WO2008133213A1 - 積層誘電体製造方法 - Google Patents
積層誘電体製造方法 Download PDFInfo
- Publication number
- WO2008133213A1 WO2008133213A1 PCT/JP2008/057625 JP2008057625W WO2008133213A1 WO 2008133213 A1 WO2008133213 A1 WO 2008133213A1 JP 2008057625 W JP2008057625 W JP 2008057625W WO 2008133213 A1 WO2008133213 A1 WO 2008133213A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- mol
- raw material
- glass powder
- material layer
- laminated dielectric
- Prior art date
Links
- 239000003989 dielectric material Substances 0.000 title abstract 3
- 238000004519 manufacturing process Methods 0.000 title abstract 2
- 239000011521 glass Substances 0.000 abstract 6
- 239000000843 powder Substances 0.000 abstract 6
- 239000002994 raw material Substances 0.000 abstract 6
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 abstract 4
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 abstract 3
- 229910052681 coesite Inorganic materials 0.000 abstract 2
- 229910052593 corundum Inorganic materials 0.000 abstract 2
- 229910052906 cristobalite Inorganic materials 0.000 abstract 2
- 239000000377 silicon dioxide Substances 0.000 abstract 2
- 235000012239 silicon dioxide Nutrition 0.000 abstract 2
- 229910052682 stishovite Inorganic materials 0.000 abstract 2
- 229910052905 tridymite Inorganic materials 0.000 abstract 2
- 229910001845 yogo sapphire Inorganic materials 0.000 abstract 2
- 238000010304 firing Methods 0.000 abstract 1
- 230000009477 glass transition Effects 0.000 abstract 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B18/00—Layered products essentially comprising ceramics, e.g. refractory products
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/018—Dielectrics
- H01G4/06—Solid dielectrics
- H01G4/08—Inorganic dielectrics
- H01G4/10—Metal-oxide dielectrics
- H01G4/105—Glass dielectric
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C10/00—Devitrified glass ceramics, i.e. glass ceramics having a crystalline phase dispersed in a glassy phase and constituting at least 50% by weight of the total composition
- C03C10/0036—Devitrified glass ceramics, i.e. glass ceramics having a crystalline phase dispersed in a glassy phase and constituting at least 50% by weight of the total composition containing SiO2, Al2O3 and a divalent metal oxide as main constituents
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C10/00—Devitrified glass ceramics, i.e. glass ceramics having a crystalline phase dispersed in a glassy phase and constituting at least 50% by weight of the total composition
- C03C10/0036—Devitrified glass ceramics, i.e. glass ceramics having a crystalline phase dispersed in a glassy phase and constituting at least 50% by weight of the total composition containing SiO2, Al2O3 and a divalent metal oxide as main constituents
- C03C10/0045—Devitrified glass ceramics, i.e. glass ceramics having a crystalline phase dispersed in a glassy phase and constituting at least 50% by weight of the total composition containing SiO2, Al2O3 and a divalent metal oxide as main constituents containing SiO2, Al2O3 and MgO as main constituents
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C14/00—Glass compositions containing a non-glass component, e.g. compositions containing fibres, filaments, whiskers, platelets, or the like, dispersed in a glass matrix
- C03C14/004—Glass compositions containing a non-glass component, e.g. compositions containing fibres, filaments, whiskers, platelets, or the like, dispersed in a glass matrix the non-glass component being in the form of particles or flakes
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C27/00—Joining pieces of glass to pieces of other inorganic material; Joining glass to glass other than by fusing
- C03C27/06—Joining glass to glass by processes other than fusing
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C3/00—Glass compositions
- C03C3/04—Glass compositions containing silica
- C03C3/076—Glass compositions containing silica with 40% to 90% silica, by weight
- C03C3/083—Glass compositions containing silica with 40% to 90% silica, by weight containing aluminium oxide or an iron compound
- C03C3/085—Glass compositions containing silica with 40% to 90% silica, by weight containing aluminium oxide or an iron compound containing an oxide of a divalent metal
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
- H01B3/02—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of inorganic substances
- H01B3/08—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of inorganic substances quartz; glass; glass wool; slag wool; vitreous enamels
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
- H01B3/02—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of inorganic substances
- H01B3/08—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of inorganic substances quartz; glass; glass wool; slag wool; vitreous enamels
- H01B3/087—Chemical composition of glass
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/018—Dielectrics
- H01G4/06—Solid dielectrics
- H01G4/08—Inorganic dielectrics
- H01G4/12—Ceramic dielectrics
- H01G4/1209—Ceramic dielectrics characterised by the ceramic dielectric material
- H01G4/1218—Ceramic dielectrics characterised by the ceramic dielectric material based on titanium oxides or titanates
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
- H05K3/4626—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials
- H05K3/4629—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials laminating inorganic sheets comprising printed circuits, e.g. green ceramic sheets
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Ceramic Engineering (AREA)
- General Chemical & Material Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Geochemistry & Mineralogy (AREA)
- Materials Engineering (AREA)
- Organic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Power Engineering (AREA)
- Inorganic Chemistry (AREA)
- Dispersion Chemistry (AREA)
- Crystallography & Structural Chemistry (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Glass Compositions (AREA)
- Inorganic Insulating Materials (AREA)
- Insulating Bodies (AREA)
- Compositions Of Oxide Ceramics (AREA)
Abstract
安定したガラスを用いる積層誘電体の製造方法の提供。 焼成前の少なくとも1層の原料層が質量%で50~80のガラス粉末、20~50のアルミナ粉末からなり当該ガラス粉末がモル%で、SiO2 45~60、Al2O3 2~10、BaO 10~30、ZnO 10~20等からなり、その原料層と隣り合う2個の原料層のガラス粉末がモル%で、SiO2 45~55、Al2O3 2~20、MgO 20~45等からなり、後者のガラス粉末のガラス転移点が前者のそれよりも50°C以上高く、隣接誘電体層の50~350°Cにおける平均線膨張係数の差の絶対値が15×10-7/°C以下である積層誘電体製造方法。
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP08740672A EP2157585A4 (en) | 2007-04-25 | 2008-04-18 | PROCESS FOR PRODUCING LAMINATED DIELECTRIC MATERIAL |
JP2009511863A JPWO2008133213A1 (ja) | 2007-04-25 | 2008-04-18 | 積層誘電体製造方法 |
US12/582,003 US20100038014A1 (en) | 2007-04-25 | 2009-10-20 | Method for producing laminated dielectric material |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2007-115724 | 2007-04-25 | ||
JP2007115724 | 2007-04-25 |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US12/582,003 Continuation US20100038014A1 (en) | 2007-04-25 | 2009-10-20 | Method for producing laminated dielectric material |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2008133213A1 true WO2008133213A1 (ja) | 2008-11-06 |
Family
ID=39925667
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/JP2008/057625 WO2008133213A1 (ja) | 2007-04-25 | 2008-04-18 | 積層誘電体製造方法 |
Country Status (6)
Country | Link |
---|---|
US (1) | US20100038014A1 (ja) |
EP (1) | EP2157585A4 (ja) |
JP (1) | JPWO2008133213A1 (ja) |
KR (1) | KR20100014344A (ja) |
TW (1) | TW200912974A (ja) |
WO (1) | WO2008133213A1 (ja) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2011046551A (ja) * | 2009-08-26 | 2011-03-10 | Nippon Electric Glass Co Ltd | グリーンシート |
EP2348002A1 (en) * | 2008-11-14 | 2011-07-27 | Asahi Glass Company Limited | Method for producing glass member provided with sealing material layer, and method for manufacturing electronic device |
JP2012250903A (ja) * | 2011-05-12 | 2012-12-20 | Nippon Electric Glass Co Ltd | ガラスセラミック複合材料 |
JP2014212267A (ja) * | 2013-04-19 | 2014-11-13 | 日本特殊陶業株式会社 | セラミック配線基板 |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101873702B1 (ko) | 2010-06-29 | 2018-07-02 | 코닝 인코포레이티드 | 오버플로 하향인발 융합 공정을 사용해 공동인발하여 만들어진 다층 유리 시트 |
KR101837933B1 (ko) * | 2013-03-29 | 2018-03-13 | 생-고뱅 세라믹스 앤드 플라스틱스, 인코포레이티드 | 고온 적용을 위한 산보나이트-계열 유리-세라믹 시일 |
US20140309099A1 (en) | 2013-04-15 | 2014-10-16 | Ppg Industries Ohio, Inc. | Low iron, high redox ratio, and high iron, high redox ratio, soda-lime-silica glasses and methods of making same |
US11261122B2 (en) * | 2013-04-15 | 2022-03-01 | Vitro Flat Glass Llc | Low iron, high redox ratio, and high iron, high redox ratio, soda-lime-silica glasses and methods of making same |
JP6976053B2 (ja) * | 2016-12-14 | 2021-12-01 | Tdk株式会社 | 積層電子部品 |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2003069236A (ja) | 2001-08-29 | 2003-03-07 | Kyocera Corp | セラミック回路基板およびその製法 |
JP2004063420A (ja) * | 2002-07-31 | 2004-02-26 | Matsushita Electric Ind Co Ltd | 誘電体シート及びその製造方法、誘電体シート用ペースト並びにプラズマディスプレイパネル |
JP2005038687A (ja) * | 2003-07-14 | 2005-02-10 | Nitto Denko Corp | 高誘電体シート、その製造方法、配線回路基板およびその製造方法 |
WO2005108327A1 (ja) * | 2004-05-06 | 2005-11-17 | Asahi Glass Company, Limited | 積層誘電体製造方法 |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5137848A (en) * | 1990-12-13 | 1992-08-11 | E. I. Du Pont De Nemours And Company | Dielectric composition containing kerf additive |
DE69623930T2 (de) * | 1995-01-27 | 2003-05-15 | Sarnoff Corp., Princeton | Gläser mit niedrigem dielektrischem verlust |
JP3591437B2 (ja) * | 2000-09-07 | 2004-11-17 | 株式会社村田製作所 | 多層セラミック基板およびその製造方法ならびに電子装置 |
EP1443029A4 (en) * | 2001-11-05 | 2007-08-01 | Asahi Glass Co Ltd | GLASS CERAMIC COMPOSITION |
US7687137B2 (en) * | 2005-02-28 | 2010-03-30 | Kyocera Corporation | Insulating substrate and manufacturing method therefor, and multilayer wiring board and manufacturing method therefor |
-
2008
- 2008-04-18 KR KR1020097015835A patent/KR20100014344A/ko not_active Application Discontinuation
- 2008-04-18 EP EP08740672A patent/EP2157585A4/en not_active Withdrawn
- 2008-04-18 JP JP2009511863A patent/JPWO2008133213A1/ja active Pending
- 2008-04-18 WO PCT/JP2008/057625 patent/WO2008133213A1/ja active Application Filing
- 2008-04-24 TW TW097115082A patent/TW200912974A/zh unknown
-
2009
- 2009-10-20 US US12/582,003 patent/US20100038014A1/en not_active Abandoned
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2003069236A (ja) | 2001-08-29 | 2003-03-07 | Kyocera Corp | セラミック回路基板およびその製法 |
JP2004063420A (ja) * | 2002-07-31 | 2004-02-26 | Matsushita Electric Ind Co Ltd | 誘電体シート及びその製造方法、誘電体シート用ペースト並びにプラズマディスプレイパネル |
JP2005038687A (ja) * | 2003-07-14 | 2005-02-10 | Nitto Denko Corp | 高誘電体シート、その製造方法、配線回路基板およびその製造方法 |
WO2005108327A1 (ja) * | 2004-05-06 | 2005-11-17 | Asahi Glass Company, Limited | 積層誘電体製造方法 |
Non-Patent Citations (1)
Title |
---|
See also references of EP2157585A4 * |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP2348002A1 (en) * | 2008-11-14 | 2011-07-27 | Asahi Glass Company Limited | Method for producing glass member provided with sealing material layer, and method for manufacturing electronic device |
EP2348002A4 (en) * | 2008-11-14 | 2012-04-18 | Asahi Glass Co Ltd | METHOD FOR PRODUCING A GLASS ELEMENT WITH A SEALING MATERIAL LAYER AND METHOD FOR PRODUCING AN ELECTRONIC DEVICE |
JP2011046551A (ja) * | 2009-08-26 | 2011-03-10 | Nippon Electric Glass Co Ltd | グリーンシート |
JP2012250903A (ja) * | 2011-05-12 | 2012-12-20 | Nippon Electric Glass Co Ltd | ガラスセラミック複合材料 |
JP2014212267A (ja) * | 2013-04-19 | 2014-11-13 | 日本特殊陶業株式会社 | セラミック配線基板 |
Also Published As
Publication number | Publication date |
---|---|
KR20100014344A (ko) | 2010-02-10 |
TW200912974A (en) | 2009-03-16 |
US20100038014A1 (en) | 2010-02-18 |
EP2157585A4 (en) | 2010-04-28 |
EP2157585A1 (en) | 2010-02-24 |
JPWO2008133213A1 (ja) | 2010-07-22 |
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