TWM603987U - Structure of water cooling head - Google Patents

Structure of water cooling head Download PDF

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Publication number
TWM603987U
TWM603987U TW109209627U TW109209627U TWM603987U TW M603987 U TWM603987 U TW M603987U TW 109209627 U TW109209627 U TW 109209627U TW 109209627 U TW109209627 U TW 109209627U TW M603987 U TWM603987 U TW M603987U
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Taiwan
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water
heat dissipation
base
pump
heat
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TW109209627U
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Chinese (zh)
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游偉智
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超昱國際有限公司
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Priority to TW109209627U priority Critical patent/TWM603987U/en
Publication of TWM603987U publication Critical patent/TWM603987U/en
Priority to CN202120666579.0U priority patent/CN214545080U/en

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  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

一種水冷頭結構，包括：本體，其裝設有泵浦以及位於該本體內部的散熱流道，泵浦內設於散熱流道內，且本體外側具有接觸導熱部，散熱流道的路徑經過接觸導熱部，又本體外表面的一側凸設有導水部，導水部與散熱流道的路徑相通，泵浦只需安裝於本體內即可帶動流體流動，節省安裝所需的空間，本體外側的接觸導熱部只需安裝於積體電路晶片的外表面即可達到散熱效果，改善習知須占用機殼內部的許多空間，安裝時容易受限於機殼內部有限的空間或是複雜的安裝過程，進而造成安裝時的不便的問題。 A water-cooling head structure includes: a body, which is equipped with a pump and a heat dissipation channel located inside the body, the pump is arranged in the heat dissipation channel, and the outside of the body has a contact heat conduction part, and the path of the heat dissipation channel passes through In contact with the heat-conducting part, and the side of the outer surface of the main body is convexly provided with a water guiding part. The water guiding part communicates with the path of the heat dissipation channel. The pump only needs to be installed in the main body to drive the fluid to flow, saving installation space. The contact heat conduction part only needs to be installed on the outer surface of the integrated circuit chip to achieve the heat dissipation effect. The improvement requires a lot of space inside the case, and the installation is easily limited by the limited space inside the case or complicated installation Process, which in turn causes inconvenience during installation.

Description

水冷頭結構 Water block structure

一種水冷頭結構，尤指透過內設於水冷頭內的泵浦，節省安裝時的空間。 A water-cooling head structure, especially a pump built in the water-cooling head, to save installation space.

科技的高速發展，電子設備的推陳出新，舉凡智慧型手機、電腦等，電子設備的普及早已成為現代社會日常生活的一部份，其便利性讓現代社會的人們不需外出即可完成生活中的大小事。 The rapid development of science and technology, the innovation of electronic equipment, such as smart phones, computers, etc., the popularization of electronic equipment has long become a part of daily life in modern society, and its convenience allows people in modern society to complete their daily life without going out. Big and small things.

近年來組裝電腦的風氣盛行，為了滿足個人使用的需求，許多人會自行購買電子零件組裝電腦，而電腦的機殼內部的電路板裝設有高效能的積體電路晶片，當高效能的積體電路晶片進行運算以及儲存大量資料的同時，機殼內部將產生大量的熱能，若無法及時將機殼內部的大量熱能帶走，累積在機殼內部的熱能除了會降低電腦的運作效能，同時也縮短了電子零件的壽命。 In recent years, the trend of assembling computers has prevailed. In order to meet the needs of personal use, many people buy electronic parts to assemble computers by themselves. The circuit boards inside the computer cases are equipped with high-performance integrated circuit chips. While the bulk circuit chip is performing calculations and storing large amounts of data, a large amount of heat energy will be generated inside the case. If the large amount of heat energy inside the case cannot be taken away in time, the heat energy accumulated inside the case will not only reduce the operating efficiency of the computer, but also Also shorten the life of electronic parts.

為了降低散熱時噪音以及達到良好的散熱效果，許多人組裝電腦時會傾向於採用水冷散熱的方式，降低積體電路晶片於運算、儲存資料的過程中產生的熱量，如台灣專利M273765號「兼具機箱通風效果的水冷式散熱裝置」中，吸熱體係抵靠於積體電路晶片的外表面，熱交換器結合泵浦，泵浦與出水管相接，出水管的一端與吸熱體的入水口相接，冷水液從吸熱體的入水口流入並從吸熱體的出水口送出，透過泵浦使上水箱、下水箱內的冷水液能夠流入吸 熱體，帶走吸熱體內的熱量，並沿著管路循環流動，達到冷卻積體電路晶片的效果。 In order to reduce noise during heat dissipation and achieve a good heat dissipation effect, many people tend to use water-cooled heat dissipation methods when assembling computers to reduce the heat generated by integrated circuit chips in the process of computing and storing data. For example, Taiwan Patent No. M273765 In the "water-cooled heat sink with chassis ventilation effect", the heat absorption system abuts on the outer surface of the integrated circuit chip, the heat exchanger is combined with the pump, and the pump is connected to the outlet pipe, and one end of the outlet pipe is connected to the water inlet of the heat sink Connected, the cold water liquid flows in from the water inlet of the heat absorbing body and is sent out from the water outlet of the heat absorbing body. The cold water liquid in the upper and lower water tanks can flow into the suction through the pump. The hot body takes away the heat in the heat absorbing body and circulates along the pipeline to achieve the effect of cooling the integrated circuit chip.

然而，上述雖能夠達到冷卻積體電路晶片的效果，但泵浦與熱交換器、上水箱及下水箱組接後仍須占用機殼內部的許多空間，安裝時容易受限於機殼內部有限的空間或是複雜的安裝過程，進而造成安裝時的不便。 However, although the above can achieve the effect of cooling the integrated circuit chip, the pump and the heat exchanger, the upper water tank and the lower water tank still need to occupy a lot of space inside the casing after being assembled, and the installation is easily limited by the limited inside the casing Space or complicated installation process, which will cause inconvenience during installation.

本創作為一種水冷頭結構，其透過內設於水冷頭內的泵浦，節省安裝時的空間，改善習知泵浦與熱交換器、上水箱及下水箱組接後必須占用機殼內部的許多空間，使用者組裝時容易受限於機殼內部有限的空間或是複雜的安裝過程，進而造成安裝時的不便。 This creation is a water block structure, which saves installation space through the pump built in the water block, and improves the conventional pump and heat exchanger, the upper water tank and the lower water tank that must occupy the inside of the casing after being assembled. Many spaces are easily limited by the limited space inside the casing or complicated installation process when the user assembles, which causes inconvenience during installation.

為達上述目的，本創作提供一種水冷頭結構，包括：一本體，其裝設有一泵浦以及位於該本體內部的一散熱流道，該泵浦內設於該散熱流道內，且該本體外側具有一接觸導熱部，該散熱流道的路徑經過該接觸導熱部，又該本體外表面的一側凸設有一導水部，該導水部與該散熱流道的路徑相通。 To achieve the above objective, this creation provides a water-cooling head structure, including: a body equipped with a pump and a heat dissipation channel located inside the body, the pump is arranged in the heat dissipation channel, and the The outer side of the main body is provided with a contact heat-conducting part, the path of the heat dissipation runner passes through the contact heat-conducting part, and a water guiding part is protruded on one side of the outer surface of the body, and the water guiding part communicates with the path of the heat dissipating runner.

1:本體 1: body

11:泵浦 11: Pump

12:散熱流道 12: cooling runner

121:進水道 121: Inlet

122:出水道 122: Outlet

123:水室 123: Water Room

124:扇葉 124: Fan Blade

125:第一流道 125: first runner

126:第二流道 126: Second runner

127:散熱空間 127: Cooling space

13:接觸導熱部 13: Contact the heat conduction part

14:導水部 14: Water guide

15:上座 15: upper seat

16:中座 16: Middle seat

17:基座 17: Pedestal

171:鰭片部 171: Fin

172:上蓋 172: upper cover

173:進水孔 173: water inlet

174:出水孔 174: Water Outlet

18:進水接頭 18: Water inlet connector

19:出水接頭 19: Outlet connector

2:電腦機殼 2: computer case

3:管路 3: pipeline

4:水冷排 4: Water cooling row

5:風扇 5: Fan

第一圖為本創作立體示意圖。 The first picture is a three-dimensional diagram of the creation.

第二圖為本創作立體分解示意圖。 The second picture is a three-dimensional exploded diagram of the creation.

第三圖為本創作另一視角立體分解示意圖。 The third figure is a three-dimensional exploded schematic diagram of the creation from another perspective.

第四圖為第一圖之Ⅳ-Ⅳ線段剖面示意圖。 The fourth figure is a schematic cross-sectional view of line IV-IV in the first figure.

第五圖為第一圖之V-V線段剖面示意圖。 Figure 5 is a schematic cross-sectional view of the line V-V in Figure 1.

第六圖為第一圖之Ⅵ-Ⅵ線段剖面示意圖。 Figure 6 is a schematic cross-sectional view of line VI-VI in Figure 1.

第七圖為第一圖Ⅶ-Ⅶ線段剖面立體圖。 The seventh figure is a three-dimensional view of the section VII-VII of the first figure.

第八圖為第七圖另一視角剖面示意圖。 Figure 8 is a schematic cross-sectional view of Figure 7 from another perspective.

第九圖為本創作之使用示意圖。 The ninth picture is a schematic diagram of the use of the creation.

第十圖為本創作基座的立體示意圖。 The tenth figure is a three-dimensional schematic diagram of the creative base.

請參閱第一圖至第八圖，本創作為一種水冷頭結構，包括：一本體1，其裝設有一泵浦11以及位於該本體1內部的一散熱流道12，該泵浦11內設於該散熱流道12內，且該本體1外側具有一接觸導熱部13，該散熱流道12的路徑經過該接觸導熱部13，又該本體1外表面的一側凸設有一導水部14，該導水部14與該散熱流道12的路徑相通。 Please refer to the first to eighth figures. This creation is a water-cooling head structure, including: a body 1, which is equipped with a pump 11 and a heat dissipation channel 12 inside the body 1, the pump 11 is provided with Inside the heat dissipation runner 12 and outside the main body 1, there is a contact heat-conducting part 13, the path of the heat dissipation runner 12 passes through the contact heat-conducting part 13, and a water guiding part 14 protrudes on one side of the outer surface of the body 1, The water guiding portion 14 communicates with the path of the heat dissipation channel 12.

由上述可知，本創作將將泵浦11裝設於本體1內的散熱流道12，並透過泵浦11運轉帶動散熱流道12內的流體流動，泵浦11不需與水箱結合，只需安裝於本體1內即可帶動流體流動，節省安裝所需的空間，本體1外側的接觸導熱部13只需抵靠於積體電路晶片的外表面即可達到散熱效果，改善習知須占用機殼內部的許多空間，安裝時容易受限於機殼內部有限的空間或是複雜的安裝過程，進而造成安裝時的不便。 It can be seen from the above that this creation will install the pump 11 in the heat dissipation channel 12 in the body 1, and drive the fluid flow in the heat dissipation channel 12 through the operation of the pump 11. The pump 11 does not need to be combined with a water tank, just Installed in the main body 1 can drive the fluid to flow, saving the space required for installation. The contact heat conduction part 13 on the outside of the main body 1 only needs to abut against the outer surface of the integrated circuit chip to achieve the heat dissipation effect. Many spaces inside the casing are easily limited by the limited space inside the casing or complicated installation process during installation, which may cause inconvenience during installation.

本創作可用於中央處理器(CPU)、顯示卡或是其他具有積體電路晶片的電子元件上，以下實施例係以本體1裝設於中央處理器(CPU)表面進行散熱為例。 This creation can be used on a central processing unit (CPU), a display card or other electronic components with integrated circuit chips. The following embodiment takes the body 1 installed on the surface of the central processing unit (CPU) for heat dissipation as an example.

請參閱第一圖，本體1包含有一上座15、一中座16及一基座17，上座15與中座16相接，中座16與基座17相接，本體1係以層層堆疊的方式，由上而下依序以上座15、中座16、基座17的順序相互堆疊組合，散熱流道12位於中座16及基座17內，接觸導熱部13位於基座17的一側。 Please refer to the first figure. The main body 1 includes an upper base 15, a middle base 16, and a base 17. The upper base 15 is connected to the middle base 16, the middle base 16 is connected to the base 17, and the main body 1 is stacked in layers In this way, the upper base 15, the middle base 16, and the base 17 are stacked and combined from top to bottom in the order of the upper base 15, the middle base 16, and the base 17, the heat dissipation channel 12 is located in the middle base 16 and the base 17, and the contact heat conduction part 13 is located on one side of the base 17 .

接著，請參閱第四圖至第九圖，部分位於中座16內的散熱流道12具有進水道121、出水道122及水室123，出水道122位於該導水部14與該水室123之間，該進水道121的一端與該導水部14連通，該進水道121、出水道122的另一端分別與部分位於基座17內的散熱流道12相通，泵浦11裝設於水室123內，泵浦11朝該水室123的一側凸伸有一扇葉124，扇葉124的部分相鄰於該出水道122，當泵浦11運轉帶動扇葉124轉動時，扇葉124得以將水室123內的流體朝出水道122的方向送出。 Next, referring to the fourth to ninth figures, part of the heat dissipation channel 12 in the middle seat 16 has an inlet channel 121, an outlet channel 122 and a water chamber 123. The outlet channel 122 is located between the water guiding portion 14 and the water chamber 123 In the meantime, one end of the water inlet 121 is connected to the water guiding part 14, the other ends of the water inlet 121 and the other end of the water outlet 122 are respectively communicated with part of the heat dissipation channel 12 in the base 17, and the pump 11 is installed in the water chamber 123 Inside, the pump 11 has a fan blade 124 protruding toward one side of the water chamber 123, and a part of the fan blade 124 is adjacent to the water outlet 122. When the pump 11 drives the fan blade 124 to rotate, the fan blade 124 can The fluid in the water chamber 123 is sent out in the direction of the water outlet 122.

中座16朝該基座17方向貫穿有一第一流道125及一第二流道126，第一流道125的一端與水室123相通，第二流道126的一端與進水道121連通，且該基座包含有一散熱空間127，該第一流道125、第二流道126的另一端分別與散熱空間127相通，基座17具有一鰭片部171，鰭片部171位於散熱空間127內，接觸導熱部13位於該鰭片部171相反的一側，並另設有一進水接頭18及一出水接頭19，使用者能夠根據自身的需求更換不同種類的中座16，使其能夠對應各種款式的進水接頭18與出水接頭19，並可選擇可彎折的軟管或是形狀固定的硬管，提供不同管體的形狀變化組合，除了能夠節省安裝的空間，也使得機殼內部的空間變得整齊美觀，提高組裝時的靈活性，滿足使用者組裝時的需求，而進水接頭18的一端與進水道121相接，出水接頭19的一端與出水道122相接，當流體位於該本體1內，泵浦11帶動扇葉124轉動時，外部的流體會由進水道121朝第二流道126的方向流動，並經過散熱空間127，流體會經過鰭片部171的縫隙，將中央處理器(CPU)產生的熱量帶往第一流道125，流體經過第一流道125到達水室123後，流體得以從出水道122的方向送出。 The middle seat 16 penetrates a first flow channel 125 and a second flow channel 126 toward the base 17, one end of the first flow channel 125 communicates with the water chamber 123, one end of the second flow channel 126 communicates with the water inlet 121, and the The base includes a heat dissipation space 127. The other ends of the first flow channel 125 and the second flow channel 126 respectively communicate with the heat dissipation space 127. The base 17 has a fin portion 171 which is located in the heat dissipation space 127 and contacts The heat conducting portion 13 is located on the opposite side of the fin portion 171, and is additionally provided with a water inlet connector 18 and a water outlet connector 19. The user can replace different types of middle seats 16 according to their own needs, so that they can correspond to various styles of The water inlet connector 18 and the water outlet connector 19, and can choose bendable hoses or fixed-shaped rigid pipes, providing different combinations of tube shapes, which not only saves installation space, but also makes the space inside the casing change It must be neat and beautiful, improve the flexibility of assembly, and meet the needs of users during assembly. One end of the water inlet connector 18 is connected to the water inlet 121, and one end of the water outlet connector 19 is connected to the water outlet 122. When the fluid is located in the body In 1, when the pump 11 drives the fan blade 124 to rotate, the external fluid will flow in the direction of the second flow path 126 from the water inlet 121 and pass through the heat dissipation space 127. The fluid will pass through the gap of the fin part 171 to treat the center The heat generated by the CPU is carried to the first flow channel 125. After the fluid reaches the water chamber 123 through the first flow channel 125, the fluid can be sent out from the direction of the water outlet 122.

本體1的散熱接觸部13係與中央處理器(CPU)外表面接觸(圖未顯示)，出水接頭19以及進水接頭18的一端分別套設有管路3，如第九圖所示，管路3分別與水冷排4一側相接，水冷排4的表面裝設有風扇5，當中央處理器(CPU)通電運作時，接觸導熱部13得以將中央處理器(CPU)運作時產生的熱量傳導至散空間127，鰭片部171的縫隙能夠提高散熱的面積，流體得以吸收並帶走鰭片部171的熱量，中央處理器(CPU)運作的同時，泵浦11運轉帶動扇葉124轉動將流體從出水道122送出時，流體經由出水接頭19朝水冷排4流動，流體流至水冷排4透過風扇5將流體的熱量排出後，流體再經由管路3回到進水道121，使流體得以於本體1以及水冷排4之間循環不斷，降低中央處理器(CPU)的溫度，使其達到散熱的功效。 The heat dissipation contact portion 13 of the body 1 is in contact with the outer surface of the central processing unit (CPU) (not shown in the figure), and one end of the water outlet connector 19 and the water inlet connector 18 are respectively sheathed with a pipe 3, as shown in the ninth figure, the pipe The road 3 is connected to the side of the water-cooled row 4 respectively. The surface of the water-cooled row 4 is equipped with a fan 5. When the central processing unit (CPU) is powered on, it contacts the heat-conducting part 13 to make the central processing unit (CPU) operate. The heat is conducted to the dispersion space 127. The gap of the fin 171 can increase the heat dissipation area. The fluid can absorb and take away the heat of the fin 171. While the central processing unit (CPU) is operating, the pump 11 drives the fan blade 124 When the fluid is sent out from the outlet channel 122 by rotation, the fluid flows to the water-cooled row 4 through the outlet connector 19, and after the fluid flows to the water-cooled row 4, the heat of the fluid is discharged by the fan 5, and the fluid returns to the inlet channel 121 through the pipeline 3 to make The fluid can circulate continuously between the main body 1 and the water cooling row 4, reducing the temperature of the central processing unit (CPU), so that it can achieve the effect of heat dissipation.

而除了上述以上座15、中座16以及基座17相互結合的使用型態外，基座17亦可作為單獨的水冷頭使用，如第十圖所示，基座17包含有上蓋172，上蓋172的表面設有進水孔173及出水孔174，基座17的進水孔173以及出水孔174能夠分別以管路3連接的方式與水冷排4連通，並透過裝設於電腦機殼2內的泵浦11使流體得以透過管路3於水冷排4及基座17之間循環，除了具有散熱的功效，使用者組裝電腦的過程中能夠依據電腦機殼2內部的空間選擇合適的使用型態，提高組裝過程中的靈活性。 In addition to the above-mentioned combination of the upper base 15, the middle base 16, and the base 17, the base 17 can also be used as a separate water cooling head. As shown in Figure 10, the base 17 includes an upper cover 172, an upper cover The surface of the 172 is provided with water inlet holes 173 and water outlet holes 174. The water inlet holes 173 and the water outlet holes 174 of the base 17 can be connected to the water cooling row 4 by way of pipes 3 respectively, and are installed in the computer casing 2 The inner pump 11 allows fluid to circulate between the water cooling row 4 and the base 17 through the pipe 3. In addition to the heat dissipation function, the user can choose the appropriate use according to the space inside the computer case 2 during the computer assembly process Shape to improve flexibility in the assembly process.

綜上所述，本創作係透過安裝於本體1內部的泵浦11，使泵浦11不需與水箱結合，只需安裝於本體1內即可帶動流體流動，節省安裝所需的空間，本體1外側的接觸導熱部13只需抵靠於積體電路晶片的外表面即可達到散熱效果，改善習知須占用機殼內部的許多空間，安裝時容易受限於機殼內部有限的空間或是複雜的安裝過程，進而造成安裝時的不便。 To sum up, this creation system uses the pump 11 installed inside the main body 1, so that the pump 11 does not need to be combined with the water tank, and only needs to be installed in the main body 1 to drive fluid flow, saving the space required for installation. 1 The contact heat conduction portion 13 on the outside only needs to abut the outer surface of the integrated circuit chip to achieve the heat dissipation effect. The improvement requires a lot of space inside the case, and the installation is easily limited to the limited space inside the case or It is a complicated installation process, which causes inconvenience during installation.

1:本體 1: body

14:導水部 14: Water guide

15:上座 15: upper seat

16:中座 16: Middle seat

17:基座 17: Pedestal

18:進水接頭 18: Water inlet connector

19:出水接頭 19: Outlet connector

Claims (7)

一種水冷頭結構，包括：一本體，其裝設有一泵浦以及位於該本體內部的一散熱流道，該泵浦內設於該散熱流道內，且該本體外側具有一接觸導熱部，該散熱流道的路徑經過該接觸導熱部，又該本體外表面的一側凸設有一導水部，該導水部與該散熱流道的路徑相通。 A water-cooling head structure includes: a body equipped with a pump and a heat dissipation channel located inside the body, the pump is arranged in the heat dissipation channel, and the body has a contact heat conduction part outside, The path of the heat dissipation flow channel passes through the contact heat-conducting part, and a water guiding part is protruded on one side of the outer surface of the body, and the water guiding part communicates with the path of the heat dissipation flow channel. 如請求項1所述之水冷頭結構，其中該本體包含有一上座、一中座及一基座，該上座與該中座位相接，該中座與該基座相接，該散熱流道位於該中座及該基座內，該接觸導熱部位於該基座的一側。 The water-cooling head structure according to claim 1, wherein the body includes an upper seat, a middle seat and a base, the upper seat is connected to the middle seat, the middle seat is connected to the base, and the heat dissipation channel is located In the middle seat and the base, the contact heat conducting part is located on one side of the base. 如請求項2所述之水冷頭結構，其中部分位於該中座內的該散熱流道具有一進水道、一出水道及一水室，該出水道位於該導水部與該水室之間，該進水道、出水道的一端與該導水部連通，該進水道、出水道的另一端分別與部分位於該基座內的散熱流道相通。 The water-cooling head structure according to claim 2, wherein part of the radiating flow prop located in the middle seat has an inlet, an outlet and a water chamber, and the outlet is located between the water guiding part and the water chamber. One ends of the water inlet and outlet are communicated with the water guiding part, and the other ends of the water inlet and outlet are respectively communicated with part of the heat dissipation channel located in the base. 如請求項3所述之水冷頭結構，其中該中座朝該基座方向貫穿有一第一流道及一第二流道，該第一流道的一端與該水室相通，該第二流道的一端與該進水道連通，且該基座包含有一散熱空間，該第一流道、第二流道的另一端分別與該散熱空間相通。 The water block structure according to claim 3, wherein the middle seat penetrates a first flow channel and a second flow channel toward the base, one end of the first flow channel communicates with the water chamber, and the second flow channel One end is communicated with the water inlet, and the base includes a heat dissipation space, and the other ends of the first and second flow paths are respectively communicated with the heat dissipation space. 如請求項4所述之水冷頭結構，其中該基座具有一鰭片部，該鰭片部位於該散熱空間內，該接觸導熱部位於該鰭片部相反的一側。 The water-cooling head structure according to claim 4, wherein the base has a fin portion, the fin portion is located in the heat dissipation space, and the contact and heat conduction portion is located on the opposite side of the fin portion. 如請求項3所述之水冷頭結構，進一步包含一進水接頭及一出水接頭，該進水接頭的一端與該進水道相接，該出水接頭的一端與該出水道相接。 The water-cooling head structure according to claim 3, further comprising a water inlet joint and a water outlet joint, one end of the water inlet joint is connected with the water inlet, and one end of the water outlet joint is connected with the water outlet. 如請求項3所述之水冷頭結構，其中該泵浦朝該水室的一側凸伸有一扇葉，該扇葉部分相鄰於該出水道。 The water cooling head structure according to claim 3, wherein the pump has a fan blade protruding toward one side of the water chamber, and the fan blade part is adjacent to the water outlet.
TW109209627U 2020-08-31 2020-08-31 Structure of water cooling head TWM603987U (en)

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