US20100307728A1 - Heat dissipation device - Google Patents
Heat dissipation device Download PDFInfo
- Publication number
- US20100307728A1 US20100307728A1 US12/549,386 US54938609A US2010307728A1 US 20100307728 A1 US20100307728 A1 US 20100307728A1 US 54938609 A US54938609 A US 54938609A US 2010307728 A1 US2010307728 A1 US 2010307728A1
- Authority
- US
- United States
- Prior art keywords
- fins
- parts
- fin
- dissipation device
- heat dissipation
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
- H01L23/427—Cooling by change of state, e.g. use of heat pipes
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
- H01L23/3672—Foil-like cooling fins or heat sinks
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
- H01L23/467—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
- H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Definitions
- the present disclosure relates generally to a heat dissipation device and, more particularly, to a heat dissipation device comprising a plurality of individual fins assembled together for removing heat from a heat-generating electronic component to ambient environment.
- Heat dissipation devices are usually used to remove heat from heat-generating electronic components, such as central processing units (CPUs), light emitting diodes (LEDS) and power transistors, etc., to keep the components in stable operation.
- CPUs central processing units
- LEDS light emitting diodes
- power transistors etc.
- the heat dissipation device comprises a solid base, a plurality of fins horizontally arranged on the base, a plurality of heat pipes connecting the fins and the base together and a fan mounted to one side of the fins.
- the base contacts the heat-generating electronic components to absorb heat generated by the heat-generating electronic components.
- the heat pipes comprise evaporating sections embedded in the base and condensing sections extending perpendicularly and upwardly through the fins.
- the fins are spaced from each other individually and secured by being soldered to the condensing sections of the heat pipes.
- contacting areas between the fins and the heat pipes are so narrow that connective integrity thereof is too weak to securely assemble the fins together in use. As a result, the fins are in high risk of suffering disengagement from the heat pipes, thereby being forced into a sympathetic vibration and producing noise in response to high-frequency vibration from the running fan.
- FIG. 1 is an assembled view of a heat dissipation device in accordance with an embodiment of the present disclosure.
- FIG. 2 is an exploded view of the heat dissipation device of FIG. 1 .
- FIG. 3 is an elevation view of the heat dissipation device FIG. 1 , with a fan thereof being removed away for clarity.
- FIGS. 1-3 illustrate a heat dissipation device in accordance with an embodiment of the present disclosure.
- the heat dissipation device is provided for removing heat from a heat-generating component such as a CPU.
- the heat dissipation device comprises a base 10 , a fin unit 20 located over the base 10 , a plurality of heat pipes 30 thermally connecting the fin unit 20 and the base 10 together, a heat dissipating member 40 located between the fin unit 20 and the base 10 , a fan 50 and two fan holders 60 securing the fan 50 to rear sides of the fin unit 20 and the heat dissipating member 40 .
- the base 10 comprises a rectangular conducting plate 12 and four fixing legs 14 extending diagonally from four corners of the conducting plate 12 .
- the conducting plate 12 is made of material with a good heat conductivity such as copper and aluminum and defines a plurality of elongated receiving grooves 120 in a top surface thereof for receiving portions of the heat pipes 30 .
- the receiving grooves 120 are spaced from each other and parallel to two opposite sides of the conducting plate 12 .
- Four fixtures 100 respectively extend through distal ends of the fixing legs 14 and fixed in the fixing legs 14 for mounting the heat dissipation device onto the heat-generating component.
- the fin unit 20 comprises a plurality of fins 22 stacked vertically together.
- Each fin 22 is bent into a wave-shaped configuration and comprises a plurality of wave crests and wave troughs alternately arranged with each other.
- the wave crests of a lower one of the two fins 22 respectively engage the wave troughs of an upper one of the two fins 22
- the wave crests of the upper one are separated from and located over the corresponding wave troughs of the lower one, respectively, whereby a plurality of air passages are respectively defined between the corresponding wave crests of the upper one and the corresponding wave troughs of the lower one of the two neighboring fins 22 .
- the fins 22 are rectangular wave-shaped in profile; thus, the air passages each are rectangular in cross section.
- the fins 22 are divided into a plurality of pairs which are vertically stacked together.
- Each pair of fins 22 consists of a first fin 22 a and a second fin 22 b engaging a bottom of the first fin 22 a. Accordingly, the first fins 22 a and the second fins 22 b are alternately arranged when the pairs of the fins 22 are stacked together.
- the first fin 22 a and second fin 22 b of each pair of the fins 22 have the same configuration, but are arranged oppositely in the vertical direction.
- Each first fin 22 a comprises a main body 220 a and two engaging parts 222 at two opposite ends of the main body 220 a.
- Each main body 220 a of the first fin 22 a is bent into a wave-shaped configuration and comprises a plurality of first crest parts 221 a, a plurality of first trough parts 223 a and a plurality of first connecting parts 222 a interconnecting the first crest and trough parts 221 a, 223 a, respectively.
- the first crest and trough parts 221 a, 223 a are parallel, flatted plates and alternately arranged along a traverse direction of the first fin 22 a.
- the first connecting parts 222 a are perpendicular to the first crest and trough parts 221 a, 223 a and respectively connected to adjacent side edges of neighboring ones of the first crest and trough parts 221 a, 223 a.
- each second fin 22 b comprises a main body 220 b and two engaging parts 222 at two opposite ends of the main body 220 b.
- Each main body 220 b of the second fins 22 b is bent into a wave-shaped configuration and comprises a plurality of second crest parts 221 b, a plurality of second trough parts 223 b and a plurality of second connecting parts 222 b interconnecting the second crest and trough parts 221 b, 223 b.
- the second crest and trough parts 221 b, 223 b are parallel flatted plates and alternately arranged.
- the second connecting parts 222 b are perpendicular to the second crest and trough parts 221 b, 223 b and respectively connected to adjacent side edges of neighboring ones of the second crest and trough parts 221 b, 223 b.
- the two engaging parts 222 of each pair of the fins 22 at the same ends of the main bodies 220 a, 220 b of the fins 22 protrude away from each other and thus separated from each other.
- a plurality of receiving holes 226 spaced from each other are defined in the corresponding engaging parts 222 for receiving the heat pipes 30 .
- Each of the first and second fins 22 a, 22 b has an annular collar 2260 extending perpendicularly from an edge of the receiving hole 226 for enlarging a contacting area between the first and second fins 22 a, 22 b and the heat pipes 30 .
- the first trough parts 223 a of one of the first fins 22 a respectively engage the crest parts 221 b of the lower neighboring second fin 22 b, while the first crest parts 221 of the first fin 22 a are respectively separated from and located over the second trough parts 223 b of the lower neighboring second fin 22 b.
- the corresponding wave crest parts 221 a, 221 b and wave trough parts 223 a, 223 b have the same configuration and size and are fitly coupled with each other.
- a plurality of air paths 228 are respectively defined between the corresponding separated first crest parts 221 a and second trough parts 223 b and between the corresponding separated first trough parts 223 a and second crest parts 221 b of the neighboring first and second fins 22 .
- the two engaging parts 222 of the fins 22 at opposite ends of the main bodies 220 a, 220 b of the fins 22 are parallel to and spaced from each other with a constant distant.
- Each heat pipe 30 is U-shaped and comprises an evaporating section 32 and two condensing sections 34 extending upwardly and perpendicularly from two opposite ends of the evaporating section 32 .
- the evaporating sections 32 of the heat pipes 30 are respectively received in the receiving grooves 120 of the base 10 .
- the condensing sections 34 of the heat pipes 30 are respectively received in the receiving holes 226 of the engaging parts 222 of the fins 22 and intimately surrounded by the annular collars 2260 of the fins.
- the condensing sections 34 are parallel to each other and perpendicular to the fins 22 .
- the heat dissipating member 40 is formed by continuously folding a metallic sheet and comprises a plurality of vertical sheets 42 and a plurality of connecting flanges 44 interconnecting top edges or bottom edges of every two neighboring vertical sheets 42 .
- the heat dissipating member 40 is sandwiched between a bottom of the fin unit 20 and the top surface of the conducting plate 12 of the base 10 and located between the two condensing sections 34 of each heat pipes 30 .
- the vertical sheets 42 are perpendicular to the conducting plate 12 and the fins 22 .
- Lower ones of the connecting flanges 44 at the bottom edges of the vertical sheets 42 are intimately attached to the top surface of the conducting plate 12 and engage a top of the evaporating sections 32 of the heat pipes simultaneously.
- the fan 50 is mounted to rear sides of the fin unit 20 and the heat dissipating member 40 by the two fan holders 60 for producing an airflow through the air paths 228 of the fin unit 20 and the heat dissipating member 40 .
- heat generated by the heat-generating component is absorbed by the conducting plate 12 of the base 10 and then directly conducted to the heat dissipating member 40 and simultaneously distributed over fin unit 20 via the heat pipes 30 ; the heat is finally brought into ambient environment by the airflow produced by the fan 50 and passing through the fin unit 20 and the heat dissipating member 40 .
- the fins 22 are wave-shaped in profile and the crest parts and trough parts of the fins 22 are respectively coupled with each other to form a structure like a honeycomb, the fin unit 20 can have a firm structure and will not have a sympathetic resonance to produce an unbearable noise when the fin unit 20 is subject to a high-frequency vibration from the fan 50 in use.
- the fins 22 are in adequate contact with each other, whereby thermal resistant between the fins 22 are so low that heat from the heat pipes 30 can be more evenly and quickly distributed over the fin unit 20 .
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
Description
- 1. Technical Field
- The present disclosure relates generally to a heat dissipation device and, more particularly, to a heat dissipation device comprising a plurality of individual fins assembled together for removing heat from a heat-generating electronic component to ambient environment.
- 2. Description of Related Art
- Heat dissipation devices are usually used to remove heat from heat-generating electronic components, such as central processing units (CPUs), light emitting diodes (LEDS) and power transistors, etc., to keep the components in stable operation.
- Conventionally, the heat dissipation device comprises a solid base, a plurality of fins horizontally arranged on the base, a plurality of heat pipes connecting the fins and the base together and a fan mounted to one side of the fins. The base contacts the heat-generating electronic components to absorb heat generated by the heat-generating electronic components. The heat pipes comprise evaporating sections embedded in the base and condensing sections extending perpendicularly and upwardly through the fins. Conventionally, the fins are spaced from each other individually and secured by being soldered to the condensing sections of the heat pipes. However, contacting areas between the fins and the heat pipes are so narrow that connective integrity thereof is too weak to securely assemble the fins together in use. As a result, the fins are in high risk of suffering disengagement from the heat pipes, thereby being forced into a sympathetic vibration and producing noise in response to high-frequency vibration from the running fan.
- What is needed is a heat dissipation device having a plurality of individual fins assembled together to obtain a fin unit with a rather firm structure.
- Many aspects of the present embodiments can be better understood with reference to the following drawings. The components in the drawings are not necessarily drawn to scale, the emphasis instead being placed upon clearly illustrating the principles of the present embodiments. Moreover, in the drawings, like reference numerals designate corresponding parts throughout the several views.
-
FIG. 1 is an assembled view of a heat dissipation device in accordance with an embodiment of the present disclosure. -
FIG. 2 is an exploded view of the heat dissipation device ofFIG. 1 . -
FIG. 3 is an elevation view of the heat dissipation deviceFIG. 1 , with a fan thereof being removed away for clarity. -
FIGS. 1-3 illustrate a heat dissipation device in accordance with an embodiment of the present disclosure. The heat dissipation device is provided for removing heat from a heat-generating component such as a CPU. The heat dissipation device comprises abase 10, afin unit 20 located over thebase 10, a plurality ofheat pipes 30 thermally connecting thefin unit 20 and thebase 10 together, aheat dissipating member 40 located between thefin unit 20 and thebase 10, afan 50 and twofan holders 60 securing thefan 50 to rear sides of thefin unit 20 and theheat dissipating member 40. - The
base 10 comprises a rectangularconducting plate 12 and fourfixing legs 14 extending diagonally from four corners of theconducting plate 12. The conductingplate 12 is made of material with a good heat conductivity such as copper and aluminum and defines a plurality ofelongated receiving grooves 120 in a top surface thereof for receiving portions of theheat pipes 30. Thereceiving grooves 120 are spaced from each other and parallel to two opposite sides of theconducting plate 12. Fourfixtures 100 respectively extend through distal ends of thefixing legs 14 and fixed in thefixing legs 14 for mounting the heat dissipation device onto the heat-generating component. - The
fin unit 20 comprises a plurality offins 22 stacked vertically together. Eachfin 22 is bent into a wave-shaped configuration and comprises a plurality of wave crests and wave troughs alternately arranged with each other. In every neighboring twofins 22, the wave crests of a lower one of the twofins 22 respectively engage the wave troughs of an upper one of the twofins 22, while the wave crests of the upper one are separated from and located over the corresponding wave troughs of the lower one, respectively, whereby a plurality of air passages are respectively defined between the corresponding wave crests of the upper one and the corresponding wave troughs of the lower one of the two neighboringfins 22. Thefins 22 are rectangular wave-shaped in profile; thus, the air passages each are rectangular in cross section. - The
fins 22 are divided into a plurality of pairs which are vertically stacked together. Each pair offins 22 consists of afirst fin 22 a and asecond fin 22 b engaging a bottom of thefirst fin 22 a. Accordingly, thefirst fins 22 a and thesecond fins 22 b are alternately arranged when the pairs of thefins 22 are stacked together. Thefirst fin 22 a andsecond fin 22 b of each pair of thefins 22 have the same configuration, but are arranged oppositely in the vertical direction. Eachfirst fin 22 a comprises amain body 220 a and twoengaging parts 222 at two opposite ends of themain body 220 a. Eachmain body 220 a of thefirst fin 22 a is bent into a wave-shaped configuration and comprises a plurality offirst crest parts 221 a, a plurality offirst trough parts 223 a and a plurality of first connectingparts 222 a interconnecting the first crest andtrough parts trough parts first fin 22 a. The first connectingparts 222 a are perpendicular to the first crest andtrough parts trough parts - Similar to the
first fins 22 a, eachsecond fin 22 b comprises amain body 220 b and twoengaging parts 222 at two opposite ends of themain body 220 b. Eachmain body 220 b of thesecond fins 22 b is bent into a wave-shaped configuration and comprises a plurality ofsecond crest parts 221 b, a plurality ofsecond trough parts 223 b and a plurality of second connectingparts 222 b interconnecting the second crest andtrough parts trough parts parts 222 b are perpendicular to the second crest andtrough parts trough parts engaging parts 222 of each pair of thefins 22 at the same ends of themain bodies fins 22 protrude away from each other and thus separated from each other. A plurality of receivingholes 226 spaced from each other are defined in the correspondingengaging parts 222 for receiving theheat pipes 30. Each of the first andsecond fins annular collar 2260 extending perpendicularly from an edge of thereceiving hole 226 for enlarging a contacting area between the first andsecond fins heat pipes 30. - In assembly of the
fin unit 20, thefirst trough parts 223 a of one of thefirst fins 22 a respectively engage thecrest parts 221 b of the lower neighboringsecond fin 22 b, while the first crest parts 221 of thefirst fin 22 a are respectively separated from and located over thesecond trough parts 223 b of the lower neighboringsecond fin 22 b. The correspondingwave crest parts wave trough parts air paths 228 are respectively defined between the corresponding separatedfirst crest parts 221 a andsecond trough parts 223 b and between the corresponding separatedfirst trough parts 223 a andsecond crest parts 221 b of the neighboring first andsecond fins 22. The twoengaging parts 222 of thefins 22 at opposite ends of themain bodies fins 22 are parallel to and spaced from each other with a constant distant. - Each
heat pipe 30 is U-shaped and comprises anevaporating section 32 and twocondensing sections 34 extending upwardly and perpendicularly from two opposite ends of theevaporating section 32. The evaporatingsections 32 of theheat pipes 30 are respectively received in the receivinggrooves 120 of thebase 10. Thecondensing sections 34 of theheat pipes 30 are respectively received in the receivingholes 226 of theengaging parts 222 of thefins 22 and intimately surrounded by theannular collars 2260 of the fins. Thecondensing sections 34 are parallel to each other and perpendicular to thefins 22. - The
heat dissipating member 40 is formed by continuously folding a metallic sheet and comprises a plurality ofvertical sheets 42 and a plurality of connectingflanges 44 interconnecting top edges or bottom edges of every two neighboringvertical sheets 42. Theheat dissipating member 40 is sandwiched between a bottom of thefin unit 20 and the top surface of the conductingplate 12 of thebase 10 and located between the twocondensing sections 34 of eachheat pipes 30. In detail, thevertical sheets 42 are perpendicular to theconducting plate 12 and thefins 22. Lower ones of the connectingflanges 44 at the bottom edges of thevertical sheets 42 are intimately attached to the top surface of the conductingplate 12 and engage a top of theevaporating sections 32 of the heat pipes simultaneously. Upper ones of the connectingflanges 44 at the top edges of thevertical sheets 42 are attached to the bottom of thefin unit 20. More specific, the lower ones of the connectingflanges 44 engage bottom surfaces of thesecond trough parts 223 b of thesecond fin 22 b at the bottom of thefin unit 20. - The
fan 50 is mounted to rear sides of thefin unit 20 and theheat dissipating member 40 by the twofan holders 60 for producing an airflow through theair paths 228 of thefin unit 20 and theheat dissipating member 40. - In use of the heat dissipation device, heat generated by the heat-generating component is absorbed by the conducting
plate 12 of thebase 10 and then directly conducted to theheat dissipating member 40 and simultaneously distributed overfin unit 20 via theheat pipes 30; the heat is finally brought into ambient environment by the airflow produced by thefan 50 and passing through thefin unit 20 and theheat dissipating member 40. As thefins 22 are wave-shaped in profile and the crest parts and trough parts of thefins 22 are respectively coupled with each other to form a structure like a honeycomb, thefin unit 20 can have a firm structure and will not have a sympathetic resonance to produce an unbearable noise when thefin unit 20 is subject to a high-frequency vibration from thefan 50 in use. In addition, thefins 22 are in adequate contact with each other, whereby thermal resistant between thefins 22 are so low that heat from theheat pipes 30 can be more evenly and quickly distributed over thefin unit 20. - It is believed that the present embodiments and their advantages will be understood from the foregoing description, and it will be apparent that various changes may be made thereto without departing from the spirit and scope of the disclosure or sacrificing all of its material advantages, the examples hereinbefore described merely being preferred or exemplary embodiments of the disclosure.
Claims (16)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
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CN200910302934.X | 2009-06-04 | ||
CN200910302934XA CN101909416A (en) | 2009-06-04 | 2009-06-04 | Heat dissipating device |
Publications (1)
Publication Number | Publication Date |
---|---|
US20100307728A1 true US20100307728A1 (en) | 2010-12-09 |
Family
ID=43264690
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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US12/549,386 Abandoned US20100307728A1 (en) | 2009-06-04 | 2009-08-28 | Heat dissipation device |
Country Status (2)
Country | Link |
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US (1) | US20100307728A1 (en) |
CN (1) | CN101909416A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20120261096A1 (en) * | 2011-04-12 | 2012-10-18 | Asia Vital Components Co., Ltd. | Radiating fin structureand thermal module using same |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN105101752A (en) * | 2015-08-10 | 2015-11-25 | 深圳市萨伏特电池电源有限公司 | Charger heat dissipation device |
KR102064529B1 (en) * | 2019-04-25 | 2020-01-09 | 잘만테크 주식회사 | Cooling apparatus for electronic components with corrugated plate layered cooling tower |
Citations (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3889745A (en) * | 1973-12-19 | 1975-06-17 | Reynolds Metals Co | Heat exchanger and method of making same |
US4428419A (en) * | 1980-01-28 | 1984-01-31 | Dubrovsky Evgeny V | Tube-and-fin heat exchanger |
US4605060A (en) * | 1981-11-26 | 1986-08-12 | Alfa-Laval Ab | Heat exchanger plate |
US4775007A (en) * | 1985-03-07 | 1988-10-04 | Mitsubishi Denki Kabushiki Kaisha | Heat exchanger for an air-conditioning apparatus |
US6450250B2 (en) * | 1999-06-11 | 2002-09-17 | Psc Computer Products, Inc. | Stackable heat sink for electronic components |
US20040031587A1 (en) * | 2001-11-29 | 2004-02-19 | Fong Wang Ching | Heat-exchanging fin device fro enhancing heat exchange efficiency |
US7011144B2 (en) * | 2004-03-31 | 2006-03-14 | Hewlett-Packard Development Company, L.P. | System and method for cooling electronic assemblies |
US7249626B2 (en) * | 2005-06-10 | 2007-07-31 | Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. | Heat dissipation device |
US20080135215A1 (en) * | 2006-12-06 | 2008-06-12 | Foxconn Technology Co., Ltd. | Heat dissipation device |
-
2009
- 2009-06-04 CN CN200910302934XA patent/CN101909416A/en active Pending
- 2009-08-28 US US12/549,386 patent/US20100307728A1/en not_active Abandoned
Patent Citations (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3889745A (en) * | 1973-12-19 | 1975-06-17 | Reynolds Metals Co | Heat exchanger and method of making same |
US4428419A (en) * | 1980-01-28 | 1984-01-31 | Dubrovsky Evgeny V | Tube-and-fin heat exchanger |
US4605060A (en) * | 1981-11-26 | 1986-08-12 | Alfa-Laval Ab | Heat exchanger plate |
US4775007A (en) * | 1985-03-07 | 1988-10-04 | Mitsubishi Denki Kabushiki Kaisha | Heat exchanger for an air-conditioning apparatus |
US6450250B2 (en) * | 1999-06-11 | 2002-09-17 | Psc Computer Products, Inc. | Stackable heat sink for electronic components |
US20040031587A1 (en) * | 2001-11-29 | 2004-02-19 | Fong Wang Ching | Heat-exchanging fin device fro enhancing heat exchange efficiency |
US7011144B2 (en) * | 2004-03-31 | 2006-03-14 | Hewlett-Packard Development Company, L.P. | System and method for cooling electronic assemblies |
US7249626B2 (en) * | 2005-06-10 | 2007-07-31 | Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. | Heat dissipation device |
US20080135215A1 (en) * | 2006-12-06 | 2008-06-12 | Foxconn Technology Co., Ltd. | Heat dissipation device |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20120261096A1 (en) * | 2011-04-12 | 2012-10-18 | Asia Vital Components Co., Ltd. | Radiating fin structureand thermal module using same |
Also Published As
Publication number | Publication date |
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CN101909416A (en) | 2010-12-08 |
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AS | Assignment |
Owner name: FOXCONN TECHNOLOGY CO., LTD., TAIWAN Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNORS:LIAN, ZHI-SHENG;DENG, GEN-PING;CHEN, CHUN-CHI;REEL/FRAME:023159/0812 Effective date: 20090725 Owner name: FU ZHUN PRECISION INDUSTRY (SHEN ZHEN) CO., LTD., Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNORS:LIAN, ZHI-SHENG;DENG, GEN-PING;CHEN, CHUN-CHI;REEL/FRAME:023159/0812 Effective date: 20090725 |
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STCB | Information on status: application discontinuation |
Free format text: ABANDONED -- FAILURE TO RESPOND TO AN OFFICE ACTION |