WO2002088843A3 - Exposure method and apparatus - Google Patents
Exposure method and apparatus Download PDFInfo
- Publication number
- WO2002088843A3 WO2002088843A3 PCT/JP2002/004082 JP0204082W WO02088843A3 WO 2002088843 A3 WO2002088843 A3 WO 2002088843A3 JP 0204082 W JP0204082 W JP 0204082W WO 02088843 A3 WO02088843 A3 WO 02088843A3
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- exposure method
- pattern
- mask
- contact hole
- patterns
- Prior art date
Links
- 230000003287 optical effect Effects 0.000 abstract 1
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
- G03F1/26—Phase shift masks [PSM]; PSM blanks; Preparation thereof
- G03F1/30—Alternating PSM, e.g. Levenson-Shibuya PSM; Preparation thereof
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/20—Exposure; Apparatus therefor
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
- G03F1/36—Masks having proximity correction features; Preparation thereof, e.g. optical proximity correction [OPC] design processes
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70058—Mask illumination systems
- G03F7/70125—Use of illumination settings tailored to particular mask patterns
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70425—Imaging strategies, e.g. for increasing throughput or resolution, printing product fields larger than the image field or compensating lithography- or non-lithography errors, e.g. proximity correction, mix-and-match, stitching or double patterning
- G03F7/70466—Multiple exposures, e.g. combination of fine and coarse exposures, double patterning or multiple exposures for printing a single feature
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
- Projection-Type Copiers In General (AREA)
Abstract
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
AU2002253574A AU2002253574A1 (en) | 2001-04-24 | 2002-04-24 | Exposure method and apparatus |
EP02722748A EP1384117A2 (en) | 2001-04-24 | 2002-04-24 | Exposure method and apparatus |
KR10-2002-7017663A KR100538362B1 (en) | 2001-04-24 | 2002-04-24 | Exposure method and apparatus |
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2001126759 | 2001-04-24 | ||
JP2001-126759 | 2001-04-24 | ||
JP2001369393 | 2001-12-03 | ||
JP2001-369393 | 2001-12-03 |
Publications (2)
Publication Number | Publication Date |
---|---|
WO2002088843A2 WO2002088843A2 (en) | 2002-11-07 |
WO2002088843A3 true WO2002088843A3 (en) | 2003-07-10 |
Family
ID=26614136
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/JP2002/004082 WO2002088843A2 (en) | 2001-04-24 | 2002-04-24 | Exposure method and apparatus |
Country Status (6)
Country | Link |
---|---|
US (1) | US7217503B2 (en) |
EP (1) | EP1384117A2 (en) |
KR (1) | KR100538362B1 (en) |
AU (1) | AU2002253574A1 (en) |
TW (1) | TW544547B (en) |
WO (1) | WO2002088843A2 (en) |
Families Citing this family (39)
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---|---|---|---|---|
TW516098B (en) * | 2001-12-20 | 2003-01-01 | Nanya Technology Corp | Light source generation apparatus and exposure method of contact hole |
JP3950731B2 (en) * | 2002-04-23 | 2007-08-01 | キヤノン株式会社 | Illumination optical system, exposure apparatus having the illumination optical system, and device manufacturing method |
TWI315027B (en) * | 2002-04-23 | 2009-09-21 | Canon Kabushiki Kaish | Mask designing method, and exposure method for illuminatiing a mask and exposing an object |
JP3984866B2 (en) | 2002-06-05 | 2007-10-03 | キヤノン株式会社 | Exposure method |
JP2004063988A (en) * | 2002-07-31 | 2004-02-26 | Canon Inc | Illumination optical system, aligner having the system, and method of manufacturing device |
JP4235410B2 (en) * | 2002-08-01 | 2009-03-11 | キヤノン株式会社 | Exposure method |
JP4332331B2 (en) | 2002-08-05 | 2009-09-16 | キヤノン株式会社 | Exposure method |
EP1450206B1 (en) * | 2003-02-21 | 2016-04-20 | Canon Kabushiki Kaisha | Mask and its manufacturing method, exposure, and semiconductor device fabrication method |
EP3226073A3 (en) | 2003-04-09 | 2017-10-11 | Nikon Corporation | Exposure method and apparatus, and method for fabricating device |
US6842223B2 (en) * | 2003-04-11 | 2005-01-11 | Nikon Precision Inc. | Enhanced illuminator for use in photolithographic systems |
KR100560662B1 (en) * | 2003-06-20 | 2006-03-16 | 삼성전자주식회사 | Mask and method for manufacturing the same |
KR100546119B1 (en) * | 2003-10-23 | 2006-01-24 | 주식회사 하이닉스반도체 | How do you improve the uniformity and alignment accuracy of your array contacts? |
TW201834020A (en) | 2003-10-28 | 2018-09-16 | 日商尼康股份有限公司 | Optical illumination device, exposure device, exposure method and device manufacturing method |
TW201809801A (en) | 2003-11-20 | 2018-03-16 | 日商尼康股份有限公司 | Optical illuminating apparatus, exposure device, exposure method, and device manufacturing method |
CN1910522B (en) | 2004-01-16 | 2010-05-26 | 卡尔蔡司Smt股份公司 | Polarization-modulating optical element |
US8270077B2 (en) | 2004-01-16 | 2012-09-18 | Carl Zeiss Smt Gmbh | Polarization-modulating optical element |
US20070019179A1 (en) | 2004-01-16 | 2007-01-25 | Damian Fiolka | Polarization-modulating optical element |
TWI395068B (en) | 2004-01-27 | 2013-05-01 | 尼康股份有限公司 | Optical system, exposure device and method of exposure |
TWI437618B (en) * | 2004-02-06 | 2014-05-11 | 尼康股份有限公司 | Polarization changing device, optical illumination apparatus, light-exposure apparatus and light-exposure method |
JP4497968B2 (en) | 2004-03-18 | 2010-07-07 | キヤノン株式会社 | Illumination apparatus, exposure apparatus, and device manufacturing method |
US7324280B2 (en) * | 2004-05-25 | 2008-01-29 | Asml Holding N.V. | Apparatus for providing a pattern of polarization |
US7372540B2 (en) | 2004-10-12 | 2008-05-13 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
US7655388B2 (en) * | 2005-01-03 | 2010-02-02 | Chartered Semiconductor Manufacturing, Ltd. | Mask and method to pattern chromeless phase lithography contact hole |
TW200923418A (en) * | 2005-01-21 | 2009-06-01 | Nikon Corp | Exposure device, exposure method, fabricating method of device, exposure system, information collecting device, and measuring device |
JP4612849B2 (en) * | 2005-03-01 | 2011-01-12 | キヤノン株式会社 | Exposure method, exposure apparatus, and device manufacturing method |
JP4336671B2 (en) * | 2005-07-15 | 2009-09-30 | キヤノン株式会社 | A program for causing a computer to determine exposure parameters, a determination method for determining exposure parameters, an exposure method, and a device manufacturing method. |
KR100722258B1 (en) * | 2005-08-18 | 2007-05-29 | 주식회사 케이디파워 | A solid state earth leakage circuit breaker |
FR2890461B1 (en) * | 2005-09-05 | 2008-12-26 | Sagem Defense Securite | SHUTTER AND ILLUMINATOR OF A PHOTOLITHOGRAPHY DEVICE |
US7697114B2 (en) * | 2006-06-14 | 2010-04-13 | Taiwan Semiconductor Manufacturing Company, Ltd. | Method and apparatus for compensated illumination for advanced lithography |
JP2009043789A (en) * | 2007-08-06 | 2009-02-26 | Elpida Memory Inc | Pattern forming method, and mask |
US8233210B2 (en) * | 2008-12-30 | 2012-07-31 | Intel Corporation | Illumination aperture for optical lithography |
US8339573B2 (en) * | 2009-05-27 | 2012-12-25 | 3M Innovative Properties Company | Method and apparatus for photoimaging a substrate |
CN102103325B (en) * | 2009-12-22 | 2013-06-19 | 株式会社Lg化学 | Photomask for forming fine pattern and method for forming fine pattern with the photomask |
EP2354853B1 (en) * | 2010-02-09 | 2013-01-02 | Carl Zeiss SMT GmbH | Optical raster element, optical integrator and illumination system of a microlithographic projection exposure apparatus |
US8697346B2 (en) * | 2010-04-01 | 2014-04-15 | The Regents Of The University Of Colorado | Diffraction unlimited photolithography |
US8524423B2 (en) * | 2011-07-11 | 2013-09-03 | United Microelectronics Corp. | Method of forming assist feature patterns |
JP5902573B2 (en) | 2012-07-18 | 2016-04-13 | 株式会社東芝 | Pattern formation method |
CA2932468A1 (en) * | 2013-12-27 | 2015-07-02 | Sensofar Medical, S.L. | Device and method for optically inspecting and analysing stent-like objects |
KR102546320B1 (en) * | 2018-06-18 | 2023-06-22 | 삼성전자주식회사 | Structured light projector and electronic apparatus including the same |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0464492A1 (en) * | 1990-06-21 | 1992-01-08 | Matsushita Electronics Corporation | A photomask used by photolithography and a process of producing the same |
US5298365A (en) * | 1990-03-20 | 1994-03-29 | Hitachi, Ltd. | Process for fabricating semiconductor integrated circuit device, and exposing system and mask inspecting method to be used in the process |
JPH06267822A (en) * | 1993-03-17 | 1994-09-22 | Toshiba Corp | Fine pattern formation |
US5447810A (en) * | 1994-02-09 | 1995-09-05 | Microunity Systems Engineering, Inc. | Masks for improved lithographic patterning for off-axis illumination lithography |
US6150059A (en) * | 1997-10-31 | 2000-11-21 | Nec Corporation | Photomask and method of exposure using same |
Family Cites Families (24)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US2002A (en) * | 1841-03-12 | Tor and planter for plowing | ||
US5153773A (en) | 1989-06-08 | 1992-10-06 | Canon Kabushiki Kaisha | Illumination device including amplitude-division and beam movements |
JP3105234B2 (en) | 1990-09-28 | 2000-10-30 | 株式会社日立製作所 | Method for manufacturing semiconductor device |
JP3165711B2 (en) | 1991-08-02 | 2001-05-14 | キヤノン株式会社 | Image projection method and method for manufacturing semiconductor device using the method |
JPH0547628A (en) | 1991-08-09 | 1993-02-26 | Canon Inc | Image projection method and manufacture of semiconductor device using the same |
KR950004968B1 (en) * | 1991-10-15 | 1995-05-16 | 가부시키가이샤 도시바 | Projection exposure apparatus |
JP3194155B2 (en) | 1992-01-31 | 2001-07-30 | キヤノン株式会社 | Semiconductor device manufacturing method and projection exposure apparatus using the same |
JPH06163364A (en) | 1992-11-16 | 1994-06-10 | Fujitsu Ltd | Aligner and pattern formation |
JP3201027B2 (en) | 1992-12-22 | 2001-08-20 | 株式会社ニコン | Projection exposure apparatus and method |
KR0155830B1 (en) * | 1995-06-19 | 1998-11-16 | 김광호 | Advanced exposure apparatus and exposure method using the same |
KR0147665B1 (en) | 1995-09-13 | 1998-10-01 | 김광호 | Changing illumination method reflection mirror and making method used thereof |
US6534242B2 (en) | 1997-11-06 | 2003-03-18 | Canon Kabushiki Kaisha | Multiple exposure device formation |
JP3101594B2 (en) | 1997-11-06 | 2000-10-23 | キヤノン株式会社 | Exposure method and exposure apparatus |
EP0939343A1 (en) | 1998-02-26 | 1999-09-01 | Canon Kabushiki Kaisha | Exposure method and exposure apparatus |
US6930754B1 (en) * | 1998-06-30 | 2005-08-16 | Canon Kabushiki Kaisha | Multiple exposure method |
JP3275863B2 (en) * | 1999-01-08 | 2002-04-22 | 日本電気株式会社 | Photo mask |
US6607535B1 (en) | 1999-02-04 | 2003-08-19 | Kwan-Ho Chan | Universal bone cement plug and method of use |
JP2000310843A (en) | 1999-04-27 | 2000-11-07 | Canon Inc | Image projection method and exposure method of contact hole using this method |
JP3353744B2 (en) | 1999-06-23 | 2002-12-03 | 日本電気株式会社 | Pattern formation method |
US6361909B1 (en) * | 1999-12-06 | 2002-03-26 | Industrial Technology Research Institute | Illumination aperture filter design using superposition |
EP1174764B1 (en) | 2000-07-21 | 2004-03-31 | ASML Netherlands B.V. | Assist features for use in lithographic projection |
DE60102523T2 (en) | 2000-07-21 | 2005-04-07 | Asml Masktools B.V. | Auxiliary pattern for lithographic exposure process |
JP3768794B2 (en) | 2000-10-13 | 2006-04-19 | 株式会社ルネサステクノロジ | Manufacturing method of semiconductor integrated circuit device |
JP2002324743A (en) | 2001-04-24 | 2002-11-08 | Canon Inc | Exposing method and equipment thereof |
-
2002
- 2002-04-24 KR KR10-2002-7017663A patent/KR100538362B1/en not_active IP Right Cessation
- 2002-04-24 TW TW091108521A patent/TW544547B/en not_active IP Right Cessation
- 2002-04-24 US US10/132,001 patent/US7217503B2/en not_active Expired - Fee Related
- 2002-04-24 WO PCT/JP2002/004082 patent/WO2002088843A2/en active IP Right Grant
- 2002-04-24 AU AU2002253574A patent/AU2002253574A1/en not_active Abandoned
- 2002-04-24 EP EP02722748A patent/EP1384117A2/en not_active Withdrawn
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5298365A (en) * | 1990-03-20 | 1994-03-29 | Hitachi, Ltd. | Process for fabricating semiconductor integrated circuit device, and exposing system and mask inspecting method to be used in the process |
EP0464492A1 (en) * | 1990-06-21 | 1992-01-08 | Matsushita Electronics Corporation | A photomask used by photolithography and a process of producing the same |
JPH06267822A (en) * | 1993-03-17 | 1994-09-22 | Toshiba Corp | Fine pattern formation |
US5447810A (en) * | 1994-02-09 | 1995-09-05 | Microunity Systems Engineering, Inc. | Masks for improved lithographic patterning for off-axis illumination lithography |
US6150059A (en) * | 1997-10-31 | 2000-11-21 | Nec Corporation | Photomask and method of exposure using same |
Non-Patent Citations (1)
Title |
---|
PATENT ABSTRACTS OF JAPAN vol. 018, no. 672 (E - 1646) 19 December 1994 (1994-12-19) * |
Also Published As
Publication number | Publication date |
---|---|
WO2002088843A2 (en) | 2002-11-07 |
KR20040000308A (en) | 2004-01-03 |
KR100538362B1 (en) | 2005-12-21 |
EP1384117A2 (en) | 2004-01-28 |
US7217503B2 (en) | 2007-05-15 |
AU2002253574A1 (en) | 2002-11-11 |
TW544547B (en) | 2003-08-01 |
US20020177048A1 (en) | 2002-11-28 |
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