WO2007004184A1 - Solid thermally expansible material - Google Patents
Solid thermally expansible material Download PDFInfo
- Publication number
- WO2007004184A1 WO2007004184A1 PCT/IB2006/052218 IB2006052218W WO2007004184A1 WO 2007004184 A1 WO2007004184 A1 WO 2007004184A1 IB 2006052218 W IB2006052218 W IB 2006052218W WO 2007004184 A1 WO2007004184 A1 WO 2007004184A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- epoxy resin
- solid
- impact modifier
- substrate
- thermally expansible
- Prior art date
Links
- 239000000463 material Substances 0.000 title claims abstract description 155
- 239000007787 solid Substances 0.000 title claims abstract description 94
- 239000003822 epoxy resin Substances 0.000 claims abstract description 46
- 229920000647 polyepoxide Polymers 0.000 claims abstract description 46
- 239000004609 Impact Modifier Substances 0.000 claims abstract description 39
- 239000000758 substrate Substances 0.000 claims abstract description 21
- 229920001971 elastomer Polymers 0.000 claims abstract description 18
- 239000005060 rubber Substances 0.000 claims abstract description 18
- 230000002787 reinforcement Effects 0.000 claims abstract description 15
- 238000000034 method Methods 0.000 claims abstract description 14
- 239000003795 chemical substances by application Substances 0.000 claims abstract description 13
- 239000004088 foaming agent Substances 0.000 claims abstract description 13
- 230000004913 activation Effects 0.000 claims abstract description 12
- 239000004850 liquid epoxy resins (LERs) Substances 0.000 claims abstract description 11
- 230000003014 reinforcing effect Effects 0.000 claims abstract 2
- 230000009477 glass transition Effects 0.000 claims description 9
- 239000004760 aramid Substances 0.000 claims description 6
- 229920006231 aramid fiber Polymers 0.000 claims description 5
- 229910052751 metal Inorganic materials 0.000 claims description 5
- 239000002184 metal Substances 0.000 claims description 5
- 238000010438 heat treatment Methods 0.000 claims description 4
- QGBSISYHAICWAH-UHFFFAOYSA-N dicyandiamide Chemical group NC(N)=NC#N QGBSISYHAICWAH-UHFFFAOYSA-N 0.000 claims description 2
- 239000012815 thermoplastic material Substances 0.000 claims 1
- 239000000945 filler Substances 0.000 description 18
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 15
- 239000000203 mixture Substances 0.000 description 11
- 239000000126 substance Substances 0.000 description 11
- 239000004848 polyfunctional curative Substances 0.000 description 8
- 229920001169 thermoplastic Polymers 0.000 description 8
- 239000004416 thermosoftening plastic Substances 0.000 description 8
- 239000013008 thixotropic agent Substances 0.000 description 8
- 125000003700 epoxy group Chemical group 0.000 description 7
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 6
- 239000000835 fiber Substances 0.000 description 6
- 238000009472 formulation Methods 0.000 description 6
- -1 poly-p-phenylene ether Chemical compound 0.000 description 6
- 229920005989 resin Polymers 0.000 description 6
- 239000011347 resin Substances 0.000 description 6
- 239000004604 Blowing Agent Substances 0.000 description 5
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 5
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 5
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 5
- 150000002460 imidazoles Chemical class 0.000 description 5
- 238000001746 injection moulding Methods 0.000 description 5
- 239000007788 liquid Substances 0.000 description 5
- KUBDPQJOLOUJRM-UHFFFAOYSA-N 2-(chloromethyl)oxirane;4-[2-(4-hydroxyphenyl)propan-2-yl]phenol Chemical compound ClCC1CO1.C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 KUBDPQJOLOUJRM-UHFFFAOYSA-N 0.000 description 4
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 description 4
- 229910052799 carbon Inorganic materials 0.000 description 4
- 239000011258 core-shell material Substances 0.000 description 4
- 239000005038 ethylene vinyl acetate Substances 0.000 description 4
- 125000000524 functional group Chemical group 0.000 description 4
- 238000005259 measurement Methods 0.000 description 4
- 239000004005 microsphere Substances 0.000 description 4
- 229920003052 natural elastomer Polymers 0.000 description 4
- 229920001194 natural rubber Polymers 0.000 description 4
- 150000002989 phenols Chemical class 0.000 description 4
- 239000004033 plastic Substances 0.000 description 4
- 229920003023 plastic Polymers 0.000 description 4
- 229920001200 poly(ethylene-vinyl acetate) Polymers 0.000 description 4
- 230000008569 process Effects 0.000 description 4
- 150000003672 ureas Chemical class 0.000 description 4
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 4
- 229920003319 Araldite® Polymers 0.000 description 3
- 239000004593 Epoxy Substances 0.000 description 3
- 229920009204 Methacrylate-butadiene-styrene Polymers 0.000 description 3
- ZMANZCXQSJIPKH-UHFFFAOYSA-N Triethylamine Chemical compound CCN(CC)CC ZMANZCXQSJIPKH-UHFFFAOYSA-N 0.000 description 3
- 239000000654 additive Substances 0.000 description 3
- 235000013877 carbamide Nutrition 0.000 description 3
- 239000000919 ceramic Substances 0.000 description 3
- 238000006243 chemical reaction Methods 0.000 description 3
- 239000004615 ingredient Substances 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 229920003051 synthetic elastomer Polymers 0.000 description 3
- 239000005061 synthetic rubber Substances 0.000 description 3
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 description 2
- 239000004215 Carbon black (E152) Substances 0.000 description 2
- 229920002943 EPDM rubber Polymers 0.000 description 2
- 239000005062 Polybutadiene Substances 0.000 description 2
- JUJWROOIHBZHMG-UHFFFAOYSA-N Pyridine Chemical compound C1=CC=NC=C1 JUJWROOIHBZHMG-UHFFFAOYSA-N 0.000 description 2
- 238000010521 absorption reaction Methods 0.000 description 2
- 150000001412 amines Chemical class 0.000 description 2
- 230000008901 benefit Effects 0.000 description 2
- WGQKYBSKWIADBV-UHFFFAOYSA-N benzylamine Chemical compound NCC1=CC=CC=C1 WGQKYBSKWIADBV-UHFFFAOYSA-N 0.000 description 2
- 229910052796 boron Inorganic materials 0.000 description 2
- DQXBYHZEEUGOBF-UHFFFAOYSA-N but-3-enoic acid;ethene Chemical compound C=C.OC(=O)CC=C DQXBYHZEEUGOBF-UHFFFAOYSA-N 0.000 description 2
- HQABUPZFAYXKJW-UHFFFAOYSA-N butan-1-amine Chemical compound CCCCN HQABUPZFAYXKJW-UHFFFAOYSA-N 0.000 description 2
- 150000001875 compounds Chemical class 0.000 description 2
- 238000004132 cross linking Methods 0.000 description 2
- GUJOJGAPFQRJSV-UHFFFAOYSA-N dialuminum;dioxosilane;oxygen(2-);hydrate Chemical class O.[O-2].[O-2].[O-2].[Al+3].[Al+3].O=[Si]=O.O=[Si]=O.O=[Si]=O.O=[Si]=O GUJOJGAPFQRJSV-UHFFFAOYSA-N 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 229920006245 ethylene-butyl acrylate Polymers 0.000 description 2
- 230000001747 exhibiting effect Effects 0.000 description 2
- 230000002349 favourable effect Effects 0.000 description 2
- 239000012765 fibrous filler Substances 0.000 description 2
- 229910021485 fumed silica Inorganic materials 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- VOZRXNHHFUQHIL-UHFFFAOYSA-N glycidyl methacrylate Chemical compound CC(=C)C(=O)OCC1CO1 VOZRXNHHFUQHIL-UHFFFAOYSA-N 0.000 description 2
- LEQAOMBKQFMDFZ-UHFFFAOYSA-N glyoxal Chemical compound O=CC=O LEQAOMBKQFMDFZ-UHFFFAOYSA-N 0.000 description 2
- 229930195733 hydrocarbon Natural products 0.000 description 2
- 150000002430 hydrocarbons Chemical class 0.000 description 2
- NNPPMTNAJDCUHE-UHFFFAOYSA-N isobutane Chemical compound CC(C)C NNPPMTNAJDCUHE-UHFFFAOYSA-N 0.000 description 2
- QWTDNUCVQCZILF-UHFFFAOYSA-N isopentane Chemical compound CCC(C)C QWTDNUCVQCZILF-UHFFFAOYSA-N 0.000 description 2
- 238000002156 mixing Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 239000002105 nanoparticle Substances 0.000 description 2
- 229920003986 novolac Polymers 0.000 description 2
- 238000005191 phase separation Methods 0.000 description 2
- 229910052615 phyllosilicate Inorganic materials 0.000 description 2
- 229920002857 polybutadiene Polymers 0.000 description 2
- 229920000642 polymer Polymers 0.000 description 2
- 229940088417 precipitated calcium carbonate Drugs 0.000 description 2
- GHMLBKRAJCXXBS-UHFFFAOYSA-N resorcinol Chemical compound OC1=CC=CC(O)=C1 GHMLBKRAJCXXBS-UHFFFAOYSA-N 0.000 description 2
- 150000004756 silanes Chemical class 0.000 description 2
- 229920003048 styrene butadiene rubber Polymers 0.000 description 2
- ARCGXLSVLAOJQL-UHFFFAOYSA-N trimellitic acid Chemical compound OC(=O)C1=CC=C(C(O)=O)C(C(O)=O)=C1 ARCGXLSVLAOJQL-UHFFFAOYSA-N 0.000 description 2
- OUPZKGBUJRBPGC-UHFFFAOYSA-N 1,3,5-tris(oxiran-2-ylmethyl)-1,3,5-triazinane-2,4,6-trione Chemical compound O=C1N(CC2OC2)C(=O)N(CC2OC2)C(=O)N1CC1CO1 OUPZKGBUJRBPGC-UHFFFAOYSA-N 0.000 description 1
- ZWOULFZCQXICLZ-UHFFFAOYSA-N 1,3-dimethyl-1-phenylurea Chemical compound CNC(=O)N(C)C1=CC=CC=C1 ZWOULFZCQXICLZ-UHFFFAOYSA-N 0.000 description 1
- XZTUYISAOWDOSC-UHFFFAOYSA-N 1-(4-chlorophenyl)-1,3-dimethylurea Chemical compound CNC(=O)N(C)C1=CC=C(Cl)C=C1 XZTUYISAOWDOSC-UHFFFAOYSA-N 0.000 description 1
- HZAXFHJVJLSVMW-UHFFFAOYSA-N 2-Aminoethan-1-ol Chemical compound NCCO HZAXFHJVJLSVMW-UHFFFAOYSA-N 0.000 description 1
- HDDQXUDCEIMISH-UHFFFAOYSA-N 2-[[4-[1,2,2-tris[4-(oxiran-2-ylmethoxy)phenyl]ethyl]phenoxy]methyl]oxirane Chemical compound C1OC1COC(C=C1)=CC=C1C(C=1C=CC(OCC2OC2)=CC=1)C(C=1C=CC(OCC2OC2)=CC=1)C(C=C1)=CC=C1OCC1CO1 HDDQXUDCEIMISH-UHFFFAOYSA-N 0.000 description 1
- LJBWJFWNFUKAGS-UHFFFAOYSA-N 2-[bis(2-hydroxyphenyl)methyl]phenol Chemical compound OC1=CC=CC=C1C(C=1C(=CC=CC=1)O)C1=CC=CC=C1O LJBWJFWNFUKAGS-UHFFFAOYSA-N 0.000 description 1
- OJPDDQSCZGTACX-UHFFFAOYSA-N 2-[n-(2-hydroxyethyl)anilino]ethanol Chemical compound OCCN(CCO)C1=CC=CC=C1 OJPDDQSCZGTACX-UHFFFAOYSA-N 0.000 description 1
- YTWBFUCJVWKCCK-UHFFFAOYSA-N 2-heptadecyl-1h-imidazole Chemical compound CCCCCCCCCCCCCCCCCC1=NC=CN1 YTWBFUCJVWKCCK-UHFFFAOYSA-N 0.000 description 1
- LXBGSDVWAMZHDD-UHFFFAOYSA-N 2-methyl-1h-imidazole Chemical compound CC1=NC=CN1 LXBGSDVWAMZHDD-UHFFFAOYSA-N 0.000 description 1
- ZCUJYXPAKHMBAZ-UHFFFAOYSA-N 2-phenyl-1h-imidazole Chemical compound C1=CNC(C=2C=CC=CC=2)=N1 ZCUJYXPAKHMBAZ-UHFFFAOYSA-N 0.000 description 1
- FUOZJYASZOSONT-UHFFFAOYSA-N 2-propan-2-yl-1h-imidazole Chemical compound CC(C)C1=NC=CN1 FUOZJYASZOSONT-UHFFFAOYSA-N 0.000 description 1
- LJGHYPLBDBRCRZ-UHFFFAOYSA-N 3-(3-aminophenyl)sulfonylaniline Chemical compound NC1=CC=CC(S(=O)(=O)C=2C=C(N)C=CC=2)=C1 LJGHYPLBDBRCRZ-UHFFFAOYSA-N 0.000 description 1
- NBOCQTNZUPTTEI-UHFFFAOYSA-N 4-[4-(hydrazinesulfonyl)phenoxy]benzenesulfonohydrazide Chemical class C1=CC(S(=O)(=O)NN)=CC=C1OC1=CC=C(S(=O)(=O)NN)C=C1 NBOCQTNZUPTTEI-UHFFFAOYSA-N 0.000 description 1
- TYOXIFXYEIILLY-UHFFFAOYSA-N 5-methyl-2-phenyl-1h-imidazole Chemical compound N1C(C)=CN=C1C1=CC=CC=C1 TYOXIFXYEIILLY-UHFFFAOYSA-N 0.000 description 1
- MARUHZGHZWCEQU-UHFFFAOYSA-N 5-phenyl-2h-tetrazole Chemical class C1=CC=CC=C1C1=NNN=N1 MARUHZGHZWCEQU-UHFFFAOYSA-N 0.000 description 1
- MKALOVJHPRAZRE-UHFFFAOYSA-N 5-phenylpenta-2,4-dienoic acid;prop-2-enoic acid Chemical compound OC(=O)C=C.OC(=O)C=CC=CC1=CC=CC=C1 MKALOVJHPRAZRE-UHFFFAOYSA-N 0.000 description 1
- 239000004156 Azodicarbonamide Substances 0.000 description 1
- LCFVJGUPQDGYKZ-UHFFFAOYSA-N Bisphenol A diglycidyl ether Chemical compound C=1C=C(OCC2OC2)C=CC=1C(C)(C)C(C=C1)=CC=C1OCC1CO1 LCFVJGUPQDGYKZ-UHFFFAOYSA-N 0.000 description 1
- PUNIDMUCDALJAS-UHFFFAOYSA-N C(C1=CC=C(C=C1)N(C(=O)NC)C)C1=CC=C(C=C1)N(C(=O)NC)C Chemical compound C(C1=CC=C(C=C1)N(C(=O)NC)C)C1=CC=C(C=C1)N(C(=O)NC)C PUNIDMUCDALJAS-UHFFFAOYSA-N 0.000 description 1
- 244000025254 Cannabis sativa Species 0.000 description 1
- 235000012766 Cannabis sativa ssp. sativa var. sativa Nutrition 0.000 description 1
- 235000012765 Cannabis sativa ssp. sativa var. spontanea Nutrition 0.000 description 1
- 229920000049 Carbon (fiber) Polymers 0.000 description 1
- 240000000491 Corchorus aestuans Species 0.000 description 1
- 235000011777 Corchorus aestuans Nutrition 0.000 description 1
- 235000010862 Corchorus capsularis Nutrition 0.000 description 1
- MQJKPEGWNLWLTK-UHFFFAOYSA-N Dapsone Chemical compound C1=CC(N)=CC=C1S(=O)(=O)C1=CC=C(N)C=C1 MQJKPEGWNLWLTK-UHFFFAOYSA-N 0.000 description 1
- MWRWFPQBGSZWNV-UHFFFAOYSA-N Dinitrosopentamethylenetetramine Chemical class C1N2CN(N=O)CN1CN(N=O)C2 MWRWFPQBGSZWNV-UHFFFAOYSA-N 0.000 description 1
- 244000043261 Hevea brasiliensis Species 0.000 description 1
- 229920013646 Hycar Polymers 0.000 description 1
- 229920000271 Kevlar® Polymers 0.000 description 1
- MGJKQDOBUOMPEZ-UHFFFAOYSA-N N,N'-dimethylurea Chemical compound CNC(=O)NC MGJKQDOBUOMPEZ-UHFFFAOYSA-N 0.000 description 1
- YJLYANLCNIKXMG-UHFFFAOYSA-N N-Methyldioctylamine Chemical compound CCCCCCCCN(C)CCCCCCCC YJLYANLCNIKXMG-UHFFFAOYSA-N 0.000 description 1
- 229920000459 Nitrile rubber Polymers 0.000 description 1
- 240000000220 Panda oleosa Species 0.000 description 1
- 235000016496 Panda oleosa Nutrition 0.000 description 1
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 1
- 239000004952 Polyamide Substances 0.000 description 1
- 239000004721 Polyphenylene oxide Substances 0.000 description 1
- 229920004482 WACKER® Polymers 0.000 description 1
- VRFNYSYURHAPFL-UHFFFAOYSA-N [(4-methylphenyl)sulfonylamino]urea Chemical class CC1=CC=C(S(=O)(=O)NNC(N)=O)C=C1 VRFNYSYURHAPFL-UHFFFAOYSA-N 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 150000007513 acids Chemical class 0.000 description 1
- 150000001252 acrylic acid derivatives Chemical class 0.000 description 1
- 239000012190 activator Substances 0.000 description 1
- 230000000996 additive effect Effects 0.000 description 1
- 239000002318 adhesion promoter Substances 0.000 description 1
- 238000013019 agitation Methods 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 150000008064 anhydrides Chemical class 0.000 description 1
- 239000003963 antioxidant agent Substances 0.000 description 1
- 150000004984 aromatic diamines Chemical class 0.000 description 1
- 229920003235 aromatic polyamide Polymers 0.000 description 1
- XOZUGNYVDXMRKW-AATRIKPKSA-N azodicarbonamide Chemical compound NC(=O)\N=N\C(N)=O XOZUGNYVDXMRKW-AATRIKPKSA-N 0.000 description 1
- 235000019399 azodicarbonamide Nutrition 0.000 description 1
- 239000000440 bentonite Substances 0.000 description 1
- 229910000278 bentonite Inorganic materials 0.000 description 1
- SVPXDRXYRYOSEX-UHFFFAOYSA-N bentoquatam Chemical compound O.O=[Si]=O.O=[Al]O[Al]=O SVPXDRXYRYOSEX-UHFFFAOYSA-N 0.000 description 1
- VJRITMATACIYAF-UHFFFAOYSA-N benzenesulfonohydrazide Chemical class NNS(=O)(=O)C1=CC=CC=C1 VJRITMATACIYAF-UHFFFAOYSA-N 0.000 description 1
- NEPKLUNSRVEBIX-UHFFFAOYSA-N bis(oxiran-2-ylmethyl) benzene-1,4-dicarboxylate Chemical compound C=1C=C(C(=O)OCC2OC2)C=CC=1C(=O)OCC1CO1 NEPKLUNSRVEBIX-UHFFFAOYSA-N 0.000 description 1
- 238000009835 boiling Methods 0.000 description 1
- LKAVYBZHOYOUSX-UHFFFAOYSA-N buta-1,3-diene;2-methylprop-2-enoic acid;styrene Chemical compound C=CC=C.CC(=C)C(O)=O.C=CC1=CC=CC=C1 LKAVYBZHOYOUSX-UHFFFAOYSA-N 0.000 description 1
- QYMGIIIPAFAFRX-UHFFFAOYSA-N butyl prop-2-enoate;ethene Chemical compound C=C.CCCCOC(=O)C=C QYMGIIIPAFAFRX-UHFFFAOYSA-N 0.000 description 1
- 229910000019 calcium carbonate Inorganic materials 0.000 description 1
- BRPQOXSCLDDYGP-UHFFFAOYSA-N calcium oxide Chemical compound [O-2].[Ca+2] BRPQOXSCLDDYGP-UHFFFAOYSA-N 0.000 description 1
- 239000000292 calcium oxide Substances 0.000 description 1
- ODINCKMPIJJUCX-UHFFFAOYSA-N calcium oxide Inorganic materials [Ca]=O ODINCKMPIJJUCX-UHFFFAOYSA-N 0.000 description 1
- 235000009120 camo Nutrition 0.000 description 1
- 239000004917 carbon fiber Substances 0.000 description 1
- 239000002041 carbon nanotube Substances 0.000 description 1
- 229910021393 carbon nanotube Inorganic materials 0.000 description 1
- 230000015556 catabolic process Effects 0.000 description 1
- 239000003054 catalyst Substances 0.000 description 1
- 230000003197 catalytic effect Effects 0.000 description 1
- 235000005607 chanvre indien Nutrition 0.000 description 1
- 239000013043 chemical agent Substances 0.000 description 1
- 239000004927 clay Substances 0.000 description 1
- 239000003086 colorant Substances 0.000 description 1
- 238000013329 compounding Methods 0.000 description 1
- 238000006731 degradation reaction Methods 0.000 description 1
- HPNMFZURTQLUMO-UHFFFAOYSA-N diethylamine Chemical compound CCNCC HPNMFZURTQLUMO-UHFFFAOYSA-N 0.000 description 1
- AFABGHUZZDYHJO-UHFFFAOYSA-N dimethyl butane Natural products CCCC(C)C AFABGHUZZDYHJO-UHFFFAOYSA-N 0.000 description 1
- XXBDWLFCJWSEKW-UHFFFAOYSA-N dimethylbenzylamine Chemical compound CN(C)CC1=CC=CC=C1 XXBDWLFCJWSEKW-UHFFFAOYSA-N 0.000 description 1
- CZZYITDELCSZES-UHFFFAOYSA-N diphenylmethane Chemical compound C=1C=CC=CC=1CC1=CC=CC=C1 CZZYITDELCSZES-UHFFFAOYSA-N 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- 150000002148 esters Chemical class 0.000 description 1
- HQQADJVZYDDRJT-UHFFFAOYSA-N ethene;prop-1-ene Chemical group C=C.CC=C HQQADJVZYDDRJT-UHFFFAOYSA-N 0.000 description 1
- 238000001125 extrusion Methods 0.000 description 1
- 238000005187 foaming Methods 0.000 description 1
- 239000002828 fuel tank Substances 0.000 description 1
- 239000003365 glass fiber Substances 0.000 description 1
- 229940015043 glyoxal Drugs 0.000 description 1
- 239000010439 graphite Substances 0.000 description 1
- 229910002804 graphite Inorganic materials 0.000 description 1
- 150000002357 guanidines Chemical class 0.000 description 1
- 239000011487 hemp Substances 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 238000012690 ionic polymerization Methods 0.000 description 1
- 230000001788 irregular Effects 0.000 description 1
- 239000001282 iso-butane Substances 0.000 description 1
- 239000012948 isocyanate Substances 0.000 description 1
- 150000002513 isocyanates Chemical class 0.000 description 1
- 239000004761 kevlar Substances 0.000 description 1
- 229940094522 laponite Drugs 0.000 description 1
- XCOBTUNSZUJCDH-UHFFFAOYSA-B lithium magnesium sodium silicate Chemical compound [Li+].[Li+].[OH-].[OH-].[OH-].[OH-].[OH-].[OH-].[OH-].[OH-].[OH-].[OH-].[OH-].[OH-].[Na+].[Na+].[Mg+2].[Mg+2].[Mg+2].[Mg+2].[Mg+2].[Mg+2].[Mg+2].[Mg+2].[Mg+2].[Mg+2].[Mg+2].[Mg+2].[Mg+2].[Mg+2].[Mg+2].[Mg+2].O1[Si](O2)([O-])O[Si]3([O-])O[Si]1([O-])O[Si]2([O-])O3.O1[Si](O2)([O-])O[Si]3([O-])O[Si]1([O-])O[Si]2([O-])O3.O1[Si](O2)([O-])O[Si]3([O-])O[Si]1([O-])O[Si]2([O-])O3.O1[Si](O2)([O-])O[Si]3([O-])O[Si]1([O-])O[Si]2([O-])O3.O1[Si](O2)([O-])O[Si]3([O-])O[Si]1([O-])O[Si]2([O-])O3.O1[Si](O2)([O-])O[Si]3([O-])O[Si]1([O-])O[Si]2([O-])O3 XCOBTUNSZUJCDH-UHFFFAOYSA-B 0.000 description 1
- FPYJFEHAWHCUMM-UHFFFAOYSA-N maleic anhydride Chemical compound O=C1OC(=O)C=C1 FPYJFEHAWHCUMM-UHFFFAOYSA-N 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 description 1
- 239000010445 mica Substances 0.000 description 1
- 229910052618 mica group Inorganic materials 0.000 description 1
- 230000005012 migration Effects 0.000 description 1
- 238000013508 migration Methods 0.000 description 1
- 239000012764 mineral filler Substances 0.000 description 1
- 229910052901 montmorillonite Inorganic materials 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 239000012766 organic filler Substances 0.000 description 1
- 150000002924 oxiranes Chemical class 0.000 description 1
- 238000012856 packing Methods 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 239000008188 pellet Substances 0.000 description 1
- 239000004014 plasticizer Substances 0.000 description 1
- 229920002647 polyamide Polymers 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 229920000570 polyether Polymers 0.000 description 1
- 229920005862 polyol Polymers 0.000 description 1
- 150000003077 polyols Chemical class 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- 229920002635 polyurethane Polymers 0.000 description 1
- 239000004814 polyurethane Substances 0.000 description 1
- 230000002028 premature Effects 0.000 description 1
- 125000002924 primary amino group Chemical group [H]N([H])* 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- UMJSCPRVCHMLSP-UHFFFAOYSA-N pyridine Natural products COC1=CC=CN=C1 UMJSCPRVCHMLSP-UHFFFAOYSA-N 0.000 description 1
- 150000003856 quaternary ammonium compounds Chemical class 0.000 description 1
- 230000001105 regulatory effect Effects 0.000 description 1
- 238000007142 ring opening reaction Methods 0.000 description 1
- 239000004576 sand Substances 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- FZHAPNGMFPVSLP-UHFFFAOYSA-N silanamine Chemical class [SiH3]N FZHAPNGMFPVSLP-UHFFFAOYSA-N 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 239000011343 solid material Substances 0.000 description 1
- 235000012424 soybean oil Nutrition 0.000 description 1
- 239000003549 soybean oil Substances 0.000 description 1
- 239000003381 stabilizer Substances 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- 238000004381 surface treatment Methods 0.000 description 1
- 239000000454 talc Substances 0.000 description 1
- 229910052623 talc Inorganic materials 0.000 description 1
- 229920001897 terpolymer Polymers 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
- 229920002725 thermoplastic elastomer Polymers 0.000 description 1
- 229920005992 thermoplastic resin Polymers 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
- 239000004634 thermosetting polymer Substances 0.000 description 1
- 230000009974 thixotropic effect Effects 0.000 description 1
- YXFVVABEGXRONW-UHFFFAOYSA-N toluene Substances CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 1
- 239000012745 toughening agent Substances 0.000 description 1
- 229920000428 triblock copolymer Polymers 0.000 description 1
- FAQYAMRNWDIXMY-UHFFFAOYSA-N trichloroborane Chemical class ClB(Cl)Cl FAQYAMRNWDIXMY-UHFFFAOYSA-N 0.000 description 1
- 239000001993 wax Substances 0.000 description 1
- 239000000080 wetting agent Substances 0.000 description 1
- 239000010456 wollastonite Substances 0.000 description 1
- 229910052882 wollastonite Inorganic materials 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J9/00—Working-up of macromolecular substances to porous or cellular articles or materials; After-treatment thereof
- C08J9/04—Working-up of macromolecular substances to porous or cellular articles or materials; After-treatment thereof using blowing gases generated by a previously added blowing agent
- C08J9/06—Working-up of macromolecular substances to porous or cellular articles or materials; After-treatment thereof using blowing gases generated by a previously added blowing agent by a chemical blowing agent
- C08J9/10—Working-up of macromolecular substances to porous or cellular articles or materials; After-treatment thereof using blowing gases generated by a previously added blowing agent by a chemical blowing agent developing nitrogen, the blowing agent being a compound containing a nitrogen-to-nitrogen bond
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B62—LAND VEHICLES FOR TRAVELLING OTHERWISE THAN ON RAILS
- B62D—MOTOR VEHICLES; TRAILERS
- B62D29/00—Superstructures, understructures, or sub-units thereof, characterised by the material thereof
- B62D29/001—Superstructures, understructures, or sub-units thereof, characterised by the material thereof characterised by combining metal and synthetic material
- B62D29/002—Superstructures, understructures, or sub-units thereof, characterised by the material thereof characterised by combining metal and synthetic material a foamable synthetic material or metal being added in situ
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
- C08G59/22—Di-epoxy compounds
- C08G59/24—Di-epoxy compounds carbocyclic
- C08G59/245—Di-epoxy compounds carbocyclic aromatic
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/4007—Curing agents not provided for by the groups C08G59/42 - C08G59/66
- C08G59/4014—Nitrogen containing compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J9/00—Working-up of macromolecular substances to porous or cellular articles or materials; After-treatment thereof
- C08J9/0061—Working-up of macromolecular substances to porous or cellular articles or materials; After-treatment thereof characterized by the use of several polymeric components
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J9/00—Working-up of macromolecular substances to porous or cellular articles or materials; After-treatment thereof
- C08J9/0085—Use of fibrous compounding ingredients
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J9/00—Working-up of macromolecular substances to porous or cellular articles or materials; After-treatment thereof
- C08J9/32—Working-up of macromolecular substances to porous or cellular articles or materials; After-treatment thereof from compositions containing microballoons, e.g. syntactic foams
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2203/00—Foams characterized by the expanding agent
- C08J2203/22—Expandable microspheres, e.g. Expancel®
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2207/00—Foams characterised by their intended use
- C08J2207/02—Adhesive
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2363/00—Characterised by the use of epoxy resins; Derivatives of epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2421/00—Characterised by the use of unspecified rubbers
Definitions
- Thermally expansible materials have long been used in the automotive industry and in several other industries. Thermally expansible materials are used for sound- deadening (baffling) purposes and for structural reinforcement purposes. For example, certain expansible materials can be molded onto a carrier and placed into an automotive cavity such as a pillar. Then, the expansible materials can be heated to an activation temperature. When the material is activated, it expands. Upon expansion, the material adheres to at least part of the automotive cavity, effectively sealing the cavity. Following expansion, the material is cured. The cured material has a sound-deadening or baffling effect.
- certain expandable materials can provide structural reinforcement to surfaces, including surfaces in automobiles.
- an expansible material (by itself or together with a carrier) can be disposed on, adjacent or near a substrate such as a plastic surface or a metal surface in an automotive structure such as a frame rail. The material is then heated to an activation temperature. When the material is activated, it expands. Upon expansion, the material adheres to at least a portion of the substrate. Following expansion, the material is cured. The cured material provides structural reinforcement for the substrate. That is, the substrate is less easily bent, twisted, crinkled and the like due to the presence of the cured material.
- thermally expansible materials used for reinforcement purposes. It is favorable for a thermally expansible material, in its uncured state, to be of a consistency that is easy to process using existing manufacturing equipment and to have a surface that is substantially tack free for ease of handling. It is favorable for an uncured expansible material to avoid premature curing and/or other degradation that could result from exposure to a high humidity, high temperature en- vironment.
- a thermally expansible material in its cured state, should substantially maintain its mechanical properties across a temperature range of from about -40°C to about 80°C.
- a mechanical property is substantially maintained if it is of the magnitude x at its highest point in that temperature range and is about 0.8x at its lowest point in that temperature range.
- a cured material should have a glass transition temperature of at least about 90°C or higher. Other desired glass transition temperatures for cured materials are at least about 95°C, at least about 100°C, and at least about 105°C. Disclosure of Invention
- a solid thermally expansible material is provided to satisfy one or more of the desired traits for thermally expansible reinforcement materials.
- a solid thermally expansible material comprises a solid epoxy resin (and is substantially free of liquid epoxy resin and semi-solid epoxy resin), an impact modifier and a curing agent.
- the uncured expansible material has an outer surface that is substantially tack free in at least temperatures ranging from about 0°C to about 40°C, and can remain substantially tack free at temperatures nearing 50°C because there is substantially no presence of a liquid epoxy resin or a semi-solid epoxy resin sufficient to migrate to the outer surface of the material to cause such tack.
- the uncured solid thermally expansible material is not brittle.
- the uncured material is surprisingly easy to process using common manufacturing equipment, even in the absence or substantial absence of liquid epoxy resin and semi-solid epoxy resin.
- An embodiment of the solid thermally expansible material comprises an impact modifier that is substantially free of natural or synthetic rubber.
- the impact modifier comprises one or more thermoplastic chemicals that include functional groups to react with the epoxy groups of the epoxy resin to increase the over-all stability of the expansible material.
- the solid thermally expansible material in this embodiment is unexpectedly stable, exhibiting little to no phase separation between the epoxy resin and the one or more thermoplastic impact modifiers. This impact modifier brings a surprising degree of processibility to the solid thermally expansible material, given the absence or substantial absence of rubber, liquid epoxy resin, or semi-solid epoxy resin.
- the glass transition temperature of the cured material in this embodiment is at least about 100°C, and can be at least about 105°C or at least about 110°C.
- An embodiment of the solid thermally expansible material comprises an impact modifier that comprises natural or synthetic rubber. This embodiment can additionally include one or more thermoplastic compounds, which include functional groups to increase the over-all stability of the expansible material.
- the rubber in this embodiment provides additional processibility to the solid material, while permitting the glass transition temperature of the cured material to be at least about 90°C, and can be at least about 95°C.
- An embodiment of the solid thermally expansible material includes a moisture release control system comprising aramid fibers. It is difficult to fully resist or avoid all absorption of water into uncured thermally expansible materials during transport and storage in high temperature / high humidity environments. This embodiment complements efforts to avoid water absorption by regulating how water is released from the uncured material during heating/expansion. The presence of too much water in uncured expansible material is undesirable because it can cause damage to the expansible materials during expansion. This is because the heat during expansion causes violent bursts of steam through the foaming material, which results in irregular, non-uniform cell structure in the cured material. Surprisingly, it has been found that aramid fibers form a mesh-like physical screen that regulates the release of steam during expansion. This regulation reduces or minimizes the violent bursts of steam. Although aramid fibers have been disclosed in thermally expansible materials as thixotropic agents, they have not been disclosed for this new use.
- FIG. 1 is a perspective view of an automotive body.
- Fig. 2 is a cut-away view of a rail from the automotive body showing uncured expansible material disposed in the rail.
- FIG. 3 is a cut-away view of the rail showing cured material disposed in the rail.
- FIG. 4 is a perspective view of a carrier with a solid thermally expansible material disposed thereon.
- FIG. 5 is a perspective view of a carrier with a solid thermally expansible material disposed thereon.
- Figures 1-5 show one of many possible applications for the solid thermally expansible materials described herein. Figures 1-5 are not intended to limit the claimed invention to the automotive industry, or to any particular application within the automotive industry.
- automobile 2 is shown identifying many (but not all) parts that can be reinforced with a solid thermally expansible material. Potentially rein- forceable structures on automobile 2 include but are not limited to A-pillar 4, rocker 6, child restraint reinforcer 10, rails 12, cross-member 14, fuel tank sealer 16, cowl 18, bumper 20, B-pillar 22, and door/liftgate 24.
- Figures 2 and 3 show a cutaway of rocker 6.
- a solid thermally expansible material 8 in its uncured state is disposed in rocker 6.
- the material 8 is cured.
- Figure 3 shows the cured material partially filling a cavity, it is also contemplated that the cured material could seal or substantially seal the cavity.
- carrier 26 (which can be metal or plastic) has uncured material 8 disposed thereon (via injection molding or any other technique). Together, carrier 26 and material 8 form an automotive part 28. Part 28 can be inserted into an automotive cavity, then upon heating to an activation temperature, material 8 expands and cures such that material 8 adheres to a substrate in the automotive cavity to provide reinforcement.
- an alternative carrier 30 (which can be metal or plastic) has uncured material 8 disposed thereon (via injection molding or any other technique). Together, carrier 30 and material 8 form an automotive part 32. Part 32 can be inserted into an automotive cavity, then upon heating to an activation temperature, material 8 expands and cures such that material 8 adheres to a substrate in the automotive cavity to provide reinforcement.
- Figures 1-5 show just one way, of many contemplated ways, that solid thermally expansible material 8 can be used to reinforce a substrate in an automobile or other structure.
- material 8 could be disposed on a carrier by molding or some other method. Then, the carrier could then be inserted into and optionally secured within rail 6, then cured. Additionally, material 8, whether or not on a carrier, could be used to reinforce any substrate in automobile 2.
- ⁇ poxy resins' refer to a large range of chemicals containing multiple epoxy groups.
- Epoxy resins are well-known in the art and are described in the chapter entitled ⁇ poxy Resins' in the Second Edition of the Encyclopedia of Polymer Science and Engineering, Volume 6, pp. 322-382 (1986).
- a 'solid' epoxy resin is solid and tack free at about room temperature (from about 20°C to about 27°C), and at about standard pressure.
- a solid epoxy resin as used herein is substantially free of liquid epoxy resin and semi-solid epoxy resin as those terms are used according to their ordinary meanings.
- a liquid epoxy resin is liquid at about room temperature and at about standard pressure, and a semi-solid epoxy resin has both solid and liquid physical characteristics, especially tackiness and tendency to block at about room temperature and at about standard pressure.
- 'Substantially free' in this context means from 0% by weight of the epoxy resin content to less than about 1.5% by weight of the epoxy resin content of the solid thermally expansible material.
- liquid and semi-solid epoxy resin should be so minimal that any migration of liquid and semi-solid epoxy resin to an outer surface of the solid expansible material in its uncured form would be insufficient to cause the surface to have discernable tackiness to a human touch.
- Solid epoxy resins that can be used with the solid thermally expansible material include solid bisphenol A resins made by advancement of bisphenol-A-diglycidyl ether with bisphenol A or by a taffy process, including without limitation type 1 to type 9 resins, such as: EPON 1001, 1004 and 1007 (available from Resolution Performance Products); ARALDITE GT7004, GT7071, GT7014, GT7255, GT7097 and GT9654 (available from Huntsman Advanced Materials), and DER 661, DER 663, and DER 664 (available from The Dow Chemical Co.).
- EPON 1001, 1004 and 1007 available from Resolution Performance Products
- ARALDITE GT7004, GT7071, GT7014, GT7255, GT7097 and GT9654 available from Huntsman Advanced Materials
- DER 661, DER 663, and DER 664 available from The Dow Chemical Co.
- Additional solid epoxy resins include novolac-based epoxy resins, including without limitation: EPON Resin 1031 and 164 1007 (available from Resolution Performance Products), ARALDITE EPN 1180, ECN 1280, ECN 1285 and ECN 9699 (available from Huntsman Advanced Materials); and DEN 438 and 439 (available from The Dow Chemical Co.).
- Additional solid epoxy resins include multifunctional epoxy resins such as tris(hydroxyphenyl)methane triglycidyl ether (available as TACTIX 742 from The Dow Chemical Co.), glyoxal phenol novolac tetraglycidyl ether (available as ARALDITE XB 4399-3), crystalline epoxy resins such as triglycidyl isocyanurate (available as PT810 from Huntsman), and terephthalic acid diglycidyl ester with trimellitic acid triglycidyl ester (available as PT910 from Huntsman).
- multifunctional epoxy resins such as tris(hydroxyphenyl)methane triglycidyl ether (available as TACTIX 742 from The Dow Chemical Co.), glyoxal phenol novolac tetraglycidyl ether (available as ARALDITE XB 4399-3), crystalline epoxy resins such as triglycidyl isocyanurate
- Suitable solid epoxy resins can have Mettler softening points in the range of from about 65°C to about 160°C (more preferably, about 70°C to about 120°C). Suitable solid epoxy resins can have an average of about two epoxy groups per molecule. Suitable solid epoxy resins may show epoxide equivalent weights in the range of from about 350 to about 2000 (more preferably, about 375 to about 1000). Numerous epoxy resins meeting these requirements are available from commercial sources known to those of skill in the art and/or can be created by blending more than one commercially available epoxy resins.
- a solid epoxy resin or combination of solid epoxy resins can be present in the solid thermally expansible material, by weight percent, from about 40% to about 80% (more preferably, about from 50% to 80% or from 60% to about 75%), wherein 100% is the weight of the solid thermally expansible material.
- an 'impact modifier also known as a 'toughener,' refers to any material that is added to a formulation to improve the impact resistance of the formulation.
- Many commercially available impact modifiers are known in the art and are suitable for use in a solid thermally expansible material.
- an impact modifier comprises one or more thermoplastic chemical and the impact modifier is substantially free of natural or synthetic rubber. It is surprising that an impact modifier that is substantially free of rubber could impart sufficient processibility on a solid thermally expansible material. 'Substantially free' in this context means from 0% to about 1.5% by weight of rubber.
- Thermoplastic chemicals that have functional groups capable of reacting with the epoxy groups on the solid epoxy resins are suitable for use with the solid thermally expansible material.
- ethylene butyl acrylate with glycidyl methacrylate (EBA with GMA) to provide epoxy functionality (to react with the epoxy groups of the solid epoxy resin) may be used.
- Ethylene vinyl acetate with maleic anhydride (EVA with MAH) to react with the epoxy groups of the solid epoxy resin may be used.
- the solid thermally expansible material in this embodiment is unexpectedly stable, exhibiting little to no phase separation between the epoxy resin and the one or more thermoplastic impact modifiers. This impact modifier brings a surprising degree of processibility to the solid thermally expansible material, given the absence or substantial absence of rubber, liquid epoxy resin, or semi-solid epoxy resin. In Examples 10-14, these thermoplastic impact modifiers, substantially free of rubber, led to solid thermally expansible materials having a glass transition temperature of 102°C, 112°C, 108°C, 108°C and 109°C, respectively.
- an impact modifier comprises rubber.
- the rubber can be natural or synthetic.
- the impact modifier may also include one or more thermoplastic chemicals that are functionalized to react with the epoxy groups of the solid epoxy resin.
- Exemplary impact modifiers for this embodiment include, without limitation, the rubbers disclosed in WO 2004/055092 (incorporated herein by reference in its entirety), solid grafted rubber, epoxy-polyurethane hybrids, isocyanate prepolymers (such as isocyanate-terminated polyether polyols) having molecular weights in the range between 1,000 to 10,000 daltons, maleic anhydride-modified ethylene propylene diene monomer (EPDM), styrene-butadiene block copolymers with hydrogenated polybutadiene (SEBS); acid-functional ethylene- vinyl acetate terpolymers (EVA), carboxylated styrene-butadiene rubber (CSBR), carboxylated nitrile rubber (such as HYCAR CTBN from Nov
- impact modifiers suitable for use with this embodiment include core-shell impact modifiers including, without limitation, triblock copolymers like methacrylate-butadiene-styrene (MBS) impact modifiers and acrylate- styrene-acrylic acid (ASA) impact modifiers.
- MBS core shell impact modifiers include PARALOID BTA-753 (available from Rohm & Haas) and KANA ACE B-564 (available from Kaneka) and SBM (like SBM AF-X22 available from Arkema).
- ASA core shell impact modifiers include GELOY 1020 from General Electric. Suitable examples include core shell impact modifiers of polysiloxane modified acrylates commercially available as GENIOPERL M23 A from Wacker.
- An impact modifier or combination of impact modifiers can be present in the solid thermally expansible material, by weight percent, from about less than about 20% (more preferably, from about 5% to about 15%), wherein 100% is the weight of the solid thermally expansible material.
- a 'heat-activated foaming agent is a physical agent or chemical agent that causes its host to expand by a pre-determined amount upon the application of a pre-determined amount of heat.
- Any known heat-activated physical foaming agent may be used in a solid thermally expansible material.
- Suitable physical heat-activated foaming agents include, without limitation, those in the EXPANCEL microsphere product line manufactured by Akzo Nobel.
- EXPANCEL microspheres are small, spherical plastic particles that encapsulate a low molecular weight hydrocarbon like isobutane or isopentane. When heated to the boiling points of the particular hydrocarbon, the microspheres can expand more than 40 times in volume.
- EXPANCEL is commercially available in many different grades and forms.
- Any known heat-activated chemical foaming agent may be used in a solid thermally expansible material.
- Suitable chemical heat-activated foaming agents include azodicarbonamide and its modified compounds, p,p'-oxybis(benzenesulfonyl hydrazide), benzenesulfonyl hydrazide, dinitrosopentamethylene tetramine, p- toluenesulfonyl semicarbazide, and 5-phenyltetrazole.
- Heat activation may result from either the external application of heat, or internal activation resulting from the release of heat in an exothermic reaction.
- the temperature at which the expansion is activated is at least about 180°C, more preferably at least about 150°C.
- a heat activated foaming agent or combination of foaming agents can be present in the solid thermally expansible material, by weight percent, from about 0.1% to about 5% (more preferably, about 0.5% to about 3%) wherein 100% is the weight of the solid thermally expansible material .
- a heat-activated foaming agent or combination of heat- activated foaming agents cause expansion from its original pre-activation uncured state (which is 100% for reference purposes) by about 20% to about 300% (more preferably, by about 50% to about 200%).
- Embodiments of a thermally expansible material may comprise at least one 'filler.
- Suitable fillers include fibrous fillers, spherical fillers, plate-like fillers, and nanoparticle fillers.
- Fibrous fillers can be inorganic, such as glass fiber or wollastonite fiber, or in the alternative, can be natural or organic.
- Natural or organic fillers include, without limitation, carbon fiber, aramid KEVLAR fiber, cellulosic fibers, jute, hemp, and the like.
- Spherical fillers can be organic or inorganic. Without limitation, organic spherical fillers can be polymeric spheres, and inorganic spherical fillers can be glass microballons, ceramic microspheres, fumed silica (organically modified or unmodified), pyrogenic silica (organically modified or unmodified), and the like.
- Plate-like fillers may be inorganic, such as graphite, talc, mica, and other materials known to those of skill in the art.
- Nanoparticle fillers can include, without limitation, phyllosilicate like illites or organically modified montmorillonite nanoclays (such as CLOISITE 30B or CLOISITE 93A available from Southern Clay), nanosilica (preferably with reactive groups), and carbon nanotube, hybrid organic-inorganic copolymers-polyhedral-oligomeric silsesquioxanes (POSS).
- phyllosilicate like illites or organically modified montmorillonite nanoclays such as CLOISITE 30B or CLOISITE 93A available from Southern Clay
- nanosilica preferably with reactive groups
- carbon nanotube hybrid organic-inorganic copolymers-polyhedral-oligomeric silsesquioxanes (POSS).
- thermosettable resin art may be used including, for example, calcium carbonate (including coated and/or precipitated calcium carbonate), ceramic fibers, calcium oxide, alumina, clays, sand, metals (for example, aluminum powder), glass or ceramic macrospheres, thermoplastic resins, thermoset resins, and carbon (all of which may be solid or hollow, expanded or expansible) and the like.
- calcium carbonate including coated and/or precipitated calcium carbonate
- ceramic fibers including coated and/or precipitated calcium carbonate
- ceramic fibers including calcium oxide, alumina, clays, sand, metals (for example, aluminum powder), glass or ceramic macrospheres
- thermoplastic resins thermoset resins
- carbon all of which may be solid or hollow, expanded or expansible
- Fillers can be conical in shape or plate-like. Platelet sizes may range from 1 to 10 mm in length, and 5 to 10 microns in width.
- a filler comprises a mixture of fibers having different shapes and sizes. Such a mixture has improved packing density, which results in improved impact resistance at low temperatures, such as temperatures ranging from about -40°C to about -5°C.
- Mineral fillers may be surface treated with example silanes to improve adhesion to the organic matrix. Epoxy silanes or amino silanes are suitable surface treatment.
- a filler or combination of fillers can be present in the solid thermally expansible material, by weight percent, from about 5% to about 45% (more preferably, about 10% to about 30%, still more preferably from about 15% to about 25%), wherein 100% is the weight of the solid thermally expansible material.
- Embodiments of a thermally expansible material may comprise at least one 'curing agent' or 'hardener,' sometimes described as a 'curative.
- a curing agent is used herein to describe a chemical composition that aids in the hardening of a thermally expansible material.
- Those of skill in the art sometimes refer to such chemicals as activators, catalysts or accelerators. While certain curatives promote curing by catalytic action, others participate directly in the reaction of the solid epoxy resin and are incorporated into the thermoset polymeric network formed by a ring-opening reaction, ionic polymerization, and/or crosslinking of the resin.
- Many commercially available hardeners known to those of skill in the art are described in the chapter in the Encyclopedia of Polymer and Engineering referenced above.
- a suitable curing agent or hardener is solid at about room temperature, and remains latent (does not promote any cross-linking reactions) up to about 140°C.
- Such a hardener can be referred to as being 'latent.' More than one hardener may be used.
- Suitable curing agents or hardeners include dicyandiamide; aromatic diamines including without limitation 3,3'-diaminodiphenylsulfone,
- mononuclear phenols such as resorcinol, hy- droquinone and N,N-bis(2-hydroxyethyl)aniline
- polynuclear phenols such as p,p'-bis(2-hydroxyethylamino)diphenylmethane.
- Suitable curing agents or hardeners include amino compounds, amine salts, and quaternary ammonium compounds, amine-epoxy adducts, boron trihalide amine adducts, ureas, and guanidines.
- Suitable boron trihalide adducts include boron trichloride adducts of amines such as monoethanolamine, diethylamine, dioctyl- methylamine, triethylamine, pyridine, benzylamine, benzyldimethyl amine, and the like.
- Boron trichloride amine adduct curatives are commercially available from CVC Specialty Chemicals, Inc.
- a curing agent or combination of curing agents can be present in the solid thermally expansible material, by weight percent, from about 0.1% to about 5% (more preferably, about 0.2% to about 2%), wherein 100% is the weight of the solid thermally expansible material .
- Embodiments of a thermally expansible material may comprise at least one 'accelerator,' which can either quicken the cure speed or lower the cure temperature of a thermally expansible material.
- a thermally expansible material may comprise at least one 'accelerator,' which can either quicken the cure speed or lower the cure temperature of a thermally expansible material.
- Suitable accelerators include, without limitation, substituted ureas, phenols, and imidazoles and imidazole salts.
- Exemplary ureas include phenyl dimethyl urea, 4-chlorophenyl dimethyl urea, 2,4-toluene bis(dimethyl urea), 4,4'-methylene bis(phenyl dimethyl urea), cy- cloaliphatic bisurea, and the like.
- Exemplary imidazoles include 2-methyl imidazole, 2-isopropyl imidazole, 2-phenyl imidazole, 2-phenyl 4-methyl imidazole, 2-heptadecyl imidazole, and the like.
- Some accelerators are commercially available through CVC Specialty Chemicals, such as the OMICURE U Series and the OMICURE B Series.
- An accelerator or combination of accelerators can be present in the solid thermally expansible material, by weight percent, from about 0.01% to about 5% (more preferably, about 0.1% to about 2%), wherein 100% is the weight of the solid thermally expansible material .
- Embodiments of a thermally expansible material may comprise at least one
- 'thixotropic agent which is an additive that brings thixotropy to a product.
- 'Thixotropy' refers to a property of certain materials to soften upon agitation, and to return to its original state when allowed to rest. Thixotropic agents help prevent and reduce sag at the temperature of the final composition following thermal expansion.
- Suitable thixotropic agents include unmodified or hydrophobically modified fumed silica and precipitated silica.
- Other suitable thixotropic agents include organically modified phyllosilicate clays such as bentonite, laponite, montmorillonite, and the like.
- Other thixotropic agents are known to those of skill in the art, such as coated precipitated calcium carbonate and polyamide waxes are suitable for use in a solid thermally expansible material, whether organic or inorganic.
- urea derivatives which can by made, without limitation, by reacting butylamine with MDI, and used as a dispersion in a non-migrating reactive liquid rubber.
- Some materials identified as fillers above also have thixotropic effects, such as platelet fillers and fiber fillers.
- a thixotropic agent or combination of thixotropic agents can be present in the solid thermally expansible material, by weight percent, from about 0.5% to about 10% (more preferably, about 1% to about 6%, still more preferably from about 2% to about 5%), wherein 100% is the weight of the solid thermally expansible material .
- Embodiments of the solid thermally expansible material may also be include other additives including but not limited to adhesion promoters, colorants, stabilizers, plasticizers, wetting agents, antioxidants, each of which is commercially available and well known in the art.
- additives can be present, by weight percent, from about 0.01 % to about 10%
- a solid thermally expansible material may be compounded or formed into pellets using standard manufacturing equipment, then injection molded onto a carrier as described in U.S. Patent No. 6,649,243, hereby incorporated by reference in its entirety.
- Alternatives to injection molding are well known in the art and contemplated for use with the solid thermally expansible material.
- the injection molding (or any other method selected to process the uncured material) occurs at temperatures below the cure activation temperature for the expansible material.
- the expansible material may be processed, shaped or molded using any method known to those of skill in the art, including extrusion, performs, thermoforms with a carrier, including without limitation, a joint, a frame, or a pillar, and thermoforms without a carrier.
- such a solid thermally expansible material (whether or not on a carrier) can be placed in an automotive cavity and activated.
- the activation causes the material to expand and to adhere to a substrate in the automotive cavity.
- the cured material provides structural reinforcement to the substrate.
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- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Materials Engineering (AREA)
- General Chemical & Material Sciences (AREA)
- Architecture (AREA)
- Structural Engineering (AREA)
- Combustion & Propulsion (AREA)
- Transportation (AREA)
- Mechanical Engineering (AREA)
- Manufacture Of Porous Articles, And Recovery And Treatment Of Waste Products (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Epoxy Resins (AREA)
- Body Structure For Vehicles (AREA)
Abstract
Description
Claims
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN2006800276602A CN101233167B (en) | 2005-07-01 | 2006-06-30 | Solid thermally expansible material |
MX2008000040A MX2008000040A (en) | 2005-07-01 | 2006-06-30 | Solid thermally expansible material. |
CA002613762A CA2613762A1 (en) | 2005-07-01 | 2006-06-30 | Solid thermally expansible material |
EP06765982.1A EP1966267B1 (en) | 2005-07-01 | 2006-06-30 | Solid thermally expansible material |
JP2008519122A JP5091129B2 (en) | 2005-07-01 | 2006-06-30 | Solid thermal expansion material |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US69618305P | 2005-07-01 | 2005-07-01 | |
US60/696,183 | 2005-07-01 |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2007004184A1 true WO2007004184A1 (en) | 2007-01-11 |
Family
ID=37198944
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/IB2006/052218 WO2007004184A1 (en) | 2005-07-01 | 2006-06-30 | Solid thermally expansible material |
Country Status (7)
Country | Link |
---|---|
US (1) | US20070034432A1 (en) |
EP (1) | EP1966267B1 (en) |
JP (1) | JP5091129B2 (en) |
CN (2) | CN101233167B (en) |
CA (1) | CA2613762A1 (en) |
MX (1) | MX2008000040A (en) |
WO (1) | WO2007004184A1 (en) |
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Also Published As
Publication number | Publication date |
---|---|
EP1966267A1 (en) | 2008-09-10 |
CN102585439A (en) | 2012-07-18 |
JP2008545039A (en) | 2008-12-11 |
EP1966267B1 (en) | 2017-12-13 |
CN102585439B (en) | 2016-06-15 |
MX2008000040A (en) | 2008-04-04 |
JP5091129B2 (en) | 2012-12-05 |
CN101233167A (en) | 2008-07-30 |
CA2613762A1 (en) | 2007-01-11 |
US20070034432A1 (en) | 2007-02-15 |
CN101233167B (en) | 2012-07-18 |
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