WO2008090985A1 - コンデンサ材料およびその製造方法、ならびにその材料を含むコンデンサ、配線板および電子機器 - Google Patents

コンデンサ材料およびその製造方法、ならびにその材料を含むコンデンサ、配線板および電子機器 Download PDF

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Publication number
WO2008090985A1
WO2008090985A1 PCT/JP2008/051110 JP2008051110W WO2008090985A1 WO 2008090985 A1 WO2008090985 A1 WO 2008090985A1 JP 2008051110 W JP2008051110 W JP 2008051110W WO 2008090985 A1 WO2008090985 A1 WO 2008090985A1
Authority
WO
WIPO (PCT)
Prior art keywords
capacitor
capacitor material
manufacturing
electronic device
wiring board
Prior art date
Application number
PCT/JP2008/051110
Other languages
English (en)
French (fr)
Inventor
Akihiko Shirakawa
Ryuichi Mitsumoto
Koji Tokita
Original Assignee
Showa Denko K.K.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Showa Denko K.K. filed Critical Showa Denko K.K.
Priority to JP2008555113A priority Critical patent/JP5302692B2/ja
Priority to EP08703922.8A priority patent/EP2109124B1/en
Priority to CN200880001590.2A priority patent/CN101578673B/zh
Priority to US12/374,698 priority patent/US8254082B2/en
Publication of WO2008090985A1 publication Critical patent/WO2008090985A1/ja

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/33—Thin- or thick-film capacitors 
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/018—Dielectrics
    • H01G4/06—Solid dielectrics
    • H01G4/08—Inorganic dielectrics
    • H01G4/12—Ceramic dielectrics
    • H01G4/1209—Ceramic dielectrics characterised by the ceramic dielectric material
    • H01G4/1218—Ceramic dielectrics characterised by the ceramic dielectric material based on titanium oxides or titanates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/018—Dielectrics
    • H01G4/20—Dielectrics using combinations of dielectrics from more than one of groups H01G4/02 - H01G4/06
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G9/00—Electrolytic capacitors, rectifiers, detectors, switching devices, light-sensitive or temperature-sensitive devices; Processes of their manufacture
    • H01G9/0029—Processes of manufacture
    • H01G9/0032—Processes of manufacture formation of the dielectric layer
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G9/00—Electrolytic capacitors, rectifiers, detectors, switching devices, light-sensitive or temperature-sensitive devices; Processes of their manufacture
    • H01G9/004—Details
    • H01G9/04—Electrodes or formation of dielectric layers thereon
    • H01G9/048—Electrodes or formation of dielectric layers thereon characterised by their structure
    • H01G9/052—Sintered electrodes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G9/00—Electrolytic capacitors, rectifiers, detectors, switching devices, light-sensitive or temperature-sensitive devices; Processes of their manufacture
    • H01G9/004—Details
    • H01G9/07—Dielectric layers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
    • H05K1/162—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed capacitors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/0175—Inorganic, non-metallic layer, e.g. resist or dielectric for printed capacitor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/0179—Thin film deposited insulating layer, e.g. inorganic layer for printed capacitor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0183—Dielectric layers
    • H05K2201/0195—Dielectric or adhesive layers comprising a plurality of layers, e.g. in a multilayer structure
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/03—Metal processing
    • H05K2203/0315—Oxidising metal
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/10—Methods of surface bonding and/or assembly therefor
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/26—Web or sheet containing structurally defined element or component, the element or component having a specified physical dimension
    • Y10T428/266—Web or sheet containing structurally defined element or component, the element or component having a specified physical dimension of base or substrate

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Ceramic Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Inorganic Chemistry (AREA)
  • Ceramic Capacitors (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
  • Inorganic Compounds Of Heavy Metals (AREA)

Abstract

　本発明のコンデンサ材料は、二酸化チタン層とペロブスカイト結晶を有するチタン酸化合物層とが積層されている。
PCT/JP2008/051110 2007-01-26 2008-01-25 コンデンサ材料およびその製造方法、ならびにその材料を含むコンデンサ、配線板および電子機器 WO2008090985A1 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2008555113A JP5302692B2 (ja) 2007-01-26 2008-01-25 コンデンサ材料およびその製造方法、ならびにその材料を含むコンデンサ、配線板および電子機器
EP08703922.8A EP2109124B1 (en) 2007-01-26 2008-01-25 Capacitor material, method for manufacturing the capacitor material, capacitor containing the capacitor material, wiring board and electronic device
CN200880001590.2A CN101578673B (zh) 2007-01-26 2008-01-25 电容器材料及其制造方法、含有该材料的电容器、布线板和电子设备
US12/374,698 US8254082B2 (en) 2007-01-26 2008-01-25 Capacitor material, production method of the same, and capacitor, wiring board and electronic device containing that material

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2007-016687 2007-01-26
JP2007016687 2007-01-26
US89966407P 2007-02-06 2007-02-06
US60/899,664 2007-02-06

Publications (1)

Publication Number Publication Date
WO2008090985A1 true WO2008090985A1 (ja) 2008-07-31

Family

ID=39644559

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/051110 WO2008090985A1 (ja) 2007-01-26 2008-01-25 コンデンサ材料およびその製造方法、ならびにその材料を含むコンデンサ、配線板および電子機器

Country Status (5)

Country Link
US (1) US8254082B2 (ja)
EP (1) EP2109124B1 (ja)
JP (1) JP5302692B2 (ja)
CN (1) CN101578673B (ja)
WO (1) WO2008090985A1 (ja)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPWO2008072684A1 (ja) * 2006-12-14 2010-04-02 タマティーエルオー株式会社 蓄電池
CN105699810A (zh) * 2016-02-29 2016-06-22 珠海格力电器股份有限公司 一种电解电容的在路测试装置及方法
CN112466665B (zh) * 2020-11-19 2022-06-10 嘉兴学院 一种柔性固态电介质薄膜电容器及其制备方法

Citations (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS335816B1 (ja) 1956-11-17 1958-07-31
US3126503A (en) 1964-03-24 Electrical capacitor and electrode
JPS4224103B1 (ja) 1965-01-19 1967-11-20
JPS4227011B1 (ja) 1964-10-03 1967-12-21
JPS432649B1 (ja) 1964-05-28 1968-01-30
JPS541020B1 (ja) 1968-11-05 1979-01-19
JPS60116119A (ja) * 1983-11-29 1985-06-22 ソニー株式会社 Ｔｉ金属層とＢａＴｉＯ↓３被膜よりなる複合体及びその製造方法
JPS62181415A (ja) * 1986-02-05 1987-08-08 松下電器産業株式会社 コンデンサ−
JPH05121275A (ja) 1991-10-28 1993-05-18 Sumitomo Chem Co Ltd チタン電解コンデンサの製造方法
JPH0649950B2 (ja) 1984-07-19 1994-06-29 ソニー株式会社 Ｔｉ金属層とＢａ１−ｘＳｒｘＴｉＯ３被膜よりなる複合体及びその製造方法
JPH0786075A (ja) 1993-06-30 1995-03-31 Murata Mfg Co Ltd コンデンサ
JPH1180596A (ja) 1997-09-04 1999-03-26 Central Glass Co Ltd マスキング剤及びパターン膜の形成法
JPH11172489A (ja) 1997-12-09 1999-06-29 Murata Mfg Co Ltd チタン酸バリウム被膜の製造方法
JP2000173349A (ja) * 1998-12-02 2000-06-23 Ube Ind Ltd 誘電体薄膜とその製法およびコンデンサ

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DE1955396B2 (de) 1968-11-05 1971-09-30 Elektrolytkondensator und verfahren zu seiner herstellung
JPS6024931B2 (ja) 1977-06-03 1985-06-15 コニカ株式会社 ハロゲン化銀写真感光材料
EP0146284B1 (en) 1983-11-29 1988-06-29 Sony Corporation Methods of manufacturing dielectric metal titanates
JP2660888B2 (ja) 1992-05-28 1997-10-08 新日本製鐵株式会社 コンクリート用鉄筋材およびコンクリート用鉄筋篭
JPH1131857A (ja) * 1997-07-14 1999-02-02 Tokai Rubber Ind Ltd 圧電体構造物およびその製造方法
JP3792129B2 (ja) * 2001-03-01 2006-07-05 新光電気工業株式会社 キャパシタ、キャパシタ内蔵回路基板及びそれらの製造方法
JP3578757B2 (ja) * 2001-07-04 2004-10-20 昭和電工株式会社 チタン酸バリウムおよびその製造方法
JP2003146659A (ja) * 2001-11-12 2003-05-21 Toho Titanium Co Ltd 複合チタン酸化被膜の形成方法およびチタン電解コンデンサ
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TWI290539B (en) * 2004-08-31 2007-12-01 Showa Denko Kk Barium titanate and capacitor
JP4348547B2 (ja) * 2005-04-14 2009-10-21 セイコーエプソン株式会社 ペロブスカイト型酸化物層の製造方法、強誘電体メモリの製造方法および表面波弾性波素子の製造方法

Patent Citations (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3126503A (en) 1964-03-24 Electrical capacitor and electrode
JPS335816B1 (ja) 1956-11-17 1958-07-31
JPS432649B1 (ja) 1964-05-28 1968-01-30
JPS4227011B1 (ja) 1964-10-03 1967-12-21
JPS4224103B1 (ja) 1965-01-19 1967-11-20
JPS541020B1 (ja) 1968-11-05 1979-01-19
JPS60116119A (ja) * 1983-11-29 1985-06-22 ソニー株式会社 Ｔｉ金属層とＢａＴｉＯ↓３被膜よりなる複合体及びその製造方法
JPH0649950B2 (ja) 1984-07-19 1994-06-29 ソニー株式会社 Ｔｉ金属層とＢａ１−ｘＳｒｘＴｉＯ３被膜よりなる複合体及びその製造方法
JPS62181415A (ja) * 1986-02-05 1987-08-08 松下電器産業株式会社 コンデンサ−
JPH05121275A (ja) 1991-10-28 1993-05-18 Sumitomo Chem Co Ltd チタン電解コンデンサの製造方法
JPH0786075A (ja) 1993-06-30 1995-03-31 Murata Mfg Co Ltd コンデンサ
JPH1180596A (ja) 1997-09-04 1999-03-26 Central Glass Co Ltd マスキング剤及びパターン膜の形成法
JPH11172489A (ja) 1997-12-09 1999-06-29 Murata Mfg Co Ltd チタン酸バリウム被膜の製造方法
JP2000173349A (ja) * 1998-12-02 2000-06-23 Ube Ind Ltd 誘電体薄膜とその製法およびコンデンサ

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* Cited by examiner, † Cited by third party
Title
"Phase Diagrams for Electronic Ceramics I: Dielectric Ti, Nb and Ta Oxide Systems", THE AMERICAN CERAMIC SOCIETY, pages: 4 - 8
See also references of EP2109124A4

Also Published As

Publication number Publication date
CN101578673B (zh) 2013-03-20
EP2109124A1 (en) 2009-10-14
EP2109124B1 (en) 2017-03-29
US20100014271A1 (en) 2010-01-21
JPWO2008090985A1 (ja) 2010-05-20
CN101578673A (zh) 2009-11-11
JP5302692B2 (ja) 2013-10-02
US8254082B2 (en) 2012-08-28
EP2109124A4 (en) 2013-04-03

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