WO2016142986A1 - 認識装置および、認識方法 - Google Patents
認識装置および、認識方法 Download PDFInfo
- Publication number
- WO2016142986A1 WO2016142986A1 PCT/JP2015/056621 JP2015056621W WO2016142986A1 WO 2016142986 A1 WO2016142986 A1 WO 2016142986A1 JP 2015056621 W JP2015056621 W JP 2015056621W WO 2016142986 A1 WO2016142986 A1 WO 2016142986A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- imaging
- component
- data
- conditions
- imaged
- Prior art date
Links
Images
Classifications
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
- G06T7/00—Image analysis
- G06T7/70—Determining position or orientation of objects or cameras
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B11/00—Measuring arrangements characterised by the use of optical techniques
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
- G06T7/00—Image analysis
- G06T7/0002—Inspection of images, e.g. flaw detection
- G06T7/0004—Industrial image inspection
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/08—Monitoring manufacture of assemblages
- H05K13/081—Integration of optical monitoring devices in assembly lines; Processes using optical monitoring devices specially adapted for controlling devices or machines in assembly lines
- H05K13/0813—Controlling of single components prior to mounting, e.g. orientation, component geometry
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
- G06T2207/00—Indexing scheme for image analysis or image enhancement
- G06T2207/30—Subject of image; Context of image processing
- G06T2207/30108—Industrial image inspection
- G06T2207/30141—Printed circuit board [PCB]
Definitions
- the present invention relates to a recognition apparatus and a recognition method for recognizing electrode positions of components mounted on a substrate.
- a recognition device is a recognition device for recognizing the electrode position of a component mounted on a substrate, and the recognition device irradiates light to the component.
- the imaging device for imaging the component based on the light reflected by the component when the component is irradiated with light from at least one of the plurality of light sources, and each of the plurality of imaging conditions
- the imaging device based on the storage device that stores the sample image data for each of the plurality of conditions, the sample image data stored in the storage device, and the imaging data of the components imaged by the imaging device
- a data analysis device for recognizing the electrode positions of the parts imaged by the device, wherein the data analysis device corresponds to the sample image data stored in the storage device.
- the component is imaged by the imaging device according to two or more imaging conditions of the image conditions, and a data creation unit that creates imaging data for each of the two or more imaging conditions, and the two or more created by the data creation unit
- the imaging device based on imaging data corresponding to a first imaging condition among imaging data for each imaging condition and sample image data corresponding to the first imaging condition stored in the storage device
- the first determination unit that determines whether or not the electrode position of the component imaged by the method can be recognized, and the 2 generated by the data generation unit when the electrode position of the component cannot be recognized by the first determination unit Of the imaging data for each imaging condition described above, imaging data corresponding to a second imaging condition different from the first imaging condition, and a support corresponding to the second imaging condition stored in the storage device.
- Based on the pull-image data, and having an image pickup device second determination section determines whether recognizable electrode position of the component picked up by.
- a recognition method includes: (a) a plurality of light sources that irradiate a component with light; and (b) at least one light source of the plurality of light sources that irradiates the component with light.
- An imaging device that images the component based on the light reflected by the component, and (c) a storage device that stores sample image data corresponding to each of a plurality of imaging conditions for each of the plurality of conditions
- a recognition method wherein the recognition method places the component in accordance with two or more imaging conditions among the plurality of imaging conditions corresponding to the sample image data stored in the storage device.
- the imaging device captures the image based on the imaging data corresponding to the second imaging condition different from the sample imaging data stored in the storage device and the second imaging condition. Characterized in that it comprises a second determination step of determining whether a recognizable electrode position of the component has.
- the recognition apparatus and the recognition method according to the present invention when the electrode position cannot be properly recognized by the recognition process using the imaging data of the first imaging condition, the second different from the first imaging condition.
- the recognition process is performed again using the imaging data of the imaging conditions. As described above, by performing recognition processing based on two types of imaging data having different imaging conditions, it is possible to appropriately recognize the electrode positions based on imaging data captured under various conditions.
- FIG. 1 shows a component mounter 10.
- the component mounter 10 is a device for performing a component mounting operation on the circuit substrate 12.
- the component mounting machine 10 includes an apparatus main body 20, a base material conveyance holding device 22, a component mounting device 24, a mark camera 26, a parts camera 28, a component supply device 30, a loose component supply device 32, and a control device (see FIG. 3) 34.
- the circuit substrate 12 includes a circuit board, a three-dimensional structure substrate, and the like, and the circuit board includes a printed wiring board and a printed circuit board.
- the apparatus main body 20 includes a frame portion 40 and a beam portion 42 that is overlaid on the frame portion 40.
- the substrate conveyance holding device 22 is disposed in the center of the frame portion 40 in the front-rear direction, and includes a conveyance device 50 and a clamp device 52.
- the conveyance device 50 is a device that conveys the circuit substrate 12
- the clamp device 52 is a device that holds the circuit substrate 12.
- the base material transport and holding device 22 transports the circuit base material 12 and holds the circuit base material 12 fixedly at a predetermined position.
- the conveyance direction of the circuit substrate 12 is referred to as an X direction
- a horizontal direction perpendicular to the direction is referred to as a Y direction
- a vertical direction is referred to as a Z direction. That is, the width direction of the component mounting machine 10 is the X direction, and the front-rear direction is the Y direction.
- the component mounting device 24 is disposed in the beam portion 42 and includes two work heads 60 and 62 and a work head moving device 64. As shown in FIG. 2, a suction nozzle 66 is provided at the lower end surface of each work head 60, 62, and the parts are sucked and held by the suction nozzle 66.
- the work head moving device 64 includes an X direction moving device 68, a Y direction moving device 70, and a Z direction moving device 72. Then, the two working heads 60 and 62 are integrally moved to arbitrary positions on the frame portion 40 by the X-direction moving device 68 and the Y-direction moving device 70.
- the work heads 60 and 62 are detachably attached to the sliders 74 and 76, and the Z-direction moving device 72 individually moves the sliders 74 and 76 in the vertical direction. That is, the work heads 60 and 62 are individually moved in the vertical direction by the Z-direction moving device 72.
- the mark camera 26 is attached to the slider 74 so as to face downward, and is moved together with the work head 60 in the X direction, the Y direction, and the Z direction. As a result, the mark camera 26 images an arbitrary position on the frame unit 40. As shown in FIG. 1, the parts camera 28 is disposed between the base material conveyance holding device 22 and the component supply device 30 on the frame portion 40 so as to face upward. Thereby, the parts camera 28 images the parts gripped by the suction nozzles 66 of the work heads 60 and 62.
- the component supply device 30 is disposed at one end of the frame portion 40 in the front-rear direction.
- the component supply device 30 includes a tray-type component supply device 78 and a feeder-type component supply device (see FIG. 3) 80.
- the tray-type component supply device 78 is a device that supplies components placed on the tray.
- the feeder-type component supply device 80 is a device that supplies components by a tape feeder or a stick feeder (not shown).
- the bulk component supply device 32 is disposed at the other end portion of the frame portion 40 in the front-rear direction.
- the separated component supply device 32 is a device for aligning a plurality of components scattered in a separated state and supplying the components in an aligned state. That is, it is an apparatus that aligns a plurality of components in an arbitrary posture into a predetermined posture and supplies the components in a predetermined posture.
- the components supplied by the component supply device 30 and the bulk component supply device 32 include electronic circuit components, solar cell components, and power module components.
- Electronic circuit components include components having leads and components not having leads.
- the control device 34 includes a controller 82, a plurality of drive circuits 86, and an image processing device 88.
- the plurality of drive circuits 86 are connected to the transport device 50, the clamp device 52, the work heads 60 and 62, the work head moving device 64, the tray-type component supply device 78, the feeder-type component supply device 80, and the bulk component supply device 32.
- the controller 82 includes a CPU, a ROM, a RAM, and the like and is mainly a computer, and includes a data storage area 96 and a data analysis area 98.
- the data storage area 96 is an area for storing various data
- the data analysis area 98 is an area for analyzing various data.
- the controller 82 is connected to a plurality of drive circuits 86. Thereby, the operations of the substrate conveyance holding device 22 and the component mounting device 24 are controlled by the controller 82. Further, the controller 82 is also connected to the image processing device 88. The image processing device 88 processes image data obtained by the mark camera 26 and the part camera 28, and the controller 82 acquires various types of information from the image data.
- the component mounting operation is performed on the circuit substrate 12 held by the substrate conveyance holding device 22 with the above-described configuration. Specifically, the circuit substrate 12 is transported to the work position, and is fixedly held by the clamp device 52 at that position. Next, the mark camera 26 moves above the circuit substrate 12 and images the circuit substrate 12. Thereby, the information regarding the holding position etc. of the circuit base material 12 is obtained. In addition, the component supply device 30 or the bulk component supply device 32 supplies components at a predetermined supply position. Then, one of the work heads 60 and 62 moves above the component supply position, and holds the component by the suction nozzle 66.
- the work heads 60 and 62 holding the parts move above the parts camera 28, and the parts held by the suction nozzle 66 are imaged by the parts camera 28. As a result, information on the holding position of the component can be obtained. Subsequently, the work heads 60 and 62 holding the components move above the circuit substrate 12 to correct errors in the holding position of the circuit substrate 12, errors in the holding position of the components, and the like. Then, the component is mounted on the circuit substrate 12 by the suction nozzle 66 separating the component.
- the lead component 100 includes a component main body 102 and a plurality of leads 104 extending from one surface of the component main body 102.
- the plurality of leads 104 are inserted into through holes formed in the circuit base 12. For this reason, in order to properly insert the lead 104 into the through hole, it is necessary to appropriately acquire information related to the position of the tip of the lead. However, the position of the tip of the lead 104 may not be properly recognized depending on the shape of the tip of the lead 104 or the like.
- the imaging condition is changed and imaging is performed a plurality of times.
- the position of the tip of the lead 104 is recognized based on the image data created by the plurality of times of imaging.
- the parts camera 28 includes a reflecting mirror 110, side illumination 112, epi-illumination 114, laser illumination 116, and an imaging device 118.
- the reflecting mirror 110 is disposed below the suction nozzle 66 holding the lead component 100 to be imaged and inclined at about 45 degrees.
- the reflectance of the reflecting mirror 110 is 50%, and the transmittance is 50%.
- the side illumination 112 has a generally annular shape, and has a shape that extends upward toward the outer edge. That is, the side illumination 112 has a shape with the bottom of the bowl removed.
- the side illumination 112 is disposed between the reflecting mirror 110 and the lead component 100 held by the suction nozzle 66. Note that the axis of the suction nozzle 66 and the center of the annular side illumination 112 substantially coincide with each other in the vertical direction. As a result, the side illumination 112 irradiates light toward the lead component 100 held by the suction nozzle 66 from obliquely below.
- the epi-illumination 114 is disposed below the reflecting mirror 110 in a state of facing upward.
- the epi-illumination 114 irradiates light from directly below the lead component 100 held by the suction nozzle 66 via the reflecting mirror 110 and the inner diameter portion of the side-illumination 112.
- the laser illumination 116 is constituted by four laser irradiation devices 119 (only two laser irradiation devices are shown in the figure) 119.
- the four laser irradiation devices 119 are arranged at four equal positions on the outer edge of the side illumination 112.
- the laser illumination 116 irradiates the laser beam from the four locations on the side toward the lead component 100 held by the suction nozzle 66 by the four laser irradiation devices 119. Since laser light does not diffuse, the laser illumination 116 irradiates the tip of the lead 104 of the lead component 100 held by the suction nozzle 66 at a pinpoint.
- the light emitted from at least one of the side illumination 112, the epi-illumination 114, and the laser illumination 116 is reflected by the lead component 100 held by the suction nozzle 66, and the optical path (between the two dotted lines 120).
- the light enters the reflecting mirror 110 along the path of Then, 50% of the light incident on the reflecting mirror 110 is reflected by the reflecting mirror 110 and enters the imaging device 118 along the optical path (path between the two dotted lines 122). This is because the reflectance of the reflecting mirror 110 is 50%.
- the imaging device 118 includes a lens 124 and an imaging device 126, and light incident on the imaging device 118 is detected by the imaging device 126 via the lens 124.
- an image on the lower surface side of the lead component 100 held by the suction nozzle 66, that is, imaging data of the tip portion of the lead 104 is obtained.
- sample data corresponding to the imaging conditions is stored in the data analysis area 98 of the controller 82.
- the sample image data stored in the data analysis area 98 and the imaging data of the parts camera 28 are analyzed by the data analysis area 98 of the controller 82, whereby the position of the tip portion of the lead 104 is recognized. .
- the position of the tip portion of the lead 104 can be recognized.
- the path of light reflected by the lead component 100 differs depending on the light source of light irradiated to the lead component 100, it may be difficult to properly recognize the position of the tip portion of the lead 104.
- the lead component 100 is irradiated with light by the epi-illumination 114
- the light irradiated from below the lead component 100 is reflected on the lower surface side of the lead component 100 and reflected.
- Imaging based on light hereinafter sometimes referred to as “epi-illumination imaging” is performed.
- An image obtained by this epi-illumination imaging (hereinafter sometimes referred to as “epi-illumination image”) is, for example, an image shown in FIG.
- the image of the tip portion of the lead 104 is clear.
- the light irradiated from below the lead component 100 is reflected not only by the lead 104 but also by the component main body 102, not only the lead 104 but also the component main body 102 is reflected in the incident image. For this reason, when the imaging data is analyzed, the image of the lead 104 and the image of the component main body 102 are confused, and the position of the tip of the lead 104 may not be properly recognized.
- laser irradiation imaging when laser light is applied to the tip of the lead 104 of the lead component 100 by the laser illumination 116 at a pinpoint, the light emitted from the side of the tip of the lead 104 is the lead 104. Imaging is performed based on the reflected light (hereinafter sometimes referred to as “laser irradiation imaging”). An image obtained by this laser irradiation imaging (hereinafter sometimes referred to as “laser irradiation image”) is, for example, an image shown in FIG. In this image, the image of the tip portion of some of the leads 104 is unclear.
- the end surface of the tip of the lead 104 is a flat surface that intersects the axis of the lead 104 at a right angle
- the light reflected by the end surface of the tip of the lead 104 is an optical path (see FIG. 5: two dotted lines). This is because it is not detected by the image sensor 126 without being incident on the path 120 between them.
- data analysis is performed based on such a laser irradiation image, it may be determined that the position of the tip of the lead 104 is not properly recognized and the lead 104 is missing. In such a case, there is a possibility that the normal lead component 100 is determined as the defective lead component 100 lacking the leads 104 and the normal lead component 100 is discarded.
- the component mounter 10 performs imaging of the lead component 100 a plurality of times according to a plurality of imaging conditions in which the lighting pattern of the light to the lead component 100 is changed, and creates the plurality of times by imaging. Based on the obtained image data, the position of the tip of the lead 104 is recognized. Specifically, at the time of imaging of the lead component 100 held by the suction nozzle 66, imaging of three times of epi-illumination imaging, laser irradiation imaging, and full-irradiation imaging is performed.
- full-irradiation imaging is performed just below and obliquely below the lead component 100 when the lead component 100 held by the suction nozzle 66 is illuminated by both side illumination 112 and epi-illumination 114. Is reflected on the lower surface side of the lead component 100, and imaging is based on the reflected light.
- sample image data corresponding to the imaging conditions for epi-illumination imaging sample image data corresponding to the imaging conditions for laser irradiation imaging
- samples corresponding to the imaging conditions for all-irradiation imaging Image data is stored. Then, when the part camera 28 performs the three times of the epi-illumination imaging, the laser irradiation imaging, and the full-irradiation imaging, first, the imaging data obtained by the laser irradiation imaging and the imaging conditions of the laser irradiation imaging are set. The corresponding sample image data is analyzed in the data analysis area 98 of the controller 82, and the position of the tip of the lead 104 is recognized.
- the lead component 100 is attached to the circuit substrate 12.
- Information indicating that the recognition process has been appropriately performed is stored in the data storage area 96 according to the imaging data of the laser irradiation imaging.
- the recognition processing uses the imaging data of the laser irradiation imaging, that is, when the recognition processing is not properly performed.
- the imaging data obtained by the epi-illumination imaging and the sample image data corresponding to the imaging conditions of the epi-illumination imaging are analyzed in the data analysis area 98 of the controller 82, and the position of the tip of the lead 104 is recognized. Is called.
- the recognition process is appropriately performed, the mounting operation of the lead component 100 to the circuit base 12 is executed based on the processing result.
- Information indicating that the recognition process has been appropriately performed is stored in the data storage area 96 according to the imaging data of the epi-illumination imaging.
- the recognition processing is not appropriately performed using the imaging data of the epi-illumination imaging
- the imaging data obtained by the all-illumination imaging and the sample image data corresponding to the imaging conditions of the all-illumination imaging are The data is analyzed in the data analysis area 98 of the controller 82, and the position of the tip of the lead 104 is recognized.
- the recognition process is appropriately performed, the mounting operation of the lead component 100 to the circuit base 12 is executed based on the processing result.
- Information indicating that the recognition process has been appropriately performed is stored in the data storage area 96 in accordance with the imaging data of all irradiation imaging.
- the lead component 100 is determined as a defective component in which the lead 104 is missing or the like and is discarded.
- the second imaging different from the first imaging condition is performed in the component mounter 10.
- the recognition process is performed again using the imaging data of the condition.
- the imaging data of the third imaging condition different from the second imaging condition is used. The recognition process is performed again.
- recognition processing is performed in the order of recognition processing using imaging data of laser irradiation imaging, recognition processing using imaging data of epi-illumination imaging, and recognition processing using imaging data of all-irradiation imaging.
- recognition processing it is possible to perform recognition processing in order of the recognition rate. Specifically, each time the information indicating that the recognition process has been properly performed is stored in the data storage area 96 in accordance with the imaging data of a predetermined imaging condition, the recognition process is appropriately performed with respect to the number of times the recognition process is performed. The ratio of the number of times, that is, the recognition rate is calculated.
- the recognition processing is performed in descending order of recognition rate among recognition processing using imaging data of laser irradiation imaging, recognition processing using imaging data of epi-illumination imaging, and recognition processing using imaging data of all-irradiation imaging. Can be done. As a result, the time required for the recognition process can be shortened.
- the data creation unit 130 is a functional unit for creating imaging data for each of a plurality of imaging conditions.
- the first determination unit 132 is a functional unit for executing recognition processing using the imaging data of the first imaging condition.
- the second determination unit 134 is a functional unit for executing recognition processing using the imaging data of the second imaging condition.
- the third determination unit 135 is a functional unit for executing recognition processing using the imaging data of the third imaging condition.
- the storage unit 136 is a functional unit for storing, in the data storage area 96, information indicating that the recognition process has been appropriately performed according to the imaging data under a predetermined imaging condition.
- the determination unit 138 is a functional unit for determining the order in which recognition processing is performed according to the recognition rate.
- this invention is not limited to the said Example, It is possible to implement in the various aspect which gave various change and improvement based on the knowledge of those skilled in the art. Specifically, for example, in the above-described embodiment, when the lead component 100 is imaged, the epi-illumination imaging, the laser irradiation imaging, and the full-irradiation imaging are performed three times. It is possible to take an image with a lighting pattern different from the lighting pattern.
- the imaging at the time of irradiation with the side illumination 112 the imaging at the time of irradiation with the side illumination 112 and the laser illumination 116, the imaging at the time of irradiation with the epi-illumination 114 and the laser illumination 116, the side illumination 112 and the epi-illumination. Imaging at the time of irradiation with the illumination 114 and the laser illumination 116 can be performed.
- the lead component 100 can be imaged under more types of imaging conditions by changing the lighting pattern of these three portions.
- the imaging condition is changed by changing the lighting pattern of the light source.
- the imaging condition is changed by changing the exposure time of the imaging device 118, that is, the shutter speed. It is also possible.
- the imaging condition can be changed by changing the height of the imaging target component, that is, the distance between the imaging target component and the imaging device 118.
- the present invention is applied to the recognition process of the position of the lead 104 of the lead component 100.
- the present invention is applied to the recognition process of the position of an electrode of an electronic circuit component having no lead, for example, a bump.
- the present invention can be applied.
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Computer Vision & Pattern Recognition (AREA)
- Theoretical Computer Science (AREA)
- Operations Research (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Quality & Reliability (AREA)
- Supply And Installment Of Electrical Components (AREA)
- Length Measuring Devices By Optical Means (AREA)
Abstract
Description
図1に、部品実装機10を示す。部品実装機10は、回路基材12に対する部品の実装作業を実行するための装置である。部品実装機10は、装置本体20、基材搬送保持装置22、部品装着装置24、マークカメラ26、パーツカメラ28、部品供給装置30、ばら部品供給装置32、制御装置(図3参照)34を備えている。なお、回路基材12として、回路基板、三次元構造の基材等が挙げられ、回路基板として、プリント配線板、プリント回路板等が挙げられる。
部品実装機10では、上述した構成によって、基材搬送保持装置22に保持された回路基材12に対して部品の装着作業が行われる。具体的には、回路基材12が、作業位置まで搬送され、その位置において、クランプ装置52によって固定的に保持される。次に、マークカメラ26が、回路基材12の上方に移動し、回路基材12を撮像する。これにより、回路基材12の保持位置等に関する情報が得られる。また、部品供給装置30若しくは、ばら部品供給装置32は、所定の供給位置において、部品を供給する。そして、作業ヘッド60,62の何れかが、部品の供給位置の上方に移動し、吸着ノズル66によって部品を保持する。続いて、部品を保持した作業ヘッド60,62が、パーツカメラ28の上方に移動し、パーツカメラ28によって、吸着ノズル66に保持された部品が撮像される。これにより、部品の保持位置等に関する情報が得られる。続いて、部品を保持した作業ヘッド60,62が、回路基材12の上方に移動し、回路基材12の保持位置の誤差,部品の保持位置の誤差等を補正する。そして、吸着ノズル66が部品を離脱することで、回路基材12に部品が装着される。
上述したように、部品実装機10では、吸着ノズル66により保持された部品が回路基材12に装着されるため、吸着ノズル66による部品の保持位置等に関する情報を適切に取得する必要がある。特に、回路基材12への装着予定の部品が、リードを有する電子回路部品(以下、「リード部品」と記載する場合がある。)である場合には、リードの先端部の位置に関する情報を適切に取得する必要がある。
Claims (5)
- 基板に実装される部品の電極位置を認識するための認識装置であって、
当該認識装置が、
部品に光を照射する複数の光源と、
前記複数の光源の少なくとも1の光源から部品に光が照射された際に、その部品により反射した光に基づいて、その部品を撮像する撮像装置と、
複数の撮像条件の各々に応じたサンプル画像データを、それら複数の条件毎に記憶する記憶装置と、
前記記憶装置に記憶されている前記サンプル画像データと、前記撮像装置により撮像された部品の撮像データとに基づいて、前記撮像装置により撮像された部品の電極位置を認識するデータ解析装置とを備え、
前記データ解析装置が、
前記記憶装置に記憶されている前記サンプル画像データに対応する前記複数の撮像条件のうちの2以上の撮像条件に従って前記部品を前記撮像装置により撮像し、前記2以上の撮像条件毎の撮像データを作成するデータ作成部と、
前記データ作成部により作成された前記2以上の撮像条件毎の撮像データのうちの第1の撮像条件に応じた撮像データと、前記記憶装置に記憶されている前記第1の撮像条件に応じたサンプル画像データとに基づいて、前記撮像装置により撮像された部品の電極位置を認識可能であるか否かを判定する第1判定部と、
第1判定部によって部品の電極位置を認識できない場合に、前記データ作成部により作成された前記2以上の撮像条件毎の撮像データのうちの前記第1の撮像条件と異なる第2の撮像条件に応じた撮像データと、前記記憶装置に記憶されている前記第2の撮像条件に応じたサンプル画像データとに基づいて、前記撮像装置により撮像された部品の電極位置を認識可能であるか否かを判定する第2判定部と
を有することを特徴とする認識装置。 - 前記複数の撮像条件は、
前記撮像装置により撮像される部品に光を照射する光源の組み合わせが異なる撮像条件と、前記撮像装置による撮像時間が異なる撮像条件と、前記撮像装置により撮像される部品と前記撮像装置との間の距離が異なる撮像条件とのうちの少なくとも1つであることを特徴とする請求項1に記載の認識装置。 - 前記データ解析装置が、
前記第1判定部と前記第2判定部との少なくとも一方によって、前記撮像装置により撮像された部品の電極位置を認識可能であると判断された場合に、その判断に用いられた撮像データの撮像条件を、前記記憶装置に記憶する記憶部と、
前記記憶制御部により前記記憶装置に記憶された撮像条件に基づいて、前記第1判定部で用いられる撮像データの前記第1の撮像条件を決定する決定部と
を有することを特徴とする請求項1または請求項2に記載の認識装置。 - 当該認識装置が、
基板に実装されるリード部品のリードの先端部の位置を認識するための装置であることを特徴とする請求項1ないし請求項3のいずれか1つに記載の認識装置。 - (a)部品に光を照射する複数の光源と、(b)前記複数の光源の少なくとも1の光源から部品に光が照射された際に、その部品により反射した光に基づいて、その部品を撮像する撮像装置と、(c)複数の撮像条件の各々に応じたサンプル画像データを、それら複数の条件毎に記憶する記憶装置とを備え、前記記憶装置に記憶されている前記サンプル画像データと、前記撮像装置により撮像された部品の撮像データとに基づいて、前記撮像装置により撮像された部品の電極位置を認識するための認識方法であって、
当該認識方法が、
前記記憶装置に記憶されている前記サンプル画像データに対応する前記複数の撮像条件のうちの2以上の撮像条件に従って前記部品を前記撮像装置により撮像し、前記2以上の撮像条件毎の撮像データを作成するデータ作成工程と、
前記データ作成工程により作成された前記2以上の撮像条件毎の撮像データのうちの第1の撮像条件に応じた撮像データと、前記記憶装置に記憶されている前記第1の撮像条件に応じたサンプル画像データとに基づいて、前記撮像装置により撮像された部品の電極位置を認識可能であるか否かを判定する第1判定工程と、
第1判定工程によって部品の電極位置を認識できない場合に、前記データ作成部により作成された前記2以上の撮像条件毎の撮像データのうちの前記第1の撮像条件と異なる第2の撮像条件に応じた撮像データと、前記記憶装置に記憶されている前記第2の撮像条件に応じたサンプル画像データとに基づいて、前記撮像装置により撮像された部品の電極位置を認識可能であるか否かを判定する第2判定工程と
を含むことを特徴とする認識方法。
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201580077442.9A CN107407552B (zh) | 2015-03-06 | 2015-03-06 | 识别装置及识别方法 |
EP15884484.5A EP3267146B1 (en) | 2015-03-06 | 2015-03-06 | Recognition device and recognition method |
JP2017504311A JP6482165B2 (ja) | 2015-03-06 | 2015-03-06 | 認識装置および、認識方法 |
PCT/JP2015/056621 WO2016142986A1 (ja) | 2015-03-06 | 2015-03-06 | 認識装置および、認識方法 |
US15/555,830 US10339666B2 (en) | 2015-03-06 | 2015-03-06 | Recognition device and recognition method |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
PCT/JP2015/056621 WO2016142986A1 (ja) | 2015-03-06 | 2015-03-06 | 認識装置および、認識方法 |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2016142986A1 true WO2016142986A1 (ja) | 2016-09-15 |
Family
ID=56878560
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/JP2015/056621 WO2016142986A1 (ja) | 2015-03-06 | 2015-03-06 | 認識装置および、認識方法 |
Country Status (5)
Country | Link |
---|---|
US (1) | US10339666B2 (ja) |
EP (1) | EP3267146B1 (ja) |
JP (1) | JP6482165B2 (ja) |
CN (1) | CN107407552B (ja) |
WO (1) | WO2016142986A1 (ja) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP7185761B2 (ja) * | 2019-03-19 | 2022-12-07 | 株式会社Fuji | 演算装置 |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0512421A (ja) * | 1991-07-08 | 1993-01-22 | Rohm Co Ltd | 画像認識手段による電子部品の位置検出装置 |
JP2006292647A (ja) * | 2005-04-14 | 2006-10-26 | Kaijo Corp | ボンディングワイヤ検査装置 |
JP2011009705A (ja) * | 2009-05-29 | 2011-01-13 | Fuji Mach Mfg Co Ltd | 撮像システムおよび電子回路部品装着機 |
JP2011029254A (ja) * | 2009-07-22 | 2011-02-10 | Panasonic Corp | 電子部品実装方法 |
JP2014132229A (ja) * | 2013-01-04 | 2014-07-17 | Fujitsu Advanced Engineering Ltd | 検査装置及び検査方法 |
Family Cites Families (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH10283479A (ja) * | 1997-03-31 | 1998-10-23 | Omron Corp | リード認識装置およびそのリード認識用の記憶媒体、ならびにその認識装置を用いた電子部品の外観計測装置 |
US6118540A (en) * | 1997-07-11 | 2000-09-12 | Semiconductor Technologies & Instruments, Inc. | Method and apparatus for inspecting a workpiece |
US6207946B1 (en) | 1998-09-03 | 2001-03-27 | Semiconductor Technologies & Instruments, Inc. | Adaptive lighting system and method for machine vision apparatus |
US6627863B2 (en) * | 2000-12-15 | 2003-09-30 | Mitutoyo Corporation | System and methods to determine the settings of multiple light sources in a vision system |
JP3551188B2 (ja) * | 2002-01-10 | 2004-08-04 | オムロン株式会社 | 表面状態検査方法および基板検査装置 |
US7508973B2 (en) | 2003-03-28 | 2009-03-24 | Hitachi High-Technologies Corporation | Method of inspecting defects |
JP2004294358A (ja) | 2003-03-28 | 2004-10-21 | Hitachi High-Technologies Corp | 欠陥検査方法および装置 |
JP2005315749A (ja) | 2004-04-28 | 2005-11-10 | Yamaha Motor Co Ltd | 照明条件特定方法、部品認識装置、同装置を備えた表面実装機および部品試験装置 |
WO2006059360A1 (ja) * | 2004-11-30 | 2006-06-08 | Advantest Corporation | 電子部品ハンドリング装置 |
JP2006294806A (ja) | 2005-04-08 | 2006-10-26 | Yamaha Motor Co Ltd | 照明設定方法、照明設定装置および部品移載装置 |
JP4875936B2 (ja) * | 2006-07-07 | 2012-02-15 | 株式会社日立ハイテクノロジーズ | 異物・欠陥検出方法および異物・欠陥検査装置 |
JP2008066032A (ja) * | 2006-09-05 | 2008-03-21 | Moritex Corp | 照明装置 |
US7915570B2 (en) * | 2007-08-03 | 2011-03-29 | National Instruments Corporation | Smart camera with an integrated lighting controller |
JP5253986B2 (ja) * | 2008-12-04 | 2013-07-31 | Juki株式会社 | ボタン認識装置およびボタン認識方法 |
CN103383239A (zh) * | 2013-06-03 | 2013-11-06 | 上海索广映像有限公司 | 一种bnc端子图像识别装置及识别方法 |
CN104359402A (zh) * | 2014-11-17 | 2015-02-18 | 南京工业大学 | 一种用于矩形引脚元件视觉定位的检测方法 |
-
2015
- 2015-03-06 US US15/555,830 patent/US10339666B2/en active Active
- 2015-03-06 EP EP15884484.5A patent/EP3267146B1/en active Active
- 2015-03-06 WO PCT/JP2015/056621 patent/WO2016142986A1/ja active Application Filing
- 2015-03-06 JP JP2017504311A patent/JP6482165B2/ja active Active
- 2015-03-06 CN CN201580077442.9A patent/CN107407552B/zh active Active
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0512421A (ja) * | 1991-07-08 | 1993-01-22 | Rohm Co Ltd | 画像認識手段による電子部品の位置検出装置 |
JP2006292647A (ja) * | 2005-04-14 | 2006-10-26 | Kaijo Corp | ボンディングワイヤ検査装置 |
JP2011009705A (ja) * | 2009-05-29 | 2011-01-13 | Fuji Mach Mfg Co Ltd | 撮像システムおよび電子回路部品装着機 |
JP2011029254A (ja) * | 2009-07-22 | 2011-02-10 | Panasonic Corp | 電子部品実装方法 |
JP2014132229A (ja) * | 2013-01-04 | 2014-07-17 | Fujitsu Advanced Engineering Ltd | 検査装置及び検査方法 |
Also Published As
Publication number | Publication date |
---|---|
EP3267146B1 (en) | 2021-02-24 |
CN107407552A (zh) | 2017-11-28 |
EP3267146A4 (en) | 2018-02-28 |
JPWO2016142986A1 (ja) | 2017-12-21 |
EP3267146A1 (en) | 2018-01-10 |
CN107407552B (zh) | 2019-11-12 |
US20180047179A1 (en) | 2018-02-15 |
US10339666B2 (en) | 2019-07-02 |
JP6482165B2 (ja) | 2019-03-13 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP6571163B2 (ja) | 認識装置 | |
CN109661863B (zh) | 识别装置 | |
JP6648132B2 (ja) | 対基板作業機、および認識方法 | |
JP6714729B2 (ja) | 表面実装機、部品認識装置、部品認識方法 | |
JP6482165B2 (ja) | 認識装置および、認識方法 | |
JP5296749B2 (ja) | 部品認識装置および表面実装機 | |
JP6754445B2 (ja) | 作業機 | |
CN110651538B (zh) | 作业机及运算方法 | |
JPWO2016143059A1 (ja) | 実装装置、撮像処理方法及び撮像ユニット | |
JP6476294B2 (ja) | 挿入部品位置決め検査方法及び挿入部品実装方法並びに挿入部品位置決め検査装置及び挿入部品実装装置 | |
JP2005340648A (ja) | 部品認識方法、部品認識装置、表面実装機および部品検査装置 | |
WO2019239573A1 (ja) | 作業機 | |
JP7128362B2 (ja) | 作業機 | |
JP7050926B2 (ja) | 異物検出方法および電子部品装着装置 | |
JP7095109B2 (ja) | 作業機、および演算方法 | |
JP6831460B2 (ja) | 部品実装装置および部品データ作成方法 | |
JP2005093906A (ja) | 部品認識装置及び同装置を搭載した表面実装機並びに部品試験装置 | |
JP6789603B2 (ja) | 実装装置 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
121 | Ep: the epo has been informed by wipo that ep was designated in this application |
Ref document number: 15884484 Country of ref document: EP Kind code of ref document: A1 |
|
ENP | Entry into the national phase |
Ref document number: 2017504311 Country of ref document: JP Kind code of ref document: A |
|
REEP | Request for entry into the european phase |
Ref document number: 2015884484 Country of ref document: EP |
|
WWE | Wipo information: entry into national phase |
Ref document number: 15555830 Country of ref document: US |
|
NENP | Non-entry into the national phase |
Ref country code: DE |