WO2004043692A1 - Substrat multicouche ceramique et procede de fabrication de celui-ci - Google Patents

Substrat multicouche ceramique et procede de fabrication de celui-ci Download PDF

Info

Publication number
WO2004043692A1
WO2004043692A1 PCT/DE2003/003725 DE0303725W WO2004043692A1 WO 2004043692 A1 WO2004043692 A1 WO 2004043692A1 DE 0303725 W DE0303725 W DE 0303725W WO 2004043692 A1 WO2004043692 A1 WO 2004043692A1
Authority
WO
WIPO (PCT)
Prior art keywords
ceramic
layer
multilayer substrate
ceramic multilayer
stack
Prior art date
Application number
PCT/DE2003/003725
Other languages
German (de)
English (en)
Inventor
Klaus-Dieter Aichholzer
Aloys Josef Foecker
Christian Hoffmann
Original Assignee
Epcos Ag
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Epcos Ag filed Critical Epcos Ag
Priority to AU2003286127A priority Critical patent/AU2003286127A1/en
Publication of WO2004043692A1 publication Critical patent/WO2004043692A1/fr

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4688—Composite multilayer circuits, i.e. comprising insulating layers having different properties
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B18/00—Layered products essentially comprising ceramics, e.g. refractory products
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
    • H05K3/4626—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials
    • H05K3/4629—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials laminating inorganic sheets comprising printed circuits, e.g. green ceramic sheets
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B2235/00—Aspects relating to ceramic starting mixtures or sintered ceramic products
    • C04B2235/65—Aspects relating to heat treatments of ceramic bodies such as green ceramics or pre-sintered ceramics, e.g. burning, sintering or melting processes
    • C04B2235/656—Aspects relating to heat treatments of ceramic bodies such as green ceramics or pre-sintered ceramics, e.g. burning, sintering or melting processes characterised by specific heating conditions during heat treatment
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B2237/00—Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
    • C04B2237/02—Aspects relating to interlayers, e.g. used to join ceramic articles with other articles by heating
    • C04B2237/04—Ceramic interlayers
    • C04B2237/06—Oxidic interlayers
    • C04B2237/064—Oxidic interlayers based on alumina or aluminates
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B2237/00—Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
    • C04B2237/30—Composition of layers of ceramic laminates or of ceramic or metallic articles to be joined by heating, e.g. Si substrates
    • C04B2237/32—Ceramic
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B2237/00—Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
    • C04B2237/50—Processing aspects relating to ceramic laminates or to the joining of ceramic articles with other articles by heating
    • C04B2237/66—Forming laminates or joined articles showing high dimensional accuracy, e.g. indicated by the warpage
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/06—Lamination
    • H05K2203/063—Lamination of preperforated insulating layer

Definitions

  • the invention relates to a ceramic multilayer substrate with a stack of ceramic layers lying one above the other.
  • the invention further relates to a method for producing such a ceramic multilayer substrate.
  • a method for producing a ceramic multilayer substrate in which a stack of ceramic green foils lying one above the other is produced in a first step.
  • a constraining layer is applied to the top and to the bottom of the stack.
  • the constraint layer consists of a material that does not sinter at the temperatures at which the layers of the layer stack are sintered.
  • ceramic multilayer substrates are required which have depressions on their surface. This allows a reduction in the component height and also protection for the components recessed in the recesses and their contacts.
  • the known method for producing multilayer ceramic substrates has the disadvantage that it is only poorly suited for the production of substrates with a recess on the surface. This results from the fact that starting points for cracks and deformations of the ceramic body are formed in the recesses, preferably on the lower side edges of the recess. One reason for this is the sintering shrinkage at the bottom of the recess, since the surfaces of the recess savings are no longer fixed by the constraining layer only resting on top of the substrate.
  • a method for producing a ceramic multilayer substrate is specified in which a stack of green foils lying one above the other is produced in a first step.
  • the top of the green foils has one or more cutouts. These recesses in the top one
  • Green foils are suitable for forming depressions in the surface of the finished ceramic multilayer substrate.
  • a constraining layer is arranged below the ceramic green film provided with the cutouts.
  • a forced layer is to be understood as a layer that changes very little during the sintering of the layer stack and, in particular, hardly deforms.
  • a compulsory layer could consist of aluminum oxide or it could also contain only aluminum oxide.
  • Aluminum oxide is characterized by a very high sintering temperature, which is not achieved when sintering the common ceramic multilayer substrates. Particular care is taken to ensure that the sintering temperature for the other ceramic green sheets is lower than the sintering temperature of the constraint layer.
  • the stack of superimposed ceramic green foils is sintered at a temperature at which the green foils of the stack sinter, but not the constraint layer.
  • the uppermost ceramic green sheet which has one or more recesses, can be prevented from shrinking in the lateral direction during sintering, both from the top and at least from the bottom, if necessary . It can be achieved with the aid of the method that the risk of shrinking of the uppermost ceramic green sheet is reduced by the constraining layer provided on the underside of this green sheet.
  • the constraint must apply that its sintering temperature or any other temperature at which the constraint changes in size or at which it undergoes other deformation processes is significantly higher or at least higher than all Process temperatures that are applied to the stack of superimposed green foils or to the ceramic multilayer substrate during its manufacture.
  • forced layers are additionally arranged on the top and on the bottom of the layer stack, specifically before the layer stack is sintered.
  • the uppermost ceramic green sheet finds a constraining layer on the top and on the bottom, which further reduces the risk of shrinking the top ceramic green sheet.
  • the invention is explained in more detail below on the basis of an exemplary embodiment and the associated figures.
  • the single figure shows a ceramic multilayer substrate in a schematic cross section.
  • the ceramic multilayer substrate 1 is produced using the method presented here from a green body. It has ceramic green foils 21, 22 which are part of a
  • the ceramic green sheet 22 forms the upper end of the layer stack.
  • the uppermost ceramic green film 22 has a cutout 3 which is suitable for forming a depression on the upper side of the ceramic multilayer substrate.
  • a constraining layer 40 is arranged below the ceramic green sheet 22, which separates the ceramic green sheet 22 from the ceramic green sheet 21.
  • the constraining layer 40 consists of an aluminum oxide layer 4, which has a further ceramic green film 41, 42 on the top and on the bottom.
  • the ceramic green foils 41, 42 are sintered together with the other ceramic green foils 21, 22. They consist of a corresponding material that has comparable or similar sintering properties.
  • the aluminum oxide layer 4 consists largely of aluminum oxide, but it can also contain organic components and can therefore have the shape of a ceramic green sheet.
  • a multilayer ceramic substrate is formed, in which a ceramic layer with cutouts 3 is arranged on the top of the stack of ceramic layers is.
  • a constraining layer 40 is arranged below the uppermost ceramic layer. The essential part of the constraining layer 40 is the aluminum oxide layer 4.
  • the layers 41, 42 can be omitted in the figure, so that the uppermost ceramic layer 22 borders directly on the aluminum oxide layer 4.
  • the force layer can on the one hand reduce the propagation of force from the inside of the ceramic substrate to the outside, in particular in the area of the recess 3, which at the same time reduces the risk of cracks.
  • the formation of cracks in the uppermost ceramic layer can be largely reduced by the constraining layer 40 arranged in the interior of the layer stack.
  • a layer of a very high-sintering material directly forms the bottom of the depression.

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Inorganic Chemistry (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)

Abstract

L'invention concerne un substrat multicouche céramique (1) et un procédé de fabrication de celui-ci, consistant a) à empiler des feuilles vertes céramiques (21, 22) dont la feuille supérieure (22) présente une cavité (3), et à appliquer une couche forcée (40) en dessous de la couche verte supérieure (22) ; et, b) à fritter la pile de couches à une température de frittage à laquelle la couche forcée ne subit quasiment pas de déformation. De manière avantageuse, le procédé selon l'invention permet de fabriquer des substrats multicouches céramiques présentant des cavités sur le côté supérieur, essentiellement exempts de fissures.
PCT/DE2003/003725 2002-11-11 2003-11-11 Substrat multicouche ceramique et procede de fabrication de celui-ci WO2004043692A1 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
AU2003286127A AU2003286127A1 (en) 2002-11-11 2003-11-11 Ceramic multilayer substrate and method for the production thereof

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE10252636.2 2002-11-11
DE2002152636 DE10252636A1 (de) 2002-11-11 2002-11-11 Keramisches Vielschichtsubstrat und Verfahren zu dessen Herstellung

Publications (1)

Publication Number Publication Date
WO2004043692A1 true WO2004043692A1 (fr) 2004-05-27

Family

ID=32115465

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/DE2003/003725 WO2004043692A1 (fr) 2002-11-11 2003-11-11 Substrat multicouche ceramique et procede de fabrication de celui-ci

Country Status (3)

Country Link
AU (1) AU2003286127A1 (fr)
DE (1) DE10252636A1 (fr)
WO (1) WO2004043692A1 (fr)

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0954209A1 (fr) * 1998-04-28 1999-11-03 Murata Manufacturing Co., Ltd. Plaquette à circuit laminée et méthode de fabrication
EP1033749A2 (fr) * 1999-03-03 2000-09-06 Murata Manufacturing Co., Ltd. Methode et fabrication d'une substrate ceramique à multi-couches
EP1096558A2 (fr) * 1999-10-28 2001-05-02 Murata Manufacturing Co., Ltd. Stratifie composite et methode de fabrication associée
EP1209734A2 (fr) * 2000-11-27 2002-05-29 Murata Manufacturing Co., Ltd. Substrat céramique à multi-couches et sa méthode de fabrication
US20020134488A1 (en) * 2001-03-23 2002-09-26 Hideyuki Harada Method for producing multilayer ceramic substrate
US20020140135A1 (en) * 2001-03-28 2002-10-03 Hideyuki Harada Multilayered ceramic substrate production method

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0954209A1 (fr) * 1998-04-28 1999-11-03 Murata Manufacturing Co., Ltd. Plaquette à circuit laminée et méthode de fabrication
EP1033749A2 (fr) * 1999-03-03 2000-09-06 Murata Manufacturing Co., Ltd. Methode et fabrication d'une substrate ceramique à multi-couches
EP1096558A2 (fr) * 1999-10-28 2001-05-02 Murata Manufacturing Co., Ltd. Stratifie composite et methode de fabrication associée
EP1209734A2 (fr) * 2000-11-27 2002-05-29 Murata Manufacturing Co., Ltd. Substrat céramique à multi-couches et sa méthode de fabrication
US20020134488A1 (en) * 2001-03-23 2002-09-26 Hideyuki Harada Method for producing multilayer ceramic substrate
US20020140135A1 (en) * 2001-03-28 2002-10-03 Hideyuki Harada Multilayered ceramic substrate production method

Also Published As

Publication number Publication date
DE10252636A1 (de) 2004-05-19
AU2003286127A1 (en) 2004-06-03

Similar Documents

Publication Publication Date Title
DE3886605T2 (de) Verfahren zur Herstellung eines keramischen Mehrschichtsubstrats.
DE10256980B4 (de) Herstellverfahren für einen gestapelten keramischen Körper
DE19931914B4 (de) Keramikelektronikteil
WO2005013352A2 (fr) Procede de production d'un composant a semi-conducteur comportant un boitier en matiere plastique et plaque support pour mettre ledit procede en oeuvre
DE19927046A1 (de) Keramik-Metall-Substrat, insbesondere Mehrfachsubstrat
DE69300506T2 (de) Herstellungsverfahren von mehrlagigen keramischen Substraten.
WO2004077583A1 (fr) Composant electrique multicouche et empilement de couches
DE68928184T2 (de) Verfahren zum Herstellen eines keramischen Laminates
DE69014954T2 (de) Geschichtete Keramikanordnung und Verfahren zu deren Herstellung.
DE3941346A1 (de) Verfahren zur herstellung von mehrschichtkondensatoren
EP2156479B1 (fr) Composant multicouche piézoélectrique
DE69309358T2 (de) Verfahren zur Herstellung eines Schaltungssubstrats
DE69208566T2 (de) Herstellungsverfahren von einem elektronischen Vielschichtbauelement
EP1476907B1 (fr) Actionneur piezo-electrique a electrode externe structuree
DE19710187B4 (de) Verfahren zum Herstellen eines Keramikmehrschichtsubstrats
DE3788442T2 (de) Keramisches Verbindungssubstrat und Verfahren zu seiner Herstellung.
DE102004026572A1 (de) Herstellungsverfahren für piezoelektrisches Schichtelement
EP0386821B1 (fr) Condensateur et son procédé de fabrication
EP2147469B1 (fr) Composant multicouche piézoélectrique
DE2249209A1 (de) Leiterrahmen zur verwendung in gehaeusen fuer halbleiterbauelemente
EP1129493B1 (fr) Structure multicouche piezoceramique presentant une surface de section polygonale
WO2004043692A1 (fr) Substrat multicouche ceramique et procede de fabrication de celui-ci
EP1497838A1 (fr) Composant ptc et procedes de fabrication
EP2847805B1 (fr) Procédé de production d'un élément mulcicouche et élément multicouche produit selon ce procédé
DE4029972A1 (de) Ultraschallwandler aus piezokeramik

Legal Events

Date Code Title Description
AK Designated states

Kind code of ref document: A1

Designated state(s): AE AG AL AM AT AU AZ BA BB BG BR BY BZ CA CH CN CO CR CU CZ DK DM DZ EC EE EG ES FI GB GD GE GH GM HR HU ID IL IN IS JP KE KG KP KR KZ LC LK LR LS LT LU LV MA MD MG MK MN MW MX MZ NI NO NZ OM PG PH PL PT RO RU SC SD SE SG SK SL SY TJ TM TN TR TT TZ UA UG US UZ VC VN YU ZA ZM ZW

AL Designated countries for regional patents

Kind code of ref document: A1

Designated state(s): BW GH GM KE LS MW MZ SD SL SZ TZ UG ZM ZW AM AZ BY KG KZ MD RU TJ TM AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HU IE IT LU MC NL PT RO SE SI SK TR BF BJ CF CG CI CM GA GN GQ GW ML MR NE SN TD TG

121 Ep: the epo has been informed by wipo that ep was designated in this application
122 Ep: pct application non-entry in european phase
NENP Non-entry into the national phase

Ref country code: JP

WWW Wipo information: withdrawn in national office

Country of ref document: JP