WO2011159082A2 - Window panel structure and capacitive touch panel having a built-in window panel - Google Patents
Window panel structure and capacitive touch panel having a built-in window panel Download PDFInfo
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- WO2011159082A2 WO2011159082A2 PCT/KR2011/004336 KR2011004336W WO2011159082A2 WO 2011159082 A2 WO2011159082 A2 WO 2011159082A2 KR 2011004336 W KR2011004336 W KR 2011004336W WO 2011159082 A2 WO2011159082 A2 WO 2011159082A2
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- WIPO (PCT)
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- window panel
- design layer
- capacitive sensor
- substrate
- film substrate
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
- G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
- G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
- G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
- G06F3/044—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means
- G06F3/0443—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means using a single layer of sensing electrodes
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B5/00—Non-insulated conductors or conductive bodies characterised by their form
- H01B5/14—Non-insulated conductors or conductive bodies characterised by their form comprising conductive layers or films on insulating-supports
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F2203/00—Indexing scheme relating to G06F3/00 - G06F3/048
- G06F2203/041—Indexing scheme relating to G06F3/041 - G06F3/045
- G06F2203/04103—Manufacturing, i.e. details related to manufacturing processes specially suited for touch sensitive devices
Definitions
- the present invention relates to a window panel structure and a window panel integrated capacitive touch panel including the same.
- the window panel integrated capacitive touch panel is configured by forming a capacitive sensor on the window panel forming the window.
- the window panel integrated capacitive touch panel forms a capacitive sensor on a film or glass substrate and then forms the window panel.
- the bottom surface of the window panel may be manufactured by attaching or directly forming a capacitive sensor on the bottom surface of the window panel.
- the window panel may be formed of tempered glass or plastic material.
- the window panel is formed of tempered glass, it is required to attach a film or an adhesive which may play a role of shatterproof.
- a design layer for forming a window by cell unit is deposited or printed.
- the design layer must be printed or deposited on a cell-by-cell basis, resulting in poor handling and poor productivity.
- the expensive tempered glass should be discarded when a defect occurs during printing.
- the problem to be solved by the present invention is a window that can solve problems such as discarding the window panel that may be caused when the design layer is formed on the lower surface of the window panel It is to provide a panel integrated capacitive touch panel.
- Window panel integrated capacitive touch panel for achieving the above object is formed on the capacitive sensor to be disposed at least partially overlapping the window panel, the capacitive sensor, the edge of the window panel. And a transparent adhesive layer formed to cover the top of the design layer and the capacitive sensor and attaching the design layer and the capacitive sensor to the bottom surface of the window panel.
- the capacitive sensor may include a capacitive sensor substrate, a conductive film and a circuit wiring formed on the capacitive sensor substrate, and the design layer may be formed on the conductive film and the circuit wiring.
- the capacitive sensor may include a capacitive sensor substrate, a conductive film and a circuit wiring formed on the capacitive sensor substrate, and a transparent planarization film formed on the conductive film and the circuit wiring, and the design layer includes the transparent planarization film. It can be formed on.
- a window panel integrated touch panel may include a window panel, a first substrate disposed below the window panel, and an upper surface of the first substrate so as to be at least partially overlapped with an edge of the window panel.
- a first transparent adhesive layer formed to cover the upper surface of the first substrate and the design layer, wherein the first transparent adhesive layer attaches the first substrate and the design layer to the lower surface of the window panel;
- a capacitive sensor disposed thereon, and a second transparent adhesive layer attaching the capacitive sensor to the lower surface of the first substrate.
- the window panel structure according to an embodiment of the present invention, a window layer, a film substrate, a design layer formed on the upper surface of the film substrate so as to be at least partially overlapping the edge of the window panel, and the film substrate and the And a transparent adhesive layer formed to cover the top surface of the design layer and attaching the film substrate and the design layer to the bottom surface of the window panel.
- a window panel integrated capacitive touch panel may include a design layer formed on an upper surface of the film substrate so as to be at least partially overlapped with a window panel, a film substrate, and an edge of the window panel, the film And a transparent adhesive layer formed to cover a top surface of the substrate and the design layer and attaching the film substrate and the design layer to the bottom surface of the window panel, and a capacitive sensor formed on the bottom surface of the film substrate.
- a window panel structure includes a window layer, a film substrate, a design layer formed on a bottom surface of the film substrate so as to be at least partially overlapped with an edge of the window panel, and the film substrate and the And a transparent adhesive layer formed to cover the bottom surface of the design layer and attaching the film substrate and the design layer to the top surface of the window panel.
- the capacitive touch panel of the window panel integrated according to another embodiment of the present invention is formed on the lower surface of the film substrate so as to be at least partially overlapping the window panel, the film substrate, the edge of the window panel A transparent adhesive layer formed to cover the lower surface of the film substrate and the design layer to attach the film substrate and the design layer to the upper surface of the window panel, and a capacitive sensor formed on the lower surface or the upper surface of the window panel.
- the capacitive touch panel of the window panel integrated according to another embodiment of the present invention the design layer is formed on the lower surface of the film substrate so as to be at least partially overlapping the window panel, the film substrate, the edge of the window panel And a capacitive sensor formed on an upper surface of the window panel, and a transparent adhesive layer formed to cover the lower surface of the film substrate and the design layer to attach the film substrate and the design layer to an upper surface of the capacitive sensor. do.
- the design layer is not formed directly on the bottom surface of the window panel, but is formed on the capacitive sensor and attached to the window panel or formed on a separate substrate and attached to the window panel, so that the window panel may be formed even when the design layer is formed incorrectly. It can overcome the problem of disposal.
- a pattern that cannot be implemented in the glass may be formed on a separate substrate, thereby forming a wider variety of patterns.
- FIG. 1 is a perspective view of an information communication device to which a window panel integrated capacitive touch panel according to an exemplary embodiment of the present invention is applied.
- FIG. 2 is a cross-sectional view taken along the line II-II of FIG. 1.
- FIG 3 is an exploded perspective view of a window panel integrated capacitive touch panel according to an exemplary embodiment of the present invention.
- FIG. 4 is a cross-sectional view of a window panel integrated capacitive touch panel according to another embodiment of the present invention.
- FIG. 5 is an exploded perspective view of the window panel integrated capacitive touch panel of FIG. 4.
- FIG. 6 is a cross-sectional view of a window panel integrated capacitive touch panel according to another exemplary embodiment of the present invention.
- FIG. 7 is an exploded perspective view of the window panel integrated capacitive touch panel of FIG. 6.
- FIG. 8 is a cross-sectional view of a window panel according to an embodiment of the present invention.
- FIG. 9 is a cross-sectional view of a capacitive touch panel integrated with a window panel according to another embodiment of the present invention.
- FIG. 10 is a cross-sectional view of a window panel according to another embodiment of the present invention.
- FIG. 11 is a cross-sectional view of a capacitive touch panel integrated with a window panel according to another embodiment of the present invention.
- FIG. 12 is a cross-sectional view of a capacitive touch panel integrated with a window panel according to another embodiment of the present invention.
- the capacitive touch panel 100 integrated with the window panel may be applied to an information communication device 10 such as a mobile phone or a PDA.
- the window panel integrated capacitive touch panel 100 includes a window panel 110.
- the window panel 110 may have a substantially rectangular plate shape, and may be formed of glass or synthetic resin such as acrylic having light transmittance.
- the rest of the information communication apparatus except for the touch panel is omitted for convenience of illustration.
- the window panel 110 may be formed of tempered glass or a synthetic resin material such as acrylic, PMMA, or PC.
- the design layer 120 is formed on the capacitive sensor 130, and the design layer 120 and the capacitive sensor 130 are attached to the bottom surface of the window panel 110 by the transparent adhesive layer 140.
- the capacitive sensor 130 is disposed below the window panel 110, and the capacitive sensor 130 may be configured in the form of a capacitive sensor having a structure known in the art.
- the capacitive sensor 130 may include a transparent conductive film 131 and a conductive circuit wiring 133.
- the conductive film 131 may have various forms known in the art, and the circuit wiring 133 is formed to be selectively electrically connected to the outside of the conductive film 131.
- a flexible printed circuit (FPC) 135 for applying an electrical signal to the circuit wiring 133 may be connected to the circuit wiring 133.
- the conductive film 131 and the circuit wiring 133 may be formed on the capacitive sensor substrate 137 formed of glass or PET film, and the conductive film 131 may be formed of indume tin oxide (ITO). , Indium zinc oxide (IZO), zinc oxide (ZnO), or the like, may be formed by sputtering or depositing on the capacitive sensor substrate 137.
- the circuit wiring 133 may be formed by silk screen printing. It can be formed by printing.
- the design layer 120 may be formed on the conductive layer 131 and the circuit wiring 133 of the capacitive sensor 130. That is, according to the embodiment of the present invention, after the design layer 120 is formed on the capacitive sensor 130, the capacitive sensor 130 and the design layer 120 are formed by the transparent adhesive layer 140. Is attached to the lower surface.
- the design layer 120 is disposed to at least partially overlap the edge of the window panel 110.
- the design layer 120 may have a shape of a rectangular strip having a predetermined width along the edge of the window panel 110.
- the design layer 120 may be formed of an opaque material.
- the design layer 120 may be formed by printing or depositing a non-conductive opaque material by a silk screen method.
- FIGS. 4 and 5 are cross-sectional views of a window panel integrated capacitive touch panel according to another exemplary embodiment of the present invention.
- the same reference numerals are used for the same components as the above-described embodiments, and descriptions of overlapping points will be omitted.
- the capacitive sensor 130 further includes a transparent planarization layer 139, and the design layer 120 is formed on the transparent planarization layer 139. That is, as shown in FIG. 4, the transparent flattening film 139 covering the conductive film 131 and the circuit wiring 133 of the capacitive sensor 130 is formed, and the design layer 120 includes the transparent flattening film ( 139 is formed along the edge.
- the transparent flattening film 139 may be formed by applying an electrically insulating transparent synthetic resin or the like.
- the transparent flattening film 139 is formed on the conductive film 131 constituting the capacitive sensor 130 and the circuit wiring 133, and the design layer 120 is formed thereon, whereby the conductive film 131 and the circuit wiring ( The design layer 120 may be stably formed in a state in which the step that may be generated by 133 is removed.
- FIGS. 6 and 7 a window panel integrated capacitive touch panel according to still another embodiment of the present invention will be described with reference to FIGS. 6 and 7.
- the same reference numerals are used for the same components as the above-described embodiments, and descriptions of overlapping points will be omitted.
- the design layer 120 is formed on the first substrate 150, and the design layer 120 and the first substrate 150 are formed on the window panel 110 by the first transparent adhesive layer 240.
- the capacitive sensor 130 is attached to the lower surface of the first substrate 150 by the second transparent adhesive layer 340.
- the first transparent adhesive layer 240 and the second transparent adhesive layer 340 may be formed of an optically clear adhesive (OCA).
- OCA optically clear adhesive
- the first transparent adhesive layer 240 to cover the upper surface of the design layer 120 and the first substrate 150. It is bonded to the lower surface of the window panel 110 in the formed state.
- the first substrate 150 may be formed of a synthetic resin material such as PET, glass or acrylic, PMMA, PC, or the like.
- FIGS. 8 to 11 a window panel structure and a window panel integrated capacitive touch panel including the same will be described with reference to FIGS. 8 to 11.
- the same reference numerals are used for the same parts as in the above-described embodiment, and detailed description thereof will be omitted.
- a window panel structure according to an embodiment of the present invention includes a window panel 110.
- the film substrate 170 is disposed below the window panel 110, and the design layer 120 is formed on the top surface of the film substrate 170 such that the design layer 120 is at least partially overlapped with the edge of the window panel 110.
- the film substrate 170 may be formed of synthetic resin such as glass or PET.
- the transparent adhesive layer 440 is formed to cover the top surfaces of the film substrate 170 and the design layer 120, and the film substrate 170 and the design layer 120 are formed by the transparent adhesive layer 440. 110 is attached to the bottom surface.
- the capacitive sensor 130 is formed on the lower surface of the film substrate 170 of the window panel structure of FIG. 8.
- the capacitive sensor 130 may include the conductive film 131 and the circuit wiring 133 as described above.
- the film substrate 270 is disposed on the window panel 110, and the film substrate 270 is disposed so that the design layer 120 is at least partially overlapped with an edge of the window panel 110. Is formed on the lower surface.
- the film substrate 270 may be formed of a synthetic resin such as glass or PET.
- the transparent adhesive layer 540 is formed to cover the bottom surface of the film substrate 270 and the design layer 120, and the film substrate 270 and the design layer 120 are formed by the transparent adhesive layer 540. 110 is attached to the upper surface.
- the capacitive sensor 130 is formed on the bottom surface of the window panel 110 of the window panel structure of FIG. 10.
- the capacitive sensor 130 may include the conductive film 131 and the circuit wiring 133 as described above.
- a layer for protecting the conductive film 131 and the circuit wiring 133 may be formed when the capacitance sensor 130 is exposed downward.
- the capacitive sensor 130 is formed on the upper surface of the window panel 110.
- the transparent adhesive layer 540 is formed to cover the lower surface of the film substrate 270 and the design layer 120 to attach the film substrate 270 and the design layer 120 to the upper surface of the capacitive sensor 130.
- the transparent adhesive layers 440 and 540 of FIGS. 8 to 12 may be formed of an optically clear adhesive (OCA).
- OCA optically clear adhesive
- the present invention relates to a touch panel and can be used as an input device of various display devices, thereby providing industrial applicability.
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Abstract
The invention relates to a capacitive touch panel having a built-in window panel, comprising said window panel, a capacitive sensor, a design layer formed on the capacitive sensor such that the design layer at least partially overlaps the edge of the window panel, and a transparent adhesive layer formed to cover the design layer and the upper portion of the capacitive sensor and attach the design layer and the capacitive sensor to the lower surface of the window panel. The design layer is formed on the capacitive sensor which is then attached to the window panel, instead of being formed directly on the lower surface of the window panel, or the design layer is formed on a separate substrate which is then attached to the window panel. Thus, the necessity of discarding the window panel is eliminated even when the design layer is erroneously formed. In addition, in the event the design layer is formed on a separate substrate and the substrate is then attached to a glass substrate, patterns which might not be producible on glass can be formed on the separate substrate, thus enabling the formation of a wide variety of patterns.
Description
본 발명은 윈도우 패널 구조체 및 이를 포함하는 윈도우 패널 일체형의 정전용량 터치 패널에 관한 것이다.The present invention relates to a window panel structure and a window panel integrated capacitive touch panel including the same.
윈도우 패널 일체형 정전용량 터치 패널은 윈도우를 형성하는 윈도우 패널에 정전용량 센서를 형성하여 구성되며, 예를 들어 윈도우 패널 일체형 정전용량 터치 패널은 필름이나 글라스 기판에 정전용량 센서를 형성한 후 이를 윈도우 패널의 하면 부착하여 제조되거나 윈도우 패널의 하면에 정전용량 센서를 직접 형성하여 제조될 수 있다.The window panel integrated capacitive touch panel is configured by forming a capacitive sensor on the window panel forming the window. For example, the window panel integrated capacitive touch panel forms a capacitive sensor on a film or glass substrate and then forms the window panel. The bottom surface of the window panel may be manufactured by attaching or directly forming a capacitive sensor on the bottom surface of the window panel.
윈도우 패널은 강화 글라스나 플라스틱 재질로 형성될 수 있는데, 윈도우 패널이 강화 글라스로 형성되는 경우 비산 방지 역할을 할 수 있는 필름 또는 점착제의 부착이 필요하며 강화 글라스 재질의 윈도우 패널의 경우 디자인 형상에 따라 셀 단위로 강화 글라스를 제작한 후 셀 단위로 윈도우를 형성하는 디자인층을 증착하거나 인쇄하게 된다.The window panel may be formed of tempered glass or plastic material. When the window panel is formed of tempered glass, it is required to attach a film or an adhesive which may play a role of shatterproof. In the case of the tempered glass window panel, depending on the design shape After manufacturing tempered glass by cell unit, a design layer for forming a window by cell unit is deposited or printed.
셀 단위로 디자인층을 인쇄하거나 증착해야 하므로 취급성이 나빠 수율이 낮으며 생산성이 떨어지는 문제가 있었다. 또한 인쇄 작업 시 불량이 발생할 경우 고가의 강화 글라스를 폐기해야 하는 문제가 있었다.The design layer must be printed or deposited on a cell-by-cell basis, resulting in poor handling and poor productivity. In addition, there was a problem that the expensive tempered glass should be discarded when a defect occurs during printing.
본 발명은 전술한 바와 같은 문제점들을 해결하기 위해 창출된 것으로서, 본 발명이 해결하려는 과제는 윈도우 패널의 하면에 디자인층을 형성하는 경우 야기될 수 있는 윈도우 패널의 폐기 등의 문제를 해결할 수 있는 윈도우 패널 일체형의 정전용량 터치 패널을 제공하는 것이다.The present invention was created to solve the problems described above, the problem to be solved by the present invention is a window that can solve problems such as discarding the window panel that may be caused when the design layer is formed on the lower surface of the window panel It is to provide a panel integrated capacitive touch panel.
상기한 과제를 달성하기 위한 본 발명의 한 실시예에 따른 윈도우 패널 일체형 정전용량 터치 패널은, 윈도우 패널, 정전용량 센서, 상기 윈도우 패널의 가장자리와 적어도 부분적으로 중첩되게 배치되도록 상기 정전용량 센서 위에 형성되는 디자인층, 그리고 상기 디자인층과 상기 정전용량 센서의 상부를 덮도록 형성되어 상기 디자인층과 상기 정전용량 센서를 상기 윈도우 패널의 하면에 부착하는 투명 접착제층을 포함한다.Window panel integrated capacitive touch panel according to an embodiment of the present invention for achieving the above object is formed on the capacitive sensor to be disposed at least partially overlapping the window panel, the capacitive sensor, the edge of the window panel. And a transparent adhesive layer formed to cover the top of the design layer and the capacitive sensor and attaching the design layer and the capacitive sensor to the bottom surface of the window panel.
상기 정전용량 센서는 정전용량 센서 기판, 그리고 상기 정전용량 센서 기판 위에 형성되는 도전성 막과 회로 배선을 포함할 수 있으며, 상기 디자인층은 상기 도전성 막 및 회로 배선 위에 형성될 수 있다.The capacitive sensor may include a capacitive sensor substrate, a conductive film and a circuit wiring formed on the capacitive sensor substrate, and the design layer may be formed on the conductive film and the circuit wiring.
상기 정전용량 센서는 정전용량 센서 기판, 상기 정전용량 센서 기판 위에 형성되는 도전성 막과 회로 배선, 그리고 상기 도전성 막과 회로 배선 위에 형성되는 투명 평탄화막을 포함할 수 있으며, 상기 디자인층은 상기 투명 평탄화막 위에 형성될 수 있다.The capacitive sensor may include a capacitive sensor substrate, a conductive film and a circuit wiring formed on the capacitive sensor substrate, and a transparent planarization film formed on the conductive film and the circuit wiring, and the design layer includes the transparent planarization film. It can be formed on.
본 발명의 다른 실시예에 따른 윈도우 패널 일체형 터치 패널은, 윈도우 패널, 상기 윈도우 패널의 아래에 배치되는 제1 기판, 상기 윈도우 패널의 가장자리와 적어도 부분적으로 중첩되게 배치되도록 상기 제1 기판의 상면에 형성되는 디자인층, 상기 제1 기판과 상기 디자인층의 상면을 덮도록 형성되어 상기 제1 기판과 상기 디자인층을 상기 윈도우 패널의 하면에 부착하는 제1 투명 접착제층, 상기 제1 기판의 아래에 배치되는 정전용량 센서, 상기 정전용량 센서를 상기 제1 기판의 하면에 부착하는 제2 투명 접착제층을 포함한다.A window panel integrated touch panel according to another exemplary embodiment of the present invention may include a window panel, a first substrate disposed below the window panel, and an upper surface of the first substrate so as to be at least partially overlapped with an edge of the window panel. A first transparent adhesive layer formed to cover the upper surface of the first substrate and the design layer, wherein the first transparent adhesive layer attaches the first substrate and the design layer to the lower surface of the window panel; A capacitive sensor disposed thereon, and a second transparent adhesive layer attaching the capacitive sensor to the lower surface of the first substrate.
한편, 본 발명의 실시예에 따른 윈도우 패널 구조체는, 윈도우 패널, 필름 기판, 상기 윈도우 패널의 가장자리와 적어도 부분적으로 중첩되게 배치되도록 상기 필름 기판의 상면에 형성되는 디자인층, 그리고 상기 필름 기판과 상기 디자인층의 상면을 덮도록 형성되어 상기 필름 기판과 상기 디자인층을 상기 윈도우 패널의 하면에 부착하는 투명 접착제층을 포함한다.On the other hand, the window panel structure according to an embodiment of the present invention, a window layer, a film substrate, a design layer formed on the upper surface of the film substrate so as to be at least partially overlapping the edge of the window panel, and the film substrate and the And a transparent adhesive layer formed to cover the top surface of the design layer and attaching the film substrate and the design layer to the bottom surface of the window panel.
본 발명의 다른 실시예에 따른 윈도우 패널 일체형의 정전용량 터치 패널은, 윈도우 패널, 필름 기판, 상기 윈도우 패널의 가장자리와 적어도 부분적으로 중첩되게 배치되도록 상기 필름 기판의 상면에 형성되는 디자인층, 상기 필름 기판과 상기 디자인층의 상면을 덮도록 형성되어 상기 필름 기판과 상기 디자인층을 상기 윈도우 패널의 하면에 부착하는 투명 접착제층, 그리고 상기 필름 기판의 하면에 형성되는 정전용량 센서를 포함한다.According to another exemplary embodiment of the present invention, a window panel integrated capacitive touch panel may include a design layer formed on an upper surface of the film substrate so as to be at least partially overlapped with a window panel, a film substrate, and an edge of the window panel, the film And a transparent adhesive layer formed to cover a top surface of the substrate and the design layer and attaching the film substrate and the design layer to the bottom surface of the window panel, and a capacitive sensor formed on the bottom surface of the film substrate.
본 발명의 또 다른 실시예에 따른 윈도우 패널 구조체는, 윈도우 패널, 필름 기판, 상기 윈도우 패널의 가장자리와 적어도 부분적으로 중첩되게 배치되도록 상기 필름 기판의 하면에 형성되는 디자인층, 그리고 상기 필름 기판과 상기 디자인층의 하면을 덮도록 형성되어 상기 필름 기판과 상기 디자인층을 상기 윈도우 패널의 상면에 부착하는 투명 접착제층을 포함한다.According to another aspect of the present invention, a window panel structure includes a window layer, a film substrate, a design layer formed on a bottom surface of the film substrate so as to be at least partially overlapped with an edge of the window panel, and the film substrate and the And a transparent adhesive layer formed to cover the bottom surface of the design layer and attaching the film substrate and the design layer to the top surface of the window panel.
한편, 본 발명의 또 다른 실시예에 따른 윈도우 패널 일체형의 정전용량 터치 패널은, 윈도우 패널, 필름 기판, 상기 윈도우 패널의 가장자리와 적어도 부분적으로 중첩되게 배치되도록 상기 필름 기판의 하면에 형성되는 디자인층, 상기 필름 기판과 상기 디자인층의 하면을 덮도록 형성되어 상기 필름 기판과 상기 디자인층을 상기 윈도우 패널의 상면에 부착하는 투명 접착제층, 그리고 상기 윈도우 패널의 하면 또는 상면에 형성되는 정전용량 센서를 포함한다.On the other hand, the capacitive touch panel of the window panel integrated according to another embodiment of the present invention, the design layer is formed on the lower surface of the film substrate so as to be at least partially overlapping the window panel, the film substrate, the edge of the window panel A transparent adhesive layer formed to cover the lower surface of the film substrate and the design layer to attach the film substrate and the design layer to the upper surface of the window panel, and a capacitive sensor formed on the lower surface or the upper surface of the window panel. Include.
한편, 본 발명의 또 다른 실시예에 따른 윈도우 패널 일체형의 정전용량 터치 패널은, 윈도우 패널, 필름 기판, 상기 윈도우 패널의 가장자리와 적어도 부분적으로 중첩되게 배치되도록 상기 필름 기판의 하면에 형성되는 디자인층, 상기 윈도우 패널의 상면에 형성되는 정전용량 센서, 그리고 상기 필름 기판과 상기 디자인층의 하면을 덮도록 형성되어 상기 필름 기판과 상기 디자인층을 상기 정전용량 센서의 상면에 부착하는 투명 접착제층을 포함한다.On the other hand, the capacitive touch panel of the window panel integrated according to another embodiment of the present invention, the design layer is formed on the lower surface of the film substrate so as to be at least partially overlapping the window panel, the film substrate, the edge of the window panel And a capacitive sensor formed on an upper surface of the window panel, and a transparent adhesive layer formed to cover the lower surface of the film substrate and the design layer to attach the film substrate and the design layer to an upper surface of the capacitive sensor. do.
본 발명에 의하면 디자인층이 윈도우 패널의 하면에 직접 형성되지 않고 정전용량 센서에 형성되어 윈도우 패널에 부착되거나 별도의 기판에 형성되어 윈도우 패널에 부착됨으로써, 디자인층이 잘못 형성되는 경우에도 윈도우 패널을 폐기해야 하는 문제를 극복할 수 있다.According to the present invention, the design layer is not formed directly on the bottom surface of the window panel, but is formed on the capacitive sensor and attached to the window panel or formed on a separate substrate and attached to the window panel, so that the window panel may be formed even when the design layer is formed incorrectly. It can overcome the problem of disposal.
또한 디자인층을 별도의 기판에 형성하여 글라스 기판에 부착하는 경우 글라스에서 구현하지 못하는 패턴을 별도의 기판에 형성할 수 있기 때문에 더 다양한 패턴을 형성할 수 있다.In addition, when the design layer is formed on a separate substrate and attached to the glass substrate, a pattern that cannot be implemented in the glass may be formed on a separate substrate, thereby forming a wider variety of patterns.
도 1은 본 발명의 실시예에 따른 윈도우 패널 일체형 정전용량 터치 패널이 적용된 정보통신 기기의 사시도이다.1 is a perspective view of an information communication device to which a window panel integrated capacitive touch panel according to an exemplary embodiment of the present invention is applied.
도 2는 도 1의 Ⅱ-Ⅱ선을 따라 절개한 단면도이다.FIG. 2 is a cross-sectional view taken along the line II-II of FIG. 1.
도 3은 본 발명의 실시예에 따른 윈도우 패널 일체형 정전용량 터치 패널의 분해 사시도이다.3 is an exploded perspective view of a window panel integrated capacitive touch panel according to an exemplary embodiment of the present invention.
도 4는 본 발명의 다른 실시예에 따른 윈도우 패널 일체형 정전용량 터치 패널의 단면도이다.4 is a cross-sectional view of a window panel integrated capacitive touch panel according to another embodiment of the present invention.
도 5는 도 4의 윈도우 패널 일체형 정전용량 터치 패널의 분해 사시도이다.5 is an exploded perspective view of the window panel integrated capacitive touch panel of FIG. 4.
도 6은 본 발명의 또 다른 실시예에 따른 윈도우 패널 일체형 정전용량 터치 패널의 단면도이다.6 is a cross-sectional view of a window panel integrated capacitive touch panel according to another exemplary embodiment of the present invention.
도 7은 도 6의 윈도우 패널 일체형 정전용량 터치 패널의 분해 사시도이다.FIG. 7 is an exploded perspective view of the window panel integrated capacitive touch panel of FIG. 6.
도 8은 본 발명의 실시예에 따른 윈도우 패널의 단면도이다.8 is a cross-sectional view of a window panel according to an embodiment of the present invention.
도 9는 본 발명의 다른 실시예에 따른 윈도우 패널 일체형의 정전용량 터치 패널의 단면도이다.9 is a cross-sectional view of a capacitive touch panel integrated with a window panel according to another embodiment of the present invention.
도 10은 본 발명의 다른 실시예에 따른 윈도우 패널의 단면도이다.10 is a cross-sectional view of a window panel according to another embodiment of the present invention.
도 11은 본 발명의 또 다른 실시예에 따른 윈도우 패널 일체형의 정전용량 터치 패널의 단면도이다.11 is a cross-sectional view of a capacitive touch panel integrated with a window panel according to another embodiment of the present invention.
도 12는 본 발명의 또 다른 실시예에 따른 윈도우 패널 일체형의 정전용량 터치 패널의 단면도이다.12 is a cross-sectional view of a capacitive touch panel integrated with a window panel according to another embodiment of the present invention.
이하에서 본 발명의 실시예를 첨부된 도면을 참조로 상세히 설명한다.Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings.
도면에서 여러 층 및 영역을 명확하게 표현하기 위하여 두께를 확대하여 나타내었다. 명세서 전체를 통하여 유사한 부분에 대해서는 동일한 도면 부호를 붙였다. 층이나 막 등의 부분이 다른 부분 “위에" 또는 “아래에” 있다고 할 때, 이는 다른 부분 “바로 위에" 또는 “바로 아래에”있는 경우뿐 아니라 그 중간에 또 다른 부분이 있는 경우도 포함한다. 반대로 어떤 부분이 다른 부분 “바로 위에" 또는 “바로 아래에” 있다고 할 때에는 중간에 다른 부분이 없는 것을 뜻한다.In the drawings, the thickness of layers, films, panels, regions, etc., are exaggerated for clarity. Like parts are designated by like reference numerals throughout the specification. When a part such as a layer or film is said to be "on" or "below" another part, this includes not only the other part "directly above" or "just below" but also another part in the middle. . On the contrary, when a part is “just above” or “just below” another part, there is no other part in the middle.
도 1에 도시된 바와 같이, 본 발명의 실시예에 따른 윈도우 패널 일체형 정전용량 터치 패널(100)은 휴대폰, PDA 등과 같은 정보통신기기(10)에 적용될 수 있다.As shown in FIG. 1, the capacitive touch panel 100 integrated with the window panel according to the exemplary embodiment of the present invention may be applied to an information communication device 10 such as a mobile phone or a PDA.
도 2 및 도 3을 참조하면, 본 발명의 실시예에 따른 윈도우 패널 일체형 정전용량 터치 패널(100)은 윈도우 패널(110)을 구비한다. 예를 들어, 윈도우 패널(110)은 대략 사각형 플레이트의 형상을 가질 수 있으며, 광 투과성을 가지는 유리나 아크릴과 같은 합성수지 등으로 형성될 수 있다. 도 2에서는 도시의 편의를 위해 터치 패널을 제외한 정보통신기기의 나머지 부분은 생략되었다.2 and 3, the window panel integrated capacitive touch panel 100 according to the embodiment of the present invention includes a window panel 110. For example, the window panel 110 may have a substantially rectangular plate shape, and may be formed of glass or synthetic resin such as acrylic having light transmittance. In FIG. 2, the rest of the information communication apparatus except for the touch panel is omitted for convenience of illustration.
예를 들어, 윈도우 패널(110)은 강화 유리 또는 아크릴, PMMA, PC 등의 합성수지 재질로 형성될 수 있다.For example, the window panel 110 may be formed of tempered glass or a synthetic resin material such as acrylic, PMMA, or PC.
디자인층(120)은 정전용량 센서(130) 위에 형성되며, 디자인층(120)과 정전용량 센서(130)가 투명 접착제층(140)에 의해 윈도우 패널(110)의 하면에 부착된다.The design layer 120 is formed on the capacitive sensor 130, and the design layer 120 and the capacitive sensor 130 are attached to the bottom surface of the window panel 110 by the transparent adhesive layer 140.
그리고 정전용량 센서(130)가 윈도우 패널(110) 아래에 배치되는데, 정전용량 센서(130)는 종래에 알려진 구조의 정전용량 센서의 형태로 구성될 수 있다. 예를 들어 정전용량 센서(130)는 투명한 도전성 막(131)과 도전성의 회로 배선(133)을 구비할 수 있다. 도전성 막(131)은 종래에 알려진 다양한 형태를 가질 수 있으며 회로 배선(133)은 도전성 막(131)의 외측과 선택적으로 전기적으로 연결되도록 형성된다. 그리고 회로 배선(133)에 전기 신호를 인가하기 위한 FPC(flexible printed circuit)(135)가 회로 배선(133)에 연결될 수 있다. 또한 도전성 막(131)과 회로 배선(133)은 유리 또는 PET 필름 등으로 형성되는 정전용량 센서 기판(137) 위에 형성될 수 있으며, 도전성 막(131)은 인듐주석산화물(ITO, indume tin oxide), 인듐아연산화물(IZO, indume zinc oxide), 아연산화물(ZnO) 등을 정전용량 센서 기판(137) 위에 스퍼터링하거나 증착하여 형성될 수 있으며, 회로 배선(133)은 도전성 잉크를 실크 스크린 인쇄 방식으로 인쇄하여 형성될 수 있다.The capacitive sensor 130 is disposed below the window panel 110, and the capacitive sensor 130 may be configured in the form of a capacitive sensor having a structure known in the art. For example, the capacitive sensor 130 may include a transparent conductive film 131 and a conductive circuit wiring 133. The conductive film 131 may have various forms known in the art, and the circuit wiring 133 is formed to be selectively electrically connected to the outside of the conductive film 131. A flexible printed circuit (FPC) 135 for applying an electrical signal to the circuit wiring 133 may be connected to the circuit wiring 133. In addition, the conductive film 131 and the circuit wiring 133 may be formed on the capacitive sensor substrate 137 formed of glass or PET film, and the conductive film 131 may be formed of indume tin oxide (ITO). , Indium zinc oxide (IZO), zinc oxide (ZnO), or the like, may be formed by sputtering or depositing on the capacitive sensor substrate 137. The circuit wiring 133 may be formed by silk screen printing. It can be formed by printing.
본 발명의 실시예에 따르면, 도 2에 도시된 바와 같이, 디자인층(120)은 정전용량 센서(130)의 도전성 막(131)과 회로 배선(133) 위에 형성될 수 있다. 즉, 본 발명의 실시예에 따르면 정전용량 센서(130)에 디자인층(120)이 형성된 후 정전용량 센서(130)와 디자인층(120)이 투명 접착제층(140)에 의해 윈도우 패널(110)의 하면에 부착되는 것이다.According to an embodiment of the present invention, as shown in FIG. 2, the design layer 120 may be formed on the conductive layer 131 and the circuit wiring 133 of the capacitive sensor 130. That is, according to the embodiment of the present invention, after the design layer 120 is formed on the capacitive sensor 130, the capacitive sensor 130 and the design layer 120 are formed by the transparent adhesive layer 140. Is attached to the lower surface.
디자인층(120)은 윈도우 패널(110)의 가장자리와 적어도 부분적으로 중첩되도록 배치된다. 예를 들어, 도면에 도시된 바와 같이 디자인층(120)은 윈도우 패널(110)의 가장자리를 따라 일정한 폭을 가지는 사각형 띠의 형상을 가질 수 있다.The design layer 120 is disposed to at least partially overlap the edge of the window panel 110. For example, as illustrated in the drawing, the design layer 120 may have a shape of a rectangular strip having a predetermined width along the edge of the window panel 110.
디자인층(120)은 불투명한 재질로 형성될 수 있으며, 예를 들어 비전도성의 불투명 재질을 실크 스크린 등의 방법으로 인쇄하거나 증착하여 형성될 수 있다.The design layer 120 may be formed of an opaque material. For example, the design layer 120 may be formed by printing or depositing a non-conductive opaque material by a silk screen method.
도 4 및 도 5를 참조하여 본 발명의 다른 실시예에 따른 윈도우 패널 일체형의 정전용량 터치 패널의 단면도이다. 위에서 설명한 실시예와 동일한 구성 요소에 대해서는 동일한 도면 부호를 사용하고 중복되는 사항에 대한 설명은 생략하기로 한다.4 and 5 are cross-sectional views of a window panel integrated capacitive touch panel according to another exemplary embodiment of the present invention. The same reference numerals are used for the same components as the above-described embodiments, and descriptions of overlapping points will be omitted.
본 실시예에 따르면 정전용량 센서(130)가 투명 평탄화막(139)을 더 포함하며, 디자인층(120)은 투명 평탄화막(139) 위에 형성된다. 즉, 도 4에 도시된 바와 같이, 정전용량 센서(130)의 도전성 막(131)과 회로 배선(133)을 덮는 투명 평탄화막(139)이 형성되고, 디자인층(120)이 투명 평탄화막(139)의 가장자리를 따라 형성된다. 예를 들어, 투명 평탄화막(139)은 전기 절연성의 투명한 합성수지 등을 도포하여 형성될 수 있다.According to the present embodiment, the capacitive sensor 130 further includes a transparent planarization layer 139, and the design layer 120 is formed on the transparent planarization layer 139. That is, as shown in FIG. 4, the transparent flattening film 139 covering the conductive film 131 and the circuit wiring 133 of the capacitive sensor 130 is formed, and the design layer 120 includes the transparent flattening film ( 139 is formed along the edge. For example, the transparent flattening film 139 may be formed by applying an electrically insulating transparent synthetic resin or the like.
정전용량 센서(130)를 구성하는 도전성 막(131)과 회로 배선(133) 위에 투명 평탄화막(139)이 형성되고 그 위에 디자인층(120)이 형성됨으로써, 도전성 막(131) 및 회로 배선(133)에 의해 생길 수 있는 단차가 제거된 상태에서 디자인층(120)이 안정적으로 형성될 수 있다.The transparent flattening film 139 is formed on the conductive film 131 constituting the capacitive sensor 130 and the circuit wiring 133, and the design layer 120 is formed thereon, whereby the conductive film 131 and the circuit wiring ( The design layer 120 may be stably formed in a state in which the step that may be generated by 133 is removed.
이하에서, 도 6 및 도 7을 참조하여 본 발명의 또 다른 실시예에 따른 윈도우 패널 일체형 정전용량 터치 패널에 대해서 설명한다. 위에서 설명한 실시예와 동일한 구성 요소에 대해서는 동일한 도면 부호를 사용하고 중복되는 사항에 대한 설명은 생략하기로 한다.Hereinafter, a window panel integrated capacitive touch panel according to still another embodiment of the present invention will be described with reference to FIGS. 6 and 7. The same reference numerals are used for the same components as the above-described embodiments, and descriptions of overlapping points will be omitted.
본 실시예에 따르면, 디자인층(120)이 제1 기판(150) 위에 형성되고, 디자인층(120)과 제1 기판(150)이 제1 투명 접착제층(240)에 의해 윈도우 패널(110)의 하면에 부착되고, 정전용량 센서(130)가 제2 투명 접착제층(340)에 의해 제1 기판(150)의 하면에 접착된다.According to the present embodiment, the design layer 120 is formed on the first substrate 150, and the design layer 120 and the first substrate 150 are formed on the window panel 110 by the first transparent adhesive layer 240. The capacitive sensor 130 is attached to the lower surface of the first substrate 150 by the second transparent adhesive layer 340.
예를 들어, 제1 투명 접착제층(240)과 제2 투명 접착제층(340)은 광학용 투명 접착제(optically clear adhesive, OCA)로 형성될 수 있다.For example, the first transparent adhesive layer 240 and the second transparent adhesive layer 340 may be formed of an optically clear adhesive (OCA).
구체적으로, 디자인층(120)이 제1 기판(150)의 상면에 가장자리를 따라 형성된 후, 제1 투명 접착제층(240)이 디자인층(120)과 제1 기판(150)의 상면을 덮도록 형성된 상태에서 윈도우 패널(110)의 하면에 접착된다.Specifically, after the design layer 120 is formed along the edge of the upper surface of the first substrate 150, the first transparent adhesive layer 240 to cover the upper surface of the design layer 120 and the first substrate 150. It is bonded to the lower surface of the window panel 110 in the formed state.
예를 들어, 제1 기판(150)은 PET, 유리 또는 아크릴, PMMA, PC 등의 합성수지 재질로 형성될 수 있다.For example, the first substrate 150 may be formed of a synthetic resin material such as PET, glass or acrylic, PMMA, PC, or the like.
이하에서, 첨부된 도 8 내지 도 11을 참조하여 본 발명의 실시예에 따른 윈도우 패널 구조체와 이를 포함하는 윈도우 패널 일체형의 정전용량 터치 패널에 대해서 설명한다. 위에서 설명한 실시예에서와 동일한 부분에 대해서는 동일한 도면부호를 사용하고 그에 대한 상세한 설명은 생략하기로 한다.Hereinafter, a window panel structure and a window panel integrated capacitive touch panel including the same will be described with reference to FIGS. 8 to 11. The same reference numerals are used for the same parts as in the above-described embodiment, and detailed description thereof will be omitted.
먼저, 도 8을 참조하면, 본 발명의 실시예에 따른 윈도우 패널 구조체는 윈도우 패널(110)을 포함한다.First, referring to FIG. 8, a window panel structure according to an embodiment of the present invention includes a window panel 110.
한편, 필름 기판(170)이 윈도우 패널(110)의 아래에 배치되며, 디자인층(120)이 윈도우 패널(110)의 가장자리와 적어도 부분적으로 중첩되게 배치되도록 필름 기판(170)의 상면에 형성된다. 필름 기판(170)은 유리 또는 PET와 같은 합성수지로 형성될 수 있다.Meanwhile, the film substrate 170 is disposed below the window panel 110, and the design layer 120 is formed on the top surface of the film substrate 170 such that the design layer 120 is at least partially overlapped with the edge of the window panel 110. . The film substrate 170 may be formed of synthetic resin such as glass or PET.
그리고 투명 접착제층(440)이 필름 기판(170)과 디자인층(120)의 상면을 덮도록 형성되며, 투명 접착제층(440)에 의해 필름 기판(170)과 디자인층(120)이 윈도우 패널(110)의 하면에 부착된다.The transparent adhesive layer 440 is formed to cover the top surfaces of the film substrate 170 and the design layer 120, and the film substrate 170 and the design layer 120 are formed by the transparent adhesive layer 440. 110 is attached to the bottom surface.
그리고, 도 9를 참조하면, 본 발명의 실시예에 따른 윈도우 패널 일체형의 정전용량 터치 패널은 도 8의 윈도우 패널 구조체의 필름 기판(170)의 하면에 정전용량 센서(130)가 형성된다. 정전용량 센서(130)는 위에서 설명한 바와 같이 도전성 막(131)과 회로 배선(133)을 포함할 수 있다.9, in the capacitive touch panel of the window panel integrated body according to the embodiment of the present invention, the capacitive sensor 130 is formed on the lower surface of the film substrate 170 of the window panel structure of FIG. 8. The capacitive sensor 130 may include the conductive film 131 and the circuit wiring 133 as described above.
다음, 도 10을 참조하면, 필름 기판(270)이 윈도우 패널(110)의 위에 배치되며, 디자인층(120)이 윈도우 패널(110)의 가장자리와 적어도 부분적으로 중첩되게 배치되도록 필름 기판(270)의 하면에 형성된다. 필름 기판(270)은 유리 또는 PET와 같은 합성수지로 형성될 수 있다.Next, referring to FIG. 10, the film substrate 270 is disposed on the window panel 110, and the film substrate 270 is disposed so that the design layer 120 is at least partially overlapped with an edge of the window panel 110. Is formed on the lower surface. The film substrate 270 may be formed of a synthetic resin such as glass or PET.
그리고 투명 접착제층(540)이 필름 기판(270)과 디자인층(120)의 하면을 덮도록 형성되며, 투명 접착제층(540)에 의해 필름 기판(270)과 디자인층(120)이 윈도우 패널(110)의 상면에 부착된다.The transparent adhesive layer 540 is formed to cover the bottom surface of the film substrate 270 and the design layer 120, and the film substrate 270 and the design layer 120 are formed by the transparent adhesive layer 540. 110 is attached to the upper surface.
그리고, 도 11을 참조하면, 본 발명의 실시예에 따른 윈도우 패널 일체형의 정전용량 터치 패널에 따르면 도 10의 윈도우 패널 구조체의 윈도우 패널(110)의 하면에 정전용량 센서(130)가 형성된다. 정전용량 센서(130)는 위에서 설명한 바와 같이 도전성 막(131)과 회로 배선(133)을 포함할 수 있다.In addition, referring to FIG. 11, according to the window panel integrated capacitive touch panel according to the exemplary embodiment, the capacitive sensor 130 is formed on the bottom surface of the window panel 110 of the window panel structure of FIG. 10. The capacitive sensor 130 may include the conductive film 131 and the circuit wiring 133 as described above.
한편, 도 9 및 도 11과 같이 정전용량 센서(130)가 하부로 노출되는 구조의 경우, 도전성 막(131)과 회로 배선(133)을 보호하기 위한 층을 형성할 수 있다.9 and 11, a layer for protecting the conductive film 131 and the circuit wiring 133 may be formed when the capacitance sensor 130 is exposed downward.
한편, 도 12를 참조하면, 본 발명의 또 다른 실시예에 따른 윈도우 패널 일체형의 정전용량 터치 패널에 따르면 윈도우 패널(110)의 상면에 정전용량 센서(130)가 형성된다. 투명 접착제층(540)이 필름 기판(270)과 디자인층(120)의 하면을 덮도록 형성되어 필름 기판(270)과 디자인층(120)을 정전용량 센서(130)의 상면에 부착한다.Meanwhile, referring to FIG. 12, according to the window panel integrated capacitive touch panel according to another exemplary embodiment, the capacitive sensor 130 is formed on the upper surface of the window panel 110. The transparent adhesive layer 540 is formed to cover the lower surface of the film substrate 270 and the design layer 120 to attach the film substrate 270 and the design layer 120 to the upper surface of the capacitive sensor 130.
도 8 내지 도 12의 투명 접착제층(440, 540)은 광학용 투명 접착제(optically clear adhesive, OCA)로 형성될 수 있다.The transparent adhesive layers 440 and 540 of FIGS. 8 to 12 may be formed of an optically clear adhesive (OCA).
위에서 사용된 '투명'이라는 용어는 광학적으로 완전히 투명한 경우뿐만 아니라 부분적으로 투명한 경우를 포함하는 의미로 사용되었다.The term 'transparent' as used above is used to mean partially transparent as well as optically completely transparent.
이상에서 본 발명의 실시예를 설명하였으나, 본 발명의 권리범위는 이에 한정되지 아니하며 본 발명의 실시예로부터 본 발명이 속하는 기술분야에서 통상의 지식을 가진 자에 의해 용이하게 변경되어 균등한 것으로 인정되는 범위의 모든 변경 및 수정을 포함한다.Although the embodiments of the present invention have been described above, the scope of the present invention is not limited thereto, and it is recognized that the present invention is easily changed and equivalent by those skilled in the art to which the present invention pertains. Includes all changes and modifications to the scope of the matter.
본 발명은 터치 패널에 관한 것으로 각종 디스플레이 장치의 입력 장치로 사용될 수 있어 산업상 이용가능성이 있다.The present invention relates to a touch panel and can be used as an input device of various display devices, thereby providing industrial applicability.
Claims (9)
- 윈도우 패널,Window Panel,정전용량 센서,Capacitive sensor,상기 윈도우 패널의 가장자리와 적어도 부분적으로 중첩되게 배치되도록 상기 정전용량 센서 위에 형성되는 디자인층, 그리고A design layer formed on the capacitive sensor so as to be at least partially overlapping an edge of the window panel; and상기 디자인층과 상기 정전용량 센서의 상부를 덮도록 형성되어 상기 디자인층과 상기 정전용량 센서를 상기 윈도우 패널의 하면에 부착하는 투명 접착제층을 포함하는 윈도우 패널 일체형 정전용량 터치 패널.And a transparent adhesive layer formed to cover the design layer and the upper portion of the capacitive sensor and attaching the design layer and the capacitive sensor to the lower surface of the window panel.
- 제1항에서,In claim 1,상기 정전용량 센서는 정전용량 센서 기판, 그리고 상기 정전용량 센서 기판 위에 형성되는 도전성 막과 회로 배선을 포함하며,The capacitive sensor includes a capacitive sensor substrate and a conductive film and a circuit wiring formed on the capacitive sensor substrate,상기 디자인층은 상기 도전성 막 및 회로 배선 위에 형성되는 윈도우 패널 일체형 정전용량 터치 패널.And the design layer is formed on the conductive film and the circuit wiring.
- 제1항에서,In claim 1,상기 정전용량 센서는 정전용량 센서 기판, 상기 정전용량 센서 기판 위에 형성되는 도전성 막과 회로 배선, 그리고 상기 도전성 막과 회로 배선 위에 형성되는 투명 평탄화막을 포함하며,The capacitive sensor includes a capacitive sensor substrate, a conductive film and a circuit wiring formed on the capacitive sensor substrate, and a transparent planarization film formed on the conductive film and the circuit wiring,상기 디자인층은 상기 투명 평탄화막 위에 형성되는 윈도우 패널 일체형 정전용량 터치 패널.The design layer is a window panel integrated capacitive touch panel formed on the transparent planarization film.
- 윈도우 패널,Window Panel,상기 윈도우 패널의 아래에 배치되는 제1 기판,A first substrate disposed under the window panel,상기 윈도우 패널의 가장자리와 적어도 부분적으로 중첩되게 배치되도록 상기 제1 기판의 상면에 형성되는 디자인층,A design layer formed on an upper surface of the first substrate to be at least partially overlapped with an edge of the window panel;상기 제1 기판과 상기 디자인층의 상면을 덮도록 형성되어 상기 제1 기판과 상기 디자인층을 상기 윈도우 패널의 하면에 부착하는 제1 투명 접착제층,A first transparent adhesive layer formed to cover the upper surface of the first substrate and the design layer, and attaching the first substrate and the design layer to the lower surface of the window panel;상기 제1 기판의 아래에 배치되는 정전용량 센서, 그리고A capacitive sensor disposed below the first substrate, and상기 정전용량 센서를 상기 제1 기판의 하면에 부착하는 제2 투명 접착제층을 포함하는 윈도우 패널 일체형 정전용량 터치 패널.The window panel integrated capacitive touch panel comprising a second transparent adhesive layer attaching the capacitive sensor to the bottom surface of the first substrate.
- 윈도우 패널,Window Panel,필름 기판,Film substrate,상기 윈도우 패널의 가장자리와 적어도 부분적으로 중첩되게 배치되도록 상기 필름 기판의 상면에 형성되는 디자인층, 그리고A design layer formed on an upper surface of the film substrate so as to be at least partially overlapped with an edge of the window panel; and상기 필름 기판과 상기 디자인층의 상면을 덮도록 형성되어 상기 필름 기판과 상기 디자인층을 상기 윈도우 패널의 하면에 부착하는 투명 접착제층을 포함하는 윈도우 패널 구조체.And a transparent adhesive layer formed to cover the upper surface of the film substrate and the design layer and attaching the film substrate and the design layer to the lower surface of the window panel.
- 윈도우 패널,Window Panel,필름 기판,Film substrate,상기 윈도우 패널의 가장자리와 적어도 부분적으로 중첩되게 배치되도록 상기 필름 기판의 상면에 형성되는 디자인층, 그리고A design layer formed on an upper surface of the film substrate so as to be at least partially overlapped with an edge of the window panel; and상기 필름 기판과 상기 디자인층의 상면을 덮도록 형성되어 상기 필름 기판과 상기 디자인층을 상기 윈도우 패널의 하면에 부착하는 투명 접착제층,A transparent adhesive layer formed to cover the top surface of the film substrate and the design layer to attach the film substrate and the design layer to the bottom surface of the window panel;상기 필름 기판의 하면에 형성되는 정전용량 센서를 포함하는 윈도우 패널 일체형의 정전용량 터치 패널.The capacitive touch panel of the window panel including a capacitive sensor formed on the lower surface of the film substrate.
- 윈도우 패널,Window Panel,필름 기판,Film substrate,상기 윈도우 패널의 가장자리와 적어도 부분적으로 중첩되게 배치되도록 상기 필름 기판의 하면에 형성되는 디자인층, 그리고A design layer formed on the bottom surface of the film substrate so as to be at least partially overlapped with an edge of the window panel; and상기 필름 기판과 상기 디자인층의 하면을 덮도록 형성되어 상기 필름 기판과 상기 디자인층을 상기 윈도우 패널의 상면에 부착하는 투명 접착제층을 포함하는 윈도우 패널 구조체.And a transparent adhesive layer formed to cover the lower surface of the film substrate and the design layer to attach the film substrate and the design layer to an upper surface of the window panel.
- 윈도우 패널,Window Panel,필름 기판,Film substrate,상기 윈도우 패널의 가장자리와 적어도 부분적으로 중첩되게 배치되도록 상기 필름 기판의 하면에 형성되는 디자인층,A design layer formed on the bottom surface of the film substrate so as to be at least partially overlapped with an edge of the window panel;상기 필름 기판과 상기 디자인층의 하면을 덮도록 형성되어 상기 필름 기판과 상기 디자인층을 상기 윈도우 패널의 상면에 부착하는 투명 접착제층, 그리고A transparent adhesive layer formed to cover the lower surface of the film substrate and the design layer to attach the film substrate and the design layer to an upper surface of the window panel;상기 윈도우 패널의 하면에 형성되는 정전용량 센서를 포함하는 윈도우 패널 일체형의 정전용량 터치 패널.Capacitive touch panel of the window panel including a capacitive sensor formed on the lower surface of the window panel.
- 윈도우 패널,Window Panel,필름 기판,Film substrate,상기 윈도우 패널의 가장자리와 적어도 부분적으로 중첩되게 배치되도록 상기 필름 기판의 하면에 형성되는 디자인층,A design layer formed on the bottom surface of the film substrate so as to be at least partially overlapped with an edge of the window panel;상기 윈도우 패널의 상면에 형성되는 정전용량 센서, 그리고A capacitive sensor formed on an upper surface of the window panel, and상기 필름 기판과 상기 디자인층의 하면을 덮도록 형성되어 상기 필름 기판과 상기 디자인층을 상기 정전용량 센서의 상면에 부착하는 투명 접착제층을 포함하는 윈도우 패널 일체형의 정전용량 터치 패널.And a transparent adhesive layer formed to cover the lower surface of the film substrate and the design layer and attaching the film substrate and the design layer to the upper surface of the capacitive sensor.
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CN201180029094.XA CN102971694B (en) | 2010-06-14 | 2011-06-14 | Window panel assembly and the one-piece type electrostatic capacitance contact panel of window panel |
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KR1020100055877A KR101254094B1 (en) | 2010-06-14 | 2010-06-14 | Capacitive touch panel of integrated window panel type |
KR10-2010-0055877 | 2010-06-14 |
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CN (1) | CN102971694B (en) |
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KR101494658B1 (en) * | 2012-11-21 | 2015-02-25 | (주)네패스디스플레이 | Touch panel, bonding device for circuit substrate, and method for bonding circuit substrate using the same |
CN103853366B (en) * | 2012-11-29 | 2017-07-11 | 宸鸿科技(厦门)有限公司 | Apply the adhesive layer and preparation method thereof in contact panel |
KR101350424B1 (en) * | 2013-04-26 | 2014-01-16 | 에스지글로벌 주식회사 | An adhesive tape and display unit for touch screen having it |
KR102016612B1 (en) | 2017-12-21 | 2019-08-30 | 한솔테크닉스(주) | Board laminate structure and manufacturing method thereof |
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KR100894710B1 (en) * | 2008-06-27 | 2009-04-24 | (주) 월드비젼 | Touch screen unification with window and manufacturing methode thereof |
KR100942763B1 (en) * | 2009-03-30 | 2010-02-18 | (주) 월드비젼 | Capacitive touch sensor integrated with window panel and mathod for manufacturing there of |
KR20100040654A (en) * | 2008-10-10 | 2010-04-20 | 주식회사 케이비에프 | Touchpanel comprising only of a windowsheet |
KR100954894B1 (en) * | 2009-09-10 | 2010-04-28 | 남동식 | Touch panel sensor |
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JP2008027329A (en) * | 2006-07-25 | 2008-02-07 | Matsushita Electric Ind Co Ltd | Touch panel |
KR20080024771A (en) * | 2006-09-14 | 2008-03-19 | 삼성전자주식회사 | Touch screen and display using the same |
US7948477B2 (en) * | 2006-12-15 | 2011-05-24 | Apple Inc. | PET-based touchpad |
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KR100894710B1 (en) * | 2008-06-27 | 2009-04-24 | (주) 월드비젼 | Touch screen unification with window and manufacturing methode thereof |
KR20100040654A (en) * | 2008-10-10 | 2010-04-20 | 주식회사 케이비에프 | Touchpanel comprising only of a windowsheet |
KR100942763B1 (en) * | 2009-03-30 | 2010-02-18 | (주) 월드비젼 | Capacitive touch sensor integrated with window panel and mathod for manufacturing there of |
KR100954894B1 (en) * | 2009-09-10 | 2010-04-28 | 남동식 | Touch panel sensor |
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KR20110136092A (en) | 2011-12-21 |
CN102971694B (en) | 2016-01-27 |
WO2011159082A3 (en) | 2012-04-19 |
CN102971694A (en) | 2013-03-13 |
TW201207712A (en) | 2012-02-16 |
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