WO2019138564A1 - ヒートシンク - Google Patents
ヒートシンク Download PDFInfo
- Publication number
- WO2019138564A1 WO2019138564A1 PCT/JP2018/000746 JP2018000746W WO2019138564A1 WO 2019138564 A1 WO2019138564 A1 WO 2019138564A1 JP 2018000746 W JP2018000746 W JP 2018000746W WO 2019138564 A1 WO2019138564 A1 WO 2019138564A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- heat sink
- heat
- heat dissipating
- fin
- radiation
- Prior art date
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
- H05K1/0209—External configuration of printed circuit board adapted for heat dissipation, e.g. lay-out of conductors, coatings
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
- H01L23/3672—Foil-like cooling fins or heat sinks
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
- H05K7/20509—Multiple-component heat spreaders; Multi-component heat-conducting support plates; Multi-component non-closed heat-conducting structures
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/06—Thermal details
- H05K2201/066—Heatsink mounted on the surface of the PCB
Definitions
- the present invention relates to a heat sink, and more particularly to a heat sink provided with heat dissipating fins.
- the heat sink has come to behave as a radiation source of electromagnetic noise. That is, noise is superimposed on the heat sink by conducting the noise of the printed circuit board to the heat sink, or, for example, by coupling the component or wiring on the printed circuit board with the heat sink, the heat sink acts as an antenna, and the noise is secondary.
- the radiation may cause a system malfunction.
- the present invention has been made in view of the above-described problems, and an object thereof is to provide a heat sink capable of achieving design freedom and reducing electromagnetic noise.
- the portion of one of the plurality of radiation fins and the portion of the other radiation fin are electrically connected by the conductive member It is done.
- the impedance on the open end side of the plurality of heat radiation fins can be reduced, and the electromagnetic noise can be returned to any of the signal ground potential, the frame ground potential and the ground of the printed circuit board.
- the degree of freedom in design can be achieved and the strength of the electromagnetic noise can be reduced without being restricted by the wavelength of the electromagnetic wave and without being restricted by the material of the radiation fin.
- FIG. 16 is an enlarged perspective view showing another example of the connection member in the embodiment. It is a perspective view which shows an example of the state in which the heat sink which concerns on Embodiment 5 of this invention was mounted in the printed circuit board.
- Embodiment 1 The heat sink according to the first embodiment will be described.
- the heat sink 1 is mounted on, for example, a printed circuit board 51.
- An electronic component 53 is mounted on the printed circuit board 51.
- the heat sink 1 is disposed in contact with the electronic component 53.
- the heat generated from the electronic component 53 such as a large scale integrated circuit is dissipated through the heat sink 1.
- the structure of the heat sink 1 will be described in detail.
- the heat sink 1 includes a base portion 3, a gap securing member 5, a plurality of heat radiation fins 7, and an upper sheet metal 9 as a conductive member.
- the base portion 3 is flat and has a constant thickness.
- the gap securing member 5 secures a space between the base portion 3 and the printed circuit board 51 such that the base portion 3 contacts or approaches the electronic component 53.
- base member 3 and printed circuit board 51 can be electrically connected by separately providing a conductive member such as a screw, an on-board contact or a gasket. It may be connected to
- Each of the plurality of heat dissipating fins 7 has a width W in the X direction, and has a length H extending in the Z direction.
- Each of the plurality of heat dissipating fins 7 has a first end 7 a and a second end 7 b opposite to each other across the length H.
- the plurality of radiation fins 7 are disposed in the base portion 3 at an interval from each other in the Y direction.
- the first end 7 a of the radiation fin 7 is fixed to the base 3.
- the second end 7 b side of the radiation fin 7 is an open end side.
- the plurality of heat dissipating fins 7 are formed of the same metal material, which has high thermal conductivity and high conductivity. Moreover, as for several radiation fin 7, it is desirable to form from the same size. The same size is not intended to be completely the same, but includes a manufacturing error.
- the heat dissipating fins 7 are preferably made of, for example, aluminum, an aluminum alloy, copper or the like.
- the impedance at the open end side of the plurality of heat radiation fins 7 can be reduced. Furthermore, the electromagnetic noise conducted to the heat sink 1 can be returned to the ground through the base portion 3 and the gap securing member 5.
- the open end sides of the plurality of heat radiation fins 7 are locked to each other by the projections 13 with a relatively narrow width. For this reason, the impedance at the open end side of the radiation fin 7 can be reduced. Further, as described in the first embodiment, the electromagnetic noise conducted to the heat sink 1 can be returned to the ground through the base portion 3 and the gap securing member 5.
- a pair of side surface metal plates 19 is disposed as a conductive member.
- Each of the plurality of radiation fins 7 has a third end 7 c and a fourth end 7 d opposite to each other across the width W.
- One side surface metal plate 19 of the pair of side surface metal plates 19 is disposed at a portion of the third end 7 c of each of the plurality of heat radiation fins 7 located on the open end side.
- the other side surface metal plate 19 is disposed at a portion of the fourth end 7 d of each of the plurality of heat radiation fins 7 located on the open end side.
- the side surface metal plate 19 is an alternative to the upper surface metal plates 9 and 11, etc., it is desirable that the upper portion of each of the third end 7c and the fourth end 7d of the radiation fin 7 be a position to arrange the side surface .
- the plate-like member is mainly described as an example of the conductive member, but it is not limited to the plate-like member as long as a plurality of heat radiation fins can be electrically connected.
- it may be in the form of a tape having conductivity.
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Thermal Sciences (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
Description
実施の形態1に係るヒートシンクについて説明する。
実施の形態2に係るヒートシンクについて説明する。
(第1例)
実施の形態3に係るヒートシンクの第1例について説明する。
実施の形態3に係るヒートシンクの第2例について説明する。
実施の形態4に係るヒートシンクについて説明する。
実施の形態5に係るヒートシンクについて説明する。
Claims (15)
- プリント基板に搭載され、前記プリント基板のシグナルグラウンド電位、フレームグラウンド電位およびアースのいずれかに電気的に接続されるベース部と、
前記ベース部に互いに間隔を隔てて配置され、前記ベース部と電気的に接続された複数の放熱フィンと
を有し、
複数の前記放熱フィンにおける、前記ベース部に取り付けられている側とは反対側の開放端側では、複数の前記放熱フィンのうち、一の放熱フィンの部分と他の放熱フィンの部分とが、導電性部材によって電気的に接続されている、ヒートシンク。 - 複数の前記放熱フィンのそれぞれは、第1方向に幅を有して前記第1方向と交差する第2方向に延在しており、
複数の前記放熱フィンは、前記第1方向および前記第2方向と交差する第3方向に互いに間隔を隔てて前記ベース部に配置されており、
複数の前記放熱フィンのそれぞれは、
前記ベース部に取り付けられる第1端部と、
前記第1端部とは前記第2方向に距離を隔てて対向し、前記開放端側に位置する第2端部と
を有し、
前記一の放熱フィンの前記第2端部と前記他の放熱フィンの前記第2端部とが、前記導電性部材によって電気的に接続されている、請求項1記載のヒートシンク。 - 前記第2端部は、前記第1方向に延在する端面を有し、
前記導電性部材は、前記端面に接続されている、請求項2記載のヒートシンク。 - 前記導電性部材は板状である、請求項3記載のヒートシンク。
- 前記導電性部材は、前記第1方向に互いに間隔を隔てて配置された第1部材と第2部材とを含む、請求項2記載のヒートシンク。
- 前記導電性部材は、前記第2端部における前記第1方向の一端から他端にわたり、前記開放端側に位置する前記一の放熱フィンと前記他の放熱フィンとの間の空隙を塞ぐように前記第2端部に接続されている、請求項2記載のヒートシンク。
- 前記導電性部材は板状である、請求項6記載のヒートシンク。
- 前記導電性部材は、
前記一の放熱フィンの前記第2端部に、前記第3方向に突出するように設けられ、前記他の放熱フィンを係止する第1突起部と、
前記他の放熱フィンの前記第2端部に、前記第3方向に突出するように設けられ、前記他の放熱フィンに隣接するさらに他の放熱フィンを係止する第2突起部と
を含む、請求項2記載のヒートシンク。 - 前記第1突起部および前記第2突起部は、前記第2端部における前記第1方向の一端から他端にわたり、前記開放端側に位置する前記一の放熱フィンと前記他の放熱フィンとの間の空隙を塞ぐように前記第2端部に設けられている、請求項8記載のヒートシンク。
- 前記導電性部材は、前記一の放熱フィンと前記他の放熱フィンとに跨るように配置される接続部材を含む、請求項2記載のヒートシンク。
- 複数の前記放熱フィンのそれぞれは、第1方向に幅を有して前記第1方向と交差する第2方向に延在しており、
複数の前記放熱フィンは、前記第1方向および前記第2方向と交差する第3方向に互いに間隔を隔てて前記ベース部に配置されており、
複数の前記放熱フィンのそれぞれは、
前記ベース部に取り付けられる第1端部と、
前記第1端部とは前記第2方向に距離を隔てて対向し、前記開放端側に位置する第2端部と
前記第1方向に距離を隔てて対向する第3端部および第4端部と
を有し、
前記一の放熱フィンの前記第3端部における前記開放端側の部分と、前記他の放熱フィンの前記第3端部における前記開放端側の部分とが、前記導電性部材によって電気的に接続されている、請求項1記載のヒートシンク。 - 前記導電性部材は板状である、請求項11記載のヒートシンク。
- 前記ベース部に取り付けられ、前記ベース部と前記プリント基板との間隔を保持する間隔保持部材を備え、
複数の前記放熱フィンは、前記ベース部および前記間隔保持部材を介して、前記プリント基板の前記シグナルグラウンド電位、前記フレームグラウンド電位および前記アースのいずれかに電気的に接続される、請求項1記載のヒートシンク。 - 複数の前記放熱フィンは同一材料から形成されている、請求項1記載のヒートシンク。
- 複数の前記放熱フィンは同一サイズである、請求項1記載のヒートシンク。
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201880076912.3A CN111567155B (zh) | 2018-01-15 | 2018-01-15 | 散热器 |
JP2019564257A JP7004746B2 (ja) | 2018-01-15 | 2018-01-15 | ヒートシンク |
PCT/JP2018/000746 WO2019138564A1 (ja) | 2018-01-15 | 2018-01-15 | ヒートシンク |
KR1020207019646A KR102434571B1 (ko) | 2018-01-15 | 2018-01-15 | 히트 싱크 |
TW107114247A TWI664896B (zh) | 2018-01-15 | 2018-04-26 | 散熱器 |
Applications Claiming Priority (1)
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---|---|---|---|
PCT/JP2018/000746 WO2019138564A1 (ja) | 2018-01-15 | 2018-01-15 | ヒートシンク |
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WO2019138564A1 true WO2019138564A1 (ja) | 2019-07-18 |
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PCT/JP2018/000746 WO2019138564A1 (ja) | 2018-01-15 | 2018-01-15 | ヒートシンク |
Country Status (5)
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JP (1) | JP7004746B2 (ja) |
KR (1) | KR102434571B1 (ja) |
CN (1) | CN111567155B (ja) |
TW (1) | TWI664896B (ja) |
WO (1) | WO2019138564A1 (ja) |
Citations (6)
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JPH02101550U (ja) * | 1989-01-26 | 1990-08-13 | ||
JPH02132993U (ja) * | 1989-04-07 | 1990-11-05 | ||
JPH09139592A (ja) * | 1995-11-15 | 1997-05-27 | Nec Corp | 電子装置の放熱構造 |
JP2003249611A (ja) * | 2002-02-26 | 2003-09-05 | Fujikura Ltd | フィン付きヒートシンク |
JP2004111727A (ja) * | 2002-09-19 | 2004-04-08 | Teac Corp | ヒートシンク |
JP2012227297A (ja) * | 2011-04-18 | 2012-11-15 | Sony Computer Entertainment Inc | ヒートシンク及びヒートシンクを備える電子機器 |
Family Cites Families (14)
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JPH09116061A (ja) * | 1995-10-13 | 1997-05-02 | Mitsubishi Materials Corp | 電子部品用冷却装置 |
JP2000305273A (ja) | 1998-11-19 | 2000-11-02 | Applied Materials Inc | 遠紫外線ドライフォトリソグラフィー |
JP3008942B1 (ja) | 1998-11-20 | 2000-02-14 | 日本電気株式会社 | 電子装置の放熱構造 |
US7408778B2 (en) * | 2006-09-11 | 2008-08-05 | International Business Machines Corporation | Heat sinks for dissipating a thermal load |
JP2007281504A (ja) | 2007-06-04 | 2007-10-25 | Fujikura Ltd | ヒートシンクおよびフィンモジュール |
CN101325862A (zh) * | 2008-08-01 | 2008-12-17 | 北京星网锐捷网络技术有限公司 | 一种机箱、散热装置以及散热装置安装方法 |
US20120132400A1 (en) * | 2009-08-07 | 2012-05-31 | Furukawa-Sky Aluminum Corp. | Heat Sink |
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WO2015033724A1 (ja) * | 2013-09-05 | 2015-03-12 | 富士電機株式会社 | 電力用半導体モジュール |
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JP6582717B2 (ja) * | 2015-08-18 | 2019-10-02 | 富士電機株式会社 | 電子電気機器 |
JP2017084883A (ja) * | 2015-10-23 | 2017-05-18 | スタンレー電気株式会社 | グラファイトを用いたヒートシンク、および、発光装置 |
JP6274709B2 (ja) | 2016-01-21 | 2018-02-07 | 株式会社Uacj | 熱交換器用ヒートシンク及び該ヒートシンクを備えた熱交換器 |
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-
2018
- 2018-01-15 KR KR1020207019646A patent/KR102434571B1/ko active IP Right Grant
- 2018-01-15 JP JP2019564257A patent/JP7004746B2/ja active Active
- 2018-01-15 CN CN201880076912.3A patent/CN111567155B/zh active Active
- 2018-01-15 WO PCT/JP2018/000746 patent/WO2019138564A1/ja active Application Filing
- 2018-04-26 TW TW107114247A patent/TWI664896B/zh active
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
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JPH02101550U (ja) * | 1989-01-26 | 1990-08-13 | ||
JPH02132993U (ja) * | 1989-04-07 | 1990-11-05 | ||
JPH09139592A (ja) * | 1995-11-15 | 1997-05-27 | Nec Corp | 電子装置の放熱構造 |
JP2003249611A (ja) * | 2002-02-26 | 2003-09-05 | Fujikura Ltd | フィン付きヒートシンク |
JP2004111727A (ja) * | 2002-09-19 | 2004-04-08 | Teac Corp | ヒートシンク |
JP2012227297A (ja) * | 2011-04-18 | 2012-11-15 | Sony Computer Entertainment Inc | ヒートシンク及びヒートシンクを備える電子機器 |
Also Published As
Publication number | Publication date |
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KR102434571B1 (ko) | 2022-08-19 |
CN111567155B (zh) | 2022-11-08 |
JPWO2019138564A1 (ja) | 2020-11-26 |
KR20200095542A (ko) | 2020-08-10 |
TW201933977A (zh) | 2019-08-16 |
TWI664896B (zh) | 2019-07-01 |
CN111567155A (zh) | 2020-08-21 |
JP7004746B2 (ja) | 2022-01-21 |
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