WO2017013479A1 - 接着性樹脂層及び接着性樹脂フィルム - Google Patents
接着性樹脂層及び接着性樹脂フィルム Download PDFInfo
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- WO2017013479A1 WO2017013479A1 PCT/IB2016/000188 IB2016000188W WO2017013479A1 WO 2017013479 A1 WO2017013479 A1 WO 2017013479A1 IB 2016000188 W IB2016000188 W IB 2016000188W WO 2017013479 A1 WO2017013479 A1 WO 2017013479A1
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- adhesive resin
- resin layer
- acrylic
- adhesive
- temperature
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Definitions
- the present invention relates to an adhesive resin layer and an adhesive resin film that can prevent the generation of bubbles even when heated and deformed after being bonded to a substrate.
- This application claims the priority based on Japanese Patent Application No. 2015-142880 for which it applied on July 17, 2015, and uses the content here.
- an acrylic pressure-sensitive adhesive As a pressure-sensitive adhesive that can easily peel off a pressure-sensitive adhesive after use, an acrylic pressure-sensitive adhesive, a photocurable acrylate compound such as urethane acrylate, an isocyanate-based curing agent (crosslinking agent), and a photopolymerization initiator
- the adhesive which contains is used (for example, refer patent documents 1-3).
- This type of pressure-sensitive adhesive has pressure-sensitive adhesive properties at room temperature, and can be re-peeled by reducing the pressure-sensitive adhesive properties by light irradiation. Therefore, this type of pressure-sensitive adhesive is widely used for pressure-sensitive adhesive tapes for semiconductor processing or transportation.
- acrylic pressure-sensitive adhesives are also widely used for laminating and bonding transparent or translucent substrates such as touch panels, mobile phones, displays, and laminated glass.
- the adhesive strength between the base materials may be reduced.
- the optical characteristic which let the base material pass may fall with a bubble.
- the present invention has been made in view of the above circumstances, and can prevent the generation of bubbles even when heated and deformed after being bonded to the base material.
- the base material, the adhesive resin layer, and the base material are in this order. It is an object of the present invention to provide an adhesive resin layer and an adhesive resin film in which the laminated body has good followability to deformation of a substrate.
- the present invention provides a single-layer adhesive resin layer containing an acrylic adhesive resin composition, wherein the adhesive resin composition comprises at least (A) an acrylic polymer, B) An acrylic monomer or an acrylic oligomer and (C) a thermal polymerization initiator, the adhesive resin layer is sticky on both sides at room temperature, and a differential scanning at a heating rate of 10 ° C./min.
- the adhesive resin layer characterized in that heat generation starts to be confirmed at 80 ° C. or higher in calorimetry (DSC) and at least one peak is confirmed between 120 ° C. and 210 ° C.
- the (C) thermal polymerization initiator is preferably a peroxide.
- the adhesive resin composition preferably contains 5 to 50 parts by weight of the (B) acrylic monomer or acrylic oligomer with respect to 100 parts by weight of the (A) acrylic polymer. It is preferable that the adhesive resin composition contains an acrylic monomer containing a hydroxyl group as at least a part of the (B) acrylic monomer or acrylic oligomer.
- the adhesive resin composition preferably contains a curable urethane acrylate as at least a part of the (B) acrylic monomer or acrylic oligomer.
- the present invention also provides an adhesive resin film, wherein the adhesive resin layer is laminated between two separators. Moreover, this invention provides the adhesive resin layer for forming the laminated body by which two base materials are laminated
- the adhesive resin layer is characterized in that the adhesive strength is 10 N / 25 mm or more even after the adhesive resin layer is heat-cured.
- this invention provides the laminated body characterized by laminating
- the adhesive resin layer is heated in a state where two substrates are laminated via the adhesive resin layer, and the obtained laminate is sandwiched between two molds.
- the boiling point of the solvent contained in the raw material composition of the adhesive resin layer is temperature A
- the temperature at which the thermal polymerization initiator has a half-life of 1 minute is temperature B
- the solvent is removed in the manufacturing process of the adhesive resin layer.
- the temperatures are in the order of the following formula (1), where temperature C is the temperature during heating and temperature D is the mold pressing temperature in the step of heat curing the adhesive resin layer.
- the temperature of the mold at the time of the heat curing is 150 to 300 ° C.
- the present invention is characterized in that the adhesive resin composition includes an acrylic polymer, an acrylic monomer or an acrylic oligomer, and a thermal polymerization initiator, and a transfer tape-like adhesive resin layer is formed by the above components. Can be produced.
- the adhesive resin layer has a substrate following property to the substrate by an acrylic monomer or an acrylic oligomer. An adhesive resin layer in which air bubbles do not enter even when the acrylic monomer or acrylic oligomer is cured by reaction initiation conditions such as heat and is heated and deformed after being bonded to a substrate, and a method for producing the same can be provided.
- the adhesive resin layer can be forced to follow the substrate forcibly, particularly by hot pressing.
- heat press that applies both heat and pressure to the laminate without air is used to suppress bubble generation and deformation of the substrate, rather than curing by electron beam irradiation or energy beam irradiation via air.
- an adhesive resin layer and an adhesive resin film that can prevent the generation of bubbles even when heated and deformed after being bonded to a substrate.
- FIG. 1 sectional drawing of an example of the adhesive resin film 10 is shown.
- the adhesive resin film 10 has two separators 12 and 13 and an adhesive resin layer 11 laminated therebetween.
- the adhesive resin composition constituting the adhesive resin layer 11 contains (A) an acrylic polymer, (B) an acrylic monomer or an acrylic oligomer, and (C) a thermal polymerization initiator. Both surfaces 11a and 11b of the adhesive resin layer 11 have adhesiveness at normal temperature (becomes adhesive surfaces).
- “normal temperature” is about 3 ° C. to about 40 ° C., preferably about 10 ° C. to about 30 ° C., more preferably about 15 ° C. to about 25 ° C., and most preferably. Is about 23 ° C.
- the adhesive resin layer 11 includes an adhesive resin composition throughout the thickness direction. If the adhesive resin composition satisfying the requirements is included, the adhesive resin layer 11 may be composed of two or more layers including the same type or different types of adhesive resin compositions. When the adhesive resin layer 11 is composed of a single adhesive resin layer, it is preferable because the layer configuration can be simplified and the cost can be reduced.
- the adhesive resin composition includes an acrylic adhesive resin (polymer).
- the optical properties of the adhesive resin composition are not limited, but may be transparent, translucent or opaque.
- the separators 12 and 13 have peelability on the surfaces 12a and 13a on the side in contact with the adhesive resin layer 11 (becomes a peel surface).
- Examples of the configuration of the separators 12 and 13 include a configuration in which a release agent layer is provided on one side or both sides of a resin film, and a configuration in which a release agent is included in the resin of the resin film.
- the separators 12 and 13 have transparency because the adhesive resin layer 11 can be optically inspected with the adhesive resin film 10 in which the separators 12 and 13 are not peeled off.
- FIG. 1 shows an example of a laminate 20 in which two base materials 21 and 22 are laminated via an adhesive resin layer 11.
- the two substrates 21 and 22 are in contact with the adhesive resin layer 11 on one surface 21a and 22a, and the opposite surfaces 21b and 22b are adhesive resin so that they can be hot pressed by a mold. It is vacant without contacting the layer 11.
- the base materials 21 and 22 are adherends bonded by the adhesive resin layer 11.
- Each of the substrates 21 and 22 may be a rigid plate or may be flexible like a film.
- a single plate made of glass, polycarbonate, acrylic, various resins, ceramics, metal, or the like may be used, or a composite made of a plurality of materials such as a liquid crystal panel, a touch panel, a cover glass, or a wiring board may be used.
- the materials, thicknesses, shapes, and the like of the base materials 21 and 22 may be the same or different.
- the inner surfaces 21a and 22a and the outer surfaces 21b and 22b of the base materials 21 and 22 may be flat, respectively, and either one or both surfaces may have a step or unevenness.
- the materials of the base materials 21 and 22 are polyolefin, polyester, polycarbonate, polyamide, acrylic, polychlorinated
- a thermoplastic resin such as vinyl or cellulose ester is preferred.
- the base material used for the thermal deformation is not limited to a thermoplastic resin base material (film, etc.) alone, but on the surface or inside of the base material, a thin film, pattern, particle, etc. of a different material (metal, inorganic matter, organic matter, etc.) It may include fine wires, fine structures, and the like.
- the order in which the separators 12 and 13 are peeled is not particularly limited. After pasting one separator on one adhesive surface exposed by peeling one separator, the other substrate is pasted on the other adhesive surface exposed by peeling the other separator. May be. After peeling both separators and exposing both adhesive surfaces, you may bond a base material, respectively.
- the adhesive resin layer 11 contains (B) an acrylic monomer or an acrylic oligomer having fluidity, the adhesive resin layer 11 has high flexibility, and the entire contact surfaces 21a and 22a of the base materials 21 and 22 are bonded to the adhesive resin composition. Can be wet with. For this reason, even if it laminates
- the laminate 20 obtained by laminating the two base materials 21 and 22 across the adhesive resin layer 11 is heated while being sandwiched between two molds, whereby the adhesive resin layer 11 Can be cured.
- reaction (polymerization, crosslinking, etc.) of (A) acrylic polymer and (B) acrylic monomer or acrylic oligomer proceeds, and the adhesive force between the base materials 21 and 22 increases.
- the air gap is filled and the air bubbles can be removed.
- at least one of the two molds is heated.
- a cushion (buffer sheet), a release sheet, a protective sheet, etc. are provided between the two molds and the laminated body (specifically, the outer surfaces 21b and 22b of the base materials 21 and 22). Inclusions) may be interposed.
- the two molds have irregularities on the pressing surface against the laminate, it is preferable to provide the above-mentioned inclusions because the pressure tends to concentrate on the convex portions when the convex portions of the mold directly contact the laminate. .
- the two molds may or may not cover the side surface of the laminate 20.
- one mold may be a convex mold
- the other mold may be a concave mold
- the laminate 20 may be accommodated in a concave recess, and then the convex protrusion may approach the concave recess.
- FIG. 3 shows an example of a laminate 30 obtained by heat curing.
- this laminated body 30 as a result of the thermosetting of the adhesive resin layer 11, an adhesive layer 23 containing an adhesive resin that is thermoset is laminated between the two base materials 21 and 22. Since the adhesive layer 23 after thermosetting has increased in hardness, it is difficult to peel again even if the adhesive resin layer 11 before heating is flexible. Thereby, as the adhesive resin layer 11, it is possible to use a resin excellent in followability to the deformation of the base material even if the adhesive force is low.
- the adhesive force (adhesive force) of the adhesive layer 23 is preferably 10 N / 25 mm or more.
- the laminated body 30 when the two base materials 21 and 22 are distinguished, several manufacturing methods can be considered. Any method can be adopted for manufacturing the laminate 30.
- the adhesive resin layer 11 is laminated on the first base material 21, and then the autoclave treatment is performed, and the second base material 22 is laminated on the adhesive resin layer 11 to obtain a laminate.
- a method of heating and curing the adhesive resin layer 11 using two molds after laminating 20 or while laminating the second base material 22 may be mentioned.
- the adhesive resin layer 11 is laminated on the second substrate 22, and then autoclave treatment is performed. After the first substrate 21 is laminated on the adhesive resin layer 11, Or the method of heat-hardening the adhesive resin layer 11 using two metal mold
- the first base material 21, the adhesive resin layer 11, and the second base material 22 are laminated at the same time or simultaneously with the lamination, and the adhesive resin layer 11 is formed using two molds. The method of heat-curing is mentioned.
- one of the base materials 21 and 22 is bonded to the adhesive resin layer 11 first and subjected to autoclave treatment, whereby the adhesive resin layer is formed on one of the base materials 21 and 22. It is easy to follow. If there is a step or recess on the surface of one of the substrates, and a gap is easily formed between the adhesive resin layer, this gap can be filled by autoclaving, so the hot press processing conditions vary greatly. However, it is a method that can reduce bubbles.
- the third lamination method is the most cost-effective method because the manufacturing process can be shortened.
- the adhesive resin layer 11 When laminating the adhesive resin layer 11 between the base materials 21 and 22 and hot pressing, it is possible to deform one or both of the base materials 21 and 22 to generate irregularities in the laminate. For example, when unevenness is provided on the pressing surfaces of two molds, the flexible base materials 21 and 22 such as a resin film can be deformed into an uneven shape. Since the initial adhesive resin layer 11 has fluidity, the unevenness of the base materials 21 and 22 can be followed. Moreover, the adhesive resin layer 11 hardens
- the deformation of the base materials 21 and 22 is fixed, and molding such as irregularities, curved surfaces, bends and curves can be realized.
- the convex portion is formed on the inner surface of the substrate, the concave portion may be formed on the outer surface on the back side.
- a corrugated sheet-shaped molded body is exemplified as an example, but the present invention is not particularly limited thereto, and an arbitrary shape can be molded.
- the adhesive resin layer 11 starts to generate heat at 80 ° C. or higher, and at least one peak is confirmed between 120 ° C. and 210 ° C. It is preferable.
- the thermosetting reaction may proceed even at room temperature, resulting in a decrease in storage stability.
- thermosetting can proceed at the same temperature.
- the base materials 21 and 22 are also softened by heating, so that the deformation becomes easy.
- the adhesive resin layer 11 is preferably thermoset by heating at a temperature of 100 to 250 ° C. and a time of 30 seconds to 10 minutes. It is preferable to perform thermosetting under the conditions of at least a part of these temperatures and time ranges, and it is more preferable that thermosetting is possible over the entire range. The thermosetting conditions during actual use may be outside the above range. However, from the viewpoint of storability, it is preferable that thermosetting does not proceed substantially at room temperature. For example, at a temperature of 100 ° C. or lower, it is preferable that the resin does not thermoset by heating within 10 minutes.
- the storage elastic modulus at a temperature of 23 ° C. is preferably 1 ⁇ 10 4 to 1 ⁇ 10 6 Pa. Further, after the adhesive resin layer 11 is thermally cured by heating, the storage elastic modulus at a temperature of 23 ° C. is preferably 1 ⁇ 10 4 to 1 ⁇ 10 9 Pa. It is preferable that the storage elastic modulus at a temperature of 23 ° C. after thermosetting by heating is higher than the storage elastic modulus at a temperature of 23 ° C. before heating.
- These storage elastic moduli are set so that the temperature of the adhesive resin layer in an uncured state (before heating) and the temperature of the adhesive resin layer after heat curing by heating (adhesive layer after heat curing) are 23 ° C. Can be measured.
- the vibration frequency when measuring the storage elastic modulus is, for example, 1 Hz.
- the adhesive raw material composition used in the production of the adhesive resin layer of the present invention preferably contains an organic solvent because it can be applied with higher accuracy when dissolved in an organic solvent.
- an adhesive resin layer is obtained. That is, the composition of the adhesive raw material composition may be obtained by adding a solvent to the composition of the adhesive resin composition constituting the adhesive resin layer.
- the adhesive resin layer can function as a pressure-sensitive adhesive layer at room temperature (before thermosetting).
- the monomer constituting the acrylic polymer is an acrylic monomer having an ester group (—COO—), an acrylic monomer having a carboxyl group (—COOH), an amide group (—CONR 2 , R is a hydrogen atom or an alkyl group)
- Non-acrylic monomers such as an acrylic monomer having a substituent such as a group, an acrylic monomer having a nitrile group (—CN), olefins, styrene, vinyl esters, vinyl ethers, vinyl silane.
- the acrylic polymer is preferably a copolymer composed of two or more monomers.
- the number average molecular weight of the (A) acrylic polymer before photopolymerization is preferably about 50,000 to 1,000,000, for example.
- the viscosity is, for example, about 1,000 to 10,000 mPa ⁇ s.
- an acrylic monomer having an ester group (—COO—) an alkyl (meth) acrylate, a (meth) acrylate having a hydroxyl group (hydroxyl group), a (meth) acrylate having an alkoxy group or a polyether group, an amino group, or a substituent
- examples thereof include (meth) acrylate having an amino group.
- (meth) acrylate is a general term for acrylate and methacrylate.
- acrylic monomer having a carboxyl group examples include acrylic acid, methacrylic acid, (meth) acrylate having a carboxyl group (—COOH), and the like.
- acrylic monomer having an amide group examples include acrylamide and methacrylamide.
- acrylic monomer having a nitrile group examples include acrylonitrile and methacrylonitrile.
- an acrylic polymer it is preferable that 50 weight% or more of a structural monomer consists of an acrylic monomer.
- alkyl (meth) acrylate examples include methyl (meth) acrylate, ethyl (meth) acrylate, n-propyl (meth) acrylate, isopropyl (meth) acrylate, n-butyl (meth) acrylate, and isobutyl (meth) acrylate.
- an alkyl (meth) acrylate having an alkyl group R 2 having 4 to 12 carbon atoms as an essential component (for example, 50 to 100 mol%).
- Examples of the (meth) acrylate containing a hydroxyl group include 2-hydroxyethyl (meth) acrylate, 2-hydroxypropyl (meth) acrylate, 3-hydroxypropyl (meth) acrylate, and 4-hydroxybutyl (meth) acrylate. , 6-hydroxyhexyl (meth) acrylate, 8-hydroxyoctane (meth) acrylate, polyethylene glycol mono (meth) acrylate, polypropylene glycol mono (meth) acrylate, cyclohexanedimethanol mono (meth) acrylate The above is mentioned.
- the acrylic monomers include (A) monomers similar to the monomers constituting the acrylic polymer, such as alkyl (meth) acrylates and (meth) acrylates containing hydroxyl groups. 1 type or 2 types or more, such as acrylamide.
- the number of polymerizable functional groups such as a (meth) acryloyl group in one molecule may be one or two or more.
- an acrylic monomer or an acrylic oligomer contains a (meth) acrylate monomer having a hydroxyl group
- the polar hydroxyl group is easily dispersed throughout the adhesive resin layer. This is preferable because moisture hardly aggregates even in a high humidity (higher temperature) environment and white turbidity of the adhesive resin layer is suppressed.
- the number of hydroxyl groups in one molecule may be one or two or more.
- curable urethane acrylate can be used as at least a part of (B) acrylic monomer or acrylic oligomer.
- the curable urethane acrylate is a compound having curability due to the (meth) acryloyloxy group which is a polymerizable functional group in the urethane acrylate.
- the number of urethane bonds in one molecule may be one or two or more.
- the number of (meth) acryloyloxy groups in one molecule may be one or two or more.
- urethane acrylate examples include a compound obtained by reacting a (meth) acrylate compound having a hydroxyl group with an isocyanate compound, a urethane prepolymer obtained by reacting a polyol compound and a polyisocyanate compound, and having a hydroxyl group (meta ) Compounds obtained by reacting acrylate compounds.
- the polyol compound examples include polyester polyol and polyether polyol.
- the acrylic monomer or acrylic oligomer is preferably a liquid (fluid) that becomes part of the polymer by thermal curing with (C) a thermal polymerization initiator and has a lower viscosity than the polymer. It is also possible to use acrylic monomers and acrylic oligomers in combination. Examples of the acrylic oligomer include acrylate oligomers such as urethane acrylate oligomers.
- the number of polymerizable functional groups possessed by the acrylic monomer or acrylic oligomer is, for example, 1 to 10, preferably 2 to 5.
- the adhesive resin composition preferably contains 5 to 50 parts by weight of (B) acrylic monomer or acrylic oligomer with respect to 100 parts by weight of (A) acrylic polymer. (B) If the amount of the acrylic monomer or acrylic oligomer added is too large, the adhesive strength of the adhesive resin layer may be excessively reduced when thermal polymerization is performed.
- the thermal polymerization initiator includes a radical initiator that decomposes by heat to start polymerization of a monomer (radical polymerization) and curing of a resin.
- a radical initiator that decomposes by heat to start polymerization of a monomer (radical polymerization) and curing of a resin.
- a redox initiator and an organometallic compound that act at a low temperature are also known.
- an (organic) peroxide type, an azo compound that acts at a higher temperature. A system or the like is preferred.
- the thermal polymerization initiator is a temperature at which the half-life of the thermal polymerization initiator becomes 1 minute in the manufacturing process of the transfer tape, in particular, in the solvent drying step, so that the half-life of the thermal polymerization initiator is 1 minute (hereinafter referred to as “1 minute half-life temperature”). Is preferably higher than the boiling point of the organic solvent contained in the adhesive raw material composition.
- the thermal polymerization initiator is preferably a material having a half-life temperature of 1 minute that is 50 ° C. or more lower than the hot press set temperature in order to sufficiently react at a temperature at the time of hot press for a certain time.
- (organic) peroxide-based thermal polymerization initiators include benzoyl peroxide, acetyl peroxide, decanoyl peroxide, lauroyl peroxide, and other diacyl peroxides, dicumyl peroxide, and di-t-butyl peroxide.
- alkylperoxy esters such as dialkyl peroxide, t-butylperoxybenzoate, and t-butylperoxy-2-ethylhexanoate
- hydroperoxides such as cumene hydroperoxide and t-butylhydroperoxide.
- organic peroxides having a 1-minute half-life temperature of 100 ° C.
- organic peroxides having a 1-minute half-life temperature in the range of 100 ° C. to 200 ° C. are more preferable.
- organic peroxides include t-hexyl peroxyneodecanoate, t-butyl peroxyneodecanoate, t-butyl peroxyneoheptanoate, t-hexyl peroxypivalate, and t-butyl peroxypivalate.
- the polymerization initiator of this invention can use the thermal polymerization initiator enclosed in the molecular capsule which has a cage-like molecule
- the cage molecule preferably has an anthracene structure.
- the addition amount of the thermal polymerization initiator (C) is preferably 0.001 to 0.5 parts by weight with respect to 100 parts by weight of the (A) acrylic polymer.
- a polymerization retarder can be added to the adhesive resin layer of the present invention.
- Use of a polymerization retarder facilitates control of the degree of polymerization. Moreover, it is preferable from a viewpoint of improving the followable
- the adhesive resin composition can further contain optional components other than (A) to (C).
- crosslinking agent such as isocyanate crosslinking agent, epoxy crosslinking agent, metal chelate compound, (A) acrylic polymer, or (B) polymerization of acrylic monomer or acrylic oligomer. It is preferably used to crosslink the polymer produced.
- (D) a polymer or monomer having a functional group that reacts with a crosslinking agent is used as at least a part of (A) acrylic polymer or (B) acrylic monomer or acrylic oligomer, if necessary. .
- the functional group that reacts with the crosslinking agent is, for example, a hydroxyl group or a carboxyl group in the case of an isocyanate crosslinking agent.
- the addition amount of a crosslinking agent 1.5 equivalent or less is preferable with respect to the functional group of a polymer.
- Curing of the (A) acrylic polymer by the crosslinking agent may be advanced by aging at the stage of producing an adhesive resin layer before being bonded to the adherend.
- the adhesive raw material composition used in the production of the adhesive resin layer may contain a solvent such as water or an organic solvent, or may be a solvent-free syrup-like composition.
- a solvent such as water or an organic solvent
- the material of the adhesive resin composition is corrosion of acid or the like.
- the acrylic monomer or acrylic oligomer that is a component to be cured in the production of the adhesive resin layer of the present invention.
- acrylic oligomers both acrylic polymers and acrylic oligomers have large molecular weights and often have poor compatibility as paints. Therefore, it is desirable to add a compatibilizer.
- a non-reactive compatibilizer may be used, but there is a possibility that it can be separated in the pressure-sensitive adhesive layer, so there is a high possibility that the usable materials are limited, and depending on the type or addition amount, foaming in a durability test, etc. This can cause problems and is less versatile.
- a compatibilizer that cures together with the acrylic oligomer during the thermal reaction is polymerized and thus leads to suppression of foaming and the like. Therefore, it is preferable to select a material having a reactive group. Furthermore, when an acrylic monomer that becomes hard after thermal reaction is used as a compatibilizer, the effect of hardening the pressure-sensitive adhesive layer after curing can be expected as well as the stability of the paint. In addition to good compatibility with acrylic monomers, the viscosity is low compared to acrylic polymers or acrylic oligomers, so it can be adjusted to the optimum viscosity during film formation by adding when the viscosity of the paint is too high. It becomes possible and contributes to productivity improvement.
- the adhesive resin layer (transfer tape) in this invention can be manufactured by apply
- the adhesive raw material composition is preferably applied using a die or a pipe doctor.
- drying the solvent drying with a dryer or the like is preferable.
- the drying time of the solvent considering productivity, it is preferably 10 minutes or less, more preferably 2 to 5 minutes.
- the laminate may have an adhesive resin layer between three or more substrates. It is preferable that one or more (preferably all) of the two or more adhesive resin layers included in the laminate are the adhesive resin layer of the present embodiment.
- two or more laminates When the laminate is hot-pressed, two or more laminates may be disposed between a pair of molds. This arrangement is not particularly limited, and two or more laminates may be stacked in the compression direction of the mold, and two or more laminates may be stacked in a plane perpendicular to the compression direction (for example, on the pressing surface of any mold). May be arranged. The above-described inclusions may be interposed between two or more laminates.
- a laminated structure as shown in FIG. 2 is produced, and a laminated body 30 as shown in FIG. 3 is produced through heat treatment such as hot pressing. Can do.
- heat treatment such as hot pressing. Can do.
- the pressing of the present invention in order to apply heat at which the heating temperature of the laminate becomes 100 to 250 ° C., it is necessary to heat the mold at a temperature higher than the desired heating temperature.
- the temperature of the mold is preferably 100 to 300 ° C.
- the reaction is preferably completed within a short time, for example, within 5 minutes, from the viewpoint of productivity. Further, the press temperature and time can be set so that the strength of the laminate is sufficient.
- Example 1 SK Dyne (registered trademark) 2094 (Soken Chemical Co., Ltd.) is used as the polymer solution containing the acrylic polymer, E-AX (Soken Chemical Co., Ltd.) is used as the cross-linking agent, and 100 parts by weight of the acrylic polymer is used as the cross-linking agent. It mix
- acrylic monomer 4-hydroxybutyl acrylate Osaka Organic Chemical Co., Ltd .; 4HBA
- An adhesive raw material composition was prepared by adding 0.08 part by weight of 2-ethylhexanoate (manufactured by NOF Corporation; product name: Perbutyl (registered trademark) O).
- the adhesive raw material composition contains ethyl acetate (boiling point: 77 ° C.) as a solvent, and properties such as viscosity are improved as a coating material for coating.
- the adhesive raw material composition was dried. After applying so as to have a thickness of 50 ⁇ m, the solvent was dried at 90 ° C.
- Example 1 a laminate including an adhesive resin layer between separator films in the composition of the adhesive raw material composition described in Table 1 and the thickness of the adhesive resin layer described in Table 2
- the body was manufactured. Matters not described in Table 1 or Table 2 are the same as in Example 1.
- the isocyanate-based crosslinking agent (TD-75, coronate HX) is not only a functional group of the acrylic polymer but also a part of the acrylic monomer (4HBA) containing a hydroxyl group. It reacts together to form a cross-linked acrylic polymer.
- the adhesive resin layer has a cross-linked acrylic polymer and a fluid resin component having reactivity. And three types of thermal polymerization initiators.
- SK Dyne 2094 and “SK Dyne 2147” are trade names of acrylic polymers, SK Dyne (registered trademark) 2094 (Soken Chemical Co., Ltd., acid value: 33, number average molecular weight 70,000, solid content concentration 25%, respectively. ), SK Dyne (registered trademark) 2147 (Soken Chemical Co., Ltd., acid value: 33).
- N-7136 represents the trade name of an acrylic polymer, Coponil (registered trademark) N-7136 (Nippon Synthetic Chemical Industry Co., Ltd., solid content concentration 32%). In Table 1, the weight in terms of solid content of each material is shown as the added amount by weight.
- Coronate registered trademark
- E-AX indicates a trade name of Epoxy Curing Agent (Soken Chemical Co., Ltd.).
- TD-75 indicates a trade name of an isocyanate curing agent (Soken Chemical Co., Ltd.).
- UV-3310B and UV-1700 represent urethane acrylate trade names (Nippon Synthetic Chemical Industry Co., Ltd.).
- the physical properties of UV-3310B are: viscosity at 60 ° C .: 40000 to 70000 mPa ⁇ s, weight average molecular weight Mw: 5000, number of oligomer functional groups: 2, glass transition temperature Tg: 22 ° C.
- Perhexa (registered trademark) V is a thermal polymerization initiator containing n-butyl 4,4-bis (t-butylperoxy) valerate as an active ingredient.
- Prorocta® O is a thermal polymerization initiator containing 1,1,3,3-tetramethylbutylperoxy-2-ethylhexanoate as an active ingredient.
- Perbutyl (registered trademark) O is a thermal polymerization initiator containing t-butylperoxy-2-ethylhexanoate as an active ingredient.
- Perhexa (registered trademark) HC is a thermal polymerization initiator containing 1,1-bis (t-hexylperoxy) cyclohexane as an active ingredient.
- Perhexyl (registered trademark) Z is a thermal polymerization initiator containing t-hexyl peroxybenzoate as an active ingredient.
- Irg651 is a photopolymerization initiator containing 2,2-dimethoxy-2-phenylacetophenone (also known as benzyldimethyl ketal) as an active ingredient.
- “Park Mill (registered trademark) ND” is a thermal polymerization initiator having a low 1 minute half-life temperature (about 94 ° C.) and containing cumyl peroxyneodecanoate as an active ingredient.
- “Parkmill (registered trademark) P” is a thermal polymerization initiator having a very high half-life temperature of 1 minute (about 232 ° C.) and containing diisopropylbenzene hydroperoxide as an active ingredient.
- the heat press temperature is set to 210 ° C. or lower and a thermal polymerization initiator having a higher half-life temperature of 1 minute is used, a part of the heat reaction initiator remains unreacted, and the durability test is performed. Since it may cause foaming, it is not preferable.
- the heat generation starting temperature and the peak temperature of the adhesive resin layer were measured by differential scanning calorimetry (DSC) at a temperature rising rate of 10 ° C./min.
- the peak temperature is a measured value of the temperature of the exothermic peak (the peak at which the calorific value is maximum).
- the exothermic start temperature is a measured value of the temperature at which the exothermic peak having the lowest peak temperature rises from the baseline.
- the measurement range is at least 20 ° C. to 210 ° C., and if no exothermic peak is confirmed in that range, “None” when the adhesive resin layer does not contain a thermal polymerization initiator, the adhesive resin layer is a thermal polymerization initiator. When it contains, it was regarded as “unobservable”.
- a mold capable of forming a multidimensional shape was used, a laminated film was placed between the upper and lower molds, and the mold temperature was raised to a set temperature.
- the set temperature (150 ° C for Example 9, 200 ° C for Examples 1-8, 12-19, 250 ° C for Example 10, 300 ° C for Example 11) is set as the hot press temperature, and before reaching the hot press temperature. This state is preheating.
- the upper and lower molds were pressed to deform the laminated film.
- the time during which the upper and lower molds were combined was set as the press time, and was set to 2 minutes in this evaluation method. After 2 minutes, the mold was opened and the laminated film was taken out.
- ⁇ (excellent), ⁇ (excellent), ⁇ ( Slightly excellent) and x (inferior) were evaluated in 4 grades.
- the failure in the lamination process was evaluated as follows according to the presence / absence, degree, etc. of adhesion failure in the lamination process before hot pressing.
- X Bubbles or defects were visually observed in the laminated film, and the appearance was outside the allowable range.
- the lift of the wrinkles was visually evaluated for the laminated film after hot pressing and evaluated as follows.
- Double-circle The wrinkle of a laminated film cannot be confirmed.
- ⁇ A slight wrinkle can be confirmed on the laminated film.
- delta Although the float of a wrinkle can be confirmed to a laminated
- X The wrinkle of the laminated film can be confirmed, which is outside the allowable range.
- the adhesive strength was evaluated as follows by measuring the adhesive strength between two PET films on a measurement sample prepared from a laminated film after hot pressing. Using a Shimadzu peel tester, one of the two PET films is peeled off, peeled over a length of 100 mm at a peel angle of 180 degrees and a pulling speed of 300 m / min, and the average value of the numerically stable part is determined as the adhesive strength. It was. From this measured value, evaluation was performed as follows.
- Adhesive strength is 30 N / 25 mm or more ⁇ : Adhesive strength is 20 N / 25 mm or more and less than 30 N / 25 mm ⁇ : Adhesive strength is 10 N / 25 mm or more and less than 20 N / 25 mm x: Adhesive strength is less than 10 N / 25 mm
- the minute followability was evaluated as follows by visually confirming the appearance of the laminated film after hot pressing to confirm whether there was foaming of bubbles or the like.
- the adhesive resin composition contains (B) an acrylic monomer or acrylic oligomer as a highly fluid component in addition to the (A) acrylic polymer. Conceivable.
- Comparative Examples 2 to 4 and 6 to 8 by the appearance confirmation after hot pressing, the deformed portion of the base material followed cleanly, but foaming was confirmed on the entire surface.
- Comparative Example 2 a flowable resin component having reactivity is contained in the adhesive resin composition.
- the initiator is a photopolymerization initiator, the curing reaction does not proceed during hot pressing. It is considered that some low molecular components were vaporized and peeled due to volatilization due to temperature and a decrease in adhesion when the pressure was released from the mold. In the case of this example, this problem can be solved if the curing reaction can be promoted by irradiating ultraviolet rays in some way during hot pressing, but it is difficult to irradiate ultraviolet rays in an opaque mold.
- Comparative Examples 3 and 7 a fluid resin component having reactivity is contained in the adhesive resin composition, but since it does not contain an initiator, the curing reaction does not proceed during hot pressing, and the same as in Comparative Example 2 It is thought that it peeled off for the reason.
- Comparative Example 4 a peroxide having a low half-life temperature of 1 minute was used as an initiator, so that the exothermic start temperature was too low and the curing reaction did not proceed during hot pressing, and peeling occurred for the same reason as in Comparative Example 2. It is thought that it has done.
- Comparative Example 8 a peroxide having a high half-life of 1 minute was used as an initiator, so that a peak could not be observed at 210 ° C.
- a reactive fluid resin component and a thermal polymerization initiator may be added to the adhesive resin composition. It turns out to be essential. Moreover, from the results of Comparative Examples 4, 6, and 8, it can be seen that there is a problem whether the peak temperature by DSC measurement of the adhesive resin layer is too low or too high in order to develop the functions of the examples.
- the peak temperature can be controlled by adjusting the type of thermal polymerization initiator, the amount of thermal polymerization initiator relative to the acrylic polymer or the flowable resin component, and the like.
- the adhesive resin layer is bonded in a state of high fluidity to a bonded substrate such as PET, so that it can be firmly adhered.
- the reactive fluid resin component flows due to the heat press and follows the deformation of the base material. Then, the thermal polymerization reaction proceeds gradually with heat, and the reactive fluid resin component becomes polymerized. Since the fluidity of the adhesive resin layer is lowered and hardens in a deformed state, it is considered that not only bubbles in the deformed portion are not generated but also foaming between the substrates does not occur.
- Addition of 4HBA having good compatibility with the acrylic oligomer as in Example 19 has an effect of ensuring the stability of the paint.
- By adding a fluid resin component having reactivity there was a tendency that the leveling property at the time of forming the adhesive resin layer was good and the uniformity of the film thickness was improved.
- the adhesive resin film of each example was cured after being hot-pressed under the same conditions as “(Adhesive resin layer evaluation method by multi-dimensional shape production)” with the adhesive resin layer being laminated between the separators.
- the obtained adhesive resin layer was analyzed by FT-IR (Fourier transform infrared spectroscopy), and almost no peaks of carbon-carbon double bonds (vinyl group of acrylic monomer, etc.) were confirmed.
- FT-IR Fastier transform infrared spectroscopy
- the adhesive resin layer contains (A) an acrylic polymer, (B) an acrylic monomer or an acrylic oligomer, and (C) a thermal polymerization initiator. It is possible to produce an adhesive film that suppresses bubbles and peeling due to hot pressing and can form a three-dimensional shape.
- Adhesive resin film 11 ... Adhesive resin layer, 11a, 11b ... Both surfaces (adhesive surface) of adhesive resin layer, 12, 13 ... Separator, 12a, 13a ... Surface of separator (peeling surface), 20, 30 ... Laminated body, 21, 22 ... base material, 21a, 22a ... inner surface, 21b, 22b ... outer surface, 23 ... adhesive layer after thermosetting.
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Abstract
Description
本願は、2015年7月17日に出願された日本国特願2015−142880号に基づく優先権を主張し、その内容をここに援用する。
前記接着性樹脂組成物が、前記(A)アクリル系ポリマー100重量部に対して、前記(B)アクリル系モノマー又はアクリル系オリゴマーを5~50重量部含有することが好ましい。
前記接着性樹脂組成物が、前記(B)アクリル系モノマー又はアクリル系オリゴマーの少なくとも一部として、水酸基を含有するアクリル系モノマーを含有することが好ましい。
前記接着性樹脂組成物が、前記(B)アクリル系モノマー又はアクリル系オリゴマーの少なくとも一部として、硬化性ウレタンアクリレートを含有することが好ましい。
また、本発明は、前記接着性樹脂層を介して、2枚の基材が積層されてなる積層体を形成するための接着性樹脂層を提供する。
また、本発明は、前記接着性樹脂層を介して、2枚の基材を積層し、得られた積層体を、2つの金型の間に挟持した状態で、前記積層体を加熱変形させ、前記接着性樹脂層が加熱硬化した後でも粘着力が10N/25mm以上であることを特徴とする接着性樹脂層を提供する。
また、本発明は、前記接着性樹脂層を介して、2枚の基材を積層し、得られた積層体を、2つの金型の間に挟持した状態で、前記接着性樹脂層を加熱硬化することを特徴とする積層体の製造方法を提供する。
式(1) 温度A<温度C<温度B<温度D
図1に、接着性樹脂フィルム10の一例の断面図を示す。接着性樹脂フィルム10は、2枚のセパレーター12,13と、これらの間に積層された接着性樹脂層11とを有する。接着性樹脂層11を構成する接着性樹脂組成物は、(A)アクリル系ポリマーと、(B)アクリル系モノマー又はアクリル系オリゴマーと、(C)熱重合開始剤とを含有する。接着性樹脂層11の両面11a,11bは、常温で粘着性を有する(粘着面となっている)。
なお、本明細書中において「常温」とは、約3℃~約40℃であり、好ましくは約10℃~約30℃であり、より好ましくは約15℃~約25℃であり、最も好ましくは約23℃である。
第2の積層方法として、第2の基材22に接着性樹脂層11を積層し、その後オートクレーブ処理を実施し、接着性樹脂層11の上に、第1の基材21を積層した後、もしくは第1の基材21を積層させながら、2つの金型を用いて接着性樹脂層11を加熱硬化させる方法が挙げられる。
第3の積層方法として、第1の基材21、接着性樹脂層11、第2の基材22を同時に積層した後、もしくは積層すると同時に、2つの金型を用いて接着性樹脂層11を加熱硬化させる方法が挙げられる。
本発明の接着性樹脂層の製造に用いる接着剤原材料組成物は、有機溶剤に溶解している方が、より厚みの精度良く塗布することが可能となるため、有機溶剤を含むことが好ましい。接着剤原材料組成物から溶剤を乾燥することで、接着性樹脂層が得られる。つまり、接着剤原材料組成物の組成は、接着性樹脂層を構成する接着性樹脂組成物の組成に、溶剤を加えたものであってもよい。接着性樹脂層は、常温では(熱硬化前)、粘着剤層として機能することができる。
アミド基(−CONR2,Rは水素原子又はアルキル基等の置換基)を有するアクリル系モノマーとしては、アクリルアミド、メタクリルアミド等が挙げられる。
ニトリル基(−CN)を有するアクリル系モノマーとしては、アクリロニトリル、メタクリロニトリル等が挙げられる。
(D)架橋剤(硬化剤)による(A)アクリル系ポリマーの硬化は、被着体に貼合する前の接着性樹脂層を製造する段階で、エージングにより進行させてもよい。
本発明における接着性樹脂層(トランスファーテープ)は、接着剤原材料組成物をセパレーターフィルムに溶媒を含んだ状態で塗布し、乾燥し、さらにセパレーターフィルムにより保護されることで製造することができる。接着剤原材料組成物は、ダイ又はパイプドクターを用いて塗布することが好ましい。溶剤の乾燥においては、ドライヤー等で乾燥させることが好ましい。溶媒の乾燥時間に関しては、生産性を考慮すると、10分間以下であることが好ましく、2~5分間であることがさらに好ましい。また、有機溶媒を十分に乾燥することが必要なため、有機溶媒の沸点以上の温度で乾燥させることが好ましく、熱重合開始剤の1分間半減期温度以下での乾燥をすることが好ましい。
本発明においてのプレス時間に関しては生産性の観点から短時間、例えば5分間以内で反応が終わることが好ましい。また、プレス温度・時間に関しては、積層体の強度が十分になるように設定することができる。
アクリル系ポリマーを含むポリマー溶液として、SKダイン(登録商標)2094(綜研化学株式会社)、架橋剤としてE−AX(綜研化学株式会社)を用い、アクリル系ポリマー100重量部に対して、架橋剤0.2重量部の割合で配合した。得られた混合物に、反応性を持つ流動性樹脂成分として、アクリル系モノマーの4−ヒドロキシブチルアクリレート(大阪有機化学工業株式会社;4HBA)40重量部と、熱重合開始剤として、t−ブチルペルオキシ−2−エチルヘキサノエート(日油株式会社製;製品名:パーブチル(登録商標)O)0.08重量部とを加えて、接着剤原材料組成物を調製した。接着剤原材料組成物は、溶媒として、酢酸エチル(沸点77℃)を含み、コーティングするための塗料として、粘度等の性状が改善されている。
その接着剤原材料組成物を、セパレーター(藤森工業株式会社製;製品名:125E−0010DG2.5AS、厚み125μm)の上面に、アプリケーターを用いて、乾燥後における接着剤樹脂層(粘着剤層)の厚みが50μmとなるように塗布した後、乾燥工程において90℃、2分間の条件で溶剤を乾燥させて接着性樹脂層が積層された積層体を作製した。
次に、得られた積層体の接着性樹脂層の上面に、セパレーター(藤森工業株式会社製;製品名;38E−0010BDAS、厚み38μm)を貼合して、実施例1の接着性樹脂フィルムを作製した。
その後、1週間のエージングを行うことで、アクリル系ポリマーと架橋剤(エポキシ系)との反応を終了させて、架橋されたアクリル系ポリマーと、反応性を持つ流動性樹脂成分と、熱重合開始剤との3種類が存在する接着性樹脂層を形成した。
次に、評価方法及びその結果について、説明する。
昇温速度10℃/分の示差走査熱量測定(DSC)により、接着性樹脂層の発熱開始温度及びピーク温度を測定した。ピーク温度は、発熱ピーク(発熱量が最大となるピーク)の温度の測定値である。発熱開始温度は、ピーク温度が最低となる発熱ピークがベースラインから立ち上がる時の温度の測定値である。測定範囲は、少なくとも20℃~210℃であり、その範囲で発熱ピークが確認されない場合、接着性樹脂層が熱重合開始剤を含まないときは「なし」、接着性樹脂層が熱重合開始剤を含むときは「観察できず」とした。
基材として、15cm×15cmに裁断した厚み100μmの平坦なポリエチレンテレフタレート(PET)フィルムを2枚用意した。これらの厚みは同じであっても異なっても構わないが、この評価方法では同じ厚みにした。接着性樹脂フィルムから片側のセパレーターを剥離して1枚目のPETフィルムに貼合し、さらに反対側のセパレーターを剥離して2枚目のPETフィルムを貼合し、接着性樹脂層を介して2枚のPETフィルムで挟んだ積層フィルムを作製した。ここまでを積層工程とする。
多次元形状を形成できるようにした金型を使用し、上下の金型の間に積層フィルムを設置し、金型の温度を設定温度まで上昇した。その設定温度(実施例9は150℃、実施例1~8、12~19は200℃、実施例10は250℃、実施例11は300℃)を熱プレス温度とし、熱プレス温度に達する前の状態をプレヒーティングとする。熱プレス温度まで熱が上がった時点で上下の金型をプレスし、積層フィルムを変形させた。上下の金型が合わさっている時間をプレス時間とし、本評価方法では2分間に設定した。2分経過後金型を開き、積層フィルムを取り出した。
◎:積層フィルムに気泡、欠陥が目視にて観察されず外観が良好であった。
○:積層フィルムに気泡、もしくは欠陥がわずかに目視にて観察されたが実害のないレベルの外観であった。
△:積層フィルムに気泡、もしくは欠陥がわずかに目視にて観察されたが許容範囲内であった。
×:積層フィルムに気泡、もしくは欠陥が目視にて観察され、外観が許容範囲外であった。
◎:積層フィルムにキワの浮きが確認できない。
○:積層フィルムにごくわずかにキワの浮きが確認できる。
△:積層フィルムにキワの浮きが確認できるが許容範囲内である。
×:積層フィルムにキワの浮きが確認でき、許容範囲外である。
◎:接着強度が30N/25mm以上
○:接着強度が20N/25mm以上、30N/25mm未満
△:接着強度が10N/25mm以上、20N/25mm未満
×:接着強度が10N/25mm未満
◎:積層フィルムに気泡が確認できない。
○:積層フィルムにごくわずかに気泡が確認できる。
△:積層フィルムに気泡が確認できるが許容範囲内である。
×:積層フィルムに気泡が確認でき、許容範囲外である。
実施例では、いずれも積層体に気泡などの外観上の不具合は確認できなかった。これは、接着性樹脂組成物中に、(A)アクリル系ポリマー以外に、流動性の高い成分として(B)アクリル系モノマー又はアクリル系オリゴマーが接着性樹脂組成物中に含まれているためと考えられる。
比較例2では、反応性を持つ流動性樹脂成分が接着性樹脂組成物中に含まれているが、開始剤が光重合開始剤であるため、熱プレス中には硬化反応が進まず、また一部の低分子成分が気化し、金型から圧力が解放される時に温度による揮発及び密着性低下によって剥離してしまったと考えられる。この例の場合は熱プレス中に何らかの方法で紫外線照射を行い、硬化反応を進めることができればこの課題は解決されるが、不透明な金型内に紫外線を照射するのは困難である。
比較例4では、1分間半減期温度が低い過酸化物を開始剤として用いたことにより、発熱開始温度が低すぎて熱プレス中に硬化反応が進まず、比較例2と同様の理由で剥離してしまったと考えられる。
比較例8では、1分間半減期が高い過酸化物を開始剤として用いたことにより、DSCによる測定において210℃以下でピークを観察することができず、熱プレス時の温度では重合反応が開始せず、比較例2と同様の理由で剥離してしまったと考えられる。
比較例6では、反応性を持つ流動性樹脂成分に対する熱重合開始剤の量が多すぎるためDSCによる測定値における発熱開始温度、ピーク温度が低く、熱プレス前から重合反応が進行し、反応してもポリマーの分子量が大きくならず、密着性が向上しないため発泡してしまうと考えられる。
比較例1~3及び7の熱プレス前でのDSCでは、発熱ピークが確認されなかった。熱による反応は確認できないため、熱硬化反応が進んでいないと判断できる。
比較例5の熱プレス前でのDSCでは、熱重合開始剤の発熱が確認されるだけで、反応性を持つ流動性樹脂成分が無いため重合反応は進行しない。
比較例4、8の熱プレス前でのDSCでは、発熱ピークは確認されたが、発熱開始温度及びピーク温度が高いため、上記の熱プレス条件では、熱硬化反応が進まなかったと判断できる。
実施例15~18において接着性樹脂自体の熱分析をDSCで行った。この結果から、熱重合開始剤の種類にもよるが、100℃以上で急激に反応がスタートすることが確認された。このことから、接着剤原材料組成物及び接着性樹脂組成物に使用できる有機溶剤の沸点は100℃以下が好ましく、より好ましくは80℃以下であることが分かる。
Claims (8)
- アクリル系の接着性樹脂組成物を含む単層の接着性樹脂層であって、
前記接着性樹脂組成物が、少なくとも(A)アクリル系ポリマーと、(B)アクリル系モノマー又はアクリル系オリゴマーと、(C)熱重合開始剤とを含有し、
前記接着性樹脂層が、常温で両面に粘着性を有し、昇温速度10℃/分の示差走査熱量測定(DSC)において、80℃以上で発熱が確認され始め、120℃~210℃の間にピークが少なくとも1つ確認されることを特徴とする接着性樹脂層。 - 前記(C)熱重合開始剤が過酸化物であることを特徴とする請求項1に記載の接着性樹脂層。
- 前記接着性樹脂組成物が、前記(A)アクリル系ポリマー100重量部に対して、前記(B)アクリル系モノマー又はアクリル系オリゴマーを5~50重量部含有することを特徴とする請求項1又は2に記載の接着性樹脂層。
- 前記接着性樹脂組成物が、前記(B)アクリル系モノマー又はアクリル系オリゴマーの少なくとも一部として、水酸基を含有するアクリル系モノマーを含有することを特徴とする請求項1~3のいずれかに記載の接着性樹脂層。
- 前記接着性樹脂組成物が、前記(B)アクリル系モノマー又はアクリル系オリゴマーの少なくとも一部として、硬化性ウレタンアクリレートを含有することを特徴とする請求項1~4のいずれかに記載の接着性樹脂層。
- 請求項1~5のいずれかに記載の接着性樹脂層が、2枚のセパレーターの間に積層されてなることを特徴とする接着性樹脂フィルム。
- 請求項1~5のいずれかに記載の接着性樹脂層を介して、2枚の基材が積層されてなる積層体を形成するための接着性樹脂層。
- 請求項1~5のいずれかに記載の接着性樹脂層を介して、2枚の基材を積層し、得られた積層体を、2つの金型の間に挟持した状態で、前記積層体を加熱変形させ、前記接着性樹脂層が加熱硬化した後でも粘着力が10N/25mm以上であることを特徴とする接着性樹脂層。
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CN109536083A (zh) * | 2017-09-19 | 2019-03-29 | 藤森工业株式会社 | 成型体的制造方法 |
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Also Published As
Publication number | Publication date |
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EP3327098A4 (en) | 2019-04-17 |
EP3327098B1 (en) | 2021-04-07 |
KR101978144B1 (ko) | 2019-05-14 |
CN107207928A (zh) | 2017-09-26 |
JP6632115B2 (ja) | 2020-01-15 |
TWI709628B (zh) | 2020-11-11 |
KR20170104545A (ko) | 2017-09-15 |
US10544333B2 (en) | 2020-01-28 |
EP3327098A1 (en) | 2018-05-30 |
KR20190053284A (ko) | 2019-05-17 |
CN107207928B (zh) | 2019-11-12 |
TW201704417A (zh) | 2017-02-01 |
US20180044552A1 (en) | 2018-02-15 |
JP2017025152A (ja) | 2017-02-02 |
KR102066875B1 (ko) | 2020-01-16 |
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