US6579392B1 - Composite laminate and method for manufacturing the same - Google Patents
Composite laminate and method for manufacturing the same Download PDFInfo
- Publication number
- US6579392B1 US6579392B1 US09/698,394 US69839400A US6579392B1 US 6579392 B1 US6579392 B1 US 6579392B1 US 69839400 A US69839400 A US 69839400A US 6579392 B1 US6579392 B1 US 6579392B1
- Authority
- US
- United States
- Prior art keywords
- green
- composite laminate
- sheet layers
- composite
- particulate aggregate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime, expires
Links
- 239000002131 composite material Substances 0.000 title claims abstract description 91
- 238000000034 method Methods 0.000 title claims description 50
- 238000004519 manufacturing process Methods 0.000 title claims description 28
- 238000010304 firing Methods 0.000 claims abstract description 29
- 239000011174 green composite Substances 0.000 claims description 82
- 239000011521 glass Substances 0.000 claims description 15
- 238000010030 laminating Methods 0.000 claims description 13
- 238000002844 melting Methods 0.000 claims description 12
- 230000008018 melting Effects 0.000 claims description 12
- 238000005245 sintering Methods 0.000 claims description 11
- 239000000919 ceramic Substances 0.000 claims description 8
- 239000002904 solvent Substances 0.000 claims description 8
- 230000035515 penetration Effects 0.000 abstract description 4
- 239000010408 film Substances 0.000 description 30
- 239000002241 glass-ceramic Substances 0.000 description 20
- 239000002002 slurry Substances 0.000 description 14
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 8
- 239000002245 particle Substances 0.000 description 6
- 239000000843 powder Substances 0.000 description 5
- 239000002270 dispersing agent Substances 0.000 description 4
- 239000000839 emulsion Substances 0.000 description 3
- 229920002803 thermoplastic polyurethane Polymers 0.000 description 3
- CPLXHLVBOLITMK-UHFFFAOYSA-N Magnesium oxide Chemical compound [Mg]=O CPLXHLVBOLITMK-UHFFFAOYSA-N 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 2
- MCMNRKCIXSYSNV-UHFFFAOYSA-N Zirconium dioxide Chemical compound O=[Zr]=O MCMNRKCIXSYSNV-UHFFFAOYSA-N 0.000 description 2
- 239000011230 binding agent Substances 0.000 description 2
- 238000011156 evaluation Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000002156 mixing Methods 0.000 description 2
- 239000004014 plasticizer Substances 0.000 description 2
- 229920001515 polyalkylene glycol Polymers 0.000 description 2
- 229920000139 polyethylene terephthalate Polymers 0.000 description 2
- 239000005020 polyethylene terephthalate Substances 0.000 description 2
- 230000003746 surface roughness Effects 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- 229910018516 Al—O Inorganic materials 0.000 description 1
- 229910002370 SrTiO3 Inorganic materials 0.000 description 1
- 229910002113 barium titanate Inorganic materials 0.000 description 1
- 229910052681 coesite Inorganic materials 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 229910052906 cristobalite Inorganic materials 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 238000007598 dipping method Methods 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 230000001747 exhibiting effect Effects 0.000 description 1
- JEIPFZHSYJVQDO-UHFFFAOYSA-N iron(III) oxide Inorganic materials O=[Fe]O[Fe]=O JEIPFZHSYJVQDO-UHFFFAOYSA-N 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
- -1 polyethylene terephthalate Polymers 0.000 description 1
- 238000009702 powder compression Methods 0.000 description 1
- 239000012255 powdered metal Substances 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 238000005096 rolling process Methods 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
- 229910052682 stishovite Inorganic materials 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- 229910052905 tridymite Inorganic materials 0.000 description 1
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B18/00—Layered products essentially comprising ceramics, e.g. refractory products
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B35/00—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
- C04B35/01—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on oxide ceramics
- C04B35/10—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on oxide ceramics based on aluminium oxide
- C04B35/111—Fine ceramics
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B35/00—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
- C04B35/622—Forming processes; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
- C04B35/626—Preparing or treating the powders individually or as batches ; preparing or treating macroscopic reinforcing agents for ceramic products, e.g. fibres; mechanical aspects section B
- C04B35/62605—Treating the starting powders individually or as mixtures
- C04B35/62625—Wet mixtures
- C04B35/6263—Wet mixtures characterised by their solids loadings, i.e. the percentage of solids
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B35/00—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
- C04B35/622—Forming processes; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
- C04B35/626—Preparing or treating the powders individually or as batches ; preparing or treating macroscopic reinforcing agents for ceramic products, e.g. fibres; mechanical aspects section B
- C04B35/63—Preparing or treating the powders individually or as batches ; preparing or treating macroscopic reinforcing agents for ceramic products, e.g. fibres; mechanical aspects section B using additives specially adapted for forming the products, e.g.. binder binders
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B35/00—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
- C04B35/622—Forming processes; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
- C04B35/626—Preparing or treating the powders individually or as batches ; preparing or treating macroscopic reinforcing agents for ceramic products, e.g. fibres; mechanical aspects section B
- C04B35/63—Preparing or treating the powders individually or as batches ; preparing or treating macroscopic reinforcing agents for ceramic products, e.g. fibres; mechanical aspects section B using additives specially adapted for forming the products, e.g.. binder binders
- C04B35/632—Organic additives
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B35/00—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
- C04B35/622—Forming processes; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
- C04B35/626—Preparing or treating the powders individually or as batches ; preparing or treating macroscopic reinforcing agents for ceramic products, e.g. fibres; mechanical aspects section B
- C04B35/63—Preparing or treating the powders individually or as batches ; preparing or treating macroscopic reinforcing agents for ceramic products, e.g. fibres; mechanical aspects section B using additives specially adapted for forming the products, e.g.. binder binders
- C04B35/632—Organic additives
- C04B35/634—Polymers
- C04B35/63448—Polymers obtained otherwise than by reactions only involving carbon-to-carbon unsaturated bonds
- C04B35/63456—Polyurethanes; Polyisocyanates
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B35/00—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
- C04B35/622—Forming processes; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
- C04B35/626—Preparing or treating the powders individually or as batches ; preparing or treating macroscopic reinforcing agents for ceramic products, e.g. fibres; mechanical aspects section B
- C04B35/63—Preparing or treating the powders individually or as batches ; preparing or treating macroscopic reinforcing agents for ceramic products, e.g. fibres; mechanical aspects section B using additives specially adapted for forming the products, e.g.. binder binders
- C04B35/632—Organic additives
- C04B35/634—Polymers
- C04B35/63448—Polymers obtained otherwise than by reactions only involving carbon-to-carbon unsaturated bonds
- C04B35/6346—Polyesters
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B35/00—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
- C04B35/622—Forming processes; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
- C04B35/626—Preparing or treating the powders individually or as batches ; preparing or treating macroscopic reinforcing agents for ceramic products, e.g. fibres; mechanical aspects section B
- C04B35/63—Preparing or treating the powders individually or as batches ; preparing or treating macroscopic reinforcing agents for ceramic products, e.g. fibres; mechanical aspects section B using additives specially adapted for forming the products, e.g.. binder binders
- C04B35/632—Organic additives
- C04B35/634—Polymers
- C04B35/63448—Polymers obtained otherwise than by reactions only involving carbon-to-carbon unsaturated bonds
- C04B35/63488—Polyethers, e.g. alkylphenol polyglycolether, polyethylene glycol [PEG], polyethylene oxide [PEO]
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B35/00—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
- C04B35/622—Forming processes; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
- C04B35/653—Processes involving a melting step
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B37/00—Joining burned ceramic articles with other burned ceramic articles or other articles by heating
- C04B37/04—Joining burned ceramic articles with other burned ceramic articles or other articles by heating with articles made from glass
- C04B37/042—Joining burned ceramic articles with other burned ceramic articles or other articles by heating with articles made from glass in a direct manner
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
- H01L21/4803—Insulating or insulated parts, e.g. mountings, containers, diamond heatsinks
- H01L21/481—Insulating layers on insulating parts, with or without metallisation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
- H01L21/4814—Conductive parts
- H01L21/4846—Leads on or in insulating or insulated substrates, e.g. metallisation
- H01L21/4857—Multilayer substrates
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/12—Mountings, e.g. non-detachable insulating substrates
- H01L23/14—Mountings, e.g. non-detachable insulating substrates characterised by the material or its electrical properties
- H01L23/15—Ceramic or glass substrates
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
- H01L23/49822—Multilayer substrates
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
- H05K3/4626—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials
- H05K3/4629—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials laminating inorganic sheets comprising printed circuits, e.g. green ceramic sheets
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4688—Composite multilayer circuits, i.e. comprising insulating layers having different properties
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2315/00—Other materials containing non-metallic inorganic compounds not provided for in groups B32B2311/00 - B32B2313/04
- B32B2315/08—Glass
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B2235/00—Aspects relating to ceramic starting mixtures or sintered ceramic products
- C04B2235/02—Composition of constituents of the starting material or of secondary phases of the final product
- C04B2235/50—Constituents or additives of the starting mixture chosen for their shape or used because of their shape or their physical appearance
- C04B2235/54—Particle size related information
- C04B2235/5418—Particle size related information expressed by the size of the particles or aggregates thereof
- C04B2235/5445—Particle size related information expressed by the size of the particles or aggregates thereof submicron sized, i.e. from 0,1 to 1 micron
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B2235/00—Aspects relating to ceramic starting mixtures or sintered ceramic products
- C04B2235/65—Aspects relating to heat treatments of ceramic bodies such as green ceramics or pre-sintered ceramics, e.g. burning, sintering or melting processes
- C04B2235/656—Aspects relating to heat treatments of ceramic bodies such as green ceramics or pre-sintered ceramics, e.g. burning, sintering or melting processes characterised by specific heating conditions during heat treatment
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B2235/00—Aspects relating to ceramic starting mixtures or sintered ceramic products
- C04B2235/65—Aspects relating to heat treatments of ceramic bodies such as green ceramics or pre-sintered ceramics, e.g. burning, sintering or melting processes
- C04B2235/656—Aspects relating to heat treatments of ceramic bodies such as green ceramics or pre-sintered ceramics, e.g. burning, sintering or melting processes characterised by specific heating conditions during heat treatment
- C04B2235/6567—Treatment time
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B2235/00—Aspects relating to ceramic starting mixtures or sintered ceramic products
- C04B2235/70—Aspects relating to sintered or melt-casted ceramic products
- C04B2235/96—Properties of ceramic products, e.g. mechanical properties such as strength, toughness, wear resistance
- C04B2235/9607—Thermal properties, e.g. thermal expansion coefficient
- C04B2235/9615—Linear firing shrinkage
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B2237/00—Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
- C04B2237/30—Composition of layers of ceramic laminates or of ceramic or metallic articles to be joined by heating, e.g. Si substrates
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B2237/00—Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
- C04B2237/30—Composition of layers of ceramic laminates or of ceramic or metallic articles to be joined by heating, e.g. Si substrates
- C04B2237/32—Ceramic
- C04B2237/34—Oxidic
- C04B2237/341—Silica or silicates
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B2237/00—Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
- C04B2237/30—Composition of layers of ceramic laminates or of ceramic or metallic articles to be joined by heating, e.g. Si substrates
- C04B2237/32—Ceramic
- C04B2237/34—Oxidic
- C04B2237/343—Alumina or aluminates
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B2237/00—Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
- C04B2237/30—Composition of layers of ceramic laminates or of ceramic or metallic articles to be joined by heating, e.g. Si substrates
- C04B2237/32—Ceramic
- C04B2237/34—Oxidic
- C04B2237/345—Refractory metal oxides
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B2237/00—Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
- C04B2237/30—Composition of layers of ceramic laminates or of ceramic or metallic articles to be joined by heating, e.g. Si substrates
- C04B2237/32—Ceramic
- C04B2237/36—Non-oxidic
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B2237/00—Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
- C04B2237/30—Composition of layers of ceramic laminates or of ceramic or metallic articles to be joined by heating, e.g. Si substrates
- C04B2237/32—Ceramic
- C04B2237/36—Non-oxidic
- C04B2237/365—Silicon carbide
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B2237/00—Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
- C04B2237/50—Processing aspects relating to ceramic laminates or to the joining of ceramic articles with other articles by heating
- C04B2237/52—Pre-treatment of the joining surfaces, e.g. cleaning, machining
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B2237/00—Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
- C04B2237/50—Processing aspects relating to ceramic laminates or to the joining of ceramic articles with other articles by heating
- C04B2237/52—Pre-treatment of the joining surfaces, e.g. cleaning, machining
- C04B2237/525—Pre-treatment of the joining surfaces, e.g. cleaning, machining by heating
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B2237/00—Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
- C04B2237/50—Processing aspects relating to ceramic laminates or to the joining of ceramic articles with other articles by heating
- C04B2237/64—Forming laminates or joined articles comprising grooves or cuts
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B2237/00—Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
- C04B2237/50—Processing aspects relating to ceramic laminates or to the joining of ceramic articles with other articles by heating
- C04B2237/68—Forming laminates or joining articles wherein at least one substrate contains at least two different parts of macro-size, e.g. one ceramic substrate layer containing an embedded conductor or electrode
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B2237/00—Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
- C04B2237/50—Processing aspects relating to ceramic laminates or to the joining of ceramic articles with other articles by heating
- C04B2237/70—Forming laminates or joined articles comprising layers of a specific, unusual thickness
- C04B2237/704—Forming laminates or joined articles comprising layers of a specific, unusual thickness of one or more of the ceramic layers or articles
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/095—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00 with a principal constituent of the material being a combination of two or more materials provided in the groups H01L2924/013 - H01L2924/0715
- H01L2924/097—Glass-ceramics, e.g. devitrified glass
- H01L2924/09701—Low temperature co-fired ceramic [LTCC]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0183—Dielectric layers
- H05K2201/0195—Dielectric or adhesive layers comprising a plurality of layers, e.g. in a multilayer structure
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
- Y10T428/24942—Structurally defined web or sheet [e.g., overall dimension, etc.] including components having same physical characteristic in differing degree
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
- Y10T428/24942—Structurally defined web or sheet [e.g., overall dimension, etc.] including components having same physical characteristic in differing degree
- Y10T428/2495—Thickness [relative or absolute]
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/249921—Web or sheet containing structurally defined element or component
- Y10T428/249953—Composite having voids in a component [e.g., porous, cellular, etc.]
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/249921—Web or sheet containing structurally defined element or component
- Y10T428/249994—Composite having a component wherein a constituent is liquid or is contained within preformed walls [e.g., impregnant-filled, previously void containing component, etc.]
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/25—Web or sheet containing structurally defined element or component and including a second component containing structurally defined particles
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/25—Web or sheet containing structurally defined element or component and including a second component containing structurally defined particles
- Y10T428/252—Glass or ceramic [i.e., fired or glazed clay, cement, etc.] [porcelain, quartz, etc.]
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/28—Web or sheet containing structurally defined element or component and having an adhesive outermost layer
- Y10T428/2848—Three or more layers
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
Definitions
- the present invention relates to composite laminates and to methods for manufacturing the same.
- the present invention relates to a composite laminate which shrinks less during firing and to a method for manufacturing the same.
- Glass ceramic multilayered circuit boards are generally formed by a sintering process, and they shrink during sintering in a direction perpendicular to the main faces of the boards (longitudinal shrinkage) and in a direction parallel to the main faces (transverse shrinkage).
- the current glass ceramic multilayered circuit boards have dimensional variations of approximately ⁇ 0.5%.
- Glass ceramic multilayered circuit boards having cavities for mounting necessary electronic components exhibit noticeable variations.
- Japanese Unexamined Patent Application Publication Nos. 5-102666 and 7-330445 disclose methods for making glass ceramic multilayered circuit boards having high dimensional accuracy.
- Japanese Unexamined Patent Application Publication No. 6-329476 discloses a method for making a glass ceramic multilayered circuit board having cavities. In each method, green sheets which cannot be sintered at the sintering temperature of a glass ceramic compact are laminated on one side or two sides of the glass ceramic compact, and powdered layers of the green sheets are removed after firing.
- a laminate of glass ceramic layers and alumina layers is fired to sinter only the glass ceramic layers so that the glass component contained in the glass ceramic layers penetrates unsintered alumina layers to bind the alumina layers.
- the glass component in the glass ceramic layers does not penetrate the entity of the alumina layers in this method. Therefore, unbounded portions of the alumina layers are removed and the surfaces are polished before conductive films for circuit patterns are formed.
- a composite laminate comprises first sheet layers including a first particulate aggregate and second sheet layers including a second particulate aggregate.
- Each internal second sheet layers is disposed between two first sheet layers and two of the second sheet layers are external constitute two main faces of the composite laminate.
- the thickness of the internal second sheet layers is greater than the thickness of the external second sheet layers.
- the first sheet layers and the second sheet layers are bonded to each other by penetration of a part of the first particulate aggregate contained in the first sheet layers into the second sheet layers.
- the thickness of the internal second sheet layers is about 1.75 to 2.67 times the thickness of the external second sheet layers.
- the first sheet layers have substantially the same thickness.
- the first particulate aggregate contains glass and the second particulate aggregate contains powdered ceramic.
- the composite laminate may further comprises a conductive film at one of the interior and the exterior thereof, wherein the first sheet layers, the second sheet layers, and the conductive film constitute a circuit board.
- the composite laminate may further comprises a cavity having an opening at least at one main face thereof.
- a method for manufacturing a composite laminate comprises a first step of preparing a green composite laminate including first green sheet layers containing a first particulate aggregate and second green sheet layers containing a second particulate aggregate unsinterable at a temperature for melting at least a part of the first particulate aggregate, wherein each second green sheet layer is disposed between two first green sheet layers, two of the second sheet layers constitute two main faces of the green composite laminate, and the thickness of the second sheet layers laminated in the interior of the green composite laminate is greater than the thickness of the second sheet layers disposed on the main face of the green composite laminate; and a second step of firing the green composite laminate at a temperature capable of melting a part of the first particulate aggregate and incapable of sintering the second particulate aggregate so that the part of the first particulate aggregate contained in the first green sheets is melted and penetrates the second green sheet layers to bond the first green sheet layers and the second sheet layers.
- the thickness of the second sheet layers laminated in the interior of the green composite laminate is about 1.75 to 2.67 times the thickness of the second sheet layers on the two main faces of the green composite laminate.
- the first step comprises a first sub-step of forming each of the second green sheet layers on each of the first green sheet layers to form a plurality of first green composite stocks, a second sub-step of laminating the plurality of first green composite stocks to form a plurality of second green composite stocks so that the two first green sheets come into contact with each other, and a third sub-step of laminating the plurality of second green composite stocks so that the two second green sheets come into contact with each other.
- the first step comprises a first sub-step of forming each of the first green sheet layers on each of the second green sheet layers to form a plurality of first green composite stocks, a second sub-step of laminating the plurality of first green composite stocks to form a plurality of second green composite stocks so that the two second green sheets come into contact with each other, and a third sub-step of laminating the plurality of second green composite stocks so that the two first green sheets come into contact with each other.
- the thicknesses of the first green sheet layers are substantially the same in the first step.
- the first particulate aggregate comprises glass as a primary component and the second particulate aggregate comprises powdered ceramic as a primary component.
- a method for manufacturing a composite laminate comprises a first step comprising the sub-steps of preparing a first particulate aggregate, preparing a second particulate aggregate which is unsinterable at a temperature for melting at least a part of the first particulate aggregate, forming first green sheets containing the first particulate aggregate, forming each of second green sheets containing the second particulate aggregate on each of the first green sheets to form a plurality of first green composite stocks, and laminating the plurality of first green composite stocks to form a green composite laminate so that the two adjacent first green sheets form each of first green sheet layers and the two adjacent second green sheets form each of second green sheet layers; and a second step of firing the green composite laminate at a temperature capable of melting a part of the first particulate aggregate and incapable of sintering the second particulate aggregate so that the part of the first particulate aggregate contained in the first green sheet layers is melted and penetrates the second green sheet layers to bond the first green sheet layers and the second sheet layers
- the first green sheet is resistant to a solvent contained in a slurry which is used for forming the second green sheet in the first step.
- the thicknesses of the first green sheet layers are substantially the same in the first step.
- the first particulate aggregate comprises glass as a primary component and the second particulate aggregate comprises powdered ceramic as a primary component.
- a method for manufacturing a composite laminate comprises a first step comprising the sub-steps of preparing a first particulate aggregate, preparing a second particulate aggregate which is unsinterable at a temperature for melting at least a part of the first particulate aggregate, forming second green sheets containing the second particulate aggregate, forming each of first green sheets containing the first particulate aggregate on each of the second green sheets to form a plurality of first green composite stocks, and laminating the plurality of first green composite stocks to form a green composite laminate so that the two adjacent first green sheets form each of first green sheet layers and the two adjacent second green sheets form each of second green sheet layers; and a second step of firing the green composite laminate at a temperature capable of melting a part of the first particulate aggregate and incapable of sintering the second particulate aggregate so that the part of the first particulate aggregate contained in the first green sheet layers is melted and penetrates the second green sheet layers to bond the first green sheet layers and the second sheet layers
- the second green sheet is resistant to a solvent contained in a slurry which is used for forming the first green sheet in the first step.
- the thicknesses of the first green sheet layers are substantially the same in the first step.
- the first particulate aggregate comprises glass as a primary component and the second particulate aggregate comprises powdered ceramic as a primary component.
- the composite laminate of the present invention exhibits reduced transverse shrinkage and high dimensional accuracy. Moreover, the composite laminate after the firing step can be used without additional steps, such as a removal step and a resin-loading step.
- the first sheet layers have substantially the same thickness
- the first sheet layers have substantially the same transverse shrinkage in the firing step
- the second sheet layers suppress the transverse shrinkage.
- warping and distortion due to transverse shrinkage are suppressed.
- the method in accordance with the present invention does not include the removal step of the second sheet layers and the resin-loading step, conductive films formed on the composite laminate and the composite laminate can be simultaneously fired.
- the transverse shrinkage and dimensional variation readily occur in conventional composite laminates having cavities.
- the composite laminate of the present invention exhibits reduced transverse shrinkage and dimensional variations even when the composite laminate has a cavity due to the above configuration.
- the second particulate aggregate contained in the second sheet layer may have any property, for example, insulating, dielectric, piezoelectric or magnetic property.
- the resulting composite laminate can exhibit a specific electromagnetic property.
- An appropriate combination of these properties can produce, for example, an L-C-R composite substrate.
- the composite laminate can have high mechanical strength.
- the composite laminate can have a specific optical function.
- FIG. 1 is a cross-sectional view of a composite laminate of a first embodiment in accordance with the present invention
- FIG. 2 is a cross-sectional view of a composite laminate of a second embodiment in accordance with the present invention.
- FIG. 3 is a cross-sectional view of a composite laminate of a third embodiment in accordance with the present invention.
- FIG. 4 is a cross-sectional view of a composite laminate of a fourth embodiment in accordance with the present invention.
- FIGS. 5A to 5 D are cross-sectional views for illustrating a method for manufacturing the composite laminate of the first embodiment of the present invention
- FIGS. 6A to 6 C are cross-sectional views for illustrating a method for manufacturing the composite laminate of the third embodiment of the present invention.
- FIG. 7 is a cross-sectional view for illustrating a method for manufacturing the composite laminate of the fourth embodiment of the present invention.
- the composite laminate in accordance with the present invention may have a variety of preferred embodiments. Four typical embodiments will be described with reference to FIGS. 1 to 4 .
- the composite laminate includes first sheet layers 2 , each composed of a first particulate aggregate, and second sheet layers 3 a and 3 b , each composed of a second particulate aggregate.
- a composite laminate 1 includes the first sheet layers 2 , each composed of the first particulate aggregate, and the second sheet layers 3 a and 3 b , each composed of the second particulate aggregate.
- the first sheet layers 2 and the second sheet layers 3 a are alternately stacked and the second sheet layers 3 b are stacked on the outer faces of the outermost first sheet layers 2 to form two main faces of the composite laminate 1 .
- the thickness A of the second sheet layers 3 a is greater than the thickness B of the second sheet layers 3 b .
- the thicknesses C 1 to C 4 of the second sheet layers 3 b are preferably greater than the thickness A of the second sheet layers 3 a .
- the thicknesses C 1 to C 4 of the second sheet layers 3 b are preferably identical.
- a composite laminate 11 includes the composite laminate 1 shown in FIG. 1 and conductive films 4 provided on both main faces thereof.
- the conductive films 4 are formed by a screen printing process using an Ag paste and have predetermined patterns.
- the Ag paste may be replaced with, for example, an Ag—Pd paste, an Ag—Pt paste, a Cu paste or a Ni paste.
- a composite laminate 21 includes first sheet layers 2 and second sheet layers 3 a and 3 b .
- Each first sheet layer 2 includes a conductive film 5 therein.
- Each conductive film 5 has a predetermined pattern.
- a composite laminate 31 includes a cavity 6 having an opening at one main face thereof.
- the cavity 6 has a predetermined depth and predetermined transverse dimensions.
- the composite laminate 31 includes conductive films 4 , as in the composite laminate 11 .
- the first particulate aggregate in the first sheet layers 2 partly penetrates the entity of the second sheet layers 3 a and 3 b so that the second particles are completely bounded by the first sheet layer material.
- the thicknesses of the second sheet layers 3 a and 3 b are preferably lower than the thicknesses of the first sheet layers 2 to ensure penetration of the first sheet layer material.
- the thicknesses of the second sheet layers 3 a stacked in the composite laminates 1 , 11 , 21 and 31 are greater than the thicknesses of the second sheet layers 3 b stacked on the main faces of the composite laminates 1 , 11 , 21 and 31 . If the thicknesses of the second sheet layers 3 a are less, the composite laminates 1 , 11 , 21 and 31 will shrink transversely in the vicinity of the center thereof. When the thicknesses of the second sheet layers 3 a stacked in the interior are sufficiently great, warping and distortion due to transverse shrinkage are suppressed. In such a case, however, the first particulate aggregate does not penetrate the entity of the second sheet layers 3 a and 3 b, reducing bonding force between sheets.
- the thicknesses of the second sheet layers 3 a stacked in the interior of the composite laminates 1 , 11 , 21 and 31 are preferably about 1.75 times to 2.67 times or more, preferably about 2.0 times, greater than the thicknesses of the second sheet layers 3 b.
- the first sheet layers 2 have substantially the same thickness.
- the first sheet layers 2 exhibits substantially the same thermal shrinkage in the firing step while the second sheet layers 3 a and 3 b suppresses the transverse shrinkage of the first sheet layers 2 , resulting in suppressed warping and distortion due to longitudinal and transverse shrinkage of the sintered composite laminates 1 , 11 , 21 and 31 .
- the first particulate aggregate in the first sheet layers 2 include glass and the second particulate aggregate in the second sheet layers 3 a and 3 b include ceramic powder.
- the glass in the first sheet layers 2 penetrates the second sheet layers 3 a and 3 b to make the second sheet layers 3 a and 3 b more dense.
- these conductive films 4 and/or 5 are formed by applying a powdered metal paste on the main and/or internal faces of the green composite, and then by sintering the paste in the firing step of the green composite.
- the conductive films 4 are provided on the two main faces of the composite laminate 11 .
- a conductive film 4 may be formed on only one main face of the composite laminate 11 .
- the position of the conductive film 4 is 10 also not limited.
- the positions and number of the conductive films 5 provided in the interior of the composite laminate 21 are not limited.
- the positions and the number of the conductive films 4 and 5 may be changed in the composite laminate 31 having the cavity 6 .
- the conductive films 4 and 5 may be omitted in the composite laminate 31 .
- These composites may have through holes and/or via holes for electrically connecting conductive films formed on different layers.
- FIGS. 5A to 5 D, 6 A to 6 C, and 7 Methods for manufacturing the composite laminates in accordance with the present invention will now be described with reference to FIGS. 5A to 5 D, 6 A to 6 C, and 7 , for the composite laminates 1 , 21 and 31 shown in FIGS. 1, 3 and 4 , respectively.
- a green sheet is formed using a slurry containing a second particulate aggregate, and another sheet is formed on the green sheet using a slurry containing a first particulate aggregate.
- the laminated sheet is cut into a predetermined size to form first green composite stocks 1 a, each including a second green sheet 13 b containing the second particulate aggregate and a first green sheet 12 a containing the first particulate aggregate on the second green sheet 13 b , as shown in FIG. 5 A.
- first green composite stocks 1 a are laminated to form a second green composite stock 1 b so that the first green sheets 12 a are bonded to each other by pressure.
- the bonded first green sheets 12 a are combined to form a first green sheet layer 12 .
- two second green composite stocks 1 b are laminated to form a green composite unit 1 c so that the second green sheets 13 b are bonded to each other by pressure.
- the bonded second green sheets 13 b are combined to form a second green sheet layer 13 a.
- two green composite units 1 c are laminated to form a green composite laminate so that the second green sheets 13 b are bonded to each other by pressure.
- the green composite laminate is fired to form the composite laminate 1 shown in FIG. 1 .
- FIG. 3 The method for manufacturing the composite laminate 21 shown in FIG. 3 is described with reference to FIGS. 6A to 6 C.
- Components having the same functions as in FIGS. 5A to 5 D are referred to with the same reference numerals, and a detailed description thereof with reference to drawings is omitted.
- a conductive film 15 is formed on the first green sheet 12 a of the first green composite stock 1 a shown in FIG. 5A to form a first green composite stock 21 a. Since the conductive film 15 has a predetermined pattern, the first green sheet 12 a may be partly exposed on one main face of the first green composite stock 21 a.
- another first green composite stock 1 a and the first green composite stock 21 a are laminated to form a second green composite stock 21 b so that the two first green sheets 12 a are bonded to each other via the conductive film 15 by pressure.
- the two first green sheets 12 a are combined to form a first green sheet layer 12 including the conductive film 15 .
- the two second green composite stocks 21 b are laminated to form a green composite unit 21 c so that the second green sheets 13 b are bonded to each other by pressure.
- the two second green sheets 13 b are combined to form a second green sheet layer 13 a.
- Two green composite units 21 c are laminated to form a green composite laminate so that the two second green sheets 13 b are bonded to each other by pressure.
- the green composite laminate is fired to form the composite laminate 21 shown in FIG. 3 .
- FIG. 7 The method for manufacturing the composite laminate 31 is described with reference to FIG. 7 .
- Components having the same functions as in FIGS. 5A to 5 D and 6 A to 6 C are referred to with the same reference numerals, and a detailed description thereof with reference to drawings is omitted.
- a green composite unit 21 c shown in FIG. 6C is prepared.
- a conductive film 14 is formed by printing on one main face of the green composite unit 21 c using a conductive paste.
- a cavity 16 having an opening at the main face provided with the conductive film 14 is formed by punching to form a green composite unit 31 a.
- the green composite unit 31 a and a green composite unit 21 c shown in FIG. 6C are laminated to form a green composite laminate so that two second green sheets 13 b are bonded to each other by pressure.
- the green composite laminate is fired to form the composite laminate 31 shown in FIG. 4 .
- the first green sheets 12 a are formed on the second green sheets 13 b to form the first green composite stocks 1 a and 21 a.
- the second green sheets 13 b may be formed on the first green sheets 12 a.
- the first green sheet 12 a and the second green sheet 13 b may be formed by a doctor blade process, a gravure process, a dipping process, a spray process, a rolling process, a thin-film forming process or a powder compression process.
- the first sheet be resistant to the solvent which is used in the slurry for forming the second sheet.
- the second green sheet 13 b is resistant to the solvent which is used in the slurry for forming the first green sheet 12 a . If the first sheet is not resistant to the solvent, the first sheet will dissolve in the solvent contained in the second sheet, and the second sheet will not be satisfactorily laminated.
- the conductive film 5 is formed on the first green sheet 12 a .
- the position and the shape of the conductive film 15 are not limited to the above embodiments.
- the conductive film may be formed on the second green sheet 13 b of the first green composite stock 1 a shown in FIG. 5 A.
- the composite laminates are schematically shown in FIGS. 1 to 4 . Since the first particulate aggregate contained in the green first sheet layer 2 partly penetrates the second sheet layers 3 a and 3 b during firing, the boundaries between the first sheet layer 2 and the second sheet layers 3 a and 3 b may not be always as distinct as illustrated in FIGS. 1 to 4 .
- Seven composite laminates 1 were prepared as follows to measure transverse shrinkage factors, in which the second sheet layers 3 a laminated in the interior of the composite laminates 1 and the second sheet layers 3 b formed on the main faces of the composite laminates 1 had different thicknesses.
- a second slurry including a second particulate aggregate was prepared by mixing and dispersing 100 parts by weight of alumina powder having a particle diameter of 0.5 ⁇ m as second particles, 45 parts by weight of water as a dispersant, 50 parts by weight of polyalkylene glycol as another dispersant, and 15 parts by weight of urethane resin emulsion as a binder.
- the second slurry may contain plasticizers, defoamers and tackifiers.
- the second slurry was applied and dried onto a polyethylene terephthalate (PET) film by a gravure process to form green sheets as second green sheets, each having a thickness of 1.0 ⁇ m, 1.5 ⁇ m, 2.0 ⁇ m or 4.0 ⁇ m.
- PET polyethylene terephthalate
- the urethane resin emulsion was converted into water-insoluble gel during the drying step.
- these green sheets were resistant to an aqueous slurry.
- a first slurry including a first particulate aggregate was prepared by mixing and dispersing 60 parts by weight of B—Si—Ca—Al—O-based glass having a diameter of 3.0 ⁇ m as first particles, 40 parts by weight of alumina powder having a diameter of 0.5 ⁇ m also as first particles, 36 parts by weight of water as a dispersant, 1 part by weight of polyalkylene glycol as another dispersant, and 12 parts by weight of urethane resin emulsion as a binder.
- the first slurry may contain plasticizers, defoamers and tackifiers.
- the first slurry was applied onto one main face of each green sheet as the second green sheet to form a green sheet having a thickness of 75 ⁇ m as a first green sheet.
- First green composites were thereby prepared.
- the two first green composites were laminated at 60° C. and 2,000 kgf/cm 2 to form a second green composite so that the first green sheets were bonded to each other.
- these two first green sheets having a thickness of 75 ⁇ m were combined by pressure to form a first green sheet layer having a thickness of 140 ⁇ m.
- Three second green composites were laminated at 60° C. and 100 kgf/cm 2 so that the second green sheets were bonded to each other by pressure.
- the composite was cut into a square of 100 mm ⁇ 100 mm to form a green composite laminate.
- the adjacent two second green sheets were combined to form a second green sheet layer.
- a laminate (sample No. 8) having a thickness of 420 ⁇ m was formed by preparing six green sheets, each having a thickness of 75 ⁇ m, using the first slurry, laminating the six green sheets at 60° C. under a pressure of 100 kgf/cm 2 , and cutting the laminate into a square of 100 mm ⁇ 100 mm.
- the resulting green composite laminates (sample Nos. 1 to 7) and the green laminate (sample No. 8) were fired at a temperature in a range of 700° C. to 1,000° C., for example, at 850° C. for 2 hours in air to form composite laminates (sample Nos. 1 to 7) and a laminate (sample No. 8).
- the alumina particles contained in the first particulate aggregate and the second particulate aggregate were not sintered during the firing step, whereas the glass powder contained in the first particulate aggregate was melted and penetrated the second sheet layers from the first sheet layers. After cooling, the melt glass was solidified to bind the first sheet layers and the second sheet layers.
- A indicates that the sample has a small transverse shrinkage factor and high dimensional accuracy
- B indicates that the sample has a small transverse shrinkage factor and average dimensional accuracy
- C indicates that the sample has a large transverse shrinkage factor and poor dimensional accuracy.
- the second sheet layers are provided in order to suppress the longitudinal shrinkage.
- the thickness of the first green sheet layer decreases from 140 ⁇ m to 100 ⁇ m by longitudinal shrinkage during firing.
- the total thicknesses of the composite laminates in sample Nos. 1 to 7 and the laminate in sample No. 8 are shown in Table 1.
- the green second sheet layer does not substantially shrink longitudinally during firing.
- each of sample Nos. 1, 4, 5, 6 and 7 has a ratio of the thickness of the internal second sheet layer to the thickness of the external second sheet layer of 1.0 or more, can be sintered at 850° C., and exhibits a small transverse shrinkage factor within a range of 0.3% to 1.4%.
- sample No. 8 exhibits a transverse shrinkage factor as high as 11.0%.
- each of sample Nos. 1, 5 and 7 has a ratio in a range of 1.75 to 2.67, can be sintered at 850° C., and exhibits a particularly small transverse shrinkage factor within a range of 0.3% to 0.5%. These composites, therefore, show high dimensional accuracy.
- Sample No. 2 which can be sintered at 850° C., exhibits a transverse shrinkage factor of 2.3%, which is two times that of sample No. 4. This composite does not show satisfactory dimensional accuracy.
- Sample No. 3 which exhibits a small transverse shrinkage factor of 0.3%, cannot be sintered at 850° C. and must be sintered at 900° C.
- the first particulate aggregate contained in the first sheet layer and the second particulate aggregate contained in the second sheet layer may be particulate aggregates of MgO, ZrO 2 , SiO 2 , TiO 2 , BaTiO 3 , SrTiO 3 , MgO 3 , Fe 2 O 3 , RuO, (Zr,Ti)O 3 , B 4 C, SiC and/or WC.
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Ceramic Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Materials Engineering (AREA)
- Structural Engineering (AREA)
- Organic Chemistry (AREA)
- Inorganic Chemistry (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Computer Hardware Design (AREA)
- General Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Laminated Bodies (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US10/192,594 US6984441B2 (en) | 1999-10-28 | 2002-07-11 | Composite laminate and method for manufacturing the same |
US11/240,388 US20060046040A1 (en) | 1999-10-28 | 2005-10-03 | Composite laminate and method for manufacturing the same |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP11-307803 | 1999-10-28 | ||
JP30780399A JP3554962B2 (ja) | 1999-10-28 | 1999-10-28 | 複合積層体およびその製造方法 |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US10/192,594 Division US6984441B2 (en) | 1999-10-28 | 2002-07-11 | Composite laminate and method for manufacturing the same |
Publications (1)
Publication Number | Publication Date |
---|---|
US6579392B1 true US6579392B1 (en) | 2003-06-17 |
Family
ID=17973422
Family Applications (3)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US09/698,394 Expired - Lifetime US6579392B1 (en) | 1999-10-28 | 2000-10-27 | Composite laminate and method for manufacturing the same |
US10/192,594 Expired - Lifetime US6984441B2 (en) | 1999-10-28 | 2002-07-11 | Composite laminate and method for manufacturing the same |
US11/240,388 Abandoned US20060046040A1 (en) | 1999-10-28 | 2005-10-03 | Composite laminate and method for manufacturing the same |
Family Applications After (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US10/192,594 Expired - Lifetime US6984441B2 (en) | 1999-10-28 | 2002-07-11 | Composite laminate and method for manufacturing the same |
US11/240,388 Abandoned US20060046040A1 (en) | 1999-10-28 | 2005-10-03 | Composite laminate and method for manufacturing the same |
Country Status (6)
Country | Link |
---|---|
US (3) | US6579392B1 (fr) |
EP (1) | EP1096558B1 (fr) |
JP (1) | JP3554962B2 (fr) |
KR (1) | KR100375862B1 (fr) |
CN (1) | CN1251562C (fr) |
DE (1) | DE60027385T2 (fr) |
Cited By (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20020062552A1 (en) * | 2000-11-27 | 2002-05-30 | Murata Manufacturing Co., Ltd. | Multilayered ceramic substrate and production method therefor |
US20020189742A1 (en) * | 2001-06-05 | 2002-12-19 | Yoichi Moriya | Glass ceramic multilayer substrate manufacturing method and glass ceramic multilayer substrate product |
US20030100146A1 (en) * | 2001-11-22 | 2003-05-29 | Sumitomo Metal (Smi) Electronics Devices Inc. | Method of fabricating multilayer ceramic substrate |
US20040159390A1 (en) * | 2001-10-01 | 2004-08-19 | Heraeus Incorporated | Methods for making and using self-constrained low temperature glass-ceramic unfired tape for microelectronics |
US20050126682A1 (en) * | 2001-04-04 | 2005-06-16 | Murata Manufacturing Co., Ltd. | Monolithic ceramic substrate and method for making the same |
US20060028553A1 (en) * | 1998-10-30 | 2006-02-09 | Kurumi Mori | Management and setting of photographing condition of image sensing apparatus |
US20090035560A1 (en) * | 2006-01-05 | 2009-02-05 | Christian Block | Monolithic Ceramic Component and Production Method |
US10485099B2 (en) | 2016-04-28 | 2019-11-19 | Murata Manufacturing Co., Ltd. | Multilayer ceramic substrate |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3633435B2 (ja) | 2000-04-10 | 2005-03-30 | 株式会社村田製作所 | 多層セラミック基板、その製造方法および設計方法、ならびに電子装置 |
DE10252636A1 (de) * | 2002-11-11 | 2004-05-19 | Epcos Ag | Keramisches Vielschichtsubstrat und Verfahren zu dessen Herstellung |
JP4687333B2 (ja) * | 2005-08-29 | 2011-05-25 | 株式会社村田製作所 | 多層セラミック基板およびその製造方法 |
KR100807316B1 (ko) | 2006-11-14 | 2008-02-28 | 주식회사 삼전 | 전류-전압 발생용 적층형 압전소자의 구조 |
CN104022320A (zh) * | 2008-10-20 | 2014-09-03 | 斯盖沃克斯瑟路申斯公司 | 磁-介电组件及制造方法 |
KR100983125B1 (ko) * | 2008-10-28 | 2010-09-17 | 삼성전기주식회사 | 다층 세라믹 기판의 제조방법 |
Citations (18)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4868711A (en) * | 1987-09-29 | 1989-09-19 | Mitsubishi Mining And Cement Co. Ltd. | Multilayered ceramic capacitor |
US5102720A (en) * | 1989-09-22 | 1992-04-07 | Cornell Research Foundation, Inc. | Co-fired multilayer ceramic tapes that exhibit constrained sintering |
JPH05102666A (ja) | 1991-10-04 | 1993-04-23 | Matsushita Electric Ind Co Ltd | 多層セラミツク基板の製造方法 |
JPH05136572A (ja) | 1991-11-15 | 1993-06-01 | Matsushita Electric Ind Co Ltd | 多層セラミツク基板の製造方法 |
JPH06329476A (ja) | 1993-05-25 | 1994-11-29 | Sumitomo Kinzoku Ceramics:Kk | セラミックス基板の製造方法 |
US5370759A (en) * | 1992-05-20 | 1994-12-06 | Matsushita Electric Industrial Co., Ltd. | Method for producing multilayered ceramic substrate |
US5456778A (en) * | 1992-08-21 | 1995-10-10 | Sumitomo Metal Ceramics Inc. | Method of fabricating ceramic circuit substrate |
US5470412A (en) * | 1992-07-30 | 1995-11-28 | Sumitomo Metal Ceramics Inc. | Process for producing a circuit substrate |
US5474741A (en) * | 1990-10-04 | 1995-12-12 | E. I. Du Pont De Nemours And Company | Method for reducing shrinkage during firing of ceramic bodies |
JPH07330445A (ja) | 1994-06-10 | 1995-12-19 | Sumitomo Metal Ind Ltd | セラミックス基板の製造方法 |
JPH09266363A (ja) | 1996-03-28 | 1997-10-07 | Sumitomo Kinzoku Electro Device:Kk | セラミック回路基板及びその製造方法 |
US5814366A (en) * | 1995-07-17 | 1998-09-29 | Sumitomo Metal Electronics Devices Inc. | Method of manufacturing multilayered ceramic substrate |
US6139666A (en) * | 1999-05-26 | 2000-10-31 | International Business Machines Corporation | Method for producing ceramic surfaces with easily removable contact sheets |
US6228196B1 (en) * | 1998-06-05 | 2001-05-08 | Murata Manufacturing Co., Ltd. | Method of producing a multi-layer ceramic substrate |
US6241838B1 (en) * | 1997-09-08 | 2001-06-05 | Murata Manufacturing Co., Ltd. | Method of producing a multi-layer ceramic substrate |
US6245185B1 (en) * | 1999-07-15 | 2001-06-12 | International Business Machines Corporation | Method of making a multilayer ceramic product with thin layers |
US6306511B1 (en) * | 1999-07-27 | 2001-10-23 | Murata Manufacturing Co., Ltd. | Hybrid laminate and manufacturing method therefor |
US6337123B1 (en) * | 1999-10-21 | 2002-01-08 | Murata Manufacturing Co., Ltd. | Multilayered ceramic substrate and method of producing the same |
Family Cites Families (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5563900A (en) * | 1978-11-08 | 1980-05-14 | Fujitsu Ltd | Multilyaer ceramic circuit board |
DE3522703A1 (de) * | 1985-06-25 | 1987-01-08 | Leitron Leiterplatten | Leiterplatte mit keramischen chip-traeger-material |
KR100200902B1 (ko) * | 1990-09-19 | 1999-06-15 | 가나이 쓰도무 | 다층세라믹 소결체 및 그 제조방법 |
EP0535711A3 (en) * | 1991-10-04 | 1993-12-01 | Matsushita Electric Ind Co Ltd | Method for producing multilayered ceramic substrate |
JPH05335183A (ja) * | 1992-05-28 | 1993-12-17 | Murata Mfg Co Ltd | 多層基板を備えた電子部品及びその製造方法 |
JP3003413B2 (ja) * | 1992-09-21 | 2000-01-31 | 松下電器産業株式会社 | 多層セラミック基板の製造方法 |
US5632942A (en) * | 1993-05-24 | 1997-05-27 | Industrial Technoology Research Institute | Method for preparing multilayer ceramic/glass substrates with electromagnetic shielding |
JPH07312511A (ja) * | 1994-05-19 | 1995-11-28 | Matsushita Electric Ind Co Ltd | マイクロ波用多層複合基板およびその製造方法 |
JP3961033B2 (ja) | 1995-02-27 | 2007-08-15 | 京セラ株式会社 | 積層ガラス−セラミック回路基板 |
WO1996039298A1 (fr) * | 1995-06-06 | 1996-12-12 | Sarnoff Corporation | Procede de reduction de la contraction laterale de plaquettes de circuits multicouches montees sur un support |
US5740603A (en) * | 1995-07-31 | 1998-04-21 | Samsung Electro-Mechanics Co., Ltd. | Method for manufacturing low dielectric constant multiple layer ceramic circuit board |
US5708570A (en) * | 1995-10-11 | 1998-01-13 | Hughes Aircraft Company | Shrinkage-matched circuit package utilizing low temperature co-fired ceramic structures |
US6042667A (en) * | 1996-03-13 | 2000-03-28 | Sumotomo Metal Electronics Devices, Inc. | Method of fabricating ceramic multilayer substrate |
JP3601671B2 (ja) * | 1998-04-28 | 2004-12-15 | 株式会社村田製作所 | 複合積層体の製造方法 |
JP2961230B1 (ja) * | 1998-07-13 | 1999-10-12 | 工業技術院長 | 金属超微粒子分散体及びその製造方法 |
US6592696B1 (en) * | 1998-10-09 | 2003-07-15 | Motorola, Inc. | Method for fabricating a multilayered structure and the structures formed by the method |
-
1999
- 1999-10-28 JP JP30780399A patent/JP3554962B2/ja not_active Expired - Fee Related
-
2000
- 2000-10-27 KR KR10-2000-0063464A patent/KR100375862B1/ko active IP Right Grant
- 2000-10-27 US US09/698,394 patent/US6579392B1/en not_active Expired - Lifetime
- 2000-10-30 EP EP00123653A patent/EP1096558B1/fr not_active Expired - Lifetime
- 2000-10-30 CN CNB001337831A patent/CN1251562C/zh not_active Expired - Lifetime
- 2000-10-30 DE DE60027385T patent/DE60027385T2/de not_active Expired - Lifetime
-
2002
- 2002-07-11 US US10/192,594 patent/US6984441B2/en not_active Expired - Lifetime
-
2005
- 2005-10-03 US US11/240,388 patent/US20060046040A1/en not_active Abandoned
Patent Citations (18)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4868711A (en) * | 1987-09-29 | 1989-09-19 | Mitsubishi Mining And Cement Co. Ltd. | Multilayered ceramic capacitor |
US5102720A (en) * | 1989-09-22 | 1992-04-07 | Cornell Research Foundation, Inc. | Co-fired multilayer ceramic tapes that exhibit constrained sintering |
US5474741A (en) * | 1990-10-04 | 1995-12-12 | E. I. Du Pont De Nemours And Company | Method for reducing shrinkage during firing of ceramic bodies |
JPH05102666A (ja) | 1991-10-04 | 1993-04-23 | Matsushita Electric Ind Co Ltd | 多層セラミツク基板の製造方法 |
JPH05136572A (ja) | 1991-11-15 | 1993-06-01 | Matsushita Electric Ind Co Ltd | 多層セラミツク基板の製造方法 |
US5370759A (en) * | 1992-05-20 | 1994-12-06 | Matsushita Electric Industrial Co., Ltd. | Method for producing multilayered ceramic substrate |
US5470412A (en) * | 1992-07-30 | 1995-11-28 | Sumitomo Metal Ceramics Inc. | Process for producing a circuit substrate |
US5456778A (en) * | 1992-08-21 | 1995-10-10 | Sumitomo Metal Ceramics Inc. | Method of fabricating ceramic circuit substrate |
JPH06329476A (ja) | 1993-05-25 | 1994-11-29 | Sumitomo Kinzoku Ceramics:Kk | セラミックス基板の製造方法 |
JPH07330445A (ja) | 1994-06-10 | 1995-12-19 | Sumitomo Metal Ind Ltd | セラミックス基板の製造方法 |
US5814366A (en) * | 1995-07-17 | 1998-09-29 | Sumitomo Metal Electronics Devices Inc. | Method of manufacturing multilayered ceramic substrate |
JPH09266363A (ja) | 1996-03-28 | 1997-10-07 | Sumitomo Kinzoku Electro Device:Kk | セラミック回路基板及びその製造方法 |
US6241838B1 (en) * | 1997-09-08 | 2001-06-05 | Murata Manufacturing Co., Ltd. | Method of producing a multi-layer ceramic substrate |
US6228196B1 (en) * | 1998-06-05 | 2001-05-08 | Murata Manufacturing Co., Ltd. | Method of producing a multi-layer ceramic substrate |
US6139666A (en) * | 1999-05-26 | 2000-10-31 | International Business Machines Corporation | Method for producing ceramic surfaces with easily removable contact sheets |
US6245185B1 (en) * | 1999-07-15 | 2001-06-12 | International Business Machines Corporation | Method of making a multilayer ceramic product with thin layers |
US6306511B1 (en) * | 1999-07-27 | 2001-10-23 | Murata Manufacturing Co., Ltd. | Hybrid laminate and manufacturing method therefor |
US6337123B1 (en) * | 1999-10-21 | 2002-01-08 | Murata Manufacturing Co., Ltd. | Multilayered ceramic substrate and method of producing the same |
Cited By (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20060028553A1 (en) * | 1998-10-30 | 2006-02-09 | Kurumi Mori | Management and setting of photographing condition of image sensing apparatus |
US20020062552A1 (en) * | 2000-11-27 | 2002-05-30 | Murata Manufacturing Co., Ltd. | Multilayered ceramic substrate and production method therefor |
US6743316B2 (en) * | 2000-11-27 | 2004-06-01 | Murata Manufacturing Co. Ltd | Multilayered ceramic substrate and production method therefor |
US20050126682A1 (en) * | 2001-04-04 | 2005-06-16 | Murata Manufacturing Co., Ltd. | Monolithic ceramic substrate and method for making the same |
US20020189742A1 (en) * | 2001-06-05 | 2002-12-19 | Yoichi Moriya | Glass ceramic multilayer substrate manufacturing method and glass ceramic multilayer substrate product |
US6797093B2 (en) * | 2001-06-05 | 2004-09-28 | Murata Manufacturing Co., Ltd. | Glass ceramic multilayer substrate manufacturing method and glass ceramic multilayer substrate product |
US20040159390A1 (en) * | 2001-10-01 | 2004-08-19 | Heraeus Incorporated | Methods for making and using self-constrained low temperature glass-ceramic unfired tape for microelectronics |
US6949156B2 (en) * | 2001-10-01 | 2005-09-27 | Heraeus Incorporated | Methods for making and using self-constrained low temperature glass-ceramic unfired tape for microelectronics |
US20050199331A1 (en) * | 2001-11-22 | 2005-09-15 | Murata Manufacturing Co., Ltd. | Method of fabricating multilayer ceramic substrate |
US6852569B2 (en) * | 2001-11-22 | 2005-02-08 | Murata Manufacturing Co., Ltd. | Method of fabricating multilayer ceramic substrate |
US20030100146A1 (en) * | 2001-11-22 | 2003-05-29 | Sumitomo Metal (Smi) Electronics Devices Inc. | Method of fabricating multilayer ceramic substrate |
US7618843B2 (en) | 2001-11-22 | 2009-11-17 | Murata Manufacturing Co., Ltd | Method of fabricating multilayer ceramic substrate |
US20090035560A1 (en) * | 2006-01-05 | 2009-02-05 | Christian Block | Monolithic Ceramic Component and Production Method |
US9532454B2 (en) | 2006-01-05 | 2016-12-27 | Epcos Ag | Monolithic ceramic component and production method |
US10485099B2 (en) | 2016-04-28 | 2019-11-19 | Murata Manufacturing Co., Ltd. | Multilayer ceramic substrate |
US10638603B2 (en) | 2016-04-28 | 2020-04-28 | Murata Manufacturing Co., Ltd. | Multilayer ceramic substrate |
Also Published As
Publication number | Publication date |
---|---|
US20030159770A1 (en) | 2003-08-28 |
JP3554962B2 (ja) | 2004-08-18 |
KR100375862B1 (ko) | 2003-03-15 |
CN1251562C (zh) | 2006-04-12 |
JP2001121640A (ja) | 2001-05-08 |
CN1305339A (zh) | 2001-07-25 |
US20060046040A1 (en) | 2006-03-02 |
DE60027385D1 (de) | 2006-05-24 |
EP1096558A3 (fr) | 2004-09-22 |
DE60027385T2 (de) | 2006-11-09 |
EP1096558B1 (fr) | 2006-04-19 |
US6984441B2 (en) | 2006-01-10 |
EP1096558A2 (fr) | 2001-05-02 |
KR20010067367A (ko) | 2001-07-12 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US20060046040A1 (en) | Composite laminate and method for manufacturing the same | |
EP0954209B1 (fr) | Plaquette à circuit laminée et méthode de fabrication | |
KR100451955B1 (ko) | 세라믹 다층 기판의 제조방법 및 미소성의 복합 적층체 | |
KR101523630B1 (ko) | 적층형 세라믹 전자부품 | |
US20100038120A1 (en) | Layered ceramic electronic component and manufacturing method therefor | |
US6891109B2 (en) | Monolithic ceramic substrate and method for making the same | |
US20020026978A1 (en) | Multilayer ceramic substrate and manufacturing method therefor | |
WO2003072325A1 (fr) | Procede pour fabriquer un substrat multicouche ceramique et corps multicouche composite cru | |
US7169331B2 (en) | Conductive paste and ceramic multilayer substrate | |
JP2002299148A (ja) | 積層セラミックコンデンサ及びその製造方法 | |
JP4565383B2 (ja) | キャビティを備えた多層セラミック基板およびその製造方法 | |
GB2315458A (en) | Manufacturing a ceramic member | |
JP3327214B2 (ja) | 多層セラミック基板の製造方法 | |
JP4120270B2 (ja) | セラミック多層基板の製造方法 | |
JP4496529B2 (ja) | 多層セラミック基板の製造方法及び多層セラミック基板 | |
US20030168150A1 (en) | Method and constrain layer for reducing shrinkage during sintering low-temperature ceramic | |
JP2001085839A (ja) | 多層セラミック基板の製造方法 | |
JP2803754B2 (ja) | 多層電子回路基板 | |
EP1378347A1 (fr) | Procédé pour la diminution du retrait au frittage de céramiques cuités a basse température | |
JPH05234805A (ja) | 積層セラミックコンデンサ | |
JP2006156595A (ja) | コンデンサ内蔵配線基板 | |
JP2006278759A (ja) | 配線基板 | |
JP2006066743A (ja) | コンデンサ内蔵ガラスセラミック多層配線基板およびその製造方法 | |
JP2005129772A (ja) | コンデンサ内蔵ガラスセラミック多層配線基板 | |
JP2004063910A (ja) | セラミック積層体の製法 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
AS | Assignment |
Owner name: MURATA MANUFACTURING CO., LTD., JAPAN Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNORS:KAMEDA, HIROKAZU;NAKAO, SHUYA;KURODA, SHIGEYUKI;AND OTHERS;REEL/FRAME:011259/0599 Effective date: 20001012 |
|
STCF | Information on status: patent grant |
Free format text: PATENTED CASE |
|
FPAY | Fee payment |
Year of fee payment: 4 |
|
FEPP | Fee payment procedure |
Free format text: PAYOR NUMBER ASSIGNED (ORIGINAL EVENT CODE: ASPN); ENTITY STATUS OF PATENT OWNER: LARGE ENTITY |
|
FPAY | Fee payment |
Year of fee payment: 8 |
|
FPAY | Fee payment |
Year of fee payment: 12 |