WO2008133213A1 - 積層誘電体製造方法 - Google Patents

積層誘電体製造方法 Download PDF

Info

Publication number
WO2008133213A1
WO2008133213A1 PCT/JP2008/057625 JP2008057625W WO2008133213A1 WO 2008133213 A1 WO2008133213 A1 WO 2008133213A1 JP 2008057625 W JP2008057625 W JP 2008057625W WO 2008133213 A1 WO2008133213 A1 WO 2008133213A1
Authority
WO
WIPO (PCT)
Prior art keywords
mol
raw material
glass powder
material layer
laminated dielectric
Prior art date
Application number
PCT/JP2008/057625
Other languages
English (en)
French (fr)
Inventor
Satoru Tomeno
Yasuko Osaki
Kazuo Watanabe
Katsuyoshi Nakayama
Original Assignee
Asahi Glass Company, Limited
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Asahi Glass Company, Limited filed Critical Asahi Glass Company, Limited
Priority to EP08740672A priority Critical patent/EP2157585A4/en
Priority to JP2009511863A priority patent/JPWO2008133213A1/ja
Publication of WO2008133213A1 publication Critical patent/WO2008133213A1/ja
Priority to US12/582,003 priority patent/US20100038014A1/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B18/00—Layered products essentially comprising ceramics, e.g. refractory products
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/018—Dielectrics
    • H01G4/06—Solid dielectrics
    • H01G4/08—Inorganic dielectrics
    • H01G4/10—Metal-oxide dielectrics
    • H01G4/105—Glass dielectric
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C10/00—Devitrified glass ceramics, i.e. glass ceramics having a crystalline phase dispersed in a glassy phase and constituting at least 50% by weight of the total composition
    • C03C10/0036—Devitrified glass ceramics, i.e. glass ceramics having a crystalline phase dispersed in a glassy phase and constituting at least 50% by weight of the total composition containing SiO2, Al2O3 and a divalent metal oxide as main constituents
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C10/00—Devitrified glass ceramics, i.e. glass ceramics having a crystalline phase dispersed in a glassy phase and constituting at least 50% by weight of the total composition
    • C03C10/0036—Devitrified glass ceramics, i.e. glass ceramics having a crystalline phase dispersed in a glassy phase and constituting at least 50% by weight of the total composition containing SiO2, Al2O3 and a divalent metal oxide as main constituents
    • C03C10/0045—Devitrified glass ceramics, i.e. glass ceramics having a crystalline phase dispersed in a glassy phase and constituting at least 50% by weight of the total composition containing SiO2, Al2O3 and a divalent metal oxide as main constituents containing SiO2, Al2O3 and MgO as main constituents
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C14/00—Glass compositions containing a non-glass component, e.g. compositions containing fibres, filaments, whiskers, platelets, or the like, dispersed in a glass matrix
    • C03C14/004—Glass compositions containing a non-glass component, e.g. compositions containing fibres, filaments, whiskers, platelets, or the like, dispersed in a glass matrix the non-glass component being in the form of particles or flakes
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C27/00—Joining pieces of glass to pieces of other inorganic material; Joining glass to glass other than by fusing
    • C03C27/06—Joining glass to glass by processes other than fusing
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C3/00—Glass compositions
    • C03C3/04—Glass compositions containing silica
    • C03C3/076—Glass compositions containing silica with 40% to 90% silica, by weight
    • C03C3/083—Glass compositions containing silica with 40% to 90% silica, by weight containing aluminium oxide or an iron compound
    • C03C3/085—Glass compositions containing silica with 40% to 90% silica, by weight containing aluminium oxide or an iron compound containing an oxide of a divalent metal
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
    • H01B3/02—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of inorganic substances
    • H01B3/08—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of inorganic substances quartz; glass; glass wool; slag wool; vitreous enamels
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
    • H01B3/02—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of inorganic substances
    • H01B3/08—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of inorganic substances quartz; glass; glass wool; slag wool; vitreous enamels
    • H01B3/087—Chemical composition of glass
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/018—Dielectrics
    • H01G4/06—Solid dielectrics
    • H01G4/08—Inorganic dielectrics
    • H01G4/12—Ceramic dielectrics
    • H01G4/1209—Ceramic dielectrics characterised by the ceramic dielectric material
    • H01G4/1218—Ceramic dielectrics characterised by the ceramic dielectric material based on titanium oxides or titanates
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
    • H05K3/4626—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials
    • H05K3/4629—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials laminating inorganic sheets comprising printed circuits, e.g. green ceramic sheets

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Ceramic Engineering (AREA)
  • General Chemical & Material Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Geochemistry & Mineralogy (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Power Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Dispersion Chemistry (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Glass Compositions (AREA)
  • Inorganic Insulating Materials (AREA)
  • Insulating Bodies (AREA)
  • Compositions Of Oxide Ceramics (AREA)

Abstract

　安定したガラスを用いる積層誘電体の製造方法の提供。 　焼成前の少なくとも１層の原料層が質量％で５０～８０のガラス粉末、２０～５０のアルミナ粉末からなり当該ガラス粉末がモル％で、ＳｉＯ２　４５～６０、Ａｌ２Ｏ３　２～１０、ＢａＯ　１０～３０、ＺｎＯ　１０～２０等からなり、その原料層と隣り合う２個の原料層のガラス粉末がモル％で、ＳｉＯ２　４５～５５、Ａｌ２Ｏ３　２～２０、ＭｇＯ　２０～４５等からなり、後者のガラス粉末のガラス転移点が前者のそれよりも５０°C以上高く、隣接誘電体層の５０～３５０°Cにおける平均線膨張係数の差の絶対値が１５×１０－７／°C以下である積層誘電体製造方法。
PCT/JP2008/057625 2007-04-25 2008-04-18 積層誘電体製造方法 WO2008133213A1 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
EP08740672A EP2157585A4 (en) 2007-04-25 2008-04-18 PROCESS FOR PRODUCING LAMINATED DIELECTRIC MATERIAL
JP2009511863A JPWO2008133213A1 (ja) 2007-04-25 2008-04-18 積層誘電体製造方法
US12/582,003 US20100038014A1 (en) 2007-04-25 2009-10-20 Method for producing laminated dielectric material

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007-115724 2007-04-25
JP2007115724 2007-04-25

Related Child Applications (1)

Application Number Title Priority Date Filing Date
US12/582,003 Continuation US20100038014A1 (en) 2007-04-25 2009-10-20 Method for producing laminated dielectric material

Publications (1)

Publication Number Publication Date
WO2008133213A1 true WO2008133213A1 (ja) 2008-11-06

Family

ID=39925667

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/057625 WO2008133213A1 (ja) 2007-04-25 2008-04-18 積層誘電体製造方法

Country Status (6)

Country Link
US (1) US20100038014A1 (ja)
EP (1) EP2157585A4 (ja)
JP (1) JPWO2008133213A1 (ja)
KR (1) KR20100014344A (ja)
TW (1) TW200912974A (ja)
WO (1) WO2008133213A1 (ja)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011046551A (ja) * 2009-08-26 2011-03-10 Nippon Electric Glass Co Ltd グリーンシート
EP2348002A1 (en) * 2008-11-14 2011-07-27 Asahi Glass Company Limited Method for producing glass member provided with sealing material layer, and method for manufacturing electronic device
JP2012250903A (ja) * 2011-05-12 2012-12-20 Nippon Electric Glass Co Ltd ガラスセラミック複合材料
JP2014212267A (ja) * 2013-04-19 2014-11-13 日本特殊陶業株式会社 セラミック配線基板

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101873702B1 (ko) 2010-06-29 2018-07-02 코닝 인코포레이티드 오버플로 하향인발 융합 공정을 사용해 공동인발하여 만들어진 다층 유리 시트
KR101837933B1 (ko) * 2013-03-29 2018-03-13 생-고뱅 세라믹스 앤드 플라스틱스, 인코포레이티드 고온 적용을 위한 산보나이트-계열 유리-세라믹 시일
US20140309099A1 (en) 2013-04-15 2014-10-16 Ppg Industries Ohio, Inc. Low iron, high redox ratio, and high iron, high redox ratio, soda-lime-silica glasses and methods of making same
US11261122B2 (en) * 2013-04-15 2022-03-01 Vitro Flat Glass Llc Low iron, high redox ratio, and high iron, high redox ratio, soda-lime-silica glasses and methods of making same
JP6976053B2 (ja) * 2016-12-14 2021-12-01 Tdk株式会社 積層電子部品

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003069236A (ja) 2001-08-29 2003-03-07 Kyocera Corp セラミック回路基板およびその製法
JP2004063420A (ja) * 2002-07-31 2004-02-26 Matsushita Electric Ind Co Ltd 誘電体シート及びその製造方法、誘電体シート用ペースト並びにプラズマディスプレイパネル
JP2005038687A (ja) * 2003-07-14 2005-02-10 Nitto Denko Corp 高誘電体シート、その製造方法、配線回路基板およびその製造方法
WO2005108327A1 (ja) * 2004-05-06 2005-11-17 Asahi Glass Company, Limited 積層誘電体製造方法

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5137848A (en) * 1990-12-13 1992-08-11 E. I. Du Pont De Nemours And Company Dielectric composition containing kerf additive
DE69623930T2 (de) * 1995-01-27 2003-05-15 Sarnoff Corp., Princeton Gläser mit niedrigem dielektrischem verlust
JP3591437B2 (ja) * 2000-09-07 2004-11-17 株式会社村田製作所 多層セラミック基板およびその製造方法ならびに電子装置
EP1443029A4 (en) * 2001-11-05 2007-08-01 Asahi Glass Co Ltd GLASS CERAMIC COMPOSITION
US7687137B2 (en) * 2005-02-28 2010-03-30 Kyocera Corporation Insulating substrate and manufacturing method therefor, and multilayer wiring board and manufacturing method therefor

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003069236A (ja) 2001-08-29 2003-03-07 Kyocera Corp セラミック回路基板およびその製法
JP2004063420A (ja) * 2002-07-31 2004-02-26 Matsushita Electric Ind Co Ltd 誘電体シート及びその製造方法、誘電体シート用ペースト並びにプラズマディスプレイパネル
JP2005038687A (ja) * 2003-07-14 2005-02-10 Nitto Denko Corp 高誘電体シート、その製造方法、配線回路基板およびその製造方法
WO2005108327A1 (ja) * 2004-05-06 2005-11-17 Asahi Glass Company, Limited 積層誘電体製造方法

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
See also references of EP2157585A4 *

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2348002A1 (en) * 2008-11-14 2011-07-27 Asahi Glass Company Limited Method for producing glass member provided with sealing material layer, and method for manufacturing electronic device
EP2348002A4 (en) * 2008-11-14 2012-04-18 Asahi Glass Co Ltd METHOD FOR PRODUCING A GLASS ELEMENT WITH A SEALING MATERIAL LAYER AND METHOD FOR PRODUCING AN ELECTRONIC DEVICE
JP2011046551A (ja) * 2009-08-26 2011-03-10 Nippon Electric Glass Co Ltd グリーンシート
JP2012250903A (ja) * 2011-05-12 2012-12-20 Nippon Electric Glass Co Ltd ガラスセラミック複合材料
JP2014212267A (ja) * 2013-04-19 2014-11-13 日本特殊陶業株式会社 セラミック配線基板

Also Published As

Publication number Publication date
KR20100014344A (ko) 2010-02-10
TW200912974A (en) 2009-03-16
US20100038014A1 (en) 2010-02-18
EP2157585A4 (en) 2010-04-28
EP2157585A1 (en) 2010-02-24
JPWO2008133213A1 (ja) 2010-07-22

Similar Documents

Publication Publication Date Title
WO2008133213A1 (ja) 積層誘電体製造方法
WO2007118872A3 (de) Keramisches dielektrikum bzw. dünn- und/oder dickschichten enthaltend mindestens ein keramisches dielektrikum, herstellungsverfahren und verwendung davon
MY156297A (en) Glass for magnetic recording medium substrate, magnetic recording medium substrate and method of manufacturing the same, and magnetic recording medium
EP2357081A4 (en) LAMINATED PLASTIC SUBSTRATE AND METHOD FOR PRODUCING THE SAME
MY156178A (en) Method for producing magnetic disk, and glass substrate for information recording medium
UA107075C2 (ru) ПРОКЛАДКА ДЛЯ ОБЕСПЕЧЕНИЯ промежутка между стеклами в стеклопакетах, СТЕКЛОПАКЕТ И СПОСОБ изготовления СТЕКЛОПАКЕТОВ
WO2010083475A3 (en) Filament-strung stand-off elements for maintaining pane separation in vacuum insulating glazing units
AU2012365511B2 (en) Spacer for insulating glazing units
WO2008038013A3 (en) Insulated ductwork products
WO2011083948A3 (ko) 진공 단열 패널 및 이를 제조하는 방법
WO2014172237A3 (en) Methods of forming laminated glass structures
WO2009075173A1 (ja) 粉末及びその製造方法
BR112017027039A2 (pt) composição de fibra de vidro de alto módulo, fibra de vidro e material compósito dela
WO2009054419A1 (ja) 基板用ガラス組成物およびその製造方法
WO2009133194A3 (de) Keramischer werkstoff, verfahren zur herstellung des keramischen werkstoffs und bauelement mit dem keramischen werkstoff
WO2008066660A3 (en) Pulling roll material for manufacture of sheet glass
MX2016005193A (es) Vidrio laminado delgado.
BRPI0702179A2 (pt) composiÇço de vidro bioativo, um mÉtodo para manufaturar uma composiÇço de vidro bioativo e implante
GB1264414A (ja)
AU2003227715A1 (en) Production of ceramic, glass ceramic and other mineral materials and composite materials
WO2012115795A3 (en) Improved frit materials and/or method of making vacuum insulating glass units including the same
WO2005069962A3 (en) Antimicrobial ceramic glaze
WO2011131700A3 (de) Abstandhalter
MX2012005102A (es) Luna teniendo elemento de conexion electrica.
WO2016055524A3 (de) Glaslaminat mit erhöhter festigkeit

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 08740672

Country of ref document: EP

Kind code of ref document: A1

WWE Wipo information: entry into national phase

Ref document number: 2009511863

Country of ref document: JP

WWE Wipo information: entry into national phase

Ref document number: 1020097015835

Country of ref document: KR

NENP Non-entry into the national phase

Ref country code: DE

WWE Wipo information: entry into national phase

Ref document number: 2008740672

Country of ref document: EP