WO2015081506A1 - 用于通信设备的互连*** - Google Patents

用于通信设备的互连*** Download PDF

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Publication number
WO2015081506A1
WO2015081506A1 PCT/CN2013/088477 CN2013088477W WO2015081506A1 WO 2015081506 A1 WO2015081506 A1 WO 2015081506A1 CN 2013088477 W CN2013088477 W CN 2013088477W WO 2015081506 A1 WO2015081506 A1 WO 2015081506A1
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WO
WIPO (PCT)
Prior art keywords
backplane
area
kth
service board
service
Prior art date
Application number
PCT/CN2013/088477
Other languages
English (en)
French (fr)
Inventor
刘长义
项能武
吴凯
Original Assignee
华为技术有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 华为技术有限公司 filed Critical 华为技术有限公司
Priority to CN201380002584.XA priority Critical patent/CN105027518B/zh
Priority to EP13898667.4A priority patent/EP3068088A4/en
Priority to PCT/CN2013/088477 priority patent/WO2015081506A1/zh
Publication of WO2015081506A1 publication Critical patent/WO2015081506A1/zh

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Classifications

    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04L—TRANSMISSION OF DIGITAL INFORMATION, e.g. TELEGRAPHIC COMMUNICATION
    • H04L12/00—Data switching networks
    • H04L12/64—Hybrid switching systems
    • H04L12/6418—Hybrid transport

Definitions

  • Embodiments of the present invention relate to the field of communication technologies and, more particularly, to an interconnection system for a communication device. Background technique
  • the system architecture of the existing communication equipment is a frame structure of a conventional printed circuit board (PCB) backplane, and a system architecture of a reciprocal interconnection. This kind of frame and refusal interconnected system architecture can not meet the system's demand for high integration, high bandwidth transmission, and flexible system expansion.
  • Embodiments of the present invention provide an interconnection system for a communication device that satisfies the system's demand for high integration, high speed, high bandwidth, and flexibility.
  • Embodiments of the present invention provide an interconnection system for a communication device, where the interconnection system includes M backplane areas and N backplane extension areas, and the M backplane areas are distributed on K printed circuit board PCB backplanes.
  • the kth backplane area includes at least one stencil connector and at least one service board connector, and the kth backplane area is any one of the M backplane areas, where: the kth At least one stencil connector of the backplane area, for connecting to the kth group stencil, at least one service board connector of the kth backplane area, for connecting with the kth group service board; the kth Each of the stencil connectors of the backplane area is respectively connected to all the service board connectors of the kth backplane area through the PCB backplane where the kth backplane area is located; corresponding to the kth backplane area
  • the kth backplane expansion area includes at least one stencil connector, at least one service board connector, and a low dielectric
  • all of the stencil connectors of the kth backplane extension and all of the service board connectors are attached to any of the PCB backplanes.
  • all of the stencil connectors of the kth backplane extension and all of the service board connectors are fixed on the PCB backplane on which the kth backplane area is located.
  • all of the stencil connectors and all of the service board connectors of the kth backplane extension are attached to the structural member.
  • the kth backplane extension is located to the left or to the right of the kth backplane region.
  • the kth backplane extension area is at least divided.
  • the P sub-backplane expansion areas are respectively located on opposite sides of the kth backplane area, where P is a positive integer greater than 1.
  • the kth backplane area is at least divided into The Q sub-backplane areas are respectively located on opposite sides of the kth backplane extension area, where Q is a positive integer greater than 1.
  • the kth backplane extension is at least divided.
  • the kth backplane area is divided into at least Q sub-backplane areas, and the pth sub-backplane extension area is located on the left or right side of the qth sub-backplane area; wherein, P and Q Both are positive integers greater than 1, p is any positive integer less than or equal to P, and q is any positive integer less than or equal to Q.
  • the low dielectric loss transmission material is a cable or an optical fiber.
  • the interconnection system for a communication device includes M backplane areas and N backplane extension areas, the M backplane areas are distributed on K PCB backplanes, and each of the kth backplane areas
  • the stencil connector is respectively connected to all the service board connectors of the kth backplane area through the PCB backplane where the kth backplane area is located; the kth backplane extension corresponding to the kth backplane area
  • Each of the stencil connectors in the zone transmits all of the services of the various backplane expansion zones through the low dielectric loss transmission material
  • the board connectors are connected; each of the service board connectors of the kth backplane extension is connected to all of the other board connectors of the other backplane extensions by the low dielectric loss transmission material.
  • the interconnection system provided by the present invention is a highly integrated, high speed, high bandwidth, and flexible point-to-point interconnection system.
  • FIG. 1 is a side cross-sectional view of an interconnection system of a communication device of a first example provided in accordance with an embodiment of the present invention.
  • FIG. 2 is a rear cross-sectional view of an interconnection system of a communication device of a first example provided in accordance with an embodiment of the present invention.
  • FIG 3 is a rear cross-sectional view of an interconnection system of a communication device of a second example provided in accordance with an embodiment of the present invention.
  • FIG. 4 is a rear cross-sectional view of an interconnection system of a communication device of a third example provided in accordance with an embodiment of the present invention.
  • Figure 5 is a rear cross-sectional view of an interconnection system of a communication device of a fourth example provided in accordance with an embodiment of the present invention. detailed description
  • a communication device such as a network server, may include a chassis, a network board, a service board, a backboard, and a cable, wherein the chassis may be a rectangular parallelepiped for accommodating the network board, the service board, the backboard, and the cable.
  • the chassis generally includes left and right side wall panels, a top panel, a bottom panel and a rear wall panel.
  • the front panel may also be provided according to specific needs, wherein the top panel and the bottom panel and the left and right side wall panels may be vertically connected or integrally formed, and the rear panel is fastened by fastening. The pieces are joined to the left and right side wall panels, the top panel and the bottom panel.
  • the resulting chassis provides installation space and structural support for components such as stencils, service boards, backplanes, and cables.
  • the backboard is used to connect the network board and the service board, and is generally vertically inserted in the chassis, and may be located in the middle or the rear of the chassis.
  • a connection slot or a connection port is mounted on the back panel.
  • the stencil and service board are connected to the backplane through connection slots or connectors.
  • the stencil and the service board are inserted from the front side of the chassis and connected to the front side of the backplane, and the cables are led out from the rear side of the backplane, and are interconnected between the stencil and the service board.
  • the stencils described herein generally refer to the central switching unit of the system, which is used to implement data exchange between service boards.
  • the service board generally refers to other boards except the switch board in the system.
  • the stencil and the service board are only convenient for description, and are distinguished from each other in function, and are not used to define physical attributes such as their structure and shape.
  • the communication device adopts a single front cross-cut design, that is, the stencil and the service board are parallel to the top board, and the stencil and the service board are vertically inserted in the back board parallel to the rear wall board.
  • the communication devices shown in the embodiments of the present invention all adopt a single front horizontal insertion design.
  • front side refers herein to the side on which the backplane is inserted with the stencil and the service board
  • back side is used herein to refer to the side opposite to the "front side”. That is, the side where the stencil and the service board are not inserted, and when the design is horizontally inserted in front of the single, it is close to the side of the rear wall.
  • horizontal is used herein to mean the direction in which the chassis is placed on a plane parallel to the plane of placement
  • vertical is used herein to mean a direction perpendicular to the plane of placement.
  • top refers to the side of the chassis that is placed vertically away from the chassis
  • bottom is used herein to refer to the side of the chassis near the plane in which the chassis is placed.
  • left side refers to the left side of the rear wall panel facing the chassis placed on a flat surface
  • right side is used herein to refer to the right side in this case.
  • parallel is used herein to mean that the two components are substantially parallel, and does not limit the two to be absolutely parallel. There may be some error between the two or a certain angle between the two, as long as the two are separated by a certain distance. The interval can be.
  • vertical is used herein to mean that the two components are substantially perpendicular, and does not limit the absolute 90 degree intersection therebetween, allowing for a reasonable error.
  • An interconnection system for a communication device includes M backplane areas and N backplanes, where M is a positive integer greater than or equal to 2, and K is a positive integer less than or equal to M.
  • M is a positive integer greater than or equal to 2
  • K is a positive integer less than or equal to M.
  • M can be physically a PCB backplane
  • M backplane areas are distributed on the PCB backplane, or M-piece PCB backplanes
  • each backplane area is distributed on each PCB backplane.
  • the value of K can be determined according to the limitation of the size of the PCB backplane and the number of backplane areas.
  • the kth backplane area is any one of the M backplane areas, and the kth backplane area satisfies the following conditions:
  • the kth backplane area includes at least one stencil connector and at least one service board connector
  • the at least one stencil connector of the kth backplane area is configured to be connected to the kth group stencil, and the at least one service board connector of the kth backplane area is used for connecting with the kth group service board
  • Each of the stencil connectors of the kth backplane area is connected to all of the service board connectors of the kth backplane area through internal traces of the PCB backplane where the kth backplane area is located.
  • the kth backplane area is any one of the M backplane areas, that is, all the backplane areas in the M backplane areas satisfy the conditions of the kth backplane area described above.
  • the kth backplane extension corresponding to the kth backplane area satisfies the following condition: the kth backplane extension area corresponding to the kth backplane area includes at least one stencil connector and at least one service board connection And a low dielectric loss transmission material, wherein at least one stencil connector in the kth backplane expansion area is used to connect with the kth stencil, and at least one service board connector in the kth backplane extension is used for Connect to the kth group business board. Since the kth backplane area corresponding to the kth backplane extension area is any one of the M backplane areas, the backplane extension area of any of the M backplane extension areas should also be satisfied. The conditions satisfied by the kth backplane extension area described above. In other words, each of the M backplane extensions satisfies the conditions satisfied by the kth backplane extension.
  • each group of network boards and each group of service boards is realized through the PCB backplane.
  • Each service board is plugged into the service board connector of the corresponding backplane area and the service board connector of the corresponding backplane expansion area.
  • Each set of network boards is simultaneously inserted into the corresponding backplane area of the network board connector.
  • each group of network boards includes at least one network board
  • each group of service boards includes at least one service board.
  • Each of the stencil connectors in the kth backplane extension is connected to all of the service board connectors of the other backplane extensions by low dielectric loss transmission material; each service board connection in the kth backplane extension
  • the device is connected to all of the stencil connectors of each of the other backplane extensions via a low dielectric loss transfer material.
  • the low dielectric loss transmission materials herein may be high speed cables or optical fibers, for example, cables capable of supporting low dielectric loss materials supporting high speed long distance transmission, and may be copper core cables, optical fibers, and other high speed low loss dielectric materials.
  • k is a positive integer less than or equal to M. Therefore, the inter-group interconnection between one set of stencils and another set of service boards can be implemented through the backplane expansion area.
  • the service board ka in the kth group service board and the service board 1 b in the first group service board may pass through the kth backplane area and the kth group stencil first.
  • the stencil k-m connection, the stencil km in the k-th stencil is connected to the service board 1-b in the first group service board via the k-th backplane extension area, thereby implementing the k-th group service through two hops
  • the backplane extension area may further include a structural member for fixing the high speed cable.
  • all the network board connectors of the kth backplane expansion area and all the service board connectors of the kth backplane expansion area may be fixed on the PCB backplane, and may be fixed directly on the PCB backplane.
  • the openings, the respective stencil connectors or the service board connectors are fixed at the openings, and may also be fixed to the PCB backplane by metal or plastic structural members, and the present invention is not limited thereto.
  • all the stencil connectors and all service board connectors of the kth backplane extension area can be fixed on the PCB backplane where the kth board area is located.
  • all of the stencil connectors and all of the service board connectors of the kth backplane extension can be attached to metal or plastic structural members.
  • the kth backplane extension area may be located on the left or right side of the kth backplane area.
  • the communication device 1000 shown in Fig. 2 is a specific embodiment of this embodiment.
  • M is equal to 2
  • N is equal to 2
  • the backplane extension regions are all located on the right side of the backplane region.
  • the kth backplane expansion area may be divided into P sub-backplane expansion areas, and the stencil connector in each sub-backplane expansion area is a stencil connection of the backplane expansion area.
  • the subset of devices, the service board connector in each sub-backplane expansion area is a subset of the service board connectors of the backplane expansion area, and the stencil connector and other sub-backplane expansion areas in each sub-backplane expansion area.
  • the stencil connectors do not intersect, and the service board connectors in each sub-backplane extension area and the service board connectors of other sub-backplane extension areas do not intersect.
  • the P sub-backplane extension areas are respectively located on both sides of the kth backplane area, that is, a part of the sub-sub-board extension areas of the P sub-backplane extension areas are located on the left side of the kth backplane area, and P sub-backplane extension areas The other part of the sub-back panel area is located on the right side of the kth backplane area.
  • P is a positive integer greater than one. Obviously, P cannot be greater than the number of stencil connectors in the kth backplane expansion area, and P cannot be greater than the number of service board connectors in the kth backplane expansion area.
  • the kth backplane area is divided into Q sub-backplanes, and the stencil connector in each sub-backplane area is a subset of the stencil connectors of the backplane area, and each In the backplane
  • the service board connector is a subset of the service board connectors in the backplane area.
  • the stencil connectors in each sub-backplane area and the stencil connectors in the other sub-backplane areas do not intersect, and the service boards in each sub-backplane area There is no intersection between the connector and the business board connectors of the other sub-backplane areas.
  • the Q sub-backplane areas are respectively located on both sides of the kth backplane expansion area, that is, a part of the sub-sub-board areas in the Q sub-backboard areas are located on the left side of the kth backplane expansion area, and in the Q sub-backboard areas Another portion of the sub-back panel area is located to the right of the kth backplane area.
  • Q is a positive integer greater than one. Obviously, Q cannot be larger than the number of stencil connectors in the kth backplane area, and Q cannot be larger than the number of service board connectors in the kth backplane area.
  • the kth backplane expansion area may be divided into P sub-backplane expansion areas, and the stencil connector in each sub-backplane expansion area is a stencil connection of the backplane expansion area.
  • the subset of devices, the service board connector in each sub-backplane expansion area is a subset of the service board connectors of the backplane expansion area, and the stencil connector and other sub-backplane expansion areas in each sub-backplane expansion area.
  • the stencil connectors do not intersect, and the service board connectors in each sub-backplane extension area and the service board connectors of other sub-backplane extension areas do not intersect.
  • the kth backplane area is divided into Q sub-backplanes, and the stencil connectors in each sub-backplane area are a subset of the stencil connectors of the backplane area, and the service board connectors in each sub-backplane are A subset of the service board connectors in the backplane area, the stencil connectors in each sub-backplane area and the stencil connectors in the other sub-backplane areas do not intersect, and the service board connectors and other sub-sub-boards in each sub-backplane area There is no intersection of the business board connectors in the backplane area.
  • the pth sub-backplane extension area is located on the left or right side of the qth sub-backplane area. Where P and Q are positive integers greater than one.
  • P cannot be greater than the number of stencil connectors in the kth backplane expansion area
  • P cannot be greater than the number of service board connectors in the kth backplane expansion area
  • Q cannot be larger than the kth backplane area.
  • the number of board connectors, Q cannot be greater than the number of service board connectors in the kth backplane area
  • p is any positive integer less than or equal to P
  • q is any positive integer less than or equal to Q.
  • the internal network board and the service board of the interconnection system for communication equipment provided by the invention are point-to-point connection and communication, and the communication link is short and the delay is small.
  • the system is divided into a backplane area and a backplane expansion area by partitioning, and the backplane expansion area enhances system configuration flexibility and scalability.
  • the system internally divides the PCB backplane into multiple backplane areas, which facilitates miniaturization of the PCB backplane of each group, reduces the manufacturing cost of the PCB backplane, and reduces the PCB backplane due to the reduction of the PCB backplane. Internal The transmission rate of the trace is increased.
  • the interconnection system for a communication device is a highly integrated, high-speed, high-bandwidth, flexible and expandable point-to-point interconnection system.
  • the interconnection system of the communication device 1000 includes two backplane areas, one on each of the backplane areas and one on the two backplane extensions.
  • the two backplanes are a first backplane area 1001 and a second backplane area 1002, respectively, and the two PCB backplanes are respectively a first PCB backplane 1001 and a second PCB backplane 1002.
  • the first backplane area 1001 is connected to the first group of network boards through a network board connector, wherein the first group of network boards includes a network board, that is, the network board 1012.
  • the first backplane area 1001 is connected to the first group of service boards through two service board connectors.
  • the first group of service boards includes two service boards, namely, a service board 1011 and a service board 1013.
  • the service board connector for connecting the service board 1011 is connected to the network board connector for connecting the network board 1012 through the internal routing of the first PCB backplane 1001, and the connector for connecting the service board 1013 passes through the first PCB.
  • the inner trace of the backplane 1001 is connected to a connector for connecting the stencil 1012. In this way, the first group of service boards and the first group of network boards can communicate intra-group through the internal routing of the first PCB backplane 1001.
  • the second backplane area 1002 is connected to the second set of network boards through a stencil connector, wherein the second set of stencils includes a stencil, that is, the stencil 1022.
  • the second backplane area 1002 is connected to the second group of service boards by using two service board connectors.
  • the second group of service boards includes two service boards, namely, a service board 1021 and a service board 1023.
  • the service board connector for connecting the service board 1021 is connected to the network board connector for connecting the network board 1022 through the internal wiring on the second PCB backplane 1002, and the service board connector for connecting the service board 1023 is passed.
  • the internal traces on the second PCB backplane 1002 are connected to the stencil connectors for connecting the stencils 1022.
  • a stencil connector of the first backplane expansion area is connected to the first group of stencils, that is, connected to the stencil 1012, and two service board connectors of the first backplane expansion area are connected to the first group of service boards, that is, The service board 1011 is connected to the service board 1013.
  • a stencil connector of the second backplane expansion area is connected to the second group of stencils, that is, connected to the stencil 1022, and two service board connectors of the second backplane expansion area are connected to the second group of service boards, that is, The service board 1021 is connected to the service board 1023.
  • the stencil connector for connecting the first group of stencils in the first backplane extension area is connected to the service board connector for connecting the second group of service boards in the extension area of the second backplane through the high speed cable.
  • the stencil connector for connecting the second group of stencils in the second backplane extension area is connected to the service board connector for connecting the first group of service boards in the first backplane extension area through the high speed cable.
  • Figure 2 shows the specific connection between the stencil connector and the service board connector in the extension area of the backplane.
  • FIG. 2 is a rear cross-sectional view of an interconnection system of a communication device of a first example provided in accordance with an embodiment of the present invention.
  • FIG. 2 specifically shows the connection relationship between the service board connector and the stencil connector in the first backplane expansion area and the second backplane extension area.
  • the stencil connector of the first backplane expansion area in FIG. 2 includes a stencil connector 1112, the service board connector includes a service board connector 1111 and a service board connector 1113, and the stencil connector of the second backplane extension area includes The stencil connector 1212, the service board connector of the second backplane extension area includes a service board connector 1211 and a service board connector 1213.
  • the network board connector 1112 in the first backplane expansion area is respectively connected to the service board connector 1211 and the service board connector 1213 in the second backplane extension area through high speed cables.
  • the stencil connector 1212 in the second backplane extension area is connected to the service board connector 1111 and the service board connector 1113 in the first backplane expansion area by high speed cables, respectively.
  • the stencil connector 1112 is configured to be connected to the first group of stencils, that is, to the stencil 1012, and the service board connector 1111 and the service board connector 1113 are respectively used in the first group of service boards.
  • the business boards 1011 and 1013 are connected.
  • the stencil connector 1212 is configured to be connected to the second group of stencils, that is, to the stencil 1022, and the service board connector 1211 and the service board connector 1213 are respectively used for the service board 1021 and the service board in the second group of service boards. 1023 connection.
  • the first group of service boards can be used only to the first group of service boards to the second group of service boards.
  • the path to communicate Each group of service boards is connected to form a point-to-point interconnection system through a stencil.
  • a group of service boards to another group of service boards can complete communication only through two hops.
  • the package is flexible and enhances the expansion of the communication equipment. Sex and integration.
  • the backplane expansion area can be modularized. According to the number of supported signal links, the number of connected packets, the different rates, bandwidth, etc., different modules are designed. This can solve different requirements for bandwidth, speed, and cost in different application scenarios.
  • the backplane extension area can also be fixed on the corresponding PCB backplane.
  • the first backplane expansion area (including the network board connector 1112, the service board connector 1111, and the service board connector 1113) may be fixed on the first PCB backplane 1001
  • the second backplane expansion area (including the stencil connector 1212, the service board connector 1211 and the service board connector 1213) may be fixed on the second PCB backplane 1002.
  • FIG. 3 is a rear cross-sectional view of an interconnection system of a communication device of a second example provided in accordance with an embodiment of the present invention.
  • the communication device 2000 shown in FIG. 3 includes M backplane areas, where M is a positive integer, and FIG. 3 shows only a screenshot of the kth backplane and the kth backplane extension in the M backplane areas.
  • the kth backplane area is any one of the M backplane areas.
  • the k-th backplane extension area connected to the k-th network board is divided into a first sub-backplane extension area and a second sub-backplane extension area, and the first sub-back
  • the board expansion area includes a first group of network board connectors and a first group of service board connectors
  • the second child back board expansion area includes a second group of network board connectors and a second group of service board connectors.
  • the first sub-backplane extension area and the second sub-backplane extension are located on the left and right sides of the kth backplane area.
  • the stencil connector in the kth backplane expansion area can be connected to the service board connector in each of the other backplane extension areas through the high speed cable, and the service board connector in the kth backplane extension area can also pass the high speed.
  • the cables are connected to the stencil connectors in the other backplane extensions.
  • the first set of stencil connectors and the second set of stencil connectors can be connected to the service board connectors in the other various backplane extensions by high speed cables.
  • the first set of service board connectors and the second set of service board connectors can also be connected to the stencil connectors in the other various backplane extensions via high speed cables.
  • FIG. 4 is a rear cross-sectional view of an interconnection system of a communication device of a third example provided in accordance with an embodiment of the present invention.
  • 4 is a rear cross-sectional view of an interconnection system of a communication device of a second example provided in accordance with an embodiment of the present invention.
  • the communication device 3000 shown in FIG. 4 includes M backplane areas, where M is a positive integer, and FIG. 4 shows only the kth backplane area and the kth backplane extension area of the M backplane areas. Screenshot, the kth backplane area is any of the M backplane areas.
  • the kth backplane area is divided into two sub-backplane areas, that is, a first sub-back board and a second sub-back board.
  • the kth backplane expansion area is divided into two sub-backplane extension areas, that is, a first sub-backplane extension area and a second sub-backplane extension area, wherein the first sub-backplane extension area includes a first group of stencil connectors And the first group of service board connectors, and the second sub-backplane expansion area includes the second group of network boards Connector and second set of business board connectors.
  • the first sub-backplane expansion area is located on the left side of the first sub-backboard area
  • the second sub-backboard extension area is located on the right side of the second sub-backboard area.
  • the stencil connector in the kth backplane expansion area can be connected to the service board connector in each of the other backplane extension areas through the high speed cable, and the service board connector in the kth backplane extension area can also pass the high speed.
  • the cables are connected to the stencil connectors in the other backplane extensions.
  • the first set of stencil connectors and the second set of stencil connectors can be connected to the service board connectors in the other various backplane extensions by high speed cables.
  • the first set of service board connectors and the second set of service board connectors can also be connected to the stencil connectors in the other various backplane extensions via high speed cables.
  • Figure 5 is a rear cross-sectional view of an interconnection system of a communication device of a fourth example provided in accordance with an embodiment of the present invention.
  • communication device 4000 includes two backplane areas.
  • the first backplane expansion area is located on the right side of the first backplane area, and is used for connecting the first group of network boards corresponding to the first backplane area and the first group of service boards.
  • the second backplane expansion area is located on the left side of the second backplane area, and is used for connecting the second group of network boards corresponding to the second backplane area and the second group of service boards.
  • the stencil connector in the first backplane expansion area is connected to the service board connector in the second backplane expansion area by a high speed cable, and the stencil connector in the second backplane expansion area passes the high speed cable and the first Business board connector connections in the backplane expansion area.
  • the disclosed systems, devices, and The method can be implemented in other ways.
  • the device embodiments described above are merely illustrative.
  • the division of the unit is only a logical function division.
  • there may be another division manner for example, multiple units or components may be combined or Can be integrated into another system, or some features can be ignored, or not executed.
  • the mutual coupling or direct coupling or communication connection shown or discussed may be an indirect coupling or communication connection through some interface, device or unit, and may be in an electrical, mechanical or other form.
  • the units described as separate components may or may not be physically separate, and the components displayed as units may or may not be physical units, that is, may be located in one place, or may be distributed to multiple network units. Some or all of the units may be selected according to actual needs to achieve the objectives of the solution of the embodiment.

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  • Engineering & Computer Science (AREA)
  • Computer Networks & Wireless Communication (AREA)
  • Signal Processing (AREA)
  • Mounting Of Printed Circuit Boards And The Like (AREA)
  • Combinations Of Printed Boards (AREA)

Abstract

　本发明实施例所提供的用于通信设备的互连***，该互连***包括：M 个背板区和 N个背板扩展区，该 M个背板区分布在 K个 PCB背板上，该第 k个背板区的每一个网板连接器通过该第k个背板区所在的 PCB背板分别与该第k个背板区的所有业务板连接器连接；对应于该第k个背板区的第k个背板扩展区中的每一个网板连接器通过该低介质损耗传输材料与其他各个背板扩展区的所有业务板连接器相连接；该第k个背板扩展区的每一个业务板连接器通过该低介质损耗传输材料与其他各个背板扩展区的所有网板连接器相连接。本发明实施例所提供的互连***是一个高集成度、高速、高带宽、可灵活扩展的点到点互连***。

Description

用于通信设备的互连*** 技术领域
本发明实施例涉及通信技术领域， 并且更具体地， 涉及用于通信设备的 互连***。 背景技术
随着智能终端的普及与应用， 网页、 音乐、 视频、 多媒体等的数据流量 与曰倶增， 这就导致了高带宽传输的需求不断攀升。 但是现有的通信设备的 ***架构为采用传统的印刷电路板 ( Printed Circuit Board, PCB )背板的框、 拒式互连的***架构。这种框、拒式互连的***架构不能满足***对高集成、 高带宽传输、 ***灵活扩展的需求。 发明内容
本发明实施例提供用于通信设备的互连***，该互连***能够满足*** 对高集成度、 高速、 高带宽、 可灵活扩展的需求。
本发明实施例提供一种用于通信设备的互连***， 该互连***包括 M 个背板区和 N个背板扩展区，该 M个背板区分布在 K个印刷电路板 PCB背 板上， 第 k个背板区包括至少一个网板连接器和至少一个业务板连接器， 该 第 k个背板区为该 M个背板区中的任一个背板区， 其中： 该第 k个背板区 的至少一个网板连接器， 用于与第 k组网板连接， 该第 k个背板区的至少一 个业务板连接器， 用于与第 k组业务板连接； 该第 k个背板区的每一个网板 连接器通过该第 k个背板区所在的 PCB背板分别与该第 k个背板区的所有 业务板连接器连接； 对应于该第 k个背板区的第 k个背板扩展区包括至少一 个网板连接器， 至少一个业务板连接器， 和低介质损耗传输材料， 其中： 该 第 k个背板扩展区的至少一个网板连接器， 用于与该第 k组网板连接， 该第 k个背板扩展区的至少一个业务板连接器， 用于与该第 k组业务板连接； 该 第 k个背板扩展区的每一个网板连接器通过该低介质损耗传输材料与其他各 个背板扩展区的所有业务板连接器相连接； 该第 k个背板扩展区的每一个业 务板连接器通过该低介质损耗传输材料与其他各个背板扩展区的所有网板 连接器相连接； 其中， M为大于或者等于 2的正整数， k为小于或者等于 M 的任一正整数， N为大于或者等于 M的正整数， K为小于或者等于 M的正 整数， 每一组网板至少包括一个网板， 每一组业务板至少包括一个业务板。
结合第一方面， 在第一种可能的实现方式中， 该第 k个背板扩展区的所 有网板连接器和所有业务板连接器固定在任一 PCB背板上。
结合第一方面， 在第二种可能的实现方式中， 该第 k个背板扩展区的所 有网板连接器和所有业务板连接器固定在第 k个背板区所在的 PCB背板上。
结合第一方面， 在第三种可能的实现方式中， 该第 k个背板扩展区的所 有网板连接器和所有业务板连接器固定在结构件上。
结合第一方面或上述任一种可能的实现方式中，在第四种可能的实现方 式中， 该第 k个背板扩展区位于该第 k个背板区的左侧或右侧。
结合第一方面或第一种可能的实现方式至第三种可能的实现方式中的 任一种可能的实现方式， 在第五种可能的实现方式中， 该第 k个背板扩展区 至少划分为 P个子背板扩展区，该 P个子背板扩展区分别位于第 k个背板区 的两侧， 其中 P为大于 1的正整数。
结合第一方面或第一种可能的实现方式至第三种可能的实现方式中的 任一种可能的实现方式， 在第六种可能的实现方式中， 该第 k个背板区至少 划分为 Q个子背板区， 该 Q个子背板区分别位于第 k个背板扩展区的两侧， 其中 Q为大于 1的正整数。
结合第一方面或第一种可能的实现方式至第三种可能的实现方式中的 任一种可能的实现方式， 在第七种可能的实现方式中， 该第 k个背板扩展区 至少划分为 P个子背板扩展区， 该第 k个背板区划分为至少 Q个子背板区， 第 p个子背板扩展区位于第 q个子背板区的左侧或者右侧； 其中， P和 Q均 为大于 1的正整数， p为小于或者等于 P的任一正整数， q为小于或者等于 Q的任一正整数。
结合第一方面或上述任一种可能的实现方式，在第八种可能的实现方式 中， 该低介质损耗传输材料为线缆或者光纤。
发明所提供的用于通信设备的互连***包括 M个背板区和 N个背板扩 展区， 该 M个背板区分布在 K个 PCB背板上， 第 k个背板区的每一个网板 连接器通过该第 k个背板区所在的 PCB背板分别与该第 k个背板区的所有 业务板连接器连接； 对应于该第 k个背板区的第 k个背板扩展区中的每一个 网板连接器通过该低介质损耗传输材料与其他各个背板扩展区的所有业务 板连接器相连接； 该第 k个背板扩展区的每一个业务板连接器通过该低介质 损耗传输材料与其他各个背板扩展区的所有网板连接器相连接。 这样， 同一 个 PCB背板上的业务板和网板可以通过内部走线进行组内通信，不同的 PCB 背板上的业务板和网板可以通过高速线缆进行组间通信， 并且一个 PCB 背 板中的业务板到另一个 PCB 背板中的业务板仅需要通过两跳就可以完成通 信。 因此， 本发明所提供的互连***是一个高集成度、 高速、 高带宽、 可灵 活扩展的点到点互连***。 附图说明
为了更清楚地说明本发明实施例的技术方案， 下面将对本发明实施例中 所需要使用的附图作筒单地介绍， 显而易见地， 下面所描述的附图仅仅是本 发明的一些实施例， 对于本领域普通技术人员来讲， 在不付出创造性劳动的 前提下， 还可以根据这些附图获得其他的附图。
图 1是根据本发明实施例提供的第一示例的通信设备的互连***的侧视 截面图。
图 2是根据本发明实施例提供的第一示例的通信设备的互连***的后视 截面图。
图 3是根据本发明实施例提供的第二示例的通信设备的互连***的后视 截面图。
图 4是根据本发明实施例提供的第三示例的通信设备的互连***的后视 截面图。
图 5是根据本发明实施例提供的第四示例的通信设备的互连***的后视 截面图。 具体实施方式
下面将结合本发明实施例中的附图，对本发明实施例中的技术方案进行 清楚、 完整地描述， 显然， 所述的实施例是本发明的一部分实施例， 而不是 全部实施例。 基于本发明中的实施例， 本领域普通技术人员在没有做出创造 性劳动的前提下所获得的所有其他实施例， 都应属于本发明保护的范围。
一般来说， 通信设备， 例如网络服务器， 可以包括机箱、 网板、 业务板、 背板和线缆， 其中机箱可以为长方体， 用于容纳网板、 业务板、 背板和线缆。 机箱一般包括左右侧壁板、 顶板、 底板和后壁板， 根据具体需要， 也可以设 置前壁板， 其中顶板和底板与左右侧壁板可以采用垂直连接或者整体成形， 后壁板通过紧固件与左右侧壁板、顶板和底板连接在一起。由此形成的机箱， 为其中的网板、 业务板、 背板和线缆等部件提供安装空间并提供结构支撑。 在通信设备例如网络服务器中， 背板用于连接网板和业务板， 一般垂直地插 置在机箱中， 可以位于机箱中部或者中后部。 背板上安装有连接插槽或者连 接端口。 网板、 业务板通过连接插槽或者连接器连接在背板上。 传统上， 网 板和业务板从机箱前侧***，连接在背板的前侧，而线缆从背板的后侧引出 , 在网板和业务板之间互连。 这里所述的网板， 一般指的是指***的中心交换 单元， 用作实现业务板之间的数据交换， 而业务板一般指的是***中除交换 板外的其他单板， 主要用作业务处理或接口处理。 在本发明实施例中， 网板 和业务板仅为了叙述方便， 从功能上加以区分， 并不用于限定它们的结构和 形状等物理属性。 一般情况下， 通信设备会采用单面前横插设计， 即网板和 业务板与顶板平行， 并且网板和业务板垂直地插在与后壁板平行的背板上。 本发明实施例所示的通信设备皆采用单面前横插设计。
在本发明实施例中， 术语 "前侧" 在本文中指代背板插有网板和业务板 的一侧， 术语 "后侧" 在本文中用来指代与 "前侧" 相对的一侧， 即未插有 网板和业务板的一侧， 在单面前横插设计时， 为靠近后壁板一侧。 术语 "水 平" 在本文中用来表示机箱放置在平面上的时候， 与放置平面平行的方向， 而术语 "垂直"在本文中用来表示垂直于所述放置平面的方向。 术语 "顶部" 在本文中指的是在垂直方向远离机箱放置平面的机箱的一侧，而术语 "底部 " 在本文中指的是靠近机箱放置平面的机箱的一侧。 术语 "左侧" 在本文中指 的是面对放置在平面上的机箱的后壁板的左侧， 而术语 "右侧" 在本文中指 的是在这种情况下的右侧。 术语 "平行" 在本文中用于表示两个部件大致平 行， 并不限定两者绝对地平行， 两者之间可以存在一定的误差或者两者成一 定的角度， 只要在两者之间隔开一定的间隔即可。 术语 "垂直" 在本文中用 于表示两个部件基本上垂直， 并不限定两者之间成绝对 90度相交， 可以容 许存在一定的合理误差。
本发明实施例提供的用于通信设备的互连***包括 M个背板区和 N个 背板上， 这里 M为大于或者等于 2的正整数， K为小于或者等于 M的正整 数， 例如， 物理上可以是一块 PCB背板， M个背板区都分布在这一块 PCB 背板上， 也可以是 M块 PCB背板， 每个 PCB背板上分布一个背板区， 也可 以根据 PCB背板尺寸的限制和背板区的个数来确定 K的值。
第 k个背板区是 M个背板区中的任一个背板区， 第 k个背板区满足以 下条件： 第 k个背板区包括至少一个网板连接器和至少一个业务板连接器， 该第 k个背板区的至少一个网板连接器， 用于与第 k组网板连接， 该第 k个 背板区的至少一个业务板连接器， 用于与第 k组业务板连接， 该第 k个背板 区的每一个网板连接器通过第 k个背板区所在的 PCB背板的内部走线分别 与第 k个背板区的所有业务板连接器连接。 第 k个背板区是 M个背板区中 的任一个背板区， 也就是说 M个背板区中的所有背板区都满足上述第 k背 板区的条件。
对应于第 k个背板区的第 k个背板扩展区满足以下条件： 该对应于第 k 个背板区的第 k个背板扩展区包括至少一个网板连接器、至少一个业务板连 接器和低介质损耗传输材料， 其中， 第 k个背板扩展区中的至少一个网板连 接器用于与第 k组网板连接， 第 k个背板扩展区中的至少一个业务板连接器 用于与第 k组业务板连接。 由于对应于第 k个背板扩展区的第 k个背板区是 M个背板区中的任一个背板区， 因此对于 M个背板扩展区中的任一个背板 扩展区也应当满足上述第 k个背板扩展区所满足的条件。换句话说， M个背 板扩展区中的每一个背板扩展区都满足第 k个背板扩展区所满足的条件。
也就是说， 在背板区， 通过 PCB 背板实现各组网板和各组业务板的组 内互连。每组业务板同时插接在对应的背板区的业务板连接器和对应的背板 扩展区的业务板连接器上，每组网板同时插接在对应的背板区的网板连接器 和对应的背板扩展区的网板连接器上。 需要说明的是， 每组网板至少包括一 个网板， 每组业务板至少包括一个业务板。
第 k个背板扩展区中的每一个网板连接器通过低介质损耗传输材料与其 他各个背板扩展区的所有业务板连接器连接； 第 k个背板扩展区中的每一个 业务板连接器通过低介质损耗传输材料与其他各个背板扩展区的所有网板 连接器连接。这里的低介质损耗传输材料可以是高速线缆或者光纤等，例如， 能支持支持高速长距离传输的低介质损耗材料的线缆， 可以是铜芯线缆、 光 纤以及其他高速度低损耗介质材料构成的传输数据用的线缆。 k为小于或等 于 M的正整数。 因此， 一组网板和另一组业务板之间的组间互连可以通过背板扩展区实 现。
对于任意两组业务板， 例如， 第 k组业务板中的业务板 k-a和第 1组业 务板中的业务板 1- b之间可以先经由第 k个背板区和第 k组网板中的网板 k- m 连接， 第 k组网板中的网板 k-m经由第 k个背板扩展区和第 1组业务板中的 业务板 1-b连接，从而通过两跳实现第 k组业务板中的业务板 k-a和第 1组业 务板中的业务板 1-b的互连， 其中， k和 1均小于 M。
进一步， 背板扩展区还可以包括用于固定高速线缆的结构件。
可选的， 第 k个背板扩展区的所有网板连接器和第 k个背板扩展区的所 有业务板连接器可以固定在 PCB背板上， 固定的方式可以是直接在 PCB背 板上开孔， 各个网板连接器或者业务板连接器固定在开孔处， 也可以通过金 属或者塑料的结构件固定在 PCB背板上， 本发明不限于此。 为了排线方便， 第 k个背板扩展区的所有网板连接器和所有业务板连接器可以固定在第 k个 被板区所在的 PCB背板上。
可选的， 第 k个背板扩展区的所有网板连接器和所有业务板连接器也可 以固定在金属或者塑料的结构件上。
可选的， 作为一个实施例， 第 k个背板扩展区可以位于第 k个背板区的 左侧或右侧。 图 2所示的通信设备 1000是本实施例的一个具体实施例。 图 2 所示的实施例中 M等于 2, N等于 2, 背板扩展区均位于背板区的右侧。
可选的， 作为另一个实施例， 第 k个背板扩展区的可以划分为 P个子背 板扩展区，每个子背板扩展区中的网板连接器为该背板扩展区的网板连接器 的子集，每个子背板扩展区中的业务板连接器为该背板扩展区的业务板连接 器的子集，每个子背板扩展区中网板连接器和其他子背板扩展区的网板连接 器没有交集，每个子背板扩展区中业务板连接器和其他子背板扩展区的业务 板连接器没有交集。 P个子背板扩展区分别位于第 k个背板区的两侧， 即 P 个子背板扩展区中的一部分子背板扩展区位于第 k个背板区的左侧， P个子 背板扩展区的另一部分子背板区位于第 k个背板区的右侧。 P为大于 1的正 整数。 显然， P不能大于第 k个背板扩展区中网板连接器的数量， P也不能 大于第 k个背板扩展区中业务板连接器的数量。
可选的， 作为另一个实施例， 第 k个背板区被划分为 Q个子背板， 每个 子背板区中的网板连接器为该背板区的网板连接器的子集，每个子背板中的 业务板连接器为该背板区的业务板连接器的子集，每个子背板区中网板连接 器和其他子背板区的网板连接器没有交集，每个子背板区中业务板连接器和 其他子背板区的业务板连接器没有交集。 Q个子背板区分别位于第 k个背板 扩展区的两侧，即 Q个子背板区中的一部分子背板区位于第 k个背板扩展区 的左侧， Q个子背板区中的另一部分子背板区位于第 k个背板区的右侧。 Q 为大于 1的正整数。 显然， Q不能大于第 k个背板区中网板连接器的数量， Q也不能大于第 k个背板区中业务板连接器的数量。
可选的， 作为另一个实施例， 第 k个背板扩展区的可以划分为 P个子背 板扩展区，每个子背板扩展区中的网板连接器为该背板扩展区的网板连接器 的子集，每个子背板扩展区中的业务板连接器为该背板扩展区的业务板连接 器的子集，每个子背板扩展区中网板连接器和其他子背板扩展区的网板连接 器没有交集，每个子背板扩展区中业务板连接器和其他子背板扩展区的业务 板连接器没有交集。第 k个背板区被划分为 Q个子背板，每个子背板区中的 网板连接器为该背板区的网板连接器的子集，每个子背板中的业务板连接器 为该背板区的业务板连接器的子集，每个子背板区中网板连接器和其他子背 板区的网板连接器没有交集，每个子背板区中业务板连接器和其他子背板区 的业务板连接器没有交集。 第 p个子背板扩展区位于第 q个子背板区的左侧 或者右侧。 其中， P和 Q均为大于 1的正整数。 显然， P不能大于第 k个背 板扩展区中网板连接器的数量， P也不能大于第 k个背板扩展区中业务板连 接器的数量， Q不能大于第 k个背板区中网板连接器的数量， Q也不能大于 第 k个背板区中业务板连接器的数量， p为小于或者等于 P的任一正整数， q为小于或者等于 Q的任一正整数。
可以理解的是， 除上述实施例以外， 各个背板区与各个背板扩展区的位 置关系并不限于上述实施例所披露的内容。任何熟悉本技术领域的技术人员 在本发明揭露的技术范围内， 可轻易想到各个背板与各个背板扩展区的位置 关系的变换， 均可以认为是本发明的等效变换。
本发明所提供的用于通信设备的互连***内部网板和业务板之间是点 到点的连接和通信， 通信链路短、 延时小。 该***通过分区， 分为背板区和 背板扩展区， 背板扩展区增强了***的配置灵活性和扩展性。 ***内部通过 对 PCB背板分组， 划分成多个背板区， 便于将每个组的 PCB背板小型化、 降低 PCB背板制造成本， 并且由于 PCB背板的减小，使得 PCB背板的内部 走线的传输速率提高。 在实现***的点到点互连的同时， 解决可传统通信系 统框间互连网板面板出线瓶颈， 并且降低网板数、 网片数、 驱动器数， 整个 ***成本低。 该***通过高密、 低介质损耗传输介质材料实现分属不同背板 区的网板和业务板之间的点到点互连。 此外， 利用该第介质损耗传输介质材 料支持长距离高速传输的特性， 使得该***内 PCB 背板以及网板和业务板 的数量可以进行扩展， 提升了***扩展性和集成度。 综上所述， 本发明所提 供的用于通信设备的互连***是一个高集成度、 高速、 高带宽、 可灵活扩展 的点到点互连***。
下面将结合具体实施例对本发明进行描述。 可以理解的是， 图 1至图 5 的实施例仅是为了帮助本领域技术人员更好的理解本发明， 而并非对本发明 的限制。
图 1是根据本发明实施例提供的第一示例的通信设备的互连***的侧视 截面图。 通信设备 1000的互连***包括 2个背板区， 每个背板区分别在一 个 PCB背板上和两个背板扩展区。 两个背板分别为第一背板区 1001和第二 背板区 1002,两个 PCB背板分别第一 PCB背板 1001，和第二 PCB背板 1002，。
第一背板区 1001通过一个网板连接器与第一组网板连接， 其中该第一 组网板包括一个网板， 即网板 1012。
第一背板区 1001通过两个业务板连接器与第一组业务板连接， 其中第 一组业务板包括两个业务板， 即业务板 1011和业务板 1013。
用于连接业务板 1011的业务板连接器通过第一 PCB背板 1001，的内部 走线与用于连接网板 1012的网板连接器连接， 用于连接业务板 1013的连接 器通过第一 PCB背板 1001，的内部走线与用于连接网板 1012的连接器连接。 这样， 第一组业务板和第一组网板可以通过第一 PCB背板 1001，的内部走线 进行组内通信。
类似的， 第二背板区 1002通过一个网板连接器与第二组网板连接， 其 中第二组网板包括一个网板， 即网板 1022。 第二背板区 1002通过两个业务 板连接器与第二组业务板连接， 其中第二组业务板包括两个业务板， 即业务 板 1021和业务板 1023。用于连接业务板 1021的业务板连接器通过第二 PCB 背板 1002，上的内部走线与用于连接网板 1022的网板连接器连接，用于连接 业务板 1023的业务板连接器通过第二 PCB背板 1002，上的内部走线与用于 连接网板 1022的网板连接器连接。 第一背板扩展区的一个网板连接器与第一组网板连接， 即与网板 1012 连接， 第一背板扩展区的两个业务板连接器与第一组业务板连接， 即与业务 板 1011和业务板 1013连接。 第二背板扩展区的一个网板连接器与第二组网 板连接， 即与网板 1022连接， 第二背板扩展区的两个业务板连接器与第二 组业务板连接， 即与业务板 1021和业务板 1023连接。 第一背板扩展区内用 于连接第一组网板的网板连接器通过高速线缆与第二背板扩展区内用于连 接第二组业务板的业务板连接器连接。 相应的， 第二背板扩展区内用于连接 第二组网板的网板连接器通过高速线缆与第一背板扩展区内用于连接第一 组业务板的业务板连接器连接。 背板扩展区内的网板连接器与业务板连接器 的具体连接关系如图 2所示。
图 2是根据本发明实施例提供的第一示例的通信设备的互连***的后视 截面图。
图 2具体示出了第一背板扩展区和第二背板扩展区内的业务板连接器与 网板连接器的连接关系。 图 2中第一背板扩展区的网板连接器包括网板连接 器 1112, 业务板连接器包括业务板连接器 1111和业务板连接器 1113 , 第二 背板扩展区的网板连接器包括网板连接器 1212,第二背板扩展区的业务板连 接器包括业务板连接器 1211和业务板连接器 1213。 第一背板扩展区中的网 板连接器 1112通过高速线缆分别与第二背板扩展区中的业务板连接器 1211 和业务板连接器 1213连接。第二背板扩展区中的网板连接器 1212通过高速 线缆分别与第一背板扩展区中的业务板连接器 1111和业务板连接器 1113连 接。
结合图 1与图 2, 网板连接器 1112用于与第一组网板连接， 即与网板 1012连接，业务板连接器 1111和业务板连接器 1113分别用于与第一组业务 板中的业务板 1011和 1013连接。 网板连接器 1212用于与第二组网板连接， 即与网板 1022连接， 业务板连接器 1211和业务板连接器 1213分别用于与 第二组业务板中的业务板 1021和业务板 1023连接。
这样，如果第一组业务板中的任一个业务板需要与第二组业务板中的任 一个业务板进行通信，可以仅通过第一组业务板到第一组网板到第二组业务 板的路径进行通信。 通过网板将各组业务板连接组成一个点到点互连的系 统，一组业务板到另一组业务板仅需要通过两跳就可以完成通信，筒单灵活， 提升了该通信设备的扩展性和集成度。 同时背板扩展区可以采用模块化设 计， 按照支持的信号链路数、 跨连接分组数、 支持不同速率、 带宽等的不同 设计成不同的模块。 这样可以解决不同应用场景下对带宽、 速率、 成本的不 同需求。 此外， 背板扩展区还可以可以固定在在所对应的 PCB 背板上。 以 图 2为例， 第一背板扩展区 （包括网板连接器 1112, 业务板连接器 1111和 业务板连接器 1113 )可以固定在第一 PCB背板 1001，上，第二背板扩展区（包 括网板连接器 1212, 业务板连接器 1211和业务板连接器 1213 )可以固定在 第二 PCB背板 1002，上。
图 3是根据本发明实施例提供的第二示例的通信设备的互连***的后视 截面图。 图 3所示的通信设备 2000包含 M个背板区， 其中 M为正整数， 图 3所示出的仅是 M个背板区中第 k个背板以及第 k个背板扩展区的截图，第 k个背板区是 M个背板区中的任一个 PCB背板区。
如图 3所示的通信设备 2000,用于与第 k组网板连接的第 k个背板扩展 区被划分为第一子背板扩展区和第二子背板扩展区， 第一子背板扩展区包括 第一组网板连接器和第一组业务板连接器， 第二子背板扩展区包括第二组网 板连接器和第二组业务板连接器。 第一子背板扩展区和第二子背板扩展区分 别位于第 k个背板区的左侧和右侧。
第 k个背板扩展区中的网板连接器可以通过高速线缆与其他各个背板扩 展区中的业务板连接器连接， 第 k个背板扩展区中的业务板连接器也可以通 过高速线缆与其他各个背板扩展区中的网板连接器连接。 具体来说， 第一组 网板连接器和第二组网板连接器可以通过高速线缆与其他各个背板扩展区 中的业务板连接器连接。第一组业务板连接器和第二组业务板连接器也可以 通过高速线缆与其他各个背板扩展区中的网板连接器连接。
图 4是根据本发明实施例提供的第三示例的通信设备的互连***的后视 截面图。 图 4是根据本发明实施例提供的第二示例的通信设备的互连***的 后视截面图。图 4所示的通信设备 3000包含 M个背板区，其中 M为正整数， 图 4所示出的仅是 M个背板区中第 k个背板区以及第 k个背板扩展区的截 图， 第 k个背板区是 M个背板区中的任一个背板区。
如图 4所示的通信设备 3000,第 k个背板区被划分为 2个子背板区， 即 第一子背板和第二子背板。 第 k个背板扩展区被划分为 2个子背板扩展区， 即第一子背板扩展区和第二子背板扩展区， 其中第一子背板扩展区包括第一 组网板连接器和第一组业务板连接器， 第二子背板扩展区包括第二组网板连 接器和第二组业务板连接器。 第一子背板扩展区位于第一子背板区左侧， 第 二子背板扩展区位于第二子背板区右侧。
第 k个背板扩展区中的网板连接器可以通过高速线缆与其他各个背板扩 展区中的业务板连接器连接， 第 k个背板扩展区中的业务板连接器也可以通 过高速线缆与其他各个背板扩展区中的网板连接器连接。 具体来说， 第一组 网板连接器和第二组网板连接器可以通过高速线缆与其他各个背板扩展区 中的业务板连接器连接。 第一组业务板连接器和第二组业务板连接器也可以 通过高速线缆与其他各个背板扩展区中的网板连接器连接。
图 5是根据本发明实施例提供的第四示例的通信设备的互连***的后视 截面图。
如图 5所示， 通信设备 4000包括两个背板区。 第一背板扩展区位于第 一背板区的右侧， 用于与第一背板区对应的第一组网板和第一组业务板连 接。 第二背板扩展区位于第二背板区的左侧， 用于与第二背板区对应的第二 组网板和第二组业务板连接。 第一背板扩展区中的网板连接器通过高速线缆 与第二背板扩展区中的业务板连接器连接， 第二背板扩展区中的网板连接器 通过高速线缆与第一背板扩展区中的业务板连接器连接。
可以理解的是， 图 1至图 5的实施例仅是为了帮助本领域技术人员更好 的理解本发明， 而并非对本发明的限制。 因此， 图 1至图 5的实施例所示的 通信设备中的背板扩展区的数量、 背板区的数量， PCB背板的数量以及网板 和业务板的数量仅是为了方便描述， 并不是对本发明的限制。 本领域技术人 员应该了解， 通信设备中的网板和业务板的数量、 背板区的数量， PCB背板 的数量以及与背板区对应的背板扩展区的数量可以根据需要进行配置。
本领域普通技术人员可以意识到， 结合本文中所公开的实施例描述的各 示例的单元及算法步骤， 能够以电子硬件、 或者计算机软件和电子硬件的结 合来实现。 这些功能究竟以硬件还是软件方式来执行， 取决于技术方案的特 定应用和设计约束条件。 专业技术人员可以对每个特定的应用来使用不同方 法来实现所描述的功能， 但是这种实现不应认为超出本发明的范围。
所属领域的技术人员可以清楚地了解到， 为描述的方便和筒洁， 上述描 述的***、 装置和单元的具体工作过程， 可以参考前述方法实施例中的对应 过程， 在此不再赘述。
在本申请所提供的几个实施例中， 应该理解到， 所揭露的***、 装置和 方法， 可以通过其它的方式实现。 例如， 以上所描述的装置实施例仅仅是示 意性的， 例如， 所述单元的划分， 仅仅为一种逻辑功能划分， 实际实现时可 以有另外的划分方式， 例如多个单元或组件可以结合或者可以集成到另一个 ***， 或一些特征可以忽略， 或不执行。 另一点， 所显示或讨论的相互之间 的耦合或直接耦合或通信连接可以是通过一些接口， 装置或单元的间接耦合 或通信连接， 可以是电性， 机械或其它的形式。
所述作为分离部件说明的单元可以是或者也可以不是物理上分开的，作 为单元显示的部件可以是或者也可以不是物理单元， 即可以位于一个地方， 或者也可以分布到多个网络单元上。可以根据实际的需要选择其中的部分或 者全部单元来实现本实施例方案的目的。
以上所述， 仅为本发明的具体实施方式， 但本发明的保护范围并不局限 于此， 任何熟悉本技术领域的技术人员在本发明揭露的技术范围内， 可轻易 想到的变化或替换， 都应涵盖在本发明的保护范围之内， 因此本发明的保护 范围应以权利要求的保护范围为准。

Claims

权利要求
1、 一种用于通信设备的互连***， 其特征在于， 所述互连***包括 M 个背板区和 N个背板扩展区，
所述 M个背板区分布在 K个印刷电路板 PCB背板上， 第 k个背板区包 括至少一个网板连接器和至少一个业务板连接器， 所述第 k个背板区为所述 M个背板区中的任一个背板区， 其中：
所述第 k个背板区的至少一个网板连接器， 用于与第 k组网板连接， 所 述第 k个背板区的至少一个业务板连接器， 用于与第 k组业务板连接； 所述第 k个背板区的每一个网板连接器通过所述第 k个背板区所在的 PCB背板分别与所述第 k个背板区的所有业务板连接器连接；
对应于所述第 k个背板区的第 k个背板扩展区包括至少一个网板连接 器， 至少一个业务板连接器， 和低介质损耗传输材料， 其中：
所述第 k个背板扩展区的至少一个网板连接器， 用于与所述第 k组网板 连接， 所述第 k个背板扩展区的至少一个业务板连接器， 用于与所述第 k组 业务板连接；
所述第 k个背板扩展区的每一个网板连接器通过所述低介质损耗传输材 料与其他各个背板扩展区的所有业务板连接器相连接；
所述第 k个背板扩展区的每一个业务板连接器通过所述低介质损耗传输 材料与其他各个背板扩展区的所有网板连接器相连接；
其中， M为大于或者等于 2的正整数， k为小于或者等于 M的任一正整 数， N为大于或者等于 M的正整数， K为小于或者等于 M的正整数， 每一 组网板至少包括一个网板， 每一组业务板至少包括一个业务板。
2、 根据权利要求 1所述的互连***， 其特征在于， 所述第 k个背板扩 展区的所有网板连接器和所有业务板连接器固定在任一 PCB背板上。
3、 根据权利要求 1所述的互连***， 其特征在于， 所述第 k个背板扩 展区的所有网板连接器和所有业务板连接器固定在第 k个背板区所在的 PCB 背板上。
4、 根据权利要求 1所述的互连***， 其特征在于， 所述第 k个背板扩 展区的所有网板连接器和所有业务板连接器固定在结构件上。
5、 根据权利要求 1至 4任一项所述的互连***， 其特征在于， 所述第 k个背板扩展区位于所述第 k个背板区的左侧或右侧。
6、 根据权利要求 1至 4任一项所述的互连***， 其特征在于， 所述第 k个背板扩展区至少划分为 P个子背板扩展区，所述 P个子背板 扩展区分别位于第 k个背板区的两侧， 其中 P为大于 1的正整数。
7、 根据权利要求 1至 4任一项所述的互连***， 其特征在于， 所述第 k个背板区至少划分为 Q个子背板区， 所述 Q个子背板区分别 位于第 k个背板扩展区的两侧， 其中 Q为大于 1的正整数。
8、 根据权利要求 1至 4任一项所述的互连***， 其特征在于， 所述第 k个背板扩展区至少划分为 P个子背板扩展区，所述第 k个背板 区划分为至少 Q个子背板区，
第 p个子背板扩展区位于第 q个子背板区的左侧或者右侧；
其中， P和 Q均为大于 1的正整数， p为小于或者等于 P的任一正整数， q为小于或者等于 Q的任一正整数。
9、 根据权利要求 1至 8任一项所述的互连***， 其特征在于， 所述低介质损耗传输材料为线缆或者光纤。
PCT/CN2013/088477 2013-12-04 2013-12-04 用于通信设备的互连*** WO2015081506A1 (zh)

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