外 的光束的干扰, 可在光纤与投影片之间设置光阑。 进行光谱分析所采用的光谱 分析元件包括光栅和 CCD或者 CMOS和计算机。 [0032] Further, when collecting the light beams at various positions in the optical imaging, the collection ends of the optical fibers are approached to the respective positions in the optical imaging plane to perform the light beam collection. Therefore, the light beams at various positions enter the optical fiber through the acquisition end, are transmitted along the optical fiber, and then enter the spectrometer for spectral analysis. Preferably, the optical fiber is a glass optical fiber or a quartz optical fiber or a plastic optical fiber. In addition, in order to filter out the interference of light beams other than optical imaging, an aperture may be provided between the optical fiber and the projection sheet. The spectral analysis components used for spectral analysis include gratings and CCDs or CMOS and computers.
[0033] S4、 建立光谱-温度关系的标准曲线, 结合标准曲线和获得的光谱, 确定 LED 光源中各 LED芯片的结温温度。 [0033] S4. Establish a standard curve of the spectrum-temperature relationship, and determine the junction temperature of each LED chip in the LED light source by combining the standard curve and the obtained spectrum.
[0034] 优选地, 通过热电偶热平衡法或者电流脉冲法单独测量 LED芯片结温, 并且测 量不同结温下的光谱, 以此建立 LED光谱 -温度的标准曲线。 从而, 实际测量的 L ED芯片结温是通过以上测量光谱信息比较以上测得的光谱-温度比较曲线获得。 此外, 为了根据测量结果对 LED光源的质量、 使用寿命作出评价, 所述测量方法 还包括: [0034] Preferably, the junction temperature of the LED chip is individually measured by a thermocouple thermal balance method or a current pulse method, and spectra at different junction temperatures are measured to thereby establish a standard curve of LED spectrum-temperature. Therefore, the actual measured junction temperature of the LED chip is obtained by comparing the measured spectral information with the measured spectral-temperature comparison curve. In addition, in order to evaluate the quality and service life of the LED light source according to the measurement results, the measurement method further includes:
[0035] 对比所有 LED芯片结温的数值, 当结温值位于额定的温差范围内时, 表明 LED 光源为合格品, 否则表明 LED光源为不合格品。 从而, 当所述差值位于额定的温 差范围内时, 表明 LED光源中各 LED芯片的热分布平衡性较好, 单个 LED芯片不 会因过热出现短路或者短路的问题。 否则, 表明 LED光源中各 LED芯片的热分布
平衡性较差, 个别 LED芯片温度过高, 长时间工作后容易发生烧坏的问题。 [0035] Comparing the junction temperature values of all LED chips, when the junction temperature value is within the rated temperature difference range, it indicates that the LED light source is a qualified product, otherwise it indicates that the LED light source is a defective product. Therefore, when the difference is within the rated temperature difference range, it indicates that the heat distribution of each LED chip in the LED light source is well balanced, and a single LED chip will not cause a short circuit or short circuit due to overheating. Otherwise, it indicates the heat distribution of each LED chip in the LED light source The balance is poor, the temperature of individual LED chips is too high, and burn-out problems are prone to occur after long hours of work.
[0036] 综上所述, 本发明的 LED光源结温的无损实时测量方法能够实时无损地对每个 LED芯片的结温进行测量, 并根据测量结果对 LED光源的质量、 使用寿命作出评 价。 同时, 测量过程中, 不必接触 LED光源, 保证了测量结果的准确性和实时性 [0036] In summary, the method for non-destructive real-time measurement of the junction temperature of the LED light source of the present invention can measure the junction temperature of each LED chip in real time without damage, and evaluate the quality and service life of the LED light source according to the measurement results. At the same time, it is not necessary to touch the LED light source during the measurement process, which ensures the accuracy and real-time of the measurement results.
[0037] 对于本领域技术人员而言, 显然本发明不限于上述示范性实施例的细节, 而且 在不背离本发明的精神或基本特征的情况下, 能够以其他的具体形式实现本发 明。 因此, 无论从哪一点来看, 均应将实施例看作是示范性的, 而且是非限制 性的, 本发明的范围由所附权利要求而不是上述说明限定, 因此旨在将落在权 利要求的等同要件的含义和范围内的所有变化囊括在本发明内。 不应将权利要 求中的任何附图标记视为限制所涉及的权利要求。 [0037] It will be apparent to those skilled in the art that the present invention is not limited to the details of the above exemplary embodiments, and the present invention can be implemented in other specific forms without departing from the spirit or basic features of the present invention. Therefore, the embodiments are to be regarded as exemplary and non-limiting in every respect. The scope of the present invention is defined by the appended claims rather than the above description, and is therefore intended to fall within the claims. All changes that are within the meaning and scope of equivalent elements are encompassed by the invention. Any reference signs in the claims should not be construed as limiting the claims involved.
[0038] 此外, 应当理解, 虽然本说明书按照实施方式加以描述, 但并非每个实施方式 仅包含一个独立的技术方案, 说明书的这种叙述方式仅仅是为清楚起见, 本领 域技术人员应当将说明书作为一个整体, 各实施例中的技术方案也可以经适当 组合, 形成本领域技术人员可以理解的其他实施方式。
[0038] In addition, it should be understood that although this description is described in terms of embodiments, not every embodiment includes only an independent technical solution, and this description of the description is for clarity only, and those skilled in the art should make the description As a whole, the technical solutions in the embodiments can also be appropriately combined to form other implementations that can be understood by those skilled in the art.
Claims
权利要求书 Claim
[权利要求 1] 一种 LED光源结温的无损实时测量方法, 其特征在于, 所述测量方法 包括如下步骤: [Claim 1] A non-destructive real-time measurement method for the junction temperature of an LED light source, characterized in that the measurement method includes the following steps:
51、 对待检测的 LED光源进行通电, 将 LED光源通电后发出的光束经 光学元件后形成的光学成像投影到屏上; 51. The LED light source to be detected is powered on, and the optical image formed by the optical beam emitted after the LED light source is powered on is projected onto the screen through the optical element;
52、 建立 LED光源中各 LED芯片与光学成像之间的位置对应关系; 52. Establish a positional correspondence between each LED chip and optical imaging in the LED light source;
53、 根据建立的对应关系, 分别采集光学成像中各个位置的光束, 对 光束中 LED芯片发出的光进行光谱分析, 获得包括对应位置的各 LED 芯片的光频峰值、 宽度信息; 53. According to the established correspondence relationship, collect light beams at various positions in the optical imaging respectively, and perform spectral analysis on the light emitted by the LED chips in the light beam to obtain the optical frequency peak and width information of the LED chips including the corresponding positions;
54、 建立光谱-温度关系的标准曲线, 结合标准曲线和获得的光谱, 确定 LED光源中各 LED芯片的结温温度。 54. Establish a standard curve of the spectrum-temperature relationship, and determine the junction temperature of each LED chip in the LED light source by combining the standard curve and the obtained spectrum.
[权利要求 2] 根据权利要求 1所述的 LED光源结温的无损实时测量方法, 其特征在 于, 所述光学元件为透镜组。 [Claim 2] The non-destructive real-time measurement method for the junction temperature of the LED light source according to claim 1, wherein the optical element is a lens group.
[权利要求 3] 根据权利要求 1所述的 LED光源结温的无损实时测量方法, 其特征在 于, 经光学元件形成的光学成像投射于投影屏上。 [Claim 3] The method for non-destructive real-time measurement of the junction temperature of an LED light source according to claim 1, wherein an optical image formed by an optical element is projected on a projection screen.
[权利要求 4] 根据权利要求 3所述的 LED光源结温的无损实时测量方法, 其特征在 于, 所述投影屏上设置有平面直角坐标系, 所述光学成像位于所述平 面直角坐标系中。 [Claim 4] The method for non-destructive real-time measurement of the junction temperature of an LED light source according to claim 3, wherein a flat rectangular coordinate system is set on the projection screen, and the optical imaging is located in the flat rectangular coordinate system. .
[权利要求 5] 根据权利要求 1所述的 LED光源结温的无损实时测量方法, 其特征在 于, 采集光学成像中各个位置的光束时, 将光纤的采集端分别靠近光 学成像面中的各个位置进行光束采集。 [Claim 5] The method for non-destructive real-time measurement of the junction temperature of the LED light source according to claim 1, characterized in that, when collecting light beams at various positions in optical imaging, the collection ends of the optical fibers are brought closer to the positions in the optical imaging surface, respectively. Beam collection.
[权利要求 6] 根据权利要求 5所述的 LED光源结温的无损实时测量方法, 其特征在 于, 所述光纤为玻璃光纤或者石英光纤或者塑料光纤。 [Claim 6] The method for non-destructive real-time measurement of the junction temperature of an LED light source according to claim 5, wherein the optical fiber is a glass optical fiber, a quartz optical fiber, or a plastic optical fiber.
[权利要求 7] 根据权利要求 1所述的 LED光源结温的无损实时测量方法, 其特征在 于, 通过热电偶热平衡法或者电流脉冲法单独测量 LED芯片结温, 并 且测量不同结温下的光谱, 以此建立 LED光谱 -温度的标准曲线。 [Claim 7] The non-destructive real-time measurement method for the junction temperature of the LED light source according to claim 1, characterized in that the junction temperature of the LED chip is individually measured by a thermocouple thermal balance method or a current pulse method, and the spectrum at different junction temperatures is measured In this way, a standard curve of LED spectrum-temperature is established.
[权利要求 8] 根据权利要求 1所述的 LED光源结温的无损实时测量方法, 其特征在 于, 实际测量的 LED芯片结温是通过以上测量光谱信息比较以上测得
的光谱-温度比较曲线获得。 。 [Claim 8] The method for non-destructive real-time measurement of the junction temperature of an LED light source according to claim 1, wherein the actually measured junction temperature of the LED chip is obtained by comparing the above measured spectral information with the above measurement The spectrum-temperature comparison curve was obtained. .
[权利要求 9] 根据权利要求 1所述的 LED光源结温的无损实时测量方法, 其特征在 于, 所述测量方法还包括: [Claim 9] The non-destructive real-time measurement method for the junction temperature of the LED light source according to claim 1, wherein the measurement method further comprises:
对比所有 LED芯片结温的数值, 当结温值位于额定的温差范围内时, 表明 LED光源为合格品, 否则表明 LED光源为不合格品。 Comparing the junction temperature values of all LED chips, when the junction temperature value is within the rated temperature difference range, it indicates that the LED light source is a qualified product, otherwise it indicates that the LED light source is a defective product.
[权利要求 10] 根据权利要求 1所述的 LED光源结温的无损实时测量方法, 其特征在 于, 进行光谱分析所采用的光谱分析元件包括光栅和 CCD或者 CMOS 和计算机。
[Claim 10] The method for non-destructive real-time measurement of the junction temperature of an LED light source according to claim 1, wherein the spectral analysis element used for the spectral analysis includes a grating and a CCD or a CMOS and a computer.
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