WO2005039256A1 - Printed circuit board including a fuse - Google Patents

Printed circuit board including a fuse Download PDF

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Publication number
WO2005039256A1
WO2005039256A1 PCT/IB2004/052022 IB2004052022W WO2005039256A1 WO 2005039256 A1 WO2005039256 A1 WO 2005039256A1 IB 2004052022 W IB2004052022 W IB 2004052022W WO 2005039256 A1 WO2005039256 A1 WO 2005039256A1
Authority
WO
WIPO (PCT)
Prior art keywords
printed circuit
circuit board
narrowed
track
metal track
Prior art date
Application number
PCT/IB2004/052022
Other languages
French (fr)
Inventor
Remy J. W. Kamp
Original Assignee
Koninklijke Philips Electronics N.V.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Koninklijke Philips Electronics N.V. filed Critical Koninklijke Philips Electronics N.V.
Priority to JP2006534879A priority Critical patent/JP2007508706A/en
Priority to US10/575,511 priority patent/US20070062031A1/en
Priority to EP04770208A priority patent/EP1678988A1/en
Publication of WO2005039256A1 publication Critical patent/WO2005039256A1/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H85/00—Protective devices in which the current flows through a part of fusible material and this current is interrupted by displacement of the fusible material when this current becomes excessive
    • H01H85/02—Details
    • H01H85/04—Fuses, i.e. expendable parts of the protective device, e.g. cartridges
    • H01H85/041—Fuses, i.e. expendable parts of the protective device, e.g. cartridges characterised by the type
    • H01H85/046—Fuses formed as printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0286—Programmable, customizable or modifiable circuits
    • H05K1/0293—Individual printed conductors which are adapted for modification, e.g. fusable or breakable conductors, printed switches
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H69/00—Apparatus or processes for the manufacture of emergency protective devices
    • H01H69/02—Manufacture of fuses
    • H01H69/022—Manufacture of fuses of printed circuit fuses
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H85/00—Protective devices in which the current flows through a part of fusible material and this current is interrupted by displacement of the fusible material when this current becomes excessive
    • H01H85/02—Details
    • H01H85/46—Circuit arrangements not adapted to a particular application of the protective device
    • H01H85/463—Circuit arrangements not adapted to a particular application of the protective device with printed circuit fuse
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09727—Varying width along a single conductor; Conductors or pads having different widths
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/0989—Coating free areas, e.g. areas other than pads or lands free of solder resist
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10181—Fuse
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/53—Means to assemble or disassemble
    • Y10T29/5313—Means to assemble electrical device
    • Y10T29/53174—Means to fasten electrical component to wiring board, base, or substrate

Definitions

  • the invention relates to a printed circuit board comprising a substrate, a plurality of electronic components, and a pattern of metal tracks, typically copper tracks, on said substrate for connecting said electronic components, said metal tracks being covered with a protective layer, typically a solder resist layer, wherein said board further comprises a fuse, said fuse comprising a narrowed metal track within the pattern.
  • the aim of the invention is printed circuit board which is protected against fire and damage at low costs in a reliable manner.
  • said narrowed metal track is uncovered such that it is exposed to air.
  • the heat of the melting metal can dissipate into the air and fire is prevented.
  • the absence of solder resist decreases the thermal conductivity of the narrowed metal track, whereby it will melt faster.
  • the chances that the solder resist itself catches fire is reduced hereby.
  • a distance of at least 1.5 mm, preferably at least 2 mm of the ends of the wider metal tracks extending from both ends of the narrowed metal track are uncovered.
  • the bigger mass of the wider metal tracks act as further heat dissipating means thereby.
  • the absence of solder resist on the ends of the wider copper tracks act as solder thieves during the solder process, such that the narrowed copper track is not overloaded with solder and a smooth, thin solder layer is formed on the narrowed copper track.
  • the width of the narrowed metal track is preferably less than 0.3 mm, more preferably less than 0.2 mm.
  • a slot is provided in the substrate alongside substantially the entire length of the narrowed metal track at both sides thereof.
  • Said slots are preferably located at a distance of less than 2 mm, more preferably less than 1.5 mm from the narrowed metal track.
  • the area between the narrowed metal track and the slots is preferably substantially uncovered.
  • the width of the slots is preferably at least 0.5 mm, more preferably at least 1 mm.
  • the invention also relates to an electronic ballast for a gas discharge lamp comprising a printed circuit board.
  • the invention furthermore relates to a method for producing a printed circuit board comprising a substrate, a plurality of electronic components, and a pattern of metal tracks on said substrate for connecting said electronic components, said metal tracks being covered with a protective layer, wherein said board is further provided with a fuse by providing a narrowed metal track within the pattern, wherein said narrowed metal track is not covered with a protective layer such that it remains exposed to air.
  • Figure 1 shows a top plan view of a detail of a first embodiment of a printed circuit board
  • Figure 2 shows a top plan view of a detail of a second embodiment of a printed circuit board.
  • a printed circuit board comprises a carrier board or substrate having circuitry of copper tracks 1 for connecting electronic components (not shown) on said board.
  • the width of the copper tracks 1 is typically approximately 1 mm.
  • the connectors of the electronic components extend through holes in the board and are fixed thereon by solder drops 2.
  • solder resist protective coating is provided to that end the surface of the board, including the copper tracks 1 but excluding the locations where the solder drops are applied.
  • the printed circuit board further comprises a fuse, which is comprised of a narrowed copper track 3 in the circuitry. If an overcurrent runs through this narrowed copper track, it will heat up and melt because of the resistance of the track, whereby the current is interrupted, thus preventing overheating of the board.
  • the width of the narrowed copper track is less than 0.3 mm or 0.2 mm. In order to promote heat dissipation to the environment in case the copper track is melting, and also to decrease the thermal conductivity of the track, the narrowed copper track 3 and the area 4 around it is not coated with solder resist.
  • This area extends approximately 1 mm at both sides from the narrowed copper track 3, and furthermore it extends approximately 2 mm in longitudinal direction along ends 6 of the wider copper tracks 1 at both ends of the narrowed copper track 3.
  • the uncovered ends 6 of the wider copper track 6 serve as a solder thieve during the solder process, whereby a thin, smooth layer of solder is formed on the narrowed copper track 3 and clogging of solder thereon is prevented.
  • Figure 2 shows a further enhancement of the board shown in Figure 1.
  • a slot 5 is provided, for instance by milling.
  • the slots 5 are provided along the entire length of the narrowed copper track 3 at a distance of approximately 1 mm thereof.
  • the width of the slots 5 is approximately 1 mm.
  • the area between the track 3 and the slots 5 is uncovered as described with reference to Figure 1.

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Structure Of Printed Boards (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)

Abstract

Printed circuit board comprising a substrate, a plurality of electronic components, and a pattern of metal tracks (1) on said substrate for connecting said electronic components, said metal tracks, typically copper, being covered with a protective layer, typically a solder resist layer, wherein said board further comprises a fuse, said fuse comprising a narrowed metal track (3) within the pattern, wherein said narrowed metal track is uncovered such that it is exposed to air.

Description

PRINTED CIRCUIT BOARD INCLUDING A FUSE
The invention relates to a printed circuit board comprising a substrate, a plurality of electronic components, and a pattern of metal tracks, typically copper tracks, on said substrate for connecting said electronic components, said metal tracks being covered with a protective layer, typically a solder resist layer, wherein said board further comprises a fuse, said fuse comprising a narrowed metal track within the pattern.
Such a printed circuit board is described in EP-A-0 626 714. The fuse provides a low-cost protection against overheating of the board if an overcurrent occurs. In that case the narrow metal track will heat up and melt, whereby the current will interrupt. A drawback of this solution is that the printed circuit board still can be burned by the heat necessary to melt the metal. The protective non-conductive layer promotes dissipation of the heat into the substrate, which will be severely damaged thereby. Even the danger of a fire outbreak, which the fuse intended to prevent, is not excluded. Therefore the known solution must be considered unreliable.
The aim of the invention is printed circuit board which is protected against fire and damage at low costs in a reliable manner. According to the invention said narrowed metal track is uncovered such that it is exposed to air. Thereby the heat of the melting metal can dissipate into the air and fire is prevented. Furthermore the absence of solder resist decreases the thermal conductivity of the narrowed metal track, whereby it will melt faster. Also the chances that the solder resist itself catches fire is reduced hereby. Preferably furthermore an area of at least 0.5 mm, preferably at least 1 mm extending from said narrowed metal track is uncovered, which further improves the heat dissipation of the substrate. Preferably furthermore a distance of at least 1.5 mm, preferably at least 2 mm of the ends of the wider metal tracks extending from both ends of the narrowed metal track are uncovered. The bigger mass of the wider metal tracks act as further heat dissipating means thereby. Also the absence of solder resist on the ends of the wider copper tracks act as solder thieves during the solder process, such that the narrowed copper track is not overloaded with solder and a smooth, thin solder layer is formed on the narrowed copper track. The width of the narrowed metal track is preferably less than 0.3 mm, more preferably less than 0.2 mm. According to another aspect of the invention a slot is provided in the substrate alongside substantially the entire length of the narrowed metal track at both sides thereof. Thereby the thermal conductivity of the narrowed metal track is further decreased. Another important advantage hereof is that spreading of a possible burning of the board near the narrowed track is blocked by said slots. This feature can be considered an invention on its own. Said slots are preferably located at a distance of less than 2 mm, more preferably less than 1.5 mm from the narrowed metal track. The area between the narrowed metal track and the slots is preferably substantially uncovered. The width of the slots is preferably at least 0.5 mm, more preferably at least 1 mm. The invention also relates to an electronic ballast for a gas discharge lamp comprising a printed circuit board. The invention furthermore relates to a method for producing a printed circuit board comprising a substrate, a plurality of electronic components, and a pattern of metal tracks on said substrate for connecting said electronic components, said metal tracks being covered with a protective layer, wherein said board is further provided with a fuse by providing a narrowed metal track within the pattern, wherein said narrowed metal track is not covered with a protective layer such that it remains exposed to air.
The invention will be illustrated by the embodiments described hereinafter with reference to the drawings, wherein: Figure 1 shows a top plan view of a detail of a first embodiment of a printed circuit board; and Figure 2 shows a top plan view of a detail of a second embodiment of a printed circuit board. According to Figure 1 a printed circuit board comprises a carrier board or substrate having circuitry of copper tracks 1 for connecting electronic components (not shown) on said board. The width of the copper tracks 1 is typically approximately 1 mm. The connectors of the electronic components extend through holes in the board and are fixed thereon by solder drops 2. To that end the surface of the board, including the copper tracks 1 but excluding the locations where the solder drops are applied, is provided by a solder resist protective coating. The printed circuit board further comprises a fuse, which is comprised of a narrowed copper track 3 in the circuitry. If an overcurrent runs through this narrowed copper track, it will heat up and melt because of the resistance of the track, whereby the current is interrupted, thus preventing overheating of the board. Typically the width of the narrowed copper track is less than 0.3 mm or 0.2 mm. In order to promote heat dissipation to the environment in case the copper track is melting, and also to decrease the thermal conductivity of the track, the narrowed copper track 3 and the area 4 around it is not coated with solder resist. This area extends approximately 1 mm at both sides from the narrowed copper track 3, and furthermore it extends approximately 2 mm in longitudinal direction along ends 6 of the wider copper tracks 1 at both ends of the narrowed copper track 3. The uncovered ends 6 of the wider copper track 6 serve as a solder thieve during the solder process, whereby a thin, smooth layer of solder is formed on the narrowed copper track 3 and clogging of solder thereon is prevented. Figure 2 shows a further enhancement of the board shown in Figure 1. On both sides of the narrowed copper track 3 a slot 5 is provided, for instance by milling. The slots 5 are provided along the entire length of the narrowed copper track 3 at a distance of approximately 1 mm thereof. The width of the slots 5 is approximately 1 mm. The area between the track 3 and the slots 5 is uncovered as described with reference to Figure 1.
Through these slots the thermal conductivity of the track 3 is further decreased, resulting in a faster melting of the track and thereby a faster interrupt of the current. It will be evident that many variations within the scope of the invention can be conceived by those skilled in the art.

Claims

CLAIMS:
1. A printed circuit board comprising a substrate, a plurality of electronic components, and a pattern of metal tracks (1) on said substrate for connecting said electronic components, said metal tracks (1) being covered with a protective non-conductive layer, wherein said board further comprises a fuse, said fuse comprising a narrowed metal track (3) within the pattern, characterized in that said narrowed metal track (3) is uncovered such that it is exposed to air.
2. The printed circuit board according to claim 1, wherein further an area (4) of at least 0.5 mm, preferably at least 1 mm extending from said narrowed metal track (1) is uncovered.
3. The printed circuit board according to claim 1 or 2, wherein further a distance of at least 1.5 mm, preferably at least 2 mm of the ends (6) of the wider metal tracks (1) extending from both ends of the narrowed metal track (3) are uncovered.
4. The printed circuit board according to claim 1, 2 or 3, wherein the width of said narrowed metal track (3) is less than 0.3 mm, preferably less than 0.2 mm.
5. The printed circuit board according to any of the previous claims 1 - 4, wherein a slot (5) is provided in the substrate alongside substantially the entire length of the narrowed metal track (3) at both sides thereof.
6. The printed circuit board according to claim 5, wherein said slots (5) are located at a distance of less than 2 mm, preferably less than 1.5 mm from the narrowed metal track (3).
7. The printed circuit board according to claim 5 or 6, wherein the area (4) between the narrowed metal track (3) and the slots (5) is substantially uncovered.
8. The printed circuit board according to claim 5, 6 or 7, wherein the width of the slots (5) is at least 0.5 mm, preferably at least 1 mm.
9. An electronic ballast for a gas discharge lamp comprising a printed circuit board according to any of the preceding claims 1 - 8.
10. A method for producing a printed circuit board comprising a substrate, a plurality of electronic components, and a pattern of metal tracks (1) on said substrate for connecting said electronic components, said metal tracks (1) being covered with a protective non-conductive layer, wherein said board is further provided with a fuse by providing a narrowed metal track (3) within the pattern, characterized in that said narrowed metal track (3) is not covered with a protective non-conductive layer such that it remains exposed to air.
PCT/IB2004/052022 2003-10-17 2004-10-07 Printed circuit board including a fuse WO2005039256A1 (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2006534879A JP2007508706A (en) 2003-10-17 2004-10-07 Printed circuit board including fuse
US10/575,511 US20070062031A1 (en) 2003-10-17 2004-10-07 Printed circuit board including a fuse
EP04770208A EP1678988A1 (en) 2003-10-17 2004-10-07 Printed circuit board including a fuse

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
EP03103846 2003-10-17
EP03103846.6 2003-10-17

Publications (1)

Publication Number Publication Date
WO2005039256A1 true WO2005039256A1 (en) 2005-04-28

Family

ID=34443032

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/IB2004/052022 WO2005039256A1 (en) 2003-10-17 2004-10-07 Printed circuit board including a fuse

Country Status (5)

Country Link
US (1) US20070062031A1 (en)
EP (1) EP1678988A1 (en)
JP (1) JP2007508706A (en)
CN (1) CN1868241A (en)
WO (1) WO2005039256A1 (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2008113343A2 (en) * 2007-03-19 2008-09-25 Conti Temic Microelectronic Gmbh Electronic module comprising a conductor fuse
EP2467867A2 (en) * 2009-08-20 2012-06-27 Eestor, Inc. Rapid activation fusible link
WO2016124706A1 (en) 2015-02-05 2016-08-11 Continental Automotive Gmbh Printed circuit board arrangement comprising an arrangement for limiting current

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2008143138A1 (en) * 2007-05-18 2008-11-27 Toppan Printing Co., Ltd. Wiring substrate, semiconductor package, and electronic device
KR102436766B1 (en) * 2015-06-01 2022-08-26 엘지이노텍 주식회사 Printed circuit board containing a fuse for blocking overcurrent
CN105513917B (en) * 2015-11-30 2017-04-05 郑州轻工业学院 Controllable type PCB is quick break fuse
AU2018313692B2 (en) 2017-08-07 2023-06-01 Depuy Synthes Products, Inc Folded MRI safe coil assembly
US11729906B2 (en) * 2018-12-12 2023-08-15 Eaton Intelligent Power Limited Printed circuit board with integrated fusing and arc suppression

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0270954A1 (en) * 1986-12-01 1988-06-15 Omron Tateisi Electronics Co. Chip-type fuse
US5192940A (en) * 1988-10-07 1993-03-09 Fujikura, Ltd. Flat resistance for blower control unit for automobile air conditioner and blower control unit using the same
EP0626714A1 (en) * 1993-05-28 1994-11-30 Telefonaktiebolaget Lm Ericsson Method of manufacturing a printed board fuse and a fuse produced by the method
FR2778057A1 (en) * 1998-04-27 1999-10-29 Sofedit Flat resistance circuit with zones of variable resistance
US20030142453A1 (en) * 2002-01-10 2003-07-31 Robert Parker Low resistance polymer matrix fuse apparatus and method

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE29818340U1 (en) * 1998-10-14 1999-03-18 Muessli, Daniel, Rumisberg Energy saving lamp with electronic ballast
WO2001069988A1 (en) * 2000-03-14 2001-09-20 Rohm Co., Ltd. Printed-circuit board with fuse

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0270954A1 (en) * 1986-12-01 1988-06-15 Omron Tateisi Electronics Co. Chip-type fuse
US5192940A (en) * 1988-10-07 1993-03-09 Fujikura, Ltd. Flat resistance for blower control unit for automobile air conditioner and blower control unit using the same
EP0626714A1 (en) * 1993-05-28 1994-11-30 Telefonaktiebolaget Lm Ericsson Method of manufacturing a printed board fuse and a fuse produced by the method
FR2778057A1 (en) * 1998-04-27 1999-10-29 Sofedit Flat resistance circuit with zones of variable resistance
US20030142453A1 (en) * 2002-01-10 2003-07-31 Robert Parker Low resistance polymer matrix fuse apparatus and method

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2008113343A2 (en) * 2007-03-19 2008-09-25 Conti Temic Microelectronic Gmbh Electronic module comprising a conductor fuse
WO2008113343A3 (en) * 2007-03-19 2009-01-22 Conti Temic Microelectronic Electronic module comprising a conductor fuse
EP2467867A2 (en) * 2009-08-20 2012-06-27 Eestor, Inc. Rapid activation fusible link
EP2467867A4 (en) * 2009-08-20 2013-09-11 Eestor Inc Rapid activation fusible link
US8698352B2 (en) 2009-08-20 2014-04-15 Eestor, Inc. Rapid activation fusible link
WO2016124706A1 (en) 2015-02-05 2016-08-11 Continental Automotive Gmbh Printed circuit board arrangement comprising an arrangement for limiting current
DE102015202071A1 (en) 2015-02-05 2016-08-11 Continental Automotive Gmbh Printed circuit board assembly
DE102015202071B4 (en) * 2015-02-05 2018-11-15 Continental Automotive Gmbh Printed circuit board assembly

Also Published As

Publication number Publication date
CN1868241A (en) 2006-11-22
EP1678988A1 (en) 2006-07-12
US20070062031A1 (en) 2007-03-22
JP2007508706A (en) 2007-04-05

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