WO2019095543A1 - Led 光源的封装结构 - Google Patents

Led 光源的封装结构 Download PDF

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Publication number
WO2019095543A1
WO2019095543A1 PCT/CN2018/072499 CN2018072499W WO2019095543A1 WO 2019095543 A1 WO2019095543 A1 WO 2019095543A1 CN 2018072499 W CN2018072499 W CN 2018072499W WO 2019095543 A1 WO2019095543 A1 WO 2019095543A1
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WIPO (PCT)
Prior art keywords
electrode
insulating
notch
aluminum substrate
light source
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PCT/CN2018/072499
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English (en)
French (fr)
Inventor
朱衡
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湖南粤港模科实业有限公司
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Publication of WO2019095543A1 publication Critical patent/WO2019095543A1/zh

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/52—Encapsulations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/64—Heat extraction or cooling elements

Definitions

  • the utility model relates to an LED light source structure, in particular to a package structure of an LED light source with quick assembly.
  • the LED light source is usually composed of an LED chip, a chip holder and a heat dissipation substrate (mostly an aluminum substrate).
  • the LED chip is fixed on the chip holder, and the positive and negative ends of the LED chip are respectively soldered to corresponding pads on the circuit board by wires.
  • the closest LED light source in the prior art is composed of an LED chip and an aluminum substrate on which the LED chip is mounted.
  • the LED chip 1 is fixed in a cup cavity disposed in the center of the aluminum substrate, and then the LED chip is positively and negatively passed through the bonding wire.
  • the ends are respectively soldered to the inner ends of the corresponding electrical pins, and the electrical pins are fixed to the corresponding electrode plates by soldering or conductive adhesive bonding.
  • This packaging method has the following disadvantages:
  • the electric pin is fixed by welding or conductive adhesive. When it is used for a long time, it is easy to loose or fall off. Moreover, when welding, the difficulty of welding is also increased due to the thin metal needle.
  • the technical problem to be solved by the utility model is to provide a package structure of an LED light source which can effectively improve assembly efficiency and has low manufacturing cost.
  • the package structure of the LED light source of the present invention comprises an LED chip and an aluminum substrate receiving the LED chip, wherein the aluminum substrate is punched to form a cup cavity in the center thereof, and at least one notch is formed on the side thereof;
  • the LED chip is embedded in the cup cavity, and the aluminum substrate is seated in an annular cavity disposed on the insulating chassis, and an insulating seat is disposed on the insulating chassis corresponding to the notch, and the insulating seat extends upward
  • the side wall is inserted into the notch, and a separate electrode which is formed by stamping and formed in a "7" shape is provided in the notch, and the horizontal portion of the separated electrode is placed in the side wall of the insulating seat and is adjacent to the side wall Closing the gap together, the vertical portion of the split electrode is an electrical pin of the electrode, and the lower end of the electric pin is disposed below the insulating chassis through a pinhole disposed on the insulating seat A counter electrode having an opposite polarity to the symmetrical
  • the counter electrode is integrally formed with the aluminum substrate, the electric pin of the electrode extends downward, and the lower end thereof is disposed under the insulating chassis through another pinhole disposed on the insulating chassis.
  • a pad of the separate electrode is disposed in the horizontal portion thereon; a pad of the opposite electrode is disposed in the cup cavity.
  • the reverse electrode has the same structure as the separate electrode, and the other aluminum plate having a position corresponding to the opposite electrode has another notch similar to the notch, and the position corresponding to the other notch is
  • the insulating chassis is provided with another insulating seat having the same structure as the insulating seat, and the lower end of the electric pin of the opposite electrode is placed downward through the pinhole on the other insulating seat corresponding thereto to be placed in the insulating Below the chassis.
  • the pads of the separate electrode and the pads of the opposite electrode are respectively disposed in the respective horizontal portions.
  • the insulating chassis, the insulating seat and the side walls are integrally formed and are formed by one injection molding of a plastic material.
  • the present invention designs an aluminum substrate that receives the LED chip and dissipates heat of the chip, and is designed as a notched component.
  • the stamping process is used to fabricate at least one electrode of the mirror aluminum material, and the electrode is separated from the aluminum substrate.
  • An electrode (referred to as a separate electrode) is disposed, the aluminum substrate is embedded in an insulating chassis, and an insulating seat is disposed in the insulating chassis, and the separated electrode is embedded in the insulating seat, and the sidewall of the insulating seat Used as an insulating medium between the separate electrode and the aluminum substrate.
  • the structure overcomes the defects of the solder joint, the detachment and the cumbersome operation of the electrical pin of the electrode in the prior art by soldering the connection structure fixed to the electrode.
  • the utility model adopts standard and separate components of the LED light source components, and these components can be composed of LED light sources with stable performance and firm structure by simple assembly. In addition to the need for soldering of the die bond wire, the rest of the components are assembled by manual quick assembly or automated assembly of the LED light source.
  • the utility model has reasonable structural design, can reduce labor cost, improve production efficiency, and can improve product stability, and is also beneficial for recycling and recycling of waste products.
  • Figure 1 is a schematic front view of the present invention.
  • Fig. 2 is a plan view of the first embodiment of Fig. 1.
  • Fig. 3 is a perspective view corresponding to Fig. 2;
  • Figure 4 is a schematic exploded view of Figure 3.
  • Fig. 5 is a plan view of the second embodiment of Fig. 1.
  • Figure 6 is a cross-sectional view taken along line A-A of Figure 5;
  • Fig. 7 is a perspective view corresponding to Fig. 5.
  • Figure 8 is a schematic exploded view of Figure 7.
  • LED chip 1 bonding wire 11, pad 12, aluminum substrate 2, cup cavity 21, notch 22, split electrode 3, horizontal portion 31, counter electrode 4, electric pin 5, insulating chassis 6, annular cavity 61
  • the package structure of the LED light source 8 of the present invention is assembled by the bonding wire between the LED chip 1 and the pad 12 on the electrode, and the other components are assembled, such as an electrode and a heat-receiving LED chip 1.
  • the aluminum substrates 2 are all made by stamping, and therefore, the assembly efficiency thereof is high and the components are produced by mass production lines, so that the manufacturing cost thereof is low.
  • It is mainly composed of a heat dissipation substrate made of an LED chip 1 and an aluminum substrate 2, a die bond wire 11, a positive and negative electrode, and an insulating chassis 6.
  • the LED chip 1 is a conventional chip in the prior art, and may be a chip of a formal structure or a chip of a flip-chip structure.
  • the LED chip 1 is fixed by silver glue and disposed in the In the circular cup cavity 21 in the center of the aluminum substrate 2, the structure can effectively improve the heat dissipation effect of the LED chip 1, that is, the heat generated by the aluminum substrate 2 is quickly absorbed by the aluminum substrate 2 and is radiated to the surrounding space.
  • the aluminum substrate 2 is stamped by mirror aluminum, and has a circular recess in the center, that is, the cup cavity 21, a notch 22 is punched on the side of the aluminum substrate 2, and the inner side of the notch 22 can extend to the cup. Inside the cavity 21.
  • a mirror piece of "7" shape is used as a electrode (such as a negative electrode) by mirror aluminum, and the electrode is referred to as a separate electrode 3, and the horizontal portion 31 of the separated electrode 3 (i.e., the "7"-shaped horizontal portion Similar to the shape of the notch 22, the size is slightly smaller than the notch 22; the vertical portion of the split electrode 3 (i.e., the vertical portion of the "7" shape) serves as the electric pin 5 of the separate electrode 3.
  • the structure makes the electrode and the electric pin 5 integrated, and can be easily obtained by a simple stamping process, which not only can reduce the manufacturing cost, but also has high connection strength between the electric pin 5 and the electrode and is not easily broken.
  • the aluminum substrate 2 serves as a counter electrode 4 (such as a positive electrode), and the electric pin 5 of the electrode is preferably disposed in the following manner:
  • one electric pin 5 is punched out at a time, that is, an electric pin 5 is disposed on the opposite side of the split electrode 3, and the electric pin 5 is integrally formed with the aluminum substrate 2, and the electric pin is formed. 5 bending downward, this kind of arrangement is the same as the foregoing, which can reduce the manufacturing cost, improve the strength of the electric pin 5, and is also beneficial to improve the assembly efficiency.
  • the electrical pin 5 of the opposite electrode 4 can also be disposed in such a manner that the metal needle is fixed to the bottom surface of the aluminum substrate 2 by soldering.
  • an insulating chassis 6 made of a plastic material is further disposed under the aluminum substrate 2, and an annular cavity 61 is disposed on the insulating chassis 6, and the aluminum substrate 2 is embedded in the annular cavity 61.
  • it can be fixed together by adhesive, riveting or card.
  • An insulating seat 7 is formed on the insulating chassis 6 corresponding to the notch 22, and the insulating seat 7 is composed of three upwardly extending side walls 71 and a cavity wall of the annular cavity 61.
  • the insulating chassis 6 and the insulating seat are arranged.
  • the side wall 71 and the side wall 71 are preferably formed by one-shot molding using a plastic material.
  • a pinhole 62 penetrating the insulating chassis 6 is formed in the insulating seat 7 adjacent to the side of the annular cavity 61.
  • the gap is inserted into the notch 22 on the aluminum substrate 2 and filled in the gap between the horizontal portion 31 of the split electrode 3 and the aluminum substrate 2 to provide insulation. Further, the horizontal portion 31 of the split electrode 3 closes the notch 22 together with the side wall 71 of the insulating seat 7. At this time, the lower end of the electric pin 5 of the split electrode 3 is placed below the insulating chassis 6 through the pinhole 62.
  • a pinhole 62 is also provided, and the lower end of the electrode pin 5 of the electrode is placed under the corresponding pinhole 62 and also placed in the insulating chassis 6.
  • the pad 12 of the split electrode 3 is disposed on the horizontal portion 31, and the pad 12 of the counter electrode 4 is disposed at any position of the aluminum substrate 2.
  • the biggest advantage of the structure is that the setting margin of the position of the pad 12 is large, and the bonding wire 11 led from the positive and negative ends of the LED chip 1 only needs to be soldered on the pad 12, and it is not necessary to be reliable.
  • the ground is welded to the end of the electric pin 5 and is troublesome.
  • the structure is the same as that of the first embodiment except that the number of the notch 22, the separation electrode 3, and the insulating holder 7 which are formed on the aluminum substrate 2 is different.
  • the opposite side of the notch 22 described in Embodiment 1 (the other side symmetrical with respect to the center of the aluminum substrate 2) is also provided with an identical notch 22, and at the same time, the counter electrode 4 of Embodiment 1 is used. Also provided is an electrode of the same structure and size as that of the split electrode 3 of the first embodiment. Similarly, one of the insulating seats 7 is provided on the insulating chassis 6 at a position corresponding to the counter electrode 4.
  • the manufacturing process of the LED light source 8 is further simplified, and in the production, the aluminum substrate with double notches 22 can be quickly produced, and the separated positive and negative electrodes can be quickly produced, and the single injection molding process is fast and low. Cost and bulk production of insulated chassis 6.
  • the pads 12 of the two separate electrodes 3 i.e., the split electrode 3 and the counter electrode 4 in the embodiment 1
  • the pads 12 of the two separate electrodes 3 i.e., the split electrode 3 and the counter electrode 4 in the embodiment 1
  • the pads 12 of the two separate electrodes 3 are disposed in the respective horizontal portions 31,
  • the advantageous effects that can be produced are the same as in the first embodiment.

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Led Device Packages (AREA)

Abstract

一种LED光源的封装结构，包括LED芯片（1）和承接该LED芯片（1）的铝基板（2）。铝基板（2）经冲压在其中央形成一个杯腔（21），在其边侧形成至少一个缺口（22），LED芯片（1）嵌置于杯腔（21）内。铝基板（2）座落在绝缘底盘（6）上，在绝缘底盘（6）上设有绝缘座（7），绝缘座（7）向上延伸的侧壁（71）***缺口（22），在缺口（22）内设分离式电极（3），在分离式电极（3）的对称侧设有与其极性相反的反向电极（4）。分离式电极（3）的水平部置于绝缘座（7）的侧壁（71）合围内，并与侧壁（71）一起将缺口（22）封闭。该结构除芯片焊线需要焊接外，其余部件均采用手工快速装配或自动化流水线装配完成组装，有效提高装配效率。

Description

LED光源的封装结构 技术领域
本实用新型涉及一种LED光源结构，尤其涉及一种装配快捷的LED光源的封装结构。
 背景技术
LED光源通常由LED芯片、芯片支架和散热基板（多为铝基板）构成，LED芯片固接在芯片支架上，LED芯片的正负端分别通过导线焊接在电路板上对应的焊盘上。
现有技术中最接近的LED光源由LED芯片和安装该LED芯片的铝基板构成，通常，LED芯片1固定在设置于铝基板中央的杯腔中，然后通过焊线将该LED芯片的正负端分别与对应的电插针的内端焊接在一起，而电插针是通过焊接或导电胶粘结方式固接在对应的电极板上。该封装方式存在以下不足：
1）电插针通过焊接或导电胶粘方式固接，使用时间长了易出现松动或脱落，而且，焊接时，由于金属针较细，焊接难度也加大。
2）电极板、电插针及LED芯片连接完成后，一旦某一部件受损，不易更换。
 技术问题
本实用新型要解决的技术问题是提供一种能有效提高装配效率且制作成本较低的LED光源的封装结构。
 技术解决方案
为了解决上述技术问题，本实用新型采用的技术方案为：
本实用新型的LED光源的封装结构，包括LED芯片和承接该LED芯片的铝基板，其特征在于：所述铝基板经冲压在其中央形成一个杯腔，在其边侧形成至少一个缺口；所述LED芯片嵌置于所述杯腔内，该铝基板座落于设置在绝缘底盘上的环形凹腔内，在与所述缺口对应位置的绝缘底盘上设有绝缘座，该绝缘座向上延伸的侧壁***所述缺口，在该缺口内设有经冲压一体成形且呈“7”字形的分离式电极，该分离式电极的水平部置于绝缘座的侧壁合围内并与该侧壁一起将所述缺口封闭，该分离式电极的竖直部为该电极的电插针，该电插针的下端向下穿过设置于绝缘座上的针孔置于所述绝缘底盘的下方，在该分离式电极的对称侧设有与其极性相反的反向电极；所述LED芯片的正负端分别通过导线焊接在对应电极的焊盘上。
所述反向电极与所述铝基板一体成形，该电极的电插针向下延伸，其下端穿过设置于所述绝缘底盘上的另一个针孔置于该绝缘底盘的下方。
所述分离式电极的焊盘设置于其上的所述水平部内；反向电极的焊盘设置在所述杯腔内。
所述反向电极与所述的分离式电极结构相同，在与该反向电极对应位置的铝基板上开有与所述缺口相同的另一缺口，在与该另一缺口对应位置的所述绝缘底盘上设有与所述绝缘座相同结构的另一绝缘座，该反向电极的电插针的下端向下穿过与其对应的所述另一绝缘座上的针孔置于所述绝缘底盘的下方。
所述分离式电极的焊盘和反向电极的焊盘分别设置在各自的所述水平部内。
所述绝缘底盘、绝缘座和侧壁为一体成形且由塑胶材料一次注塑制成。
 有益效果
与现有技术相比，本实用新型将承接LED芯片并将芯片热量散热出去的铝基板设计成带有缺口的部件，采用冲压工艺制作镜面铝材质的至少一个电极，该电极为与铝基板分离设置的电极（称为分离式电极），将铝基板嵌置在一个绝缘底盘中，再在该绝缘底盘中设置绝缘座，将所述分离式电极嵌于该绝缘座中，绝缘座的侧壁用作分离式电极与铝基板之间的绝缘介质。该结构克服了现有技术中电极的电插针通过焊接与该电极固接在一起的连接结构所存在的虚焊、脱落和操作繁琐等缺陷。
本实用新型将LED光源组成部件采用标准且分离设置的部件，只需简单的装配即可将这些部件组成性能稳定、结构牢靠的LED光源。其除芯片焊线需要焊接外，其余部件均采用手工快速装配或自动化流水线装配完成LED光源的组装。
本实用新型的结构设计合理，既可降低人工成本，又可提高生产效率，还可提高产品的稳定性，同时，还有利于废品的回收再利用。
 附图说明
图1为本实用新型的正向示意图。
图2为图1的实施例1的俯视图。
图3为图2对应的立体图。
图4为图3的***示意图。
图5为图1的实施例2的俯视图。
图6为图5中A-A向剖视图。
图7为图5对应的立体图。
图8为图7的***示意图。
附图标记如下：
LED芯片1、焊线11、焊盘12、铝基板2、杯腔21、缺口22、分离式电极3、水平部31、反向电极4、电插针5、绝缘底盘6、环形凹腔61、针孔62、绝缘座7、侧壁71、LED光源8。
 本发明的最佳实施方式
本实用新型的LED光源8的封装结构除LED芯片1与电极上的焊盘12之间通过焊线11焊接连接外，其余部件均采用组装式，如电极、起散热作用的承接LED芯片1的铝基板2均通过冲压制成，因此，其装配效率很高且各部件通过大批量流水线生产使得其制造成本较低。
其主要由LED芯片1、铝基板2制作的散热基板、芯片焊线11、正负电极和绝缘底盘6构成。
实施例1
如图1－4所示，LED芯片1为现有技术中的常规芯片，可以为正装结构的芯片，也可为倒装结构的芯片，该LED芯片1通过银胶固接在设置于所述铝基板2中央的圆形的杯腔21中，该结构可有效提高LED芯片1的散热效果，即其产生的热量很快被铝基板2吸收并散发至周围空间。
所述铝基板2采用镜面铝冲压而成，其中央为圆形凹坑，即所述的杯腔21，在该铝基板2的边侧冲压出一个缺口22，缺口22的内侧可以延伸至杯腔21内。
采用镜面铝冲压一件呈“7”形的杆件用作一个电极（如负极），简称该电极为分离式电极3，该分离式电极3的水平部31（即“7”字形的横部）与所述缺口22形状相似，大小略小于缺口22；分离式电极3的竖直部（即“7”字形的竖部）作为该分离式电极3的电插针5。该结构使得电极与电插针5融为一体，其通过简单的冲压工艺即可轻松获得，其不仅可以降低制造成本，而且，电插针5与电极之间因连接强度高而不易折损。
铝基板2作为反向电极4（如正极），该电极的电插针5，本实施例优选以下方式设置：
在冲压该铝基板2时，一次冲压出一个电插针5，即在分离式电极3的对侧设置一根电插针5，该电插针5与铝基板2一体成形，该电插针5向下弯折，该种设置方式如同前述，既可降低制造成本，又可提高电插针5的强度，还有利于提高装配效率。
当然，该反向电极4的电插针5也可以采用金属针经焊接固接在铝基板2的底面上的方式设置。
本实施例中，在铝基板2之下还设有一块由塑胶材料制作的绝缘底盘6，在该绝缘底盘6上设有一个环形凹腔61，铝基板2嵌置在该环形凹腔61中，其间可通过胶粘剂、铆接或卡装固接在一起。
在绝缘底盘6上对应所述缺口22的位置设有一个绝缘座7，该绝缘座7由三个向上延伸的侧壁71和环形凹腔61的腔壁围合构成，绝缘底盘6、绝缘座7和侧壁71优选采用塑胶材料一次性注塑制成。在该绝缘座7内临近环形凹腔61边侧位置开有贯穿该绝缘底盘6的针孔62，当铝基板2与绝缘底盘6嵌合在一起时，所述绝缘座7的侧壁71正好***铝基板2上的缺口22内并填充在分离式电极3的水平部31与铝基板2之间的缝隙中起到绝缘作用。并且，分离式电极3的水平部31与绝缘座7的侧壁71一起将所述缺口22封闭。此时，分离式电极3的电插针5的下端向下穿过所述的针孔62置于所述绝缘底盘6的下方。
在该绝缘底盘6上，位于反向电极4的电插针5的位置，也设有针孔62，该电极的电插针5的下端下穿对应的针孔62也置于该绝缘底盘6的下方。
该实施例中，分离式电极3的焊盘12设置在所述的水平部31上，反向电极4的焊盘12设置在铝基板2的任何一个位置。该结构的最大的好处是，焊盘12位置的设定选择裕度大，由LED芯片1正负端外引的焊线11，只需焊接在焊盘12上即可，无需为是否能牢靠地焊接在电插针5的端部而烦恼。
实施例2
如图1、5－8所示，与实施例1相比，除开设在铝基板2上的缺口22、分离式电极3和绝缘座7的个数不同外，其他结构相同。
本实施例在实施例1中所述的缺口22对侧（以铝基板2中心为对称的另一侧），也设有一个相同的缺口22，同时，将实施例1中的反向电极4也设置为与实施例1中的分离式电极3相同结构和大小的电极，同样，在与该反向电极4对应位置的绝缘底盘6上，也设有一个所述的绝缘座7。
如此，进一步简化了该LED光源8的制造工艺，生产时，采用大批量流水线作业，可以快速生产出带有双缺口22的铝基板2、分离式的正负电极，采用一次注塑工艺快速、低成本和大批量的生产绝缘底盘6。装配时，只需按件定位组装即可，该结构可大大提高装配效率。
与实施例1相同，该实施例中的两个分离式电极3（即实施例1中的分离式电极3和反向电极4）的焊盘12均设置在各自的所述水平部31内，可产生的有益效果与实施例1相同。

Claims (6)

  1. 一种LED光源的封装结构，包括LED芯片（1）和承接该LED芯片（1）的铝基板（2），其特征在于：所述铝基板（2）经冲压在其中央形成一个杯腔（21），在其边侧形成至少一个缺口（22）；所述LED芯片（1）嵌置于所述杯腔（21）内，该铝基板（2）座落于设置在绝缘底盘（6）上的环形凹腔（61）内，在与所述缺口（22）对应位置的绝缘底盘（6）上设有绝缘座（7），该绝缘座（7）向上延伸的侧壁（71）***所述缺口（22），在该缺口（22）内设有经冲压一体成形且呈“7”字形的分离式电极（3），该分离式电极（3）的水平部（31）置于绝缘座（7）的侧壁（71）合围内并与该侧壁（71）一起将所述缺口（22）封闭，该分离式电极（3）的竖直部为该电极的电插针（5），该电插针（5）的下端向下穿过设置于绝缘座（7）上的针孔（62）置于所述绝缘底盘（6）的下方，在该分离式电极（3）的对称侧设有与其极性相反的反向电极（4）；所述LED芯片（1）的正负端分别通过导线焊接在对应电极的焊盘（12）上。
  2. 根据权利要求1所述的LED光源的封装结构，其特征在于：所述反向电极（4）与所述铝基板（2）一体成形，该电极的电插针（5）向下延伸，其下端穿过设置于所述绝缘底盘（6）上的另一个针孔（62）置于该绝缘底盘（6）的下方。
  3. 根据权利要求2所述的LED光源的封装结构，其特征在于：所述分离式电极（3）的焊盘（12）设置于其上的所述水平部（31）内；反向电极（4）的焊盘（12）设置在所述杯腔（21）内。
  4. 根据权利要求1所述的LED光源的封装结构，其特征在于：所述反向电极（4）与所述的分离式电极（3）结构相同，在与该反向电极（4）对应位置的铝基板（2）上开有与所述缺口（22）相同的另一缺口（22），在与该另一缺口（22）对应位置的所述绝缘底盘（6）上设有与所述绝缘座（7）相同结构的另一绝缘座（7），该反向电极（4）的电插针（5）的下端向下穿过与其对应的所述另一绝缘座（7）上的针孔（62）置于所述绝缘底盘（6）的下方。
  5. 根据权利要求4所述的LED光源的封装结构，其特征在于：所述分离式电极（3）的焊盘（12）和反向电极（4）的焊盘（12）分别设置在各自的所述水平部（31）内。
  6. 根据权利要求1－5中任一项所述的LED光源的封装结构，其特征在于：所述绝缘底盘（6）、绝缘座（7）和侧壁（71）为一体成形且由塑胶材料一次注塑制成。
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CN202888239U (zh) * 2012-11-08 2013-04-17 廖旭文 Led发光芯片的散热载体结构
CN206541847U (zh) * 2017-01-24 2017-10-03 东莞市长晟电子科技有限公司 散热led支架
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CN201130672Y (zh) * 2007-12-24 2008-10-08 深圳市瑞丰光电子有限公司 高功率发光二极管
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